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Internal Use Only

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Europe/Africa
Asia/Oceania

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LCD TV
SERVICE MANUAL
CHASSIS : LP91A

MODEL : 32LH20R

32LH20R-MA

CAUTION
BEFORE SERVICING THE CHASSIS,
READ THE SAFETY PRECAUTIONS IN THIS MANUAL.

CONTENTS

CONTENTS .............................................................................................. 2
PRODUCT SAFETY ..................................................................................3
SPECIFICATION ........................................................................................6
ADJUSTMENT INSTRUCTION................................................................11
TROUBLE SHOOTING ............................................................................16
BLOCK DIAGRAM...................................................................................19
EXPLODED VIEW .................................................................................. 20
SVC. SHEET ...............................................................................................

Copyright C 2009 LG Electronics. Inc. All right reserved.


Only for training and service purposes

-2-

LGE Internal Use Only

SAFETY PRECAUTIONS
IMPORTANT SAFETY NOTICE
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by
in the
Schematic Diagram and Exploded View.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.

Leakage Current Hot Check (See below Figure)


Plug the AC cord directly into the AC outlet.

General Guidance
An isolation Transformer should always be used during the
servicing of a receiver whose chassis is not isolated from the AC
power line. Use a transformer of adequate power rating as this
protects the technician from accidents resulting in personal injury
from electrical shocks.
It will also protect the receiver and it's components from being
damaged by accidental shorts of the circuitry that may be
inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown,
replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor,
over 1W), keep the resistor 10mm away from PCB.

Do not use a line Isolation Transformer during this check.


Connect 1.5K/10watt resistor in parallel with a 0.15uF capacitor
between a known good earth ground (Water Pipe, Conduit, etc.)
and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter
with 1000 ohms/volt or more sensitivity.
Reverse plug the AC cord into the AC outlet and repeat AC voltage
measurements for each exposed metallic part. Any voltage
measured must not exceed 0.75 volt RMS which is corresponds to
0.5mA.
In case any measurement is out of the limits specified, there is
possibility of shock hazard and the set must be checked and
repaired before it is returned to the customer.

Leakage Current Hot Check circuit


Keep wires away from high voltage or high temperature parts.

AC Volt-meter

Before returning the receiver to the customer,


always perform an AC leakage current check on the exposed
metallic parts of the cabinet, such as antennas, terminals, etc., to
be sure the set is safe to operate without damage of electrical
shock.
To Instruments
exposed
METALLIC PARTS

Leakage Current Cold Check(Antenna Cold Check)


With the instrument AC plug removed from AC source, connect an
electrical jumper across the two AC plug prongs. Place the AC
switch in the on position, connect one lead of ohm-meter to the AC
plug prongs tied together and touch other ohm-meter lead in turn to
each exposed metallic parts such as antenna terminals, phone
jacks, etc.
If the exposed metallic part has a return path to the chassis, the
measured resistance should be between 1M and 5.2M.
When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.

Copyright C 2009 LG Electronics. Inc. All right reserved.


Only for training and service purposes

-3-

Good Earth Ground


such as WATER PIPE,
CONDUIT etc.
0.15uF

1.5 Kohm/10W

When 25A is impressed between Earth and 2nd Ground


for 1 second, Resistance must be less than 0.1
*Base on Adjustment standard

LGE Internal Use Only

SERVICING PRECAUTIONS
CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conflict between the
following servicing precautions and any of the safety precautions on
page 3 of this publication, always follow the safety precautions.
Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board
module or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an
explosion hazard.
2. Test high voltage only by measuring it with an appropriate high
voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. Unless specified otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10% (by volume) Acetone and 90% (by
volume) isopropyl alcohol (90%-99% strength)
CAUTION: This is a flammable mixture.
Unless specified otherwise in this service manual, lubrication of
contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks are
correctly installed.
7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test fixtures specified in this
service manual.
CAUTION: Do not connect the test fixture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged easily
by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques
should be used to help reduce the incidence of component
damage caused by static by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground.
Alternatively, obtain and wear a commercially available
discharging wrist strap device, which should be removed to
prevent potential shock reasons prior to applying power to the
Copyright C 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes

unit under test.


2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or
exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES
devices.
4. Use only an anti-static type solder removal device. Some solder
removal devices not classified as "anti-static" can generate
electrical charges sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads
electrically shorted together by conductive foam, aluminum foil
or comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be
installed.
CAUTION: Be sure no power is applied to the chassis or circuit,
and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged
replacement ES devices. (Otherwise harmless motion such as
the brushing together of your clothes fabric or the lifting of your
foot from a carpeted floor can generate static electricity
sufficient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within the
range or 500F to 600F.
2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500F to 600F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suctiontype solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500F to 600F)
b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there
only until the solder flows onto and around both the
component lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
splashed solder with a small wire-bristle brush.

-4-

LGE Internal Use Only

IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by gently
prying up on the lead with the soldering iron tip as the solder
melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing the
IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete Transistor
Removal/Replacement
1. Remove the defective transistor by clipping its leads as close as
possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.

Circuit Board Foil Repair


Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC
connections).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the good
copper pattern. Solder the overlapped area and clip off any
excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly
connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.

Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as
possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Copyright C 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes

-5-

LGE Internal Use Only

SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement.

1. Application range

3. Test method

This spec sheet is applied to LCD TV used LP91A chassis.

1) Performance: LGE TV test method followed


2) Demanded other specification
- Safety: CE, IEC specification
- EMC : CE, IEC

2. Specification
Each part is tested as below without special appointment.
1) Temperature : 255C (779F), CST : 405C
2) Relative Humidity : 6510%
3) Power Voltage : Standard input voltage(100~240V@50/60Hz)
* Standard Voltage of each products is marked by models.
4) Specification and performance of each parts are followed
each drawing and specification by part number in
accordance with BOM.
5) The receiver must be operated for about 5 minutes prior to
the adjustment.

4. Electrical specification
4.1 General Specification
No

Item

Specification

Screen Size

32 wide Color Display Module

Aspect Ratio

16:9

LCD Module

32 TFT WXGA LCD

Operating Environment

Temp.: 0 ~ 40 deg

Measurement

Remark
Resolution: 1366*768 / 1920*1080
HD

Humidity : 0 ~ 80 %
5

Storage Environment

Temp.: -20 ~ 60 deg


Humidity : 0~ 85 %

6
7

Input Voltage
LDC Module

AC100-240V~, 50/60Hz
150 W

32 HD

HD

760 x 450 x 48

(Maker : LGD)

with inverter

0.17025 x 0.51075
12 EEFL
Coating

Copyright C 2009 LG Electronics. Inc. All right reserved.


Only for training and service purposes

3H

-6-

LGE Internal Use Only

5. Chroma& Brightness (Optical)


5.1. LCD Module
the Color Coordinates check condition
- 50cm from the surface, Full White Pattern
- Picture mode Vivid
No.

Item

1.

Luminance

2.

VIew angle (R/L, U/D)

3.

Color Coordinates

Min.

Typ.

400

500

Max.

cd/m2

Unit

178/ 178

degree

Maker

Remark

(W/O PC mode)
White
RED
Green
Blue
4.

Contrast ratio

5.

Luminance Variation

Wx

Typ

0.279

Typ

Wy

-0.03

0.292

+0.03

Xr

0.636

Yr

0.335

Xg

0.291

Yg

0.613

Xb

0.146

Yb

0.061
800:1

LGD

CR > 10

LGD 32(HD)

1100:1

LGD 32(HD)
1.3

8. Component Video Input (Y, PB, PR)


Specification

No
Resolution

Remark

H-freq(kHz)

V-freq(Hz)
59.94

Pixel Clock(MHz)

720* 480

15.73

13.500

SDTV, DVD 480I( 525I)

720* 480

15.75

60.00

13.514

SDTV, DVD 480I( 525I)

720* 576

15.625

50.00

13.500

SDTV, DVD 576I( 625I) 50Hz

720* 480

31.47

59.94

27.000

SDTV 480P

720* 480

31.50

60.00

27.027

SDTV 480P

720* 576

31.25

50.00

27.000

SDTV 576P 50Hz

1280* 720

44.96

59.94

74.176

HDTV 720P

1280* 720

45.00

60.00

74.250

HDTV 720P

1280* 720

37.50

50.00

74.25

HDTV 720P 50Hz

10

1920* 1080

28.125

50.00

74.250

HDTV 1080I 50Hz,

11

1920* 1080

33.72

59.94

74.176

HDTV 1080I

12

1920* 1080

33.75

60.00

74.25

HDTV 1080I

13

1920* 1080

56.25

50

148.5

HDTV 1080P

14

1920* 1080

67.432

59.94

148.350

HDTV 1080P

15

1920* 1080

67.5

60.00

148.5

HDTV 1080P

Copyright C 2009 LG Electronics. Inc. All right reserved.


Only for training and service purposes

-7-

LGE Internal Use Only

9. RGB
9.1 Analog PC, RGB- DTV NOT SUPPORT
Specification

No
Resolution

H-freq(kHz)

Remark
V-freq(Hz)

Pixel Clock(MHz)

640* 350

31.468

70.09

25.17

EGA

720* 400

31.469

70.09

28.32

DOS

640* 480

31.469

59.94

25.17

VESA( VGA)

800* 600

37.879

60.317

40

VESA( SVGA)

1024* 768

48.363

60.004

65

VESA( XGA)

1280* 768

47.776

59.87

79.5

VESA( WXGA)

1360* 768

47.72

59.799

84.75

VESA( WXGA)

1280* 1024

63.668

59.895

109.00

XGA

Only FHD Model

1920* 1080

66.587

59.934

138.50

WUXGA(Reduced Blanking)

Only FHD Model

10. HDMI Input


10.1 PC Spec. out but it can be shown the picture at only HDMI/ DVI IN 1 via DVI to HDMI Cable)
No

H-freq(kHz)

V-freq.(Hz)

Pixel clock(MHz)

640 x 480

31.469

59.94

25.17

VESA( VGA)

800 x 600

37.879

60.317

40.00

VESA( SVGA)

1024 x 768

48.363

60.004

65.00

VESA( XGA)

1280 x 768

47.776

59.87

79.5

VESA( WXGA)

1360 x 768

47.72

59.799

84.62

VESA( WXGA)

Resolution

Proposed

1366 x 768

47.7

60.00

84.62

WXGA

1280 x 1024

63.595

60.00

108.875

SXGA

1920 x 1080

66.647

59.988

138.625

WUXGA

Remark

10.2 DTV Mode


Specification

No
Resolution

H-freq(kHz)

Remark
V-freq(Hz)

Pixel Clock(MHz)

720 x 480

15.73

59.94

13.500

SDTV, DVD 480I(525I)

720 x 480

15.75

60.00

13.514

SDTV, DVD 480I(525I)

Spec. out

720 x 576

15.625

50.00

13.500

SDTV, DVD 576I(625I) 50Hz

but display.

