Professional Documents
Culture Documents
MCP 3202
MCP 3202
12-bit resolution
1 LSB max DNL
1 LSB max INL (MCP3202-B)
2 LSB max INL (MCP3202-C)
Analog inputs programmable as single-ended or
pseudo-differential pairs
On-chip sample and hold
SPI serial interface (modes 0,0 and 1,1)
Single supply operation: 2.7V-5.5V
100 ksps max. sampling rate at VDD = 5V
50 ksps max. sampling rate at VDD = 2.7V
Low power CMOS technology
- 500 nA typical standby current, 5 A max.
- 550 A max. active current at 5V
Industrial temp range: -40C to +85C
8-pin MSOP, PDIP, SOIC and TSSOP packages
CH0
CH1
VSS
MCP3202
Package Types
Sensor Interface
Process Control
Data Acquisition
Battery Operated Systems
Description
The Microchip Technology Inc. MCP3202 is a successive approximation 12-bit Analog-to-Digital (A/D)
Converter with on-board sample and hold circuitry. The
MCP3202 is programmable to provide a single pseudodifferential input pair or dual single-ended inputs. Differential Nonlinearity (DNL) is specified at 1 LSB, and
Integral Nonlinearity (INL) is offered in 1 LSB
(MCP3202-B) and 2 LSB (MCP3202-C) versions.
Communication with the device is done using a simple
serial interface compatible with the SPI protocol. The
device is capable of conversion rates of up to 100 ksps
at 5V and 50 ksps at 2.7V. The MCP3202 device operates over a broad voltage range (2.7V-5.5V). Lowcurrent design permits operation with typical standby
and active currents of only 500 nA and 375 A, respectively. The MCP3202 is offered in 8-pin MSOP, PDIP,
TSSOP and 150 mil SOIC packages.
VDD/VREF
CLK
DOUT
DIN
CH0
CH1
Input
Channel
Mux
VSS
DAC
Comparator
Applications
12-Bit SAR
Sample
and
Hold
Control Logic
CS/SHDN
DIN
CLK
Shift
Register
DOUT
DS21034D-page 1
MCP3202
1.0
ELECTRICAL
CHARACTERISTICS
1.1
Maximum Ratings*
Function
VDD/VREF
All inputs and outputs w.r.t. VSS ...... -0.6V to VDD +0.6V
CH0
CH1
CLK
Serial Clock
DIN
Serial Data In
DOUT
CS/SHDN
VDD.........................................................................7.0V
ELECTRICAL CHARACTERISTICS
All parameters apply at VDD = 5.5V, VSS = 0V, TAMB = -40C to +85C, fSAMPLE = 100 ksps and fCLK = 18*fSAMPLE
unless otherwise noted.
Parameter
Conversion Rate:
Conversion Time
Sym
Min.
Typ.
Max.
Units
tCONV
12
clock
cycles
clock
cycles
1.5
tSAMPLE
Throughput Rate
fSAMPLE
100
50
ksps
ksps
DC Accuracy:
Resolution
Integral Nonlinearity
INL
Differential Nonlinearity
DNL
12
0.75
1
0.5
1
2
1
bits
LSB
LSB
LSB
Conditions
VDD = VREF = 5V
VDD = VREF = 2.7V
MCP3202-B
MCP3202-C
No missing codes over
temperature
Offset Error
1.25
3
LSB
Gain Error
1.25
5
LSB
Dynamic Performance:
Total Harmonic Distortion
THD
-82
dB
VIN = 0.1V to 4.9V@1 kHz
Signal to Noise and Distortion
SINAD
72
dB
VIN = 0.1V to 4.9V@1 kHz
(SINAD)
Spurious Free Dynamic Range
SFDR
86
dB
VIN = 0.1V to 4.9V@1 kHz
Analog Inputs:
VDD
V
Input Voltage Range for CH0 or
VSS
CH1 in Single-Ended Mode
See Sections 3.1 and 4.1
Input Voltage Range for IN+ in
IN+
IN
VDD+INPseudo-Differential Mode
VSS+100
mV
See Sections 3.1 and 4.1
Input Voltage Range for IN- in
INVSS-100
Pseudo-Differential Mode
Leakage Current
.001
1
A
Switch Resistance
RSS
1k
DS21034D-page 2
MCP3202
ELECTRICAL CHARACTERISTICS (CONTINUED)
All parameters apply at VDD = 5.5V, VSS = 0V, TAMB = -40C to +85C, fSAMPLE = 100 ksps and fCLK = 18*fSAMPLE
unless otherwise noted.
