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  • CCI Standard Server CPU Thermal Solution: Prepared by CCI PDD Rev: A04 Date: March. 21. 2014

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    Siap Siap
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    Heat control is vital for mobile devices There are two key IC-related heat issues with smartphones and tablet PCs. One is the need to avoid low-temperature burns when the skin touches the surface of a device. The other concerns the heat that the IC generates, which degrades the chip and device performance. Satoshi Matakawa, who was a Team Leader of Marketing Group III in the Electrical & Electronic Materials Division (at the time when we produced this report), told us that, “TVs and PCs use aluminum or copper foil, while laptop PCs and other equipment incorporate cooling fans. However the metal foil is too heavy and the thickness is a problem for thin and lightweight devices such as smartphones and tablet PCs. Accordingly, Kaneka offers graphite sheet as a thermal solution for mobile devices. The sheet is far more thermally conductive Heat control is vital for mobile devices There are two key IC-related heat issues with smartphones and tablet PCs. One is the need to avoid low-temperature burns when the skin touches the surface of a device. The other concerns the heat that the IC generates, which degrades the chip and device performance. Satoshi Matakawa, who was a Team Leader of Marketing Group III in the Electrical & Electronic Materials Division (at the time when we produced this report), told us that, “TVs and PCs use aluminum or copper foil, while laptop PCs and other equipment incorporate cooling fans. However the metal foil is too heavy and the thickness is a problem for thin and lightweight devices such as smartphones and tablet PCs. Accordingly, Kaneka offers graphite sheet as a thermal solution for mobile devices. The sheet is far more thermally conductive Heat control is vital for mobile devices There are two key IC-related heat issues with smartphones and tablet PCs. One is the need to avoid low-temperature burns when the skin touches the surface of a device. The other concerns the heat that the IC generates, which degrades the chip and device performance. Satoshi Matakawa, who was a Team Leader of Marketing Group III in the Electrical & Electronic Materials Division (at the time when we produced this report), told us that, “TVs and PCs use aluminum or copper foil, while laptop PCs and other equipment incorporate cooling fans. However the metal foil is too heavy and the thickness is a problem for thin and lightweight devices such as smartphones and tablet PCs. Accordingly, Kaneka offers graphite sheet as a thermal solution for mobile devices. The sheet is far more thermally conductive Heat control is vital for mobile devices There are two key IC-related heat issues with smartphones and tablet PCs. One is the need to avoid low-temperature burns when the skin touches the surface of a device. The other concerns the heat that the IC generates, which degrades the chip and device performance. Satoshi Matakawa, who was a Team Leader of Marketing Group III in the Electrical & Electronic Materials Division (at the time when we produced this report), told us that, “TVs and PCs use aluminum or copper foil, while laptop PCs and other equipment incorporate cooling fans. However the metal foil is too heavy and the thickness is a problem for thin and lightweight devices such as smartphones and tablet PCs. Accordingly, Kaneka offers graphite sheet as a thermal solution for mobile devices. The sheet is far more thermally conductive

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    Heat control is vital for mobile devices There are two key IC-related heat issues with smartphones and tablet PCs. One is the need to avoid low-temperature burns when the skin touches the surface of a device. The other concerns the heat that the IC generates, which degrades the chip and device performance. Satoshi Matakawa, who was a Team Leader of Marketing Group III in the Electrical & Electronic Materials Division (at the time when we produced this report), told us that, “TVs and PCs use aluminum or copper foil, while laptop PCs and other equipment incorporate cooling fans. However the metal foil is too heavy and the thickness is a problem for thin and lightweight devices such as smartphones and tablet PCs. Accordingly, Kaneka offers graphite sheet as a thermal solution for mobile devices. The sheet is far more thermally conductive Heat control is vital for mobile devices There are two key IC-related heat issues with smartphones and tablet PCs. One is the need to avoid low-temperature burns when the skin touches the surface of a device. The other concerns the heat that the IC generates, which degrades the chip and device performance. Satoshi Matakawa, who was a Team Leader of Marketing Group III in the Electrical & Electronic Materials Division (at the time when we produced this report), told us that, “TVs and PCs use aluminum or copper foil, while laptop PCs and other equipment incorporate cooling fans. However the metal foil is too heavy and the thickness is a problem for thin and lightweight devices such as smartphones and tablet PCs. Accordingly, Kaneka offers graphite sheet as a thermal solution for mobile devices. The sheet is far more thermally conductive Heat control is vital for mobile devices There are two key IC-related heat issues with smartphones and tablet PCs. One is the need to avoid low-temperature burns when the skin touches the surface of a device. The other concerns the heat that the IC generates, which degrades the chip and device performance. Satoshi Matakawa, who was a Team Leader of Marketing Group III in the Electrical & Electronic Materials Division (at the time when we produced this report), told us that, “TVs and PCs use aluminum or copper foil, while laptop PCs and other equipment incorporate cooling fans. However the metal foil is too heavy and the thickness is a problem for thin and lightweight devices such as smartphones and tablet PCs. Accordingly, Kaneka offers graphite sheet as a thermal solution for mobile devices. The sheet is far more thermally conductive Heat control is vital for mobile devices There are two key IC-related heat issues with smartphones and tablet PCs. One is the need to avoid low-temperature burns when the skin touches the surface of a device. The other concerns the heat that the IC generates, which degrades the chip and device performance. Satoshi Matakawa, who was a Team Leader of Marketing Group III in the Electrical & Electronic Materials Division (at the time when we produced this report), told us that, “TVs and PCs use aluminum or copper foil, while laptop PCs and other equipment incorporate cooling fans. However the metal foil is too heavy and the thickness is a problem for thin and lightweight devices such as smartphones and tablet PCs. Accordingly, Kaneka offers graphite sheet as a thermal solution for mobile devices. The sheet is far more thermally conductive