720 x 480

31.47

59.94

27

SDTV 480P

720 x 480

31.5

60.00

27.027

SDTV 480P

720 x 576

31.25

50.00

27

SDTV 576P

1280 x 720

44.96

59.94

74.176

HDTV 720P

1280 x 720

45

60.00

74.25

HDTV 720P

1280 x 720

37.5

50.00

74.25

HDTV 720P

10

1920 x 1080

28.125

50.00

74.25

HDTV 1080I

11

1920 x 1080

33.72

59.94

74.176

HDTV 1080I

12

1920 x 1080

33.75

60.00

74.25

HDTV 1080I

13

1920 x 1080

56.25

50.00

148.5

HDTV 1080P

14

1920 x 1080

67.432

59.94

148.350

HDTV 1080P

15

1920 x 1080

67.5

60.00

148.5

HDTV 1080P

16

1920 x 1080

27

24.00

74.25

HDTV 1080P

17

1920 x 1080

33.75

30.00

74.25

HDTV 1080P

Copyright C 2009 LG Electronics. Inc. All right reserved.


Only for training and service purposes

-8-

LGE Internal Use Only

11. Mechical spec.


No

Item

Min

Typ

Max

Unit

1.

C/ A + B/ C top gap

0.5

1.5

mm

2.

C/ A + B/ C side gap

0.5

1.5

mm

3.

C/ A + Deco Front gap( ONE SIDE).

0.8

1.2

mm

1) Gap between Front Frame /Back cover and Middle Cabinet


2) Gap between Front Frame /Middle Cabinet

Top View
Back Cover
"b
Middle Cabinet
"b

Front Frame
Gap b between Front Frame (Back cover) and Middle Cabinet
-> 0 b B (Side gap)

"b

Gap a between Front Frame and Middle Cabine


-> 0 a A (Side gap)

"a
Gap a between Front Frame and Middle Cabine
-> 0 a A (Left/ Right gap)

3) Gap between Back Cover and Side AV


Side View

Back View

Side AV

Back Cover

Gap f between Back Cover and Side AV


-> 0 f 1.0
Gap g between Back Cover and Side AV
-> 0 g 1.0
Copyright C 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes

-9-

LGE Internal Use Only

4)Gap between Back Cover and Side AV

Side View

"h"

Control Braket

Back Cover

Gap h between Back Cover and Control Bracket


-> 0 h 0.8
*Active area
1. Active area of LCD PANEL is in bezel of cabinet
2. Interval between active area and bezel
|A-B|< 2.0 mm ,|C-D|< 2.0 mm
A:Interval between left of active area and bezel
B:Interval between right of active area and bezel
C:Interval between top of active area and bezel
D:Interval between bottom of active area and beze
C
Active Area
B

Bezel

Copyright C 2009 LG Electronics. Inc. All right reserved.


Only for training and service purposes

- 10 -

LGE Internal Use Only

ADJUSTMENT INSTRUCTION
1. Application Range
This specification sheet is applied to all of the LCD TV,
LP91A/B/C/D chassis.

(2) Download steps


1) Execute ISP Tool program, the main window(Mstar ISP
utility Vx.x.x) will be opened
2) Click the Connect button and confirm Dialog Box

2. Specification
1) Because this is not a hot chassis, it is not necessary to use
an isolation transformer. However, the use of isolation
transformer will help protect test instrument.
2) Adjustment must be done in the correct order.
3) The adjustment must be performed in the circumstance of
25 5 C of temperature and 6510% of relative humidity if
there is no specific designation.
4) The input voltage of the receiver must keep 100~220V,
50/60Hz.
5) Before adjustment, execute Heat-Run for 5 minutes at RF
no signal.

3. Adjustment items
3.1. PCB assembly adjustment items
(1) Download the MSTAR main software
(IC800, Mstar ISP Utility)
1) Using D/L Jig
2) Using USB Memory Stick.
(2) ADC Calibration RGB / Component
(3) Input Tool-Option/Area option.
(4) Check SW Version.

4. PCB assembly adjustment method


4.1. Mstar Main S/W program download

3) Click the Config. button and Change speed I2C Speed


setting : 350Khz~400Khz

4.1.1. Using D/L Jig


(1) Preliminary steps
1) Connect the download jig to D-sub(RGB) jack
- LH20/ LH30

4) Read and write bin file.


Click (1)Read tab, and then load download
file(XXXX.bin) by clicking Read.

Filexxx.bin

Filexxx.

Copyright C 2009 LG Electronics. Inc. All right reserved.


Only for training and service purposes

- 11 -

LGE Internal Use Only

5) Click (2)Auto tab and set as below


6) Click (3)Run.
7) After downloading, you can see the (4)Pass message.

4.2. Adjust tool/area option.


Adjust tool/area option refer to the BOM.

4.3. Adjust tool/area option.


Adjust tool/area option refer to the BOM.

4.4. EDID D/L method


Recommend that dont connect HDMI and RGB(D-SUB) cable
when downloading the EDID.
If not possible, recommend that connect the MSPG equipment.
There are two methods of downloading the edid data

4.1.2. Using the Memory Stick


* USB download : Service Mode
1) Insert the USB memory stick to the ISB port.
2) Automatically detect the SW Version.
-> S/W download process is executed automatically.
3) Show the message Copy the file from the Memory

4.4.1. 1st Method


EDID datas are automatically downloaded when adjusting the
Tool Option2.
Automatically downloaded when pushing the enter key after
adjusting the tool option2.
It takes about 2seconds.

4.4.2. 2nd Method


* Caution :
Must be checked that the tool option is right or not.
If tool option is wrong, hdmi edid data could not be
downloaded well.
1) Press the ADJ key
2) Move to the EDID D/L and Press the right direction key(G)
3) Press the right direction key(G) at Start.
4) After about a few seconds, appear OK, then compele.

4) After Finished the Download, Automatically DC Off -> On

4.4.3. RS-232C command Method


(1) Command : AE 00 10
* Caution
Dont connect HDMI and RGB(D-SUB) cable when
downloading the EDID.
If the cables are connected, Downloading of edid could be
failed.

5) Check The update SW Version.


Copyright C 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes

- 12 -

LGE Internal Use Only

4.4.4. EDID data


(1) HD MODEL
<Analog(RGB): 128bytes>

4.5. ADC Calibration


4.5.1. ADC Calibration - Component (Using External pattern)
(1) Required Equipments
- Remote controller for adjustment
- MSPG-925F/MSPG-1025/MSPG-3233 Pattern Generator
(2) Process
1) Change the Input to Component1 or 2 mode.
2) Input the Component 480i@60Hz 100% Color Bar
YPbPr signal into Component1 or 2.
(MSPG-925F Model: 209 / Pattern: 65 )

<HDMI 1 : 256Bytes>

3) Press ADJ key on R/C for adjustment.


4) Enter Password number. Password is 0 0 0 0.
5) Select 0. ADC calibration : Component by using D/E
(CH +/-) and press ENTER(A).
6) ADC adjustment is executed automatically .
7) When ADC adjustment is finished, this OSD appear
<HDMI 2 : 256Bytes>

OK

4.5.2. ADC Calibration - RGB (Using External pattern)


(1) Required Equipments
- Remote controller for adjustment
- MSPG-925F/MSPG-1025/MSPG-3233 Pattern Generator
(2) Process
1) Change the Input to RGB mode..
2) Input the PC 1024x768@60Hz Horizontal Color Bar
signal into RGB.
(MSPG-925F Model: 60 / Pattern: 65 )

3) Press ADJ key on R/C for adjustment.


4) Enter Password number. Password is 0 0 0 0.
5) Select 0. ADC calibration : RGB by using D/E(CH +/-)
and press ENTER(A).
6) ADC adjustment is executed automatically .
7) When ADC adjustment is finished, this OSD appear
OK

Copyright C 2009 LG Electronics. Inc. All right reserved.


Only for training and service purposes

- 13 -

LGE Internal Use Only

4.6. Input Tool-Option, Area Option.


## TOOL Option, Area Option change and AC off
Before PCBA check, you have to change the Tool option,
Area option and have to AC off/on (Plug out and in)
(If missing this process, set can operate abnormally)

5.3. Connecting diagram of equipment for


measuring (For automatic adjustment)

4.6.1. Profile
: Must be changed the option value because being different
with some setting value depend on module maker, inch and
market
4.6.2. Equipment : adjustment remote control.
4.6.3. Adjustment method
The input methods are same as other chassis.(Use IN-START
Key on the Adjust Remocon.)
(If not changed the option, the input menu can differ the
model spec.)
* Refer to Job Expression of each main chassis assy
(EBTxxxxxxxx) for Option value
* Never push the IN-STOP KEY after completing the function
inspection.

* LP91A~D Support RS-232C & I2C DDC Communication-White


Balance Mode.
(1) Enter the adjustment mode of DDC
- Set command delay time : 50ms
- Enter the DDC adjustment mode at the same time heatrun mode when pushing the power on by power only key
- Maintain the DDC adjustment mode with same condition
of Heat-run => Maintain after AC off/on in status of Heatrun pattern display)
(2) Release the DDC adjustment mode
- Release the adjust mode after AC off/on or std-by off/on
in status of finishing the Hear-run mode
- Release the Adjust mode when receiving the aging off
command(F3 00 00) from adjustment equipment.
- Need to transmit the aging off command to TV set after
finishing the adjustment.
- Check DDC adjust mode release by exit key and release
DDC adjust mode)

4.7. Check SW Version


(1) Method
1) Push In-star key on Adjust remote-controller.
2) SW Version check
Check SW VER : V3.xx LH20

(3) Enter the adjust mode of white balance)


- Enter the white balance adjustment mode with aging
command (F3, 00, FF)
* Luminance min value is 150cd in the Cool/Medium/Warm
mode(For LCD)

5.3. Adjustment of White Balance (for Manual


adjustment)

5. White Balance adjstment


5.1. Overview
(1) Purpose : Adjust the color temperature to reduce the
deviation of the module color temperature.
(2) Principle : To adjust the white balance without the
saturation, Fix the one of R/G/B gain to 192 (default data)
and decrease the others.
(3) Adjustment mode : Three modes Cool / Medium / Warm

5.2. Required Equipment


(1) Remote controller for adjustment
(2) Color Analyzer : CA100+ or CA-210 or same product LCD TV (ch:9)
(should be used in the calibrated ch by CS-1000)
(3) Auto W/B adjustment instrument(only for Auto adjustment)

Copyright C 2009 LG Electronics. Inc. All right reserved.