Parameter
Sample Capacitor
Digital Input/Output:
Data Coding Format
High Level Input Voltage
Low Level Input Voltage
High Level Output Voltage
Low Level Output Voltage
Input Leakage Current
Output Leakage Current
Pin Capacitance
(All Inputs/Outputs)
Timing Parameters:
Clock Frequency
Clock High Time
Clock Low Time
CS Fall To First Rising CLK
Edge
Data Input Setup Time
Data Input Hold Time
CLK Fall To Output Data Valid
CLK Fall To Output Enable
CS Rise To Output Disable
CS Disable Time
DOUT Rise Time
DOUT Fall Time
Sym
Min.
Typ.
Max.
Units
CSAMPLE
20
pF
VIH
VIL
VOH
VOL
ILI
ILO
CIN, COUT
Straight Binary
0.7 VDD
0.3 VDD
4.1
0.4
-10
10
-10
10
10
fCLK
tHI
tLO
tSUCS
250
250
100
tSU
tHD
tDO
tEN
tDIS
V
V
V
V
A
A
pF
1.8
0.9
MHz
MHz
ns
ns
ns
50
50
200
200
100
ns
ns
ns
ns
ns
tCSH
tR
500
100
ns
ns
tF
100
ns
Conditions
See Figure 4-1
Power Requirements:
2.7
5.5
V
Operating Voltage
VDD
Operating Current
IDD
375
550
A
VDD = 5.0V, DOUT unloaded
0.5
5
A
CS = VDD = 5.0V
Standby Current
IDDS
Temperature Ranges:
Specified Temperature Range
TA
-40
+85
C
-40
+85
C
Operating Temperature Range
TA
Storage Temperature Range
TA
-65
+150
C
Thermal Package Resistance:
Thermal Resistance, 8L-PDIP
JA
85
C/W
Thermal Resistance, 8L-SOIC
JA
163
C/W
Thermal Resistance, 8L-MSOP
JA
206
C/W
JA
C/W
Thermal Resistance, 8L-TSSOP
Note 1: This parameter is established by characterization and not 100% tested.
2: Because the sample cap will eventually lose charge, effective clock rates below 10 kHz can affect linearity
performance, especially at elevated temperatures. See Section 6.2 for more information.
DS21034D-page 3
MCP3202
tCSH
CS
tSUCS
tLO
tHI
CLK
tSU
DIN
tHD
MSB IN
tEN
DOUT
tR
tDO
tDIS
MSB OUT
NULL BIT
FIGURE 1-1:
tF
LSB
Serial Timing.
Load circuit for tDIS and tEN
Test Point
1.4V
VDD
3 k
Test Point
DOUT
3 k
tDIS Waveform 2
VDD/2
tEN Waveform
DOUT
100 pF
CL = 100 pF
DOUT
CS
tF
tR
tDIS Waveform 1
VSS
CLK
4
B11
DOUT
tEN
Voltage Waveforms for tDO
CLK
tDO
VIH
DOUT
Waveform 1*
DOUT
90%
TDIS
DOUT
Waveform 2
10%
FIGURE 1-2:
Test Circuits.
DS21034D-page 4
MCP3202
2.0
Note:
The graphs provided following this note are a statistical summary based on a limited number of samples
and are provided for informational purposes only. The performance characteristics listed herein are not
tested or guaranteed. In some graphs, the data presented may be outside the specified operating range
(e.g., outside specified power supply range) and therefore outside the warranted range.
Note: Unless otherwise indicated, VDD = 5V, VSS = 0V, fSAMPLE = 100 ksps, fCLK = 18* fSAMPLE,TA = 25C
1.0
2.0
Positive INL
0.8
1.0
INL (LSB)
0.4
INL (LSB)
VDD = 2.7V
1.5
0.6
0.2
0.0
-0.2
Negative INL
-0.4
Positive INL
0.5
0.0
-0.5
Negative INL
-1.0
-0.6
-1.5
-0.8
-2.0
-1.0
0
25
50
75
100
125
150
20
FIGURE 2-1:
Rate.