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    30 views18 pages

    CCI Standard Server CPU Thermal Solution: Prepared by CCI PDD Rev: A04 Date: March. 21. 2014

    Uploaded by

    Siap Siap
    Heat control is vital for mobile devices There are two key IC-related heat issues with smartphones and tablet PCs. One is the need to avoid low-temperature burns when the skin touches the surface of a device. The other concerns the heat that the IC generates, which degrades the chip and device performance. Satoshi Matakawa, who was a Team Leader of Marketing Group III in the Electrical & Electronic Materials Division (at the time when we produced this report), told us that, “TVs and PCs use aluminum or copper foil, while laptop PCs and other equipment incorporate cooling fans. However the metal foil is too heavy and the thickness is a problem for thin and lightweight devices such as smartphones and tablet PCs. Accordingly, Kaneka offers graphite sheet as a thermal solution for mobile devices. The sheet is far more thermally conductive Heat control is vital for mobile devices There are two key IC-related heat issues with smartphones and tablet PCs. One is the need to avoid low-temperature burns when the skin touches the surface of a device. The other concerns the heat that the IC generates, which degrades the chip and device performance. Satoshi Matakawa, who was a Team Leader of Marketing Group III in the Electrical & Electronic Materials Division (at the time when we produced this report), told us that, “TVs and PCs use aluminum or copper foil, while laptop PCs and other equipment incorporate cooling fans. However the metal foil is too heavy and the thickness is a problem for thin and lightweight devices such as smartphones and tablet PCs. Accordingly, Kaneka offers graphite sheet as a thermal solution for mobile devices. The sheet is far more thermally conductive Heat control is vital for mobile devices There are two key IC-related heat issues with smartphones and tablet PCs. One is the need to avoid low-temperature burns when the skin touches the surface of a device. The other concerns the heat that the IC generates, which degrades the chip and device performance. Satoshi Matakawa, who was a Team Leader of Marketing Group III in the Electrical & Electronic Materials Division (at the time when we produced this report), told us that, “TVs and PCs use aluminum or copper foil, while laptop PCs and other equipment incorporate cooling fans. However the metal foil is too heavy and the thickness is a problem for thin and lightweight devices such as smartphones and tablet PCs. Accordingly, Kaneka offers graphite sheet as a thermal solution for mobile devices. The sheet is far more thermally conductive Heat control is vital for mobile devices There are two key IC-related heat issues with smartphones and tablet PCs. One is the need to avoid low-temperature burns when the skin touches the surface of a device. The other concerns the heat that the IC generates, which degrades the chip and device performance. Satoshi Matakawa, who was a Team Leader of Marketing Group III in the Electrical & Electronic Materials Division (at the time when we produced this report), told us that, “TVs and PCs use aluminum or copper foil, while laptop PCs and other equipment incorporate cooling fans. However the metal foil is too heavy and the thickness is a problem for thin and lightweight devices such as smartphones and tablet PCs. Accordingly, Kaneka offers graphite sheet as a thermal solution for mobile devices. The sheet is far more thermally conductive