Only for training and service purposes

- 14 -

(1) Color analyzer(CA100+, CA210) should be used in the


calibrated ch by CS-1000
(2) Operate the zero-calibration of the CA100+ or CA-210,
then stick sensor to the module when adjusting.
(3) For manual adjustment, it is also possible by the following
sequence.
1) Select white pattern of heat-run by pressing POWER
ON key on remote control for adjustment then operate
heat run longer than 15 minutes. (If not executed this
step, the condition for W/B may be different.)
2) Push Exit key.
3) Change to the AV mode by remote control.
4) Input external pattern (85% white pattern)
5) Push the ADJ key -> Enter 0000 (Password)
6) Select 3. W/B ADJUST
7) Enter the W/B ADJUST Mode
8) Stick the sensor to the center of the screen and select
each items (Red/Green/Blue Gain and Offset) using
D/E(CH +/-) key on R/C..
9) Adjust R/ G/ B Gain using F/G(VOL +/-) key on R/C.
10) Adjust three modes all (Cool / Medium / Warm) : Fix
the one of R/G/B gain and change the others
11) When adjustment is completed, Enter COPY ALL.
12) Exit adjustment mode using EXIT key on R/C.
LGE Internal Use Only

* CASE
First adjust the coordinate far away from the target value(x, y).
1. x, y > target
i) Decrease the R, G.
2. x, y < target
i) First decrease the B gain,
ii) Decrease the one of the others.
3. x > target, y < target
i) First decrease B, so make y a little more than the target.
ii) Adjust x value by decreasing the R
4. x < target, y > target
i) First decrease B, so make x a little more than the target.
ii) Adjust x value by decreasing the G
(4) Standard color coordinate and temperature when using the
CA100+ or CA210 equipment
Coordinate
Mode
Cool

0.2760.002 0.2830.002

Temp

uv

11000K

0.000

Medium

0.2850.002 0.2930.002

9300K

0.000

Warm

0.3130.002 0.3290.002

6500K

0.003

To check the Coordinates of White Balance, you have to


measure at the below conditions.
Picture Mode : User 1
Dynamic Contrast : Off
Dynamic Colour : Off
(If you miss the upper condition, the coordinates of W/B
can be lower than the spec.)

Copyright C 2009 LG Electronics. Inc. All right reserved.


Only for training and service purposes

- 15 -

LGE Internal Use Only

TROUBLESHOOTING
: [A]

No power
(LED indicator off)

PROCESS
Fail

Check 24V, 12V, 5,2V


of Power B/D

Check short of Main B/D


or Change Power B/D

Pass
Fail

Check Output of
IC1001, IC1003, IC1007

Check short of IC1001, IC1003, IC1007

Fail

Re-soldering or Change defect


part of IC1001, IC1003, IC1007

Pass
Pass
Change IC1002,, Q1003
Fail

Check LED Assy

Change LEDAssy

Pass

Check P307 Connector

No Raster

[B]: Process

Pass

Check LED status


On Display Unit

Fail

Repeat A PROCESS

Pass

Check Panel Link Cable


Or Module

Fail

Change Panel Link Cable


Or Module

Fail

Change Inverter Connector


Or Inverter

Pass

Check Inverter Connector


Or Inverter
Pass

Check Output of IC802

Fail

Change IC802

Pass
Check LVDS Cable

Fail

Copyright C 2009 LG Electronics. Inc. All right reserved.


Only for training and service purposes

Change Module

- 16 -

LGE Internal Use Only

No Raster on PC Signal

Pass
Check Input source Cable And Jack
Pass
Check the Input/Output
Of J104

Re-soldering or
Change the defect part

Fail

Pass
Check the Input/Output
Of IC100

Re-soldering or
Change the defect part,
Check RGB EDID Data

Fail

Pass
Check the Input/Output
Of IC800

Re-soldering or
Change the defect part

Fail

Pass
Repeat [A], & [B] Process

No Raster on HDMI Signal

No Raster on COMMPONENT Signal

Pass

Pass

Check Input source


Cable And Jack

Check Input source


Cable And Jack

Pass

Pass
Check The Input/Output
Of JK101

Check the Input/Output


Of JK301, JK302, JK303
Fail

Re-soldering or
Change the defect part

Check the Input/Output


Of JK301, JK302, JK303

Fail

Re-soldering or
Change the defect part

Fail

Re-soldering or
Change the defect part

Pass

Pass
Check the Input/Output
Of IC800

Fail

Re-soldering or
Change the defect part

Pass
Check the Input/Output
Of IC300, IC301, JK302

Fail

Pass

Repeat [A], & [B] Process

Check the Input/Output


Of IC800

Fail

Re-soldering or
Change the defect part
Check HDMI EDID Data
Re-download HDCP
Re-soldering or
Change the defect part

Pass
Repeat [A], & [B] Process

Copyright C 2009 LG Electronics. Inc. All right reserved.


Only for training and service purposes

- 17 -

LGE Internal Use Only

No Raster On AV (Video, S-Video)Signal

No Signal On TV(RF) Signal

Pass

Pass

Check Input source


Cable And Jack

Check Input source


Cable And Jack

Pass
Check The Input/Output
Of JK101, JK201

Pass

Fail

Re-soldering or
Change the defect part

Fail

Re-soldering or
Change the defect part

Check The Input/Output


Of TU500

Pass
Check the Input/Output
Of IC800

Fail

Re-soldering or
Change the defect part

Fail

Re-soldering or
Change the defect part

Pass
Check the Input/Output
Of IC800

Pass

Pass

Repeat [A], & [B] Process

Repeat [A], & [B] Process

No Sound

Check The Input


Sourse

Fail

Change The Source Input

Pass

Check The Input/Output


Of IC600

Fail

Re-soldering or
Change the defect part

Pass

Check The Speaker

Fail

Change Speaker

Pass
Check The Speaker Wire

Copyright C 2009 LG Electronics. Inc. All right reserved.


Only for training and service purposes

- 18 -

LGE Internal Use Only

Copyright C 2009 LG Electronics. Inc. All right reserved.


Only for training and service purposes

- 19 -

AV2
( Sid e AV)

HDMI3

USB

USB
Fo r D/ L

RS232

TV
( RF)

AV1

MNT_OUT

COMP1
COMP2

RGB_PC

PC_Aud io

EEPROM
24C02

SIDE_V : 1Vp p

SIF

SUB_SCL / SDA

PC_SCL/ SDA

EEPROM
24C02
HDMI3_SCL/ SDA

AUDIO
AMP

HDMI1_SCL/
_
SDA

HDM 2_SCL/ SDA

232C Driver
ST3232C

SIDE_L/ SIDE_R :5 00mVrms

TMDS

Tx/ Rx : 15Vp p

TUNER

TU_MAIN

MNT_LOUT/ ROUT: 500m Vrm s

AV11_LIN/ RIN :5 00m Vrms

MNT_OUT: 1Vp p

AV1_VIN: 1Vp p

COMP2_Y/ Pb /Pr
/
: 1/ 0. 7Vp p
Co mp 1_L/ R :5 00mVrms
Co mp 2_L/ R :5 00mVrms

Pr : 1/ 0. 7Vp p
COMP1_Y/ Pb / P

PC_R/ G/ B/ HS/ VS

EEPROM
24C02

EEPROM
24C02
PC_Aud io _L/ R :7 00m Vrms

TMDS
TMDS

AV2_VIN

AV2_LIN/ RIN

HDMI_DATA_3

USB_DN/ PN

IIS_OUT

OUT_O_TX_A
OUT_O_TX_A
OUT_O_TX_B
OUT_O_TX_B
OUT_O_TX_C
OUT_O_TX_C
OUT_O_TX_CLK
OUT_O_TX_C
OUT_O_TX_D
OUT_O_TX_D
OUT_O_TX_E
OUT_O_TX_E

OUT_E_TX_A
OUT_E_TX_A
OUT_E_TX_B
OUT_E_TX_B
OUT_E_TX_C
OUT_E_TX_C
OUT_E_TX_CLK
OUT_E_TX_CLK
OUT_E_TX_D
OUT_E_TX_
OUT_E_TX_E
OUT_E_TX_

MAIN SCALER

TXD / RXD :5V Dig it al

SIF

TU_MAIN

MNT_L/ R OUT

AV1_LIN/ RIN

MNT_VOUT

AV1_VIN

COMP2_LIN/ RIN

COMP2_Y/ Pb / Pr: 1/0. 7Vp p


MNT_OUT RIN
COMP1_LIN/

COMP1_Y/ Pb / Pr: 1/ 0. 7Vp p

PC_R/ G/ B/ HS/ VS

PC_Aud io _L/ R

IR
HDMI_DATA_1
HDMI_DATA_2
TX

DDR2( 512MB)

EEPROM( 256K)

Serial Flas h
( 8MByt e)

PWM
NTP3100L
R_CH
L_CH

L VDS c onnec tor

HDMI1
HDMI2

R_SPK_OUT
L_SPK_OUT

BLOCK DIAGRAM

LGE Internal Use Only

EXPLODED VIEW
IMPORTANT SAFETY NOTICE

310

A2

510

300

500

LV1

120

A10

200N

900

200T

200

802

550

803

804

801

806

530

540

805

520

400

Many electrical and mechanical parts in this chassis have special safety-related characteristics. These
parts are identified by
in the Schematic Diagram and EXPLODED VIEW.
It is essential that these special safety parts should be replaced with the same components as
recommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.

Copyright
LG Electronics. Inc. All right reserved.
Only for training and service purposes

- 20 -

LGE Internal Use Only

VSS

A2

A1

A0

1K

1K

150

SDA

SCL

WP

VCC

2K

22

R8000
10K

Q800
ISA1530AC1
B E
C
R886

C870
47uF25V

R885

220

R807
402
READY

R808

E
C B
Q801
ISA1530AC1

+12V_AUDIO

R813

22

C803
0.01uF

R812

SW800
JTP-1127WEM

+5VST_MST

R810
68

R8041
C
B
E
47
Q802
RT1C3904-T112

R809
470

R8006 22

R8005 22

R817
4.7K

EEP_SDA

EEP_SCL

EEP_SDA

EEP_SCL

R888
C814
0.1uF

C8000
READY

1K

R853

D802
KDS181

MNT_VOUT_T

R8028
4.7K

+3.3V_MULTI_MST

R8027
4.7K

100
R887
33K

Q803
RT1C3904-T112

R855
10K

+5VST_MST

2.2uF E
16V

C871
4.7uF
10V
READY

+5VST_MST

D803
KDS181

C812
4.7uF

C819

C815

0.1uF

0.1uF

0.1uF

C810

C838

SYS_RESET

MULTI_PW_SW

POWER_DET

RL_ON

MNT_L_AMP
MNT_R_AMP

SIDE_LIN
SIDE_RIN

MAIN_SIF

MNT_VOUT_T

TV_MAIN

COMP2_PR
SIDE_C
SIDE_Y
CVBS_VIN
SIDE_V

COMP2_PB
COMP2_Y

PC_R

PC_B
PC_G

HDMI_2
0.01uF

0.1uF

C804/C805/C806:Close to IC
as close as possible

Q804
NON 19_22"
RT1C3904-T112
R8037
C B R8007 33K
E
NON 19_22"
0

NON 19_22"

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES


SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

RESET

R861

D801
KDS181

R8001

R8036
20K
19_22_26"