80
100
1.0
0.8
FSAMPLE = 50 ksps
0.8
Positive INL
0.6
Positive INL
0.6
0.4
INL (LSB)
0.4
0.2
0.0
-0.2
-0.4
Negative INL
0.2
0.0
-0.2
-0.4
-0.6
-0.6
-0.8
-0.8
Negative INL
-1.0
-1.0
3.0
3.5
4.0
4.5
2.5
5.0
3.0
3.5
FIGURE 2-2:
4.0
4.5
5.0
VDD(V)
VDD(V)
FIGURE 2-5:
1.0
1.0
0.8
0.8
VDD = 2.7V
0.6
0.6
FSAMPLE = 50 ksps
0.4
0.4
INL (LSB)
INL (LSB)
60
1.0
INL (LSB)
40
0.2
0.0
-0.2
-0.4
0.2
0.0
-0.2
-0.4
-0.6
-0.6
-0.8
-0.8
-1.0
-1.0
0
512
1024
1536 2048
2560 3072
3584 4096
Digital Code
512
1024
1536 2048
2560 3072
3584 4096
Digital Code
DS21034D-page 5
MCP3202
Note: Unless otherwise indicated, VDD = 5V, VSS = 0V, fSAMPLE = 100 ksps, fCLK = 18* fSAMPLE,TA = 25C
1.0
1.0
0.8
VDD = 2.7V
0.6
0.6
FSAMPLE = 50 ksps
0.4
0.4
Positive INL
INL (LSB)
INL (LSB)
0.8
0.2
0.0
Negative INL
-0.2
0.2
0.0
-0.2
-0.4
-0.4
-0.6
-0.6
-0.8
-0.8
Negative INL
-1.0
-1.0
-50
-25
25
50
75
-50
100
-25
FIGURE 2-7:
Temperature.
Integral
Nonlinearity
(INL)
vs.
25
50
1.0
2.0
0.8
1.5
0.6
75
100
(INL)
vs.
V DD = 2.7V
DNL (LSB)
1.0
0.4
DNL (LSB)
Temperature (C)
Temperature (C)
Positive DNL
0.2
0.0
-0.2
Negative DNL
-0.4
Positive DNL
0.5
0.0
-0.5
Negative DNL
-1.0
-0.6
-1.5
-0.8
-2.0
-1.0
0
25
50
75
100
125
150
20
40
60
80
100
Nonlinearity
(DNL)
vs.
Nonlinearity
(DNL)
vs.
1.0
1.0
FSAMPLE = 100 ksps
0.8
0.6
0.6
0.4
0.2
0.0
-0.2
-0.4
FSAMPLE = 50 ksps
0.8
Positive DNL
DNL (LSB)
DNL (LSB)
Positive INL
Negative DNL
Positive DNL
0.4
0.2
0.0
-0.2
-0.4
-0.6
-0.6
-0.8
-0.8
Negative DNL
-1.0
-1.0
3.0
3.5
4.0
4.5
5.0
VDD(V)
FIGURE 2-9:
DS21034D-page 6
2.5
3.0
3.5
4.0
4.5
5.0
VDD(V)
MCP3202
1.0
1.0
0.8
0.8
V DD = 2.7V
0.6
0.6
FSAMPLE = 50 ksps
0.4
0.4
DNL (LSB)
DNL (LSB)
Note: Unless otherwise indicated, VDD = 5V, VSS = 0V, fSAMPLE = 100 ksps, fCLK = 18* fSAMPLE,TA = 25C
0.2
0.0
-0.2
-0.4
0.2
0.0
-0.2
-0.4
-0.6
-0.6
-0.8
-0.8
-1.0
-1.0
512
512
Digital Code
Digital Code
(DNL)
vs.
1.0
1.0
0.8
0.8
V DD = 2.7V
0.6
FSAMPLE = 50 ksps
Positive DNL
DNL (LSB)
DNL (LSB)
0.6
0.4
0.2
0.0
-0.2
Negative DNL
-0.4
(DNL)
vs.