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    of 18

    CCI Standard Server CPU

    Thermal Solution

    Prepared byCCI PDD


    Rev: A04
    Date: March. 21. 2014

    CPU Heat Sinks


    SKU
    TOWER
    Heatpipe solution

    2U
    Extrusion solution

    Heatpipe solution

    1U /
    BLADE
    Heatpipe solution
    Extrusion solution

    Vapor Chamber solution

    TDP
    65W

    95W

    135W

    160W

    Server 1U CPU heatsink 65W Passive


    CCI part number: 00Z84570101
    Heatsink dimension: 84 x 106 x 25.5 mm
    -- Extrusion
    Total weight: 229 g
    Screw type: M4
    Socket R Narrow ( Hole pattern: 94 x 56 mm)
    Produced location: DG

    Server 1U CPU heatsink 105W Passive


    CCI part number: 0013309101
    Heatsink dimension: 90 x 89 x 30 mm
    -- Fin: Al 1050
    -- Base: ADC 6
    -- Block: Cu 1100
    -- Heat pipe: 6*2pcs
    Total weight: 219 g
    Screw type: M4
    Socket R ( Hole pattern: 80 x 80 mm)
    System air flow rate: 10 CFM
    Thermal resistance: 0.290 deg C/W
    Produced location: KS

    Server 1U CPU heatsink 120W Passive


    CCI part number: 0013075101
    Heatsink dimension: 128 x 82 x 22 mm
    -- Fin: Al 1050
    -- Base: ADC 6
    -- Block: Cu 1100
    -- Heat pipe: 6 *2pcs
    Total weight: 270 g
    Screw type: M4
    Socket R Narrow ( Hole pattern: 94 x 56 mm)
    System air flow rate: 10 CFM
    Thermal resistance: 0.297 deg C/W
    Produced location: KS

    Server 1U CPU heatsink 160W Passive


    CCI part number: 0013361101
    Heatsink dimension: 70 x 106 x 26.5 mm
    -- Fin: Cu 1100
    -- Base: Vapor chamber
    Total weight: 420 g
    Screw type: M4
    Socket R Narrow ( Hole pattern: 94 x 56 mm)
    System air flow rate: 30 CFM
    Thermal resistance: 0.208 deg C/W
    Produced location: KS

    Server 1U/Blade CPU heatsink 130W Passive


    CCI part number: 0012149101
    Heatsink dimension: 90 x 90 x 26 mm
    -- Fin: Cu 1100
    -- Base: Vapor chamber
    Total weight: 364 g
    Screw type: M4
    Socket R ( Hole pattern: 80 x 80 mm)
    System air flow rate: 13 CFM
    Thermal resistance: 0.228 deg C/W
    Produced location: KS

    Server 1U CPU heatsink 130W Passive


    CCI part number: 0011149101
    Heatsink dimension: 90 x 90 x 26 mm
    -- Fin: Cu 1100
    -- Base: Vapor chamber
    Total weight: 319 g
    Screw type: M4
    Socket R ( Hole pattern: 80 x 80 mm)
    System air flow rate: 16 CFM
    Thermal resistance: 0.224 deg C/W
    Produced location: KS

    Server 2U CPU heatsink 80W Passive


    CCI part number: 0022014331
    Heatsink dimension: 123 x 80 x 41.5 mm
    -- Extrusion
    Total weight: 353 g
    Screw type: M4
    Socket R Narrow ( Hole pattern: 94 x 56 mm)
    System air flow rate: 10 CFM
    Thermal resistance: 0.385 deg C/W
    Produced location: KS

    Server 1U/2U CPU heatsink 115W Passive


    CCI part number: 0013153101
    Heatsink dimension: 90 x 89 x 48 mm
    -- Fin: Al 1050
    -- Base: Cu 1100
    -- Heatpipe: 6 *3 pcs
    Total weight: 452 g
    Screw type: M4
    Socket R ( Hole pattern: 80 x 80 mm)
    System air flow rate: 20 CFM
    Thermal resistance: 0.180 deg C/W
    Produced location: KS

    10

    Server 2U CPU heatsink 135W Passive


    CCI part number: 0013137101
    Heatsink dimension: 106 x 70 x 63.5 mm
    -- Fin: Al 1050
    -- Base: ADC6
    -- Block: Cu 1100
    -- Heatpipe: 6 *4 pcs
    Total weight: 393 g
    Screw type: M4
    Socket R Narrow ( Hole pattern: 94 x 56 mm)
    System air flow rate: 12 CFM
    Thermal resistance: 0.254 deg C/W
    Produced location: KS