R860

R800
READY
0

SDA

SCL

WP

VCC

IC803
CAT24WC08W-T

P_24V_SMALL_15V
P_12V_SMALL_15V

MNT_VOUT

GAIN X 4

R8004
4.7K

HDCP EEPROM

VSS

A2

A1

3 1

A0

C833

0.01uF

C841

0.1uF
0.1uF
2.2uF
2.2uF
100
100
100
100

C856
C861
R882
R881
R846
R847

0.047uF
0.047uF
0.047uF

0.047uF
0.047uF
1000pF
0.047uF
0.047uF
0.047uF
0.047uF
0.047uF

0.047uF

0.047uF

C868
C869

C834
C836
C837

C826
C828
C835
C830
C800
C801
C831
C832

C829

+1.2V_VDDC_MST

22K

47
47

R875
R876

22K
0.01uF

47
47
47

R831
R857
R830

R845

47
47
470
47
47
47
47
47

R832
R834
R835
R837
R804
R815
R897
R802

R842
C839

47

C827

47

R836

10
10

R891
R892

R833

10
10

R880
R890

R814
R803
R816
R818
R838

10
10
10
10
10
10

R869
R871
R872
R873
R874
R879

390
0.1uF
0.1uF
0.1uF
0.047uF
1000pF
0.047uF
0.047uF
0.047uF

10
10

R859
R862

R840
C804
C805
C806
47 C843
470 C846
47 C845
47 C847
47 C825

TMDS1_RX2TMDS1_RX2+
HPD_MST_1

TMDS1_RX1TMDS1_RX1+

TMDS2_RX2TMDS2_RX2+
TMDS1_RXCTMDS1_RXC+
TMDS1_RX0TMDS1_RX0+

100

0.1uF
C883

POWER_SW
SYS_RESET
CEC_C
PC_VS
PC_HS
0
0
R8035
R8034

TXD
LED_R

100
100
R895
R849

IR
DSUB_SDA
RXD
100
100
R850
R8012

KEY2
KEY1

0
READY
0
READY
R8016
R8017

100
100
R824
R825

C816 20pF

C817 20pF
X801
12MHz
R839
1M

I2S_WS
I2S_MCLK
PANEL_STATUS
R829

TXD
RXD
EEP_SCL
EEP_SDA
RL_ON
I2S_SDO
I2S_SCK
100 R8022
100 R8021

0.1uF
C844

MST99A88ML(MATRIX BASIC)

+3.3V_MULTI_MST

4.7K

4.7K

R864

R863

HDMI_3

+3.3V_MULTI_MST

R867 1K
1K
R868

0.1uF
C863

DDR2_A[6]
DDR2_A[4]
DDR2_A[2]
DDR2_A[0]
AR815
56

AR813
56

AR812
56

DDR2_CKE
56

DDR2_A[11]
DDR2_A[8]
DDR2_BA1
DDR2_WEZ
AR814
56

DDR2_A[3]
DDR2_A[7]
DDR2_A[12]
DDR2_A[9]
DDR2_A[5]
DDR2_A[10]
DDR2_A[1]
R852

DDR2_CASZ
DDR2_RASZ
DDR2_ODT
AR800
56

DDR2_BA0

HWRESET 256
CEC 255
VSYNC1 254
HSYNC1 253
VSYNC0 252
HSYNC0 251
IRIN 250
GPIO140 249
GPIO139 248
GPIO138 247
GPIO135 246
GPIO134 245
XIN 244
XOUT 243
AVDD_MPLL 242
SAR3 241
SAR2 240
SAR1 239
SAR0 238
USB0_DP 237
USB0_DM 236
GND_18 235
GND_17 234
UART1_TX/GPIO87 233
UART1_RX/GPIO86 232
UART2_TX/I2CM_SCK 231
UART2_RX/I2CM_SDA 230
SPDIFO 229
I2S_OUT_SD 228
I2S_OUT_BCK 227
VDDC_7 226
GND_16 225
VDDP_5 224
I2S_OUT_WS 223
I2S_OUT_MCK 222
I2S_IN_SD 221
I2S_IN_BCK/GPIO68220
I2S_IN_WS/GPIO67219
VDDC_6 218
A_MCLKE 217
A_MADR[3] 216
A_MADR[7] 215
A_MADR[12] 214
A_MADR[9] 213
A_MADR[5] 212
AVDD_DDR_6 211
A_MADR[10] 210
A_MADR[1] 209
A_BADR[0] 208
A_BADR[1] 207
A_WEZ 206
A_MADR[11] 205
A_MADR[8] 204
A_MADR[6] 203
GND_15 202
A_MADR[4] 201
A_MADR[2] 200
A_MADR[0] 199
A_CASZ 198
A_RASZ 197
A_ODT 196
MVREF 195
AVDD_MEMPLL
194
GND_14 193
IC800

R884
1K
READY

R883
1K

[MODE SELECTION]

R889
1K

R811
1K
READY

+3.3V_MULTI_MST

C842

0.1uF

0.01uF

100

R8042

C850

1K

R8038

0.1uF

0.1uF

C849

C848

0.1uF

C853

DDR2_D[13]
DDR2_D[10]
DDR2_D[8]
DDR2_D[15]

R8018

DDR2_D[6]
DDR2_D[1]
DDR2_D[3]
DDR2_D[4]

DDR2_D[14]
DDR2_D[9]
DDR2_D[12]
DDR2_D[11]

1K

1
2
3

187

10
11
12
13
14

176

173

174

175

177

178

179

180

181

182

183

184

185

16

20

19

18

17

15

186

188

189

190

191

192

R893 4.7K

165

161

158

154

144

SIF0M

AUVRM

AUR5

AUL5

VDDC_1

AUOUTL2
AUOUTL1

AUOUTR2
AUOUTR1

52
53

56
57
58
59
60
61
62
63
64

129

130

131

132

133

134

135

136

137

138

139

140

141

142

143

145

146

147

148

149

150

151

152

153

155

38

48

51

50

49

47

46

45

44

43

42

41

40

39

156

157

159

160

162

163

164

166

167

168

169

170

172

27

31

34

37

36

35

33

32

30

29

28

26

25

24

171

21

22

23

54
SIF0P 55

GND_3

CVBSOUT

AVDD_33_4

VCOM0

CVBS0

VCOM1

CVBS1

CVBS2

CVBS3

CVBS4

CVBS5

CVBS6

RIN2P

SOGIN2

GIN2P

BIN2P

GND_2

AVDD_33_3

RIN0P

RINM

SOGIN0

GIN0P

GINM

BIN0P

BINM

RIN1P

GIN1P

SOGIN1

BIN1P

REFM

REFP

VCLAMP

REXT

HOTPLUGA

C858
0.01uF

C859
0.01uF

B_DDR2_DQS[0]

B_DDR2_DQSB[0]

AVDD_DDR_3

VDDP_4

GND_12

B_DDR2_DQS[1]

B_DDR2_DQSB[1]

AVDD_DDR_4

B_MDATA[15]

B_MDATA[8]

GND_13

B_MDATA[10]

B_MDATA[13]

AVDD_DDR_5

B_MDATA[7]

B_MDATA[0]

B_MDATA[2]

B_MDATA[5]

B_MCLK

B_MCLKZ

TXCE4TXCE4+
TXCE3TXCE3+
TXCLKETXCLKE+
TXCE2TXCE2+
TXCE1TXCE1+
TXCE0TXCE0+

TXCO4TXCO4+
TXCO3TXCO3+
TXCLKOTXCLKO+
TXCO2TXCO2+
TXCO1TXCO1+
TXCO0TXCO0+

+3.3V_MULTI_MST

DDR2_D[0-15]

C864
0.01uF

+1.8V_DDR

C857
0.01uF

+1.2V_VDDC_MST

LVB4P

LVB4M

LVB3P

LVB3M

LVBCKP

LVBCKM

LVB2P

LVB2M

LVB1P

LVB1M

LVB0P

LVB0M

AVDD_LPLL

GND_7

VDDC_4

GPIO150/I2C_OUT_MUTE

GPIO151/I2C_OUT_SD2

GPIO152/I2C_OUT_SD3

GND_8

GPIO51

GPIO52

GPIO53

GPIO54

GPIO55

GPIO56

GPIO57

GPIO58

VDDP_3

VDDC_5

B_MDATA[4]

B_MDATA[3]

GND_9

B_MDATA[1]

B_MDATA[6]

AVDD_DDR_1

B_MDATA[11]

B_MDATA[12]

GND_10

B_MDATA[9]

B_MDATA[14]

AVDD_DDR_2

B_DDR2_DQM[1]

B_DDR2_DQM[0]

GND_11

IC800-*1
LGE3767A [MST99A88ML(MATRIX ONLY SD DIVX_ NON RM) ]

RXA2P

RXA2N

GND_1

RXA1P

RXA1N

AVDD_33_2

RXA0P

RXA0N

RXACKP

RXACKN

RXB2P

RXB2N

AVDD_33_1

RXB1P

RXB1N

HOTPLUGB

RXB0P

RXB0N

RXBCKP

RXBCKN

OPC_EN

MUTE_LINE R865 4.7K


SUB_SCL
R866 4.7K
SUB_SDA
S_VIDEO_DET
PANEL_ON R819 3.3K
DISP_EN/VAVS_ON
SW_RESET
DDC_WP

AR810
56

AR809
56

DDR2_DQM0
DDR2_DQM1

DDR2_DQS0M
DDR2_DQS0P

DDR2_DQS1M
DDR2_DQS1P

AR806
56

65

+3.3V_MULTI_MST

HWRESET

66
AUL0

IC801
24LC256-I/SM

CEC
255

256

67
AUL1

AUR0

HDMI_1

GND

DDR2_MCLKZ
DDR2_MCLK
DDR2_D[5]
DDR2_D[2]
DDR2_D[0]
DDR2_D[7]

HSYNC1
68

AUL0
AUR0
AUL1
AUR1
AUL2
AUR2
AUL3
AUR3
AUCOM
AUL4
AUR4
GND_4
AUVRP
AUVAG
AVDD_AU
GND_5
VDDC_2
DDCA_CK
DDCA_DA
DDCDA_CK
DDCDA_DA
DDCDB_CK
DDCDB_DA
GPIO20
VDDP_1
VDDC_3
UART2_RX
UART2_TX
DDCDC_CK
RXCCKN
RXCCKP
DDCDC_DA
RXC0N
RXC0P
GND_6
RXC1N
RXC1P
AVDD_DM
RXC2N
RXC2P
HOTPLUGC
USB1_DM
USB1_DP
SCK
SDI
SDO
SCZ
PWM0
PWM1
PWM2
PWM3
LVA4P
LVA4M
LVA3P
LVA3M
LVACKP
LVACKM
LVA2P
LVA2M
LVA1P
LVA1M
LVA0P
LVA0M
VDDP_2

AR805
56

70

33
33

74
AUL4

R843
R844

VSYNC0
252

253

69
AUL2

AUR1

B_MCLKZ 192
B_MCLK 191
B_MDATA[5] 190
B_MDATA[2] 189
B_MDATA[0] 188
B_MDATA[7] 187
AVDD_DDR_5 186
B_MDATA[13] 185
B_MDATA[10] 184
GND_13 183
B_MDATA[8] 182
B_MDATA[15] 181
AVDD_DDR_4 180
B_DDR2_DQSB[1] 179
B_DDR2_DQS[1] 178
GND_12 177
VDDP_4 176
AVDD_DDR_3 175
B_DDR2_DQSB[0] 174
B_DDR2_DQS[0] 173
GND_11 172
B_DDR2_DQM[0] 171
B_DDR2_DQM[1] 170
AVDD_DDR_2 169
B_MDATA[14] 168
B_MDATA[9] 167
GND_10 166
B_MDATA[12] 165
B_MDATA[11] 164
AVDD_DDR_1 163
B_MDATA[6] 162
B_MDATA[1] 161
GND_9 160
B_MDATA[3] 159
B_MDATA[4] 158
VDDC_5 157
VDDP_3 156
GPIO58 155
GPIO57 154
GPIO56 153
GPIO55 152
GPIO54 151
GPIO53 150
GPIO52 149
GPIO51 148
GND_8 147
GPIO152/I2C_OUT_SD3 146
GPIO151/I2C_OUT_SD2 145
GPIO150/I2C_OUT_MUTE 144
VDDC_4 143
GND_7 142
AVDD_LPLL 141
LVB0M 140
LVB0P 139
LVB1M 138
LVB1P 137
LVB2M 136
LVB2P 135
LVBCKM 134
LVBCKP 133
LVB3M 132
LVB3P 131
LVB4M 130
LVB4P 129