Positive DNL
0.4
0.2
0.0
-0.2
Negative DNL
-0.4
-0.6
-0.6
-0.8
-0.8
-1.0
-1.0
-50
-25
25
50
75
-50
100
-25
Temperature (C)
25
50
75
100
Temperature (C)
Nonlinearity
(DNL)
vs.
Nonlinearity
(DNL)
vs.
2.0
2.0
1.8
1.5
FSAMPLE = 10 ksps
1.0
0.5
0.0
-0.5
-1.0
FSAMPLE = 100 ksps
-1.5
1.6
1.4
FSAMPLE = 50 ksps
1.2
1.0
0.8
0.6
FSAMPLE = 10 ksps
0.4
0.2
FSAMPLE = 50 ksps
-2.0
0.0
2.5
3.0
3.5
4.0
VDD(V)
4.5
5.0
2.5
3.0
3.5
4.0
4.5
5.0
VDD(V)
DS21034D-page 7
MCP3202
Note: Unless otherwise indicated, VDD = 5V, VSS = 0V, fSAMPLE = 100 ksps, fCLK = 18* fSAMPLE,TA = 25C
1.0
2.0
1.8
V DD = 2.7V
0.6
0.8
FSAMPLE = 50 ksps
0.4
0.2
0.0
-0.2
-0.4
-0.6
V DD = 5V
-0.8
-50
-25
25
50
VDD = 5V
1.4
1.2
1.0
0.8
VDD = 2.7V
0.6
FSAMPLE = 50 ksps
0.4
0.2
-1.0
1.6
75
0.0
-50
100
-25
75
100
100
100
90
VDD = 5V
90
80
80
60
SINAD (dB)
70
SNR (dB)
50
Temperature (C)
Temperature (C)
VDD = 2.7V
50
FSAMPLE = 50 ksps
40
30
VDD = 5V
FSAMPLE = 100 ksps
70
60
50
VDD = 2.7V
40
FSAMPLE = 50 ksps
30
20
20
10
10
10
100
10
100
FIGURE 2-23:
Signal to Noise and Distortion
(SINAD) vs. Input Frequency.
80
-10
VDD = 5V
70
-20
60
-40
VDD = 2.7V
-50
FSAMPLE = 50 ksps
SINAD (dB)
-30
THD (dB)
25
-60
-70
-80
VDD = 5V
-90
50
VDD = 2.7V
40
FSAMPLE = 50 ksps
30
20
10
0
-100
1
10
100
DS21034D-page 8
-40
-35
-30
-25
-20
-15
-10
-5
FIGURE 2-24:
Signal to Noise and Distortion
(SINAD) vs. Signal Level.
MCP3202
Note: Unless otherwise indicated, VDD = 5V, VSS = 0V, fSAMPLE = 100 ksps, fCLK = 18* fSAMPLE,TA = 25C
12.0
12.0
11.5
11.0
ENOB (rms)
ENOB (rms)
VDD = 5V
11.5
FSAMPLE = 50ksps
11.0
FSAMPLE = 100 ksps
10.5
10.0
10.5
10.0
9.5
9.0
9.5
V DD = 2.7V
8.5
9.0
2.0
2.5
3.0
3.5
4.0
4.5
FSAMPLE = 50 ksps
8.0
5.0
10
VDD (V)
VDD = 5V
90
SFDR (dB)
80
70
60
50
V DD = 2.7V
40
FSAMPLE = 50 ksps
30
20
10
0
1
10
100
100
-10
-20
-30
-40
-50
-60
-70
-80
1
10
0
-10
-20
-30
-40
-50
-60
-70
-80
-90
-100
-110
-120
-130
Dynamic
Range
10000
20000
30000
40000
50000
Frequency (Hz)
1000
10000
VDD = 5V
100
Amplitude (dB)
Amplitude (dB)
100
0
-10
-20
-30
-40
-50
-60
-70
-80
-90
-100
-110
-120
-130
VDD = 2.7V
FSAMPLE = 50 ksps
FINPUT = 998.76 Hz
4096 points
5000
10000
15000
20000
25000
Frequency (Hz)
DS21034D-page 9
MCP3202
Note: Unless otherwise indicated, VDD = 5V, VSS = 0V, fSAMPLE = 100 ksps, fCLK = 18* fSAMPLE,TA = 25C
500
80
450
400
60
IDDS (pA)
350
IDD (A)
CS = V DD
70
300
250
200
150
50
40
30
20
100
10
50
0
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
2.0
6.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
VDD (V)
VDD (V)
100.00
500
450
VDD = CS = 5V
400
V DD = 5V
10.00
300
IDDS (nA)
IDD (A)
350
250
V DD = 2.7V
200
1.00
150
0.10
100
50
0
10
100
1000
0.01
10000
-50
-25
350
IDD (A)
75
100