    11

    Server Tower CPU heatsink 120W Passive


    CCI part number: 0013250101
    Heatsink dimension: 109.5 x 84 x 105 mm
    -- Fin: Al 1050
    -- Base: Al 6063-T5
    -- Heatpipe: 6 *2 pcs
    Total weight: 348 g
    Screw type: M4
    Socket R Narrow ( Hole pattern: 94 x 56 mm)
    System air flow rate: 15 CFM
    Thermal resistance: 0.270 deg C/W
    Produced location: KS

    12

    Server Tower CPU heatsink 145W Passive


    CCI part number: 0013251101
    Heatsink dimension: 109.5 x 84 x 105 mm
    -- Fin: Al 1050
    -- Base: Al 6063-T5
    -- Block: Cu 1100
    -- Heatpipe: 6 *4 pcs
    Total weight: 421 g
    Screw type: M4
    Socket R Narrow ( Hole pattern: 94 x 56 mm)
    System air flow rate: 15 CFM
    Thermal resistance: 0.240 deg C/W
    Produced location: KS

    13

    Server Tower CPU heatsink 155W Passive


    CCI part number: 00Z89400101
    Heatsink dimension: 105.5 x 95 x 105 mm
    -- Fin: Al 1050
    -- Base: ADC 12
    -- Block: Cu 1100
    -- Heatpipe: 6 *4 pcs
    Total weight: 587 g
    Screw type: M4
    Socket R Narrow ( Hole pattern: 94 x 56 mm)
    System air flow rate: 33.5 CFM
    Thermal resistance: 0.171 deg C/W
    Produced location: DG

    14

    Server Tower CPU heatsink 130W Active


    CCI part number: 00Z83190201
    Heatsink dimension: 100 x 97 x 129.41 mm
    -- Fin: Al 1100
    -- Base: Cu 1100
    -- Heatpipe: 6 *4 pcs
    -- Fan speed:
    - In quiet mode: 1800 rpm
    - In performance mode: 2600 rpm
    - Max. air flow: 40 CFM
    - In quiet mode: 4.5 B(A)
    - In performance mode: 5.5 B(A)
    Total weight: 620 g
    Screw type: M4
    Socket R Narrow ( Hole pattern: 80 x 80 mm)
    Thermal resistance: 0.173 deg C/W
    Produced location: DG
    15

    Server Tower CPU heatsink 130W Active


    CCI part number: 00C99400101
    Heatsink dimension: 100 x 97 x 129.41 mm
    -- Fin: Al 1100
    -- Base: Cu 1100
    -- Heatpipe: 6 *4 pcs
    -- Fan speed:
    - In quiet mode: 1800 rpm
    - In performance mode: 2600 rpm
    - Max. air flow: 40 CFM
    - In quiet mode: 4.5 B(A)
    - In performance mode: 5.5 B(A)
    Total weight: 636.7 g
    Screw type: M3
    Socket B Narrow ( Hole pattern: 80 x 80 mm)
    Thermal resistance: 0.173 deg C/W
    Produced location: DG
    16

    Desktop CPU heat sink 65W/ 95W Active


    CCI part number: 0011208101 / 0011207101
    Heat sink height: 50/ 62.9 (mm)

    -- Sunflower: Al6063 90 x 24.6/ L 37.5 (mm)

    -- Weight : 160 / 226 (g)

    Fan Feature : 80 x 80 x 25 mm (with PWM)


    -- Max speed : 4500 rpm
    -- Max. air flow: 58.7 CFM
    -- Acoustic noise: 44 dB-A
    Total Weight: 270/ 336 g
    Screw Type: M3
    Socket H (Hole pattern: 75 x 75 mm)
    TIM: Dow Corning TC-5026
    Thermal Resistance: 0.3/ 0.27 (/W)
    17

    Desktop CPU heat sink 125W Active


    CCI part number: 0012109101
    Heat sink height: 62.7 (mm)

    -- Sunflower: Al6063 90 x L 32.5 (mm)


    C1100 30 x L 28 (mm)

    -- Weight : 390 (g)

    Fan Feature : 80 x 80 x 25 mm (with PWM)


    -- Max speed : 4500 rpm
    -- Max. air flow: 63.28 CFM
    -- Acoustic noise: 46.5 dB-A
    Total Weight: 469 g
    Screw Type: M3
    Socket H (Hole pattern: 75 x 75 mm)
    TIM: Dow Corning TC-5026
    Thermal Resistance: 0.25 (/W)

    18

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