71
AUL3

AUR2

RXBCKN
RXBCKP
RXB0N
RXB0P
HOTPLUGB
RXB1N
RXB1P
AVDD_33_1
RXB2N
RXB2P
RXACKN
RXACKP
RXA0N
RXA0P
AVDD_33_2
RXA1N
RXA1P
GND_1
RXA2N
RXA2P
HOTPLUGA
REXT
VCLAMP
REFP
REFM
BIN1P
SOGIN1
GIN1P
RIN1P
BINM
BIN0P
GINM
GIN0P
SOGIN0
RINM
RIN0P
AVDD_33_3
GND_2
BIN2P
GIN2P
SOGIN2
RIN2P
CVBS6
S-VIDEO
CVBS5
CVBS4
CVBS3
CVBS2
CVBS1
VCOM1
CVBS0
VCOM0
AVDD_33_4
CVBSOUT
GND_3
SIF0P
SIF0M
VDDC_1
AUL5
AUR5
AUVRM
AUOUTL2
AUOUTR2
AUOUTL1
AUOUTR1

72
AUR3

EEPROM

1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64

75
AUR4

10
10
10
10

76
GND_4

R851
R854
R856
R858

80
GND_5

TMDS2_RXCTMDS2_RXC+
TMDS2_RX0TMDS2_RX0+
HPD_MST_2
TMDS2_RX1TMDS2_RX1+

77
AUVRP

READY

78
AUVAG

8 SO/SIO1 WP/ACC 9

73
AUCOM

SPI_DO

81
VDDC_2

C866
10uF

79
AVDD_AU

L800
120-ohm

82

C867
0.1uF

83

DDC_WP

89

R828
C
B
E
10K
Q805 READY
RT1C3904-T112

93

R878
4.7K

94

GND 10

97

7 CS

98

SPI_CZ

103

+3.3V_MULTI_MST

105

NC_5 11

107

NC_6 12

109
SDI

6 NC_4

AVDD_DDR_6

111
SCZ

5 NC_3

A_MADR[10]
210

211
110
SDO

R877
4.7K

112
PWM0

+3.3V_MULTI_MST

113
PWM1

C823 2.2uF
65
CVBS_LIN
66
C824 2.2uF
CVBS_RIN
67
68
69
C802 2.2uF
COMP2_L
70
C873 2.2uF
COMP2_R
C874 2.2uF
71
72
C875 2.2uF
73
C808 0.1uF
Close to IC
74
C821
2.2uF
PC_AUD_L
with width trace
75
C822 2.2uF
PC_AUD_R
C809 10uF 16V
76
C813 0.1uF
77
78
C818 1000pF
79
C820 4.7uF
C840 0.01uF
L801
80
120-ohm
81
82
R894
0
DSUB_SCL
83
R899
0
DSUB_SDA
84
R8023
100
DDC_SCL1
85
R8024
100
DDC_SDA1
86
R8025
100
DDC_SCL2
87
R8026
100
DDC_SDA2
88
R8033
0 READY
POWER_DET
89
C882
0.1uF
90
R806
0
91
M_SDA
R870
0
92
M_SCL
R8039 100 HDMI3_SIDE
93
DDC_SCL3
R801
10 HDMI3_SIDE 94
TMDS3_RXCR805
10 HDMI3_SIDE 95
TMDS3_RXC+
R8040 100HDMI3_SIDE
96
DDC_SDA3
R820
10 HDMI3_SIDE 97
TMDS3_RX0R821
10 HDMI3_SIDE 98
TMDS3_RX0+
99
R822
10 HDMI3_SIDE 100
TMDS3_RX1R823
10 HDMI3_SIDE 101
TMDS3_RX1+
C876 0.01uF
102
R841
10 HDMI3_SIDE 103
TMDS3_RX2R848
10 HDMI3_SIDE 104
TMDS3_RX2+
105
HPD_MST_3
106
R826
0
USB_DN
107
USB PART USB_DP
R827
0
108
SPI_CLK
109
AR818
SPI_DI
33
110
SPI_DO
111
SPI_CZ
112
113
114
I-DIM
115
E-DIM
116
117
118
119
120
121
122
123
124
125
126
127
128

+1.2V_VDDC_MST

114
PWM2

+1.8V_DDR

115
PWM3

L802
120-ohm

116
LVA4P

+3.3V_MULTI_MST

118
LVA3P

SPI_DI

122
LVA2P

NC_7 13

124
LVA1P

NC_8 14

126
LVA0P

SI.SIO015

99
RXC0P

4 NC_2

100
GND_6
RXC0N

3 NC_1

GND_16

101
RXC1P
RXC1N

2 VCC

104
RXC2P
RXC2N

+3.3V_MULTI_MST

88
GPIO20

I2S_OUT

117
LVA4M

SPI_CLK

119
LVA3M

SCLK 16

123
LVA2M

1 HOLD

A_RASZ

125
LVA1M

C807
0.01uF

A_ODT
196

197

C860
0.01uF

C877
0.01uF

C862
0.01uF

C878
0.01uF

C865
0.01uF

C879
0.01uF

Close to IC as close as possible

127
LVA0M

+3.3V_MULTI_MST

90
VDDP_1

+1.8V_DDR

128
VDDP_2

R8003
10K

91
VDDC_3

+3.3V_MST

120
LVACKP

R8020
10K

108
SCK

USB1_DP

C811
0.1uF

121
LVACKM

+3.3V_MST

84
DDCA_CK

** Small HD : 19/22/26 Inch


** Non Small FHD : Normal(non 100Hz) FHD Model

SAR1

85
DDCA_DA

IC802
MX25L6405DMI-12G

102
AVDD_DM

SERIAL FLASH 64M

92
UART2_TX

UART2_RX

4.7K
R8010 4.7K R8011 +3.3V_MULTI_MST
R896
4.7K R898
4.7K
+3.3V_MULTI_MST
Small_HD
Small_HD
Non_Small_FHD
Small_FHD
R898-*2
R8010-*3
R896-*2
R8011-*3
4.7K
4.7K
4.7K
4.7K
100Hz
Non_Small_HD
100Hz
Apollo
DDR2_A[0-12]
R8010-*2
R8011-*2
R898-*1
R896-*1
4.7K
4.7K
4.7K
4.7K
Small_FHD
Non_Small_FHDApollo
Apollo
R8010-*1
R8011-*1
4.7K
4.7K
+5VST_MST
Small_FHD
Non_Small_HD

106
USB1_DM
HOTPLUGC

R8011
X
4.7K
4.7K
X
4.7K
4.7K

95
RXCCKP
RXCCKN
DDCDC_CK

R8010
4.7K
4.7K
X
4.7K
4.7K
X

VSYNC1
254

SAR2
240

SAR3
241

AVDD_MPLL
242

XOUT
243

XIN
244

GPIO134
245

GPIO135
246

GPIO138
247

GPIO139
248

GPIO140
249

IRIN
250

HSYNC0
251

VDDC_7
226

I2S_OUT_BCK
227

I2S_OUT_SD
228

SPDIFO
229

UART2_RX/I2CM_SDA
230

UART2_TX/I2CM_SCK
231

UART1_RX/GPIO86
232

UART1_TX/GPIO87
233

GND_17
234

GND_18
235

USB0_DM
236

A_MADR[5]
212

A_MADR[9]
213

A_MADR[12]
214

A_MADR[7]
215

A_MADR[3]
216

A_MCLKE
217

VDDC_6
218

I2S_IN_WS/GPIO67
219

I2S_IN_BCK/GPIO68
220

I2S_IN_SD
221

I2S_OUT_MCK
222

I2S_OUT_WS
223

A_CASZ
198

A_MADR[0]
199

A_MADR[2]
200

A_MADR[4]
201

GND_15
202

A_MADR[6]
203

A_MADR[8]
204

A_MADR[11]
205

A_WEZ
206

A_BADR[1]
207

A_BADR[0]
208

A_MADR[1]
209

GND_14
193

AVDD_MEMPLL
194

MVREF
195

USB0_DP
237

86
DDCDB_CK
DDCDA_CK

R898
X
X
X
4.7K
4.7K
4.7K

SAR0
238

239

87
DDCDB_DA

R896
Small HD
4.7K
Small FHD (27) 4.7K
Non Small HD
4.7K
Non Small FHD
X
Apollo
X
X
100HZ

VDDP_5
224

225
96
DDCDC_DA

Copyright
LG Electronics. Inc. All right reserved.
Only for training and service purposes
DDCDA_DA

*H/W OPTION

SCHEMATIC DIAGRAM
MSTAR

LGE Internal Use Only

Copyright
LG Electronics. Inc. All right reserved.
Only for training and service purposes
+1.8V_DDR

DDR2_DQS0M
DDR2_DQS1M

DDR2_DQM0
DDR2_DQM1

DDR2_DQS0P
DDR2_DQS1P

DDR2_RASZ
DDR2_CASZ
DDR2_WEZ

DDR2_ODT

DDR2_MCLK
DDR2_MCLKZ
DDR2_CKE

DDR2_BA1

DDR2_BA0

READY

R906
150

R901
56

R903
56

56

VDDL

VSSDL

NC3

NC2

NC1

NC6

NC5

NC4

UDQS

LDQS

UDM

LDM

UDQS

LDQS

WE

CAS

RAS

CS

ODT

CKE

CK

CK

BA1

BA0

A12

A11

J2

J1

J7

R8

E2

A2

R7

R3

L1

A8

E8

B3

F3

B7

F7

K3

L7

K7

L8

K9

K2

K8

J8

L3

L2

R2

P7

M2

P3

P8

P2

N7

N3

N8

N2

M7

M3

M8

H8

H2

F8

F2

E7

D8

D2

A7

B8

B2

P9

N1

J3

E3

A3

G9

G7

G3

G1

E9

C9

C7

C3

C1

A9

R1

M9

J9

E1

A1

B9

B1

D9

D1

D3

D7

C2

C8

F9

F1

H9

H1

H3

H7

G2

G8

VSSQ1

VSSQ2

VSSQ3

VSSQ4

VSSQ5

VSSQ6

VSSQ7

VSSQ8

VSSQ9

VSSQ10

VSS1

VSS2

VSS3

VSS4

VSS5

VDDQ1

VDDQ2

VDDQ3

VDDQ4

VDDQ5

VDDQ6

VDDQ7

VDDQ8

VDDQ9

VDDQ10

VDD1

VDD2

VDD3

VDD4

VDD5

DQ15

DQ14

DQ13

DQ12

DQ11

DQ10

DQ9

DQ8

DQ7

DQ6

DQ5

DQ4

DQ3

DQ2

DQ1

DQ0

DDR2 MEMORY

C919
10uF
10V

R905
56

R904

56

R902

56

A9

A8

A7

A6

A5

A4

A3

A2

A1

A0

VREF

IC900
HYB18TC512160B2F-2.5

DDR2_D[0-15]