2.0
V DD = 5V
400
50
500
450
25
Temperature (C)
300
250
200
VDD = 2.7V
150
100
50
0
-50
-25
25
50
Temperature (C)
DS21034D-page 10
75
100
1.8
1.6
1.4
1.2
VDD = 5V
1.0
0.8
0.6
0.4
0.2
0.0
-50
-25
25
50
75
100
Temperature (C)
MCP3202
3.0
PIN DESCRIPTIONS
4.1
3.1
CH0/CH1
3.2
3.3
3.4
3.5
The SPI serial data output pin is used to shift out the
results of the A/D conversion. Data will always change
on the falling edge of each clock as the conversion
takes place.
4.0
DEVICE OPERATION
Analog Inputs
4.2
DS21034D-page 11
MCP3202
VDD
RSS
VT = 0.6V
CHx
CPIN
7 pF
VA
Sampling
Switch
VT = 0.6V
SS
ILEAKAGE
1 nA
RS = 1 k
CSAMPLE
= DAC capacitance
= 20 pF
VSS
Legend
VA
RSS
CHx
CPIN
VT
ILEAKAGE
SS
RS
CSAMPLE
FIGURE 4-1:
=
=
=
=
=
=
=
=
=
signal source
source impedance
input channel pad
input pin capacitance
threshold voltage
leakage current at the pin
due to various junctions
sampling switch
sampling switch resistor
sample/hold capacitance
2.0
1.8
VDD = 5V
1.6
1.4
1.2
1.0
0.8
0.6
V DD = 2.7V
0.4
0.2
0.0
100
1000
10000
DS21034D-page 12
MCP3202
5.0
SERIAL COMMUNICATIONS
5.1
Overview
On the falling edge of the clock for the MSBF bit, the
device will output a low null bit. The next sequential
12 clocks will output the result of the conversion with
MSB first as shown in Figure 5-1. Data is always output
from the device on the falling edge of the clock. If all
12 data bits have been transmitted and the device continues to receive clocks while the CS is held low, (and
MSBF = 1), the device will output the conversion result
LSB first as shown in Figure 5-2. If more clocks are provided to the device while CS is still low (after the LSB
first data has been transmitted), the device will clock
out zeros indefinitely.
If necessary, it is possible to bring CS low and clock in
leading zeros on the DIN line before the start bit. This is
often done when dealing with microcontroller-based
SPI ports that must send 8 bits at a time. Refer to
Section 6.1 for more details on using the MCP3202
devices with hardware SPI ports.
Config
Bits
Channel
Selection
GND
Sgl/
Diff
Odd/
sign
Single Ended
Mode
1
1
PseudoDifferentiaL
Mode
TABLE 5-1:
IN+
IN-
IN-
IN+
tCYC
tCYC
tCSH
CS
tSUCS
CLK
DIN
HI-Z
DOUT
tSAMPLE
Dont Care
Null
Bit B11 B10 B9 B8 B7 B6 B5 B4 B3 B2 B1 B0*
tCONV
HI-Z
tDATA**
* After completing the data transfer, if further clocks are applied with CS low, the A/D Converter will output zeros
indefinitely. See Figure 5-2 below for details on obtaining LSB first data.
** tDATA: during this time, the bias current and the comparator power down while the reference input becomes a
high impedance node, leaving the CLK running to clock out the LSB-first data or zeros.