A10/AP

V_REF

R900

C900
0.01uF
50V

DDR2_A[12]

DDR2_A[11]

DDR2_A[10]

DDR2_A[9]

DDR2_A[8]

DDR2_A[7]

DDR2_A[6]

DDR2_A[5]

DDR2_A[4]

DDR2_A[3]

DDR2_A[2]

DDR2_A[1]

DDR2_A[0]

Close to DDR2 IC

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES


SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

DDR2_A[0-12]

C918
0.1uF
50V

V_REF

C904
C905
0 . 0 1 u F 1000pF

+1.8V_DDR
1K
R907
1K
R908

DDR2_D[0-15]

+1.8V_DDR

DDR2_D[15]

DDR2_D[14]

DDR2_D[13]

DDR2_D[12]

DDR2_D[11]

DDR2_D[10]

DDR2_D[9]

DDR2_D[8]

DDR2_D[7]

DDR2_D[6]

DDR2_D[5]

DDR2_D[4]

DDR2_D[3]

DDR2_D[2]

DDR2_D[1]

DDR2_D[0]

C901
0.01uF

C902
0.01uF

C903
0.01uF

C906
0.01uF

Close to DDR2 IC
+1.8V_DDR

C907
0.01uF

C908
0.01uF

C909
0.01uF

C910
0.01uF

C911
0.01uF

C912
0.01uF

C913
0.01uF

C914
0.01uF

C915
0.01uF

C916
0.01uF

C917
0.01uF

DDR2

LGE Internal Use Only

Copyright
LG Electronics. Inc. All right reserved.
Only for training and service purposes

NC

24V

GND

12V

GND

5.2V

5.2V

GND

GND

NC

R1005
1.2K

R1002
10K

26"

23

21

19

17

15

13

11

25

24

22

20

18

16

14

12

10

5.2V

GND

GND

Power ON

24

PWM Dim

Error Out

R10450
CMO 32,42,47,57

R1043 0
NON CMO 32,42,47,57

R1042
0

R1041
0
CMO 57"

R1064 0

120-ohm

L1001

120-ohm

+5VST_MST

VIN

OPC_ENABLE
R1021
1K
OPC_DISABLE

R1075
1K

OPC_DISABLE
R1076
1K

NON 19_22"

R1022
1K
OPC_ENABLE

NC

NC

5V

5V

GND

GND

15V

15V

RL_ON

C1053
0.01uF

SMAW200-11

R1001 0
NON CMO 57"

PANEL_STATUS

11

10

C1044
2.2uF 16V

R1079
10K

I-DIM

R1023
0
NON (CMO 32,42,47,57, SHARP 32")

A.Dim

PWM_Dim

P1002

19_22"

+3.3V_MST
C1034
1uF 25V
READY

+5VST_MST
C1011
0.01uF

R1014
0
CMO 32,42,47,57

OPC_OUT

E-DIM

DISP_EN/VAVS_ON

+16V_NTP

+12V_AUDIO

C1001
0.1uF
50V

Inverter_ON
9

C1052
10uF16V

C1008
0.01uF

C1007
0.01uF

C1046
0.01uF

3
R1003 10K
12
NON 19_22"
Q1000
2SC3875S

R1000
2.2K

P_24V_SMALL_15V

**OPC_ENABLE : USE LGD Module

C1045
2.2uF 16V R1044-*1
100
DC_DIM PWM_DIM

R1044 1K
DC_DIM

R1039
0
CMO 32,42,47

3
R1047 10K
1 2 Q1002
2SC3875S

R1046
3K

+5V_MULTI

VOUT

NON 19_22"

P_5V

GND

3
2
MAX 300mA
1

P_12V_SMALL_15V

P_5V

IC1007
AP2121N-3.3TRE1

R1054 4.7K
NON SHARP 32&52",AUO
25V
R1053
C1043
0
0.47uF
SHARP 52",AUO
NON SHARP 52",AUO

R1040 0
CMO 57"

C1003
10uF
16V

C1002
47uF 25V

*ST 5V->3.3V

*SHARP32":DC DIMMING

Inverter ON

24V

GND

12V

GND

5.2V

5.2V

GND

GND

NON_19_22_26"

23

22

20

19

21

18

16

14

12

10

17

15

13

11

Power ON

PWM Dim

Error Out

Inverter ON

24V

GND

12V

GND

5.2V

P1000
FW20020-24S

NC

A.Dim

NC

24V

GND

12V

GND

5.2V

5.2V

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES


SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

D1002
SAM2333

+5V_MULTI

NC

A.Dim

+5VST_MST

LED Block

P_24V_SMALL_15V

P_12V_SMALL_15V

P_5V

R1077 0
READY

NC

GND

GND

P_5V

C1006
68uF
35V

R1074
0

P1001
FM20020-24

P_12V_SMALL_15V

L1000
CIC21J501NE
EAM58113401

19_22"

L1012
MLB-201209-0120P-N2

1/4W
5%

P_24V_SMALL_15V

C1004
10uF
16V

C1017
10uF
16V
GND
4

MAX 2A

PGND

SW

PVCC

EN

R1073

C1014
0 . 1 u FC1013
16V 10uF
16V

INPUT 3
C1054
0.1uF
1

P_12V_SMALL_15V

C1056
1uF25V

R1065
33K NON 19_22"

R1049
33K

R1068
10K
B

R1069
1.6K

R1070
22K

C1048
1uF

P_12V_SMALL_15V

L1008
CIC21J501NE

0
NON 19_22"

R1012

S2A 50V

19_22"
D1001

C1030
10uF
25V

R2

R1

Q1004
RT1C3904-T112

P_5V

R1065-*1
19_22" 10K C
R1048 10K
B
Q1001
RT1C3904-T112
R1020
E
10K

C1027
68uF
35V
READY
Close to Q1003

**DC-DC CONVERTER
12V->5V_TUNER/USB

POWER_SW

PANEL_ON

P_5V

G2

D2_1

6 D2_2

D1_2

S2 3

7 D1_1

Q1003
SI4925BDY
EBK32753101

G1 2

S1

C1031
10uF
25V

R1058
5.6K

R1057
30K

BS 4

IN 3

GND2

FB 1
C1032
560pF
50V

R1011

MAX 3A

IC1006
MP2212DN

5 VCC

6 SW_1

7 SW_2

8 EN/SYNC

R1059
10K
NON 19_22"

V0 = 0.8*(1+(R1/R2))

L1006
L1005
120-ohm
120-ohm
19/22"(HD)/22"(FHD)/32"(Sharp) 26/27/32(LPL)/37/42/47/52"

R2
C1018
10uF
16VR1010
3.3K
1%

R1009
2K
R1

1/10W 1/10W
1%

C1035
1uF 25V

C1029
0.1uF
50V

R1024
10

+5V_MULTI

L1009 3.6uH

READY

R1051
2.2K

C1024
0.1uF
50V
READY

R1007
56
1%

R1004
120
5%

C1020
10uF
16V

R1052
2.2K

C1033
0.1uF
50V

C1000
10uF
16V

OUT:5V

R1056
10

+5V_MULTI

R2

R1

OUT:1.85V
C1022 C1023
0.1uF
10uF
50V
6.3V

R1013
0

19_22"

R1015 10

C1025
0.1uF
16V

19_22"

+5V_MULTI

+5V_+12V_LCD

+5V_USB

RL_ON

Small(19_22")
3
R1017 10K
12
19_22"
Q1005
2SC3875S

R1016
4.7K

+5V_MULTI
19_22"

DDR2, Vref

NTP,AUDIO DSP

+1.8V

L1010
MLB-201209-0120P-N2
+5V_TUNER

C1010
0.01uF

C1038
1uF 25V
READY

C1009
100uF16V

120-ohm

C1037
1uF 25V
READY

+1.8V_DDR

+3.3V_MULTI_MST

OUT:1.27V
+1.2V_VDDC_MST

L1013
MLB-201209-0120P-N2

C1036
1uF 25V
READY

V0 = 1.25*(1+(R2/R1))

OUT

ADJ/GND

3 MAX 1A 2

0LCML00003B R1050
2.2K

C1026
100uF
16V

R1018
2K
NON 19_22"

IC1002
AP1117EG-13

L1007
MLB-201209-0120P-N2

C1015
0.1uF
50V

IN

C1019
C1021
10uF 16V 0.01uF

C1005
0.1uF

C1016
10uF
10V

2 OUTPUT OUT:3.3V
C1028
100uF16V

ADJ/GND

MAX 3A

IC1003
AZ1085S-3.3TR/E1

R1078
3.3
READY
C1055
2200pF
50V
READY

L1002
2.2uH

10K
R1006

V0 = 0.8*(1+(R2/R1))

C1012
560pF
50V

R1008
12K

ITH

VCC

IC1001
BD9130EFJ-E2

**Switch 12V:P12V
**Switch 5V:5V_MULTI -> 1.8V

+5V_MULTI

ADJ

**5V_MULTI->3.3V->1.2V

POWER

LGE Internal Use Only

R624

C604
10uF
16V

C600
10uF
16V

BST1A

4
5

11
12

AVDD_PLL

+1.8V_DVDD

C607
0.1uF
50V

C609
10uF16V

TEST0 14

DVDD_PLL

10

LFM

13

AGND_PLL

DGND_PLL

VDD_IO

CLK_I

VSS_IO 6

AD

DVSS_1

RESET

VDR1A

C610
0.1uF

READY

C642
10uF
35V

C615
0.1uF

C617
0.1uF

IC600
NTP-3100L

R602 R603
100 100

C638
33pF
50V
READY

C612
330uF35V

C616
22000pF

C613
0.01uF

R604
3.3

Main AMP

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES


SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

SPK_L-

SPK_L+

SMAW250-04

P600

+1.8V_DVDD

+1.8V_AVDD
C602
0.1uF

+3.3V_MULTI_MST

C608
R601 100 1uF
C606
1000pF

C605
C603
0.1uF
1000pF
C601
100pF
R600
3.3K

+1.8V_AVDD

I2S_MCLK

SPK_R+

0
R631
22KREADY
R627

READY

Q603
RT1C3904-T112

R630
10K

SPK_R-

MULTI_PW_SW

SW_RESET

READY

10KB

22000pF
PGND1A_2
56

R629

C611

16
DVDD

+3.3V_MST

PGND1A_1
55
SDATA
100
R676

MLB-201209-0120P-N2
0LCML00003B

OUT1A_2
54
17

+1.8V_DVDD

OUT1A_1
53
18
WCK
100
R677

+1.8V_AVDD

PVDD1A_2
52
19
BCK
100
R678

120-ohm

PVDD1A_1
51
20
SDA

0LCML00003B
L605

PVDD1B_2
50
21
SCL

15

PVDD1B_1
49
22
MONITOR_0
C639
33pF
50V
READY

I2S_SDO
I2S_WS
I2S_SCK
M_SDA
M_SCL
AMP_MUTE_HOTEL

R673 0
C651
1000pF
50V

C614
1uF

VDR2A
BST2A
PGND2A_2
PGND2A_1
OUT2A_2
OUT2A_1
PVDD2A_2
PVDD2A_1
PVDD2B_2
PVDD2B_1
OUT2B_2
OUT2B_1
PGND2B_2

40
39
38
37
36
35
34
33
32
31
30
29

C626
0.1uF

+16V_NTP

C671
0.01uF

R625
3.3

R626
3.3

C672
0.01uF

SPK_L-

R621
12

C634
390pF
R654
12

C673
1S
1F 0.47uF
EAP38319001

R658 R653
12
12
C630
L607
390pF
2S DA-8580 2F

C669
0.1uF R623
4.7K

C637 R663
0.1uF 4.7K

C629
0.1uF

C632
0.47uF

C625
22000pF

C624
1uF

MULTI_PW_SW

C623 22000pF

NC

41

1S
1F
EAP38319001

L603
2S DA-8580 2F

42

C618
1uF

C621
390pF
R610 R638
12
12

C619
390pF

R608 R611
12
12

+16V_NTP

OUT1B_2
48
23
MONITOR_1

L606

OUT1B_1
47
24
MONITOR_2

120-ohm

PGND1B_2
46
25

MLB-201209-0120P-N2

PGND1B_1
45

FAULT

+1.8V

BST1B
44

26

R656 0
HOTEL_OPT

DVSS_2

VDR1B
43

27
BST2B

28

VDR2B

Copyright
LG Electronics. Inc. All right reserved.
Only for training and service purposes
PGND2B_1