FIGURE 5-1:
DS21034D-page 13
MCP3202
tCYC
tCSH
CS
tSUCS
Power Down
HI-Z
DOUT
tSAMPLE
MSBF
SGL/
DIFF
ODD/
SIGN
DIN
Start
CLK
Dont Care
Null
B11 B10 B9
Bit
B8
B7
B6
B5 B4
B3
B2
B1
B0
B1
B2
B3
B4
B5
B6
B7
B8
B9 *B10 B11
HI-Z
(MSB)
tCONV
tDATA **
* After completing the data transfer, if further clocks are applied with CS low, the A/D Converter will
output zeros indefinitely.
** tDATA: During this time, the bias circuit and the comparator power down while the reference input
becomes a high impedance node, leaving the CLK running to clock out LSB first data or zeroes.
FIGURE 5-2:
DS21034D-page 14
MCP3202
6.0
APPLICATIONS INFORMATION
6.1
CS
SCLK
10
11
12
13
14
15
16
17
18
19
20
B5
B4
21
22
23
24
B2
B1
B0
ODD/
SIGN
DIN
SGL/
DIFF
Start
MSBF
HI-Z
DOUT
NULL
B11
BIT
B10
B9
B8
B7
B6
B3
Start
Bit
MCU Transmitted Data
(Aligned with falling
edge of clock)
MCU Received Data
(Aligned with rising
edge of clock)
CS
SGL/ ODD/
MSBF
DIFF SIGN
FIGURE 6-1:
0
B11
(Null)
B10
B9
B7
B8
B6
B5
B4
B3
B2
B1
B0
SPI Communication using 8-bit segments (Mode 0,0: SCLK idles low).
SCLK
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
B5
B4
B3
B2
B1
B0
MSBF
SGL/
DIFF
Start
DIN
ODD/
SIGN
HI-Z
DOUT
NULL
B11
BIT
B10
B9
B8
B6
B7
Start
Bit
SGL/ ODD/
MSBF
DIFF SIGN
0
B11
(Null)
B10
B9
B8
B7
B6
B5
B4
B3
B2
B1
B0
FIGURE 6-2:
SPI Communication using 8-bit segments (Mode 1,1: SCLK idles high).
DS21034D-page 15
MCP3202
6.2
6.3
6.4
Layout Considerations
Device 4
Device 1
Device 3
Device 2
VDD
10 F
R1
VIN
C1
MCP601
+
R2
C2
0.1 F
IN+
MCP3202
IN-
R3
R4
DS21034D-page 16
MCP3202
7.0
PACKAGING INFORMATION
7.1
MCP3202 e3
I/PNNN
YYWW
XXXXXXXX
XXXXXNNN
YYWW
Example:
MCP3202 e3
ISNYYWW
NNN
XXXXXXXX
XXXXYYWW
NNN
Example:
8-Lead MSOP
XXXXXX
YWWNNN
3202I e3
YWWNNN
Example:
8-Lead TSSOP
XXXX
YYWW
NNN
3202
IYWW
NNN
Legend: XX...X
Y
YY
WW
NNN
Customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week 01)
Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator (e3 )
can be found on the outer packaging for this package.
e3
*
Note:
Example:
In the event the full Microchip part number cannot be marked on one line, it
will be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
Standard OTP marking consists of Microchip part number, year code, week code, facility code, mask
rev#, and assembly code.