C643
0.1uF

C644
0.1uF

R667
4.7K
C647
0.01uF

R635
3.3

R671
3.3

C648
R628 0.01uF
4.7K

SPK_L-

SPK_L+

SPK_R-

SPK_R+

MNT_ROUT

R609
1K

R616-*12K

HOTEL_OPT

R616 10K

NON_HOTEL_OPT

C633 33pF

R615 5.6K

AMP_MUTE_HOTEL

R612 200 B
HOTEL_OPT

GND 11

8
9

SPK_R-_HOTEL

10

P601
12505WR-09A00
HOTEL_OPT
1

OUT3 8

SPK_R+_HOTEL

R619 0

HOTEL_OPT

R620 0
C636 HOTEL_OPT
0.1uF
HOTEL_OPT

+16V_NTP

7 OUT2

6 INPUT2- INPUT3- 9

5 INPUT2+ INPUT3+ 10

4 VCC

3 INPUT1+ INPUT4+ 12

2 INPUT1- INPUT4- 13

AUDIO_R

R622
6.8K

C635
0.01uF

R618
6.8K

IC601
1 OUT1 LM324DOUT4 14

R617 SW_RESET
10K
HOTEL_OPT
C Q602
RT1C3904-T112
HOTEL_OPT

+3.3V_MULTI_MST

Chinese Hotel Option

R606
4.7K

R614 5.6K

C631 33pF

R613 10K

NON_HOTEL_OPT

R613-*12K

+12V_AUDIO

C628
6800pF

MNT_R_AMP

Q601
RT1C3904-T112

C622
0.1uF

R607
1K
C627
6800pF

MNT_L_AMP

R605
4.7K

+12V_AUDIO

MNT_LOUT

Q600
RT1C3904-T112

C620
0.1uF

HOTEL_OPT

AMP :GAIN X 4
+12V_AUDIO

AUDI

LGE Internal Use Only

READY

Copyright
LG Electronics. Inc. All right reserved.
Only for training and service purposes

20 NC_9

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES


SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

SHIELD

21

C503
0.1uF
50V

L501
L501-*1
0
0 Ohm

C504
READY

Q502
ISA1530AC1
C

R507
220

R506
220

120-ohm

TV_MAIN

21

NTSC_TUNER

16

15

14

13

12

11

10

SHIELD

18

17

20

MAIN_SIF

M_SCL

C509
100uF16V

+5V_TUNER

C506
100uF16V

19 NC_8

R502
4.7K

R505 47

M_SDA

C505
100uF16V

19

C502
27pF

C508
10uF
16V

+5V_TUNER

Near the pin

NC_9

NC_8

NC_7

NC_6

SIF-OUT

A-OUT

NC_5

V-OUT

NC_4

MOPLL_AS

SCL

SDA

GND_2

NC_3

TP[3.3V_OPT]

RF_AGC

NC_2

+B[5V]

GND_1

NC_1

TAFT-H203F

TU500-*1

15 A-OUT
16 SIF-OUT
17 NC_6
18 NC_7

C507
82pF
READY

L502
10uH
READY

9 SDA
10
PAL_TUNER SCL
C500
27pF
11 MOPLL_AS
12 NC_4
13 V-OUT
14 NC_5

C501
0.01uF

R504 47

120-ohm

L500

6 TP[3.3V_OPT]
7 NC_3
8 GND_2

3 +B[5V]
4 NC_2
5 RF_AGC

2 GND_1

1 NC_1

TU500
TAFT-Z203D

TUNER

LGE Internal Use Only

HPD_MST_1

8 DATA0_SHIELD

21

20JACK_GND

1 DATA2+

2SC3875S

7 DATA0+

21

20JACK_GND

1 DATA2+

2 DATA2_SHIELD

3 DATA2-

4 DATA1+

5 DATA1_SHIELD

6 DATA1-

JP300

+5V_HDMI_1

R302
1K

RT1C3904-T112

8 DATA0_SHIELD

9 DATA0-

11
10 CLK+

12

13

14

15

16

17

18

19

Q300C

JK301
QJ41193-CFEE1-7F

22

2 DATA2_SHIELD

3 DATA2-

4 DATA1+

5 DATA1_SHIELD

6 DATA1-

7 DATA0+

JP301

SDA

SCL

WP

VCC

TMDS1_RX2+

CEC
TMDS1_RXCTMDS1_RXC+
TMDS1_RX0TMDS1_RX0+
TMDS1_RX1TMDS1_RX1+
TMDS1_RX2-

VSS

A2

A1

A0

SDA

SCL

WP

VCC

IC300
CAT24C02WI-GT3

CEC
TMDS2_RXCTMDS2_RXC+
TMDS2_RX0TMDS2_RX0+
TMDS2_RX1TMDS2_RX1+
TMDS2_RX2TMDS2_RX2+

VSS

A2

A0

A1

IC301
CAT24C02WI-GT3

R303
1K

9 DATA0-

11
10 CLK+

12

13

14

15

16

17

18

19

JK302
QJ41193-CFEE1-7F

22

Q301

RT1C3904-T112

R301
10K

R300
10K

HPD_MST_2

+5V_HDMI_2

JP303

JP302

R307 100

R306 100

R331 100

R305 100

R304 100

R327 100

A2

R308 R310
10K 10K
C302
0.01uF

D300
KDS184S

+5V_HDMI_1

+5V_MULTI

R309 R311
10K 10K
C301
0.01uF

DDC_WP

HPD_MST_3

DDC_SDA1
DDC_SCL1

DDC_WP

DDC_SDA2
DDC_SCL2

D301
KDS184S

A1

1 DATA2+

2 DATA2_SHIELD

3 DATA2-

4 DATA1+

5 DATA1_SHIELD

6 DATA1-

7 DATA0+

8 DATA0_SHIELD

9 DATA0-

10 CLK+

11 CLK_SHIELD

12 CLK-

13 CEC

14 NC

15 SCL

16 SDA

17DDC/CEC_GND

18+5V_POWER

Q303
BSS83
CEC_READY
D
B
S
G

VSS

A2

A1

A0

D304
CDS3C30GTH
30V CEC_READY

R313
0

D303
MMBD301LT1G
30V
CEC_READY

R315
68K
CEC_READY
R316
56K
CEC_READY

SDA

SCL

WP

VCC

CEC

CEC_C

IC302
CAT24C02WI-GT3

CEC
TMDS3_RXCTMDS3_RXC+
TMDS3_RX0TMDS3_RX0+
TMDS3_RX1TMDS3_RX1+
TMDS3_RX2TMDS3_RX2+

+3.3V_MST

JP305

JP304

RT1C3904-T112

Q302C
2SC3875S

19 HPD

KJA-ET-0-0032
JK303

20

JACK_GND

R312
10K

+5V_HDMI_3
R314
1K

R318 100

R317 100

R329 100

SW_HPD : USE SW HPD (Default)

A2
C300
0.01uF

A1

DDC_SDA3
DDC_SCL3

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES


SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

R319 R320
10K 10K

D302
KDS184S

+5V_HDMI_3

DDC_WP

MST_HPD : USE MST HPD

+5V_MULTI

+5V_MULTI
+5V_HDMI_2

A2

2SC3875S

A1

Copyright
LG Electronics. Inc. All right reserved.
Only for training and service purposes
C

OPTION

HDMI

LGE Internal Use Only

Copyright
LG Electronics. Inc. All right reserved.
Only for training and service purposes

AUDIO_R

MNT_ROUT

MNT_LOUT

MNT_VOUT

C100

POP NOISE

MUTE_LINE

16V 10uF C101


R101 0
HOTEL_OPT

SPK_R+_HOTEL

POP NOISE

MUTE_LINE

16V 10uF

SPK_R-_HOTEL

C
B E

Q101
RT1C3904-T112E

Q100
RT1C3904-T112

16V 100uF C102

R105 0
HOTEL_OPT
R106 0
NON_HOTEL_OPT

C103
100pF
READY

R103 0
HOTEL_OPT

R102 75

[YL]O-SPRING_B

D103
30V
NON_HOTEL_OPT

GND

SHIELD

S-VIDEO
JK101
PSJ014-01

C-LUG4

C-LUG3

0-SPRING

C-LUG2

C-LUG1

R122
75

R121
75

C104
OPT
READY

SIDE_Y

+3.3V_MULTI_MST

SIDE_C

SD05
ZD105

ADUC30S03010L_AMODIODE

D105
30V

D104
30V

ZD104
SD05

D100
30V

D101
30V

ZD100
SD05

ZD101
SD05

ZD102
SD05
SD05
ZD103

10K

10K

R112
220K

R116 10K

R111
220K

R115 10K

R110
75

R100
220K

R113

R104
220K

R114

R107
75

R108
75

R109
75

CVBS_RIN

CVBS_LIN

CVBS_VIN

COMP2_R

COMP2_L

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES


SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

R120
12K

R119
12K

R117
12K

R118
12K

COMP2_PR

COMP2_PB

COMP2_Y

AV1

S-VIDEO

R123
10K

S-VIDEO

3H [RD]CONTACT_A_2

4H [RD]O-SPRING_A_2

9H [RD]2P_CAN

8G [WH]C-LUG_A_2

9G [WH]2P_CAN

3F [YL]CONTACT_A

4F [YL]O-SPRING_A

9F [YL]2P_CAN

3E [RD]CONTACT_A_1

4E[RD]O-SPRING_A_1

9E[RD]1P_CAN_2

8D [WH]C-LUG_A_1

9D [WH]1P_CAN

8C [RD]C-LUG_A

9C [RD]1P_CAN_1

8B [BL]C-LUG_A

9B [BL]1P_CAN

3A [GN]CONTACT_A

4A [GN]O-SPRING_A

9A [GN]1P_CAN

COMPONENT1

ZD107
SD05

ZD106
SD05

D106
30V

D107
30V

6L

5L

7K

6J

5J

JK100
PPJ226-01

S_VIDEO_DET

[RD]CONTACT_B

[RD]O-SPRING_B

D102
30V
NON_HOTEL_OPT

[WH]C-LUG_B

[YL]CONTACT_B

S-VIDEO(China Model)