DS21034D-page 17
MCP3202
8-Lead Plastic Dual In-line (P) 300 mil Body (PDIP)
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
E1
D
2
n
A2
A1
B1
p
eB
Units
Dimension Limits
n
p
INCHES*
NOM
8
.100
.155
.130
MAX
MILLIMETERS
NOM
8
2.54
3.56
3.94
2.92
3.30
0.38
7.62
7.94
6.10
6.35
9.14
9.46
3.18
3.30
0.20
0.29
1.14
1.46
0.36
0.46
7.87
9.40
5
10
5
10
MAX
Number of Pins
Pitch
Top to Seating Plane
A
.140
.170
4.32
Molded Package Thickness
A2
.115
.145
3.68
Base to Seating Plane
.015
A1
Shoulder to Shoulder Width
E
.300
.313
.325
8.26
Molded Package Width
E1
.240
.250
.260
6.60
Overall Length
D
.360
.373
.385
9.78
Tip to Seating Plane
L
.125
.130
.135
3.43
c
Lead Thickness
.008
.012
.015
0.38
Upper Lead Width
B1
.045
.058
.070
1.78
Lower Lead Width
B
.014
.018
.022
0.56
Overall Row Spacing
eB
.310
.370
.430
10.92
DS21034D-page 18
MIN
MIN
MCP3202
8-Lead Plastic Small Outline (SN) Narrow, 150 mil Body (SOIC)
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
E
E1
D
2
B
45
c
A2
Units
Dimension Limits
n
p
INCHES*
NOM
8
.050
.061
.056
.007
.237
.154
.193
.015
.025
4
.009
.017
12
12
MAX
MILLIMETERS
NOM
8
1.27
1.35
1.55
1.32
1.42
0.10
0.18
5.79
6.02
3.71
3.91
4.80
4.90
0.25
0.38
0.48
0.62
0
4
0.20
0.23
0.33
0.42
0
12
0
12
MAX
Number of Pins
Pitch
Overall Height
A
.053
.069
1.75
Molded Package Thickness
A2
.052
.061
1.55
Standoff
A1
.004
.010
0.25
Overall Width
E
.228
.244
6.20
Molded Package Width
E1
.146
.157
3.99
Overall Length
D
.189
.197
5.00
Chamfer Distance
h
.010
.020
0.51
Foot Length
L
.019
.030
0.76
Foot Angle
0
8
8
c
Lead Thickness
.008
.010
0.25
Lead Width
B
.013
.020
0.51
MIN
A1
MIN
DS21034D-page 19
MCP3202
8-Lead Plastic Micro Small Outline Package (MS) [MSOP]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
N
E
E1
NOTE 1
1
2
e
b
A2
L1
A1
Number of Pins
Pitch
Overall Height
Molded Package
Standoff
Overall Width
Molded Package
Overall Length
Foot Length
Footprint
Foot Angle
Lead Thickness
Lead Width
Units
Dimension Limits
N
e
A
Thickness
A2
A1
E
Width
E1
D
L
L1
c
b
MIN
0.75
0.00
0.40
0
0.08
0.22
MILLIMETERS
NOM
8
0.65 BSC
0.85
4.90 BSC
3.00 BSC
3.00 BSC
0.60
0.95 REF
MAX
1.10
0.95
0.15
0.80
8
0.23
0.40
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions
shall not exceed 0.15 mm per side.
3. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing No. C04111, Sept. 8, 2006
DS21034D-page 20
MCP3202
8-Lead Plastic Thin Shrink Small Outline (ST) 4.4 mm Body (TSSOP)
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
E
E1
e
D
2
1
n
b
Units
Dimension Limits
Number of Pins
n
Pitch
e
Overall Height
A
Molded Package Thickness
A2
Standoff
A1
Overall Width
E
Molded Package Width
E1
Molded Package Length
D
Foot Length
L
Foot Angle
Lead Thickness
c
Lead Width
b
Mold Draft Angle Top
A2
A1
MIN
.031
.002
.169
.114
.018
0
.004
.007
INCHES
NOM
8
.026 BSC
.039
.252 BSC
.173
.118
.024
12 REF
12 REF
MAX
.047
.041
.006
.177
.122
.030
8
.008
.012
MILLIMETERS*
NOM
MAX
8
0.65 BSC
1.20
0.80
1.00
1.05
0.05
0.15
6.40 BSC
4.30
4.40
4.50
2.90
3.00
3.10
0.45
0.60
0.75
0
8
0.09
0.20
0.19
0.30
12 REF
12 REF
MIN
*Controlling Parameter
Notes:
1. Dimension D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.005" (0.127mm) per side.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
See ASME Y14.5M
REF: Reference Dimension, usually without tolerance, for information purposes only.
See ASME Y14.5M
Drawing No. C04-086
Revised 7-25-06
DS21034D-page 21
MCP3202
NOTES:
DS21034D-page 22
MCP3202
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO.