MNT_OUT

COMPONENT1, AV1, MNT_OUT[JACK PACK TYPE D] : JK100

INPUT1

LGE Internal Use Only

R2IN 8

T2OUT

V-

C2-

C2+ 4

C1- 3

V+

R230

JK201

9 R2OUT

10 T2IN

JK204

R204
4.7K

2C[RD]U_CAN

5C[RD]CONTACT

4C[RD]O_SPRING

2B[WH]U_CAN

3B[WH]C_LUG

2A [YL]U_CAN

L201 500

D207
30V
READY

D208
30V
READY

R201

USB_DP USB_DL_P

Its possibel to 27~47ohm


R200
USB_DN USB_DL_N
0

1A Design

C210 10uF6.3V

220uF
C212 16V

100uF
C214 16V

R205
4.7K

R237 0
Non_OCP

5.6B
ZD203

5.6B
ZD202

D205
30V

D206
30V

R227
75

RXD
TXD

IR_OUT

D201
ADUC30S03010L_AMODIODE
30V

D200
ADUC30S03010L_AMODIODE
30V

+3.3V_MST

100

100

5A[YL]CONTACT

Close to SIDE_USB

**

R203

R202

4A [YL]O_SPRING

PPJ218-01

SIDE_USB

REAR_USB

USB_DL_P

USB_DL_N

REAR_USB
R229

USB

R1OUT

11 T1IN

12

13 R1IN

14 T1OUT

15 GND

16 VCC

IC200
ST3232CDR

SIDE AV

C202
0.1uF

C201
0.1uF

C200
0.1uF

C1+ 1

KJA-UB-4-0004

+3.3V_MST

REAR_USB
JK205

R222
220K

READY

R225

R223
220K

READY

R224

10K

10K

10

VIN 1
GND 2
ENABLE 3

6 VOUT
5 ILIMIT
4 FAULT/

IC202 OCP_READY
MIC2009YM6-TR

Pin to Pin with


EAN43439401

SIDE_RIN

SIDE_LIN

C
A

KDS226
D213

AC

OCP_READY

R210
4.7K
OCP_READY
C208
0.1uF
OCP_READY

R238
510
OCP_READY
L200
120OHM
OCP_READY
C209
10uF
OCP_READY

+5V_USB

SHILED

15

14

13

12

11

VSS

A2

A1

A0

SDA

SCL

WP

VCC

R218
100

R217
100

READY

R219
4.7K

SHIELD_PLATE
8

R216
100

T_TERMINAL2

B_TERMINAL2

T_SPRING

R_SPRING

6B

7B

B_TERMINAL1

7A

E_SPRING
T_TERMINAL1

DDC_GND

DDC_CLOCK

SYNC_GND

GND_1

V_SYNC

NC

BLUE

H_SYNC

BLUE_GND

GREEN

DDC_DATA

GREEN_GND

RED

GND_2

RED_GND

6A

IC201
CAT24C02WI-GT3

PC EDID

JK203
PEJ024-01

16

10

PC SOUND

6630TGA004K

KCN-DS-1-0089

JK202

PC
C204
0.1uF

+5V_MULTI

R220
4.7K

R221
4.7K

R232
220K

10K

R234

R231
220K

10K

R233

PC_B
ZD201
SD05

ZD200
SD05

30V

PC_AUD_L

PC_AUD_R

D209

R215
4.7K

R214
4.7K

R208
68

R207
68

PC_VS

DSUB_SCL

C211
68pF

PC_HS

DSUB_SDA

C213
68pF

D204
ADUC30S03010L_AMODIODE

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES


SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

DDC_WP
DSUB_SCL
DSUB_SDA

R236
12K

R235
12K

R213
75

PC_G

PC_R

ADUC30S03010L_AMODIODE
30V

C207
0.1uF

C206
0.1uF

R212
75

C205
0.01uF

+5VST_MST

D203
30V
CDS3C30GTH

D202
30V
CDS3C30GTH

R211
75

AC

KCN-DS-1-0088

R209
1K
OCP_READY

OCP_READY
R206
160

R228
12K

12K

R226

SIDE_V

IR_OUT

UB01123-4HHS-4F

C203
0.1uF

5 4

1
2
3
4

Copyright
LG Electronics. Inc. All right reserved.
Only for training and service purposes

USB DOWN STREAM


5

ENKMC2837-T112
D210

JK200

ENKMC2837-T112
D211

AC

A
AC

ENKMC2837-T112
D212

RS-232C (CI ITEM)

INPUT2

USB DOWN STREAM

LGE Internal Use Only

Copyright
LG Electronics. Inc. All right reserved.
Only for training and service purposes

19_22_26"
P405

13

12

11

10

ZD401

ZD402

LED_R

LED_B

IR

GND

5V_ST

GND

KEY2

C414

19_22_26"

C402
100pF
50V

19_22_26"
L405
BG1608B121F

C404
470pF

L406 120ohm

C406
47uF
16V

L407 120-ohm
0

READY

R426 47K
IR-OUT
B

IR

R428 10K
IR-OUT

E Q405
2SC3052
IR-OUT

R427
10K
IR-OUT

+5VST_MST

NON_19_22_26"

C411
0.1uF

KEY2

KEY1

SUB_SCL

R418 0
READY

R406
4.7K
19_22_26"

+3.3V_MST

R415 10K
19_22_26"

R414
10K
19_22_26"

+3.3V_MST

Q402 E
2SC3052
19_22_26"

R404
10K
19_22_26"
R416 0
READY
R410 10K
19_22_26"

+3.3V_MULTI_MST

LED_R

R430 22
IR-OUT

C Q404
E 2SC3052
IR-OUT

R429
10K
IR-OUT

+5VST_MST

IR_OUT

KEY2

KEY1

19_22_26" C400
100pF
50V

19_22_26"

L401
BG1608B121F

19_22_26"
L400
BG1608B121F

C401
GND
100pF19_22_26"
50V

KEY2

KEY1

19_22_26"
P404

SMAW200-03

52

3
4
5

51

50

49

48

47

46

45

44

43

42

41

40

39

38

37

36

35

34

33

32

31

30

29

28

27

26

25

24

23

22

21

20

19

18

17

16

15

14

13

12

11

100

READY

R409

NON 22/27" FHD


R425 0
R431 0
NON 22/27" FHD

TXCO4-

TXCO4+

TXCO3-

TXCO3+

TXCLKO-

TXCLKO+

TXCO2+
TXCO2-

TXCO0+
TXCO0TXCO1+
TXCO1-

TXCE4-

TXCE4+

TXCE3-

TXCE3+

TXCLKE-

TXCLKE+

TXCE2-

TXCE2+

TXCE1-

8BIT(HD)
8BIT(FHD)
52 sharp
32 sharp

X
X
X
X

0
0
0
X

NON 22/27" FHD


R423 0

R424
0
VESA

R407
4.7K
JEIDA

+3.3V_MULTI_MST

*8BIT(FHD):22/27"

R401 R402
R402
0
8 B I T o r 5 2 s h a r p10BIT(FHD)4.7K X

R401
4.7K
10BIT

+3.3V_MULTI_MST

31

30

29

28

27

26

25

24

23

22

21

20

19

18

17

16

15

14

13

12

11

10

10

+5V_+12V_LCD

HD(26/32/37/42/47")

TXCE0+
TXCE0TXCE1+

P402
FF10001-30

NON 22/27" FHD


R419 0
R422 0
NON 22/27" FHD

+5V_+12V_LCD

TXCE0+

TXCE0-

TXCE1+

TXCE1-

TXCE2+

TXCE2-

TXCLKE+

TXCLKE-

TXCE3+

TXCE3-

P403

HD(19/22")

28

27

26

25

24

23

22

21

20

19

18

17

16

15

14

13

12

11

10

SMW200-28C

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES


SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

External VBR

E-DIM

OPC_OUT

OPC_OUTPUT

OPC_EABLE
C B
OPC_EN
OPC_ENABLE
E
Q400
RT1C3904-T112

R411
1K

OPC_ENABLE

OPC_ENABLE

R412

R405
READY
0

R435
470
OPC_ENABLE

+3.3V_MULTI_MST

TXCE0+

TXCE0-

TXCE1+

TXCE1-

TXCE2+

TXCE2-

TXCLKE+

TXCLKE-

TXCE3+

TXCE3-

+5V_+12V_LCD

TXCE0+,TXCE0-,TXCE1+,TXCE1-,TXCE2+,TXCE2-,TXCE3+,TXCE3-,TXCE4+,TXCE4-,TXCLKE+,TXCLKE-,TXCLKO+,TXCLKO-,TXCO0+,TXCO0-,TXCO1+,TXCO
1-,TXCO2+,TXCO2-,TXCO3+,TXCO3-,TXCO4+,TXCO4-

TF05-51S

FHD

CONTROL KEY
(19/22/26")

IR(19/22/26")

0
NON_19_22_26"

R400

+3.3V_MULTI_MST

0.1uF
READY
+3.3V_MST

L404
120-ohm

C408
0.1uF

R421
4.7K

+3.3V_MST

NON_19_22_26"

+5VST_MST

NON_19_22_26"

C412
470pF

L402 120ohm
C403
C407
47pF

0.1uFNON_19_22_26"
16V

R403

L403 120ohm
NON_19_22_26"

R420
4.7K

SUB_SDA

SUB_SCL

NON_19_22_26"

NON_19_22_26"

NON_19_22_26"
NON_19_22_26" R417
0

ZD400

19_22_26" C B
Q401 E
2SC3052

19_22_26"
L408
BG1608B121F

C405
100pF
50V
19_22_26"

READY
R413
0

POWER_ON(LED_R_SMALL)

ST_3.3V(LED_B)

GND

IR

WARM_ST(LED_R_BIG)

GND

5V_ST

KEY2

KEY1

GND

SDA

SCL

KEY1

12507WS-12L

P400

NON_19_22_26"

L411 500-ohm
NON_19_22_26"
L410 500-ohm
NON_19_22_26"

IR(Non 19/22/26)
CONTROL KEY(Non 19/22/26)

P401

TXCE0+,TXCE0-,TXCE1+,TXCE1-,TXCE2+,TXCE2-,TXCE3+,TXCE3-,TXCE4+,TXCE4-,TXCLKE+,TXCLKE-,TXCLKO+,TXCLKO-,TXCO0+,TXCO0-,TXCO1+,TXCO
1-,TXCO2+,TXCO2-,TXCO3+,TXCO3-,TXCO4+,TXCO4-

PANEL WAFER

LVDS/ CTR KEY

LGE Internal Use Only

P/NO : MFL60021515

Feb., 2009
Printed in Korea

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