/XX
Device
Performance
Grade
Temperature
Range
Package
Device:
Performance Grade:
B
C
Temperature Range:
= -40C to +85C
Package:
MS
P
SN
ST
=
=
=
=
Examples:
a)
b)
c)
d)
a)
DS21034C-page23
MCP3202
NOTES:
DS21034C-page24
MCP3202
APPENDIX A:
REVISION HISTORY
DS21034D-page 25
NOTES:
DS21034D-page 26
Note the following details of the code protection feature on Microchip devices:
Microchip products meet the specification contained in their particular Microchip Data Sheet.
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchips Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as unbreakable.
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchips code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Trademarks
The Microchip name and logo, the Microchip logo, Accuron,
dsPIC, KEELOQ, microID, MPLAB, PIC, PICmicro, PICSTART,
PRO MATE, PowerSmart, rfPIC, and SmartShunt are
registered trademarks of Microchip Technology Incorporated
in the U.S.A. and other countries.
AmpLab, FilterLab, Migratable Memory, MXDEV, MXLAB,
SEEVAL, SmartSensor and The Embedded Control Solutions
Company are registered trademarks of Microchip Technology
Incorporated in the U.S.A.
Analog-for-the-Digital Age, Application Maestro, CodeGuard,
dsPICDEM, dsPICDEM.net, dsPICworks, ECAN,
ECONOMONITOR, FanSense, FlexROM, fuzzyLAB,
In-Circuit Serial Programming, ICSP, ICEPIC, Linear Active
Thermistor, Mindi, MiWi, MPASM, MPLIB, MPLINK, PICkit,
PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal,
PowerInfo, PowerMate, PowerTool, REAL ICE, rfLAB,
rfPICDEM, Select Mode, Smart Serial, SmartTel, Total
Endurance, UNI/O, WiperLock and ZENA are trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
2006, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
DS21034D-page 27
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://support.microchip.com
Web Address:
www.microchip.com
India - Bangalore
Tel: 91-80-4182-8400
Fax: 91-80-4182-8422
India - New Delhi
Tel: 91-11-4160-8631
Fax: 91-11-4160-8632
Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
Denmark - Copenhagen
Tel: 45-4450-2828
Fax: 45-4485-2829
India - Pune
Tel: 91-20-2566-1512
Fax: 91-20-2566-1513
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
Japan - Yokohama
Tel: 81-45-471- 6166
Fax: 81-45-471-6122
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Atlanta
Alpharetta, GA
Tel: 770-640-0034
Fax: 770-640-0307
Boston
Westborough, MA
Tel: 774-760-0087
Fax: 774-760-0088
Chicago
Itasca, IL
Tel: 630-285-0071
Fax: 630-285-0075
Dallas
Addison, TX
Tel: 972-818-7423
Fax: 972-818-2924
Detroit
Farmington Hills, MI
Tel: 248-538-2250
Fax: 248-538-2260
Kokomo
Kokomo, IN
Tel: 765-864-8360
Fax: 765-864-8387
Los Angeles
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
Santa Clara
Santa Clara, CA
Tel: 408-961-6444
Fax: 408-961-6445
Toronto
Mississauga, Ontario,
Canada
Tel: 905-673-0699
Fax: 905-673-6509
Australia - Sydney
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
China - Beijing
Tel: 86-10-8528-2100
Fax: 86-10-8528-2104
China - Chengdu
Tel: 86-28-8665-5511
Fax: 86-28-8665-7889
Korea - Gumi
Tel: 82-54-473-4301
Fax: 82-54-473-4302
China - Fuzhou
Tel: 86-591-8750-3506
Fax: 86-591-8750-3521
Korea - Seoul
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
Malaysia - Penang
Tel: 60-4-646-8870
Fax: 60-4-646-5086
China - Qingdao
Tel: 86-532-8502-7355
Fax: 86-532-8502-7205
Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069
China - Shanghai
Tel: 86-21-5407-5533
Fax: 86-21-5407-5066
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
China - Shenzhen
Tel: 86-755-8203-2660
Fax: 86-755-8203-1760
Taiwan - Kaohsiung
Tel: 886-7-536-4818
Fax: 886-7-536-4803
China - Shunde
Tel: 86-757-2839-5507
Fax: 86-757-2839-5571
Taiwan - Taipei
Tel: 886-2-2500-6610
Fax: 886-2-2508-0102
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
UK - Wokingham
Tel: 44-118-921-5869
Fax: 44-118-921-5820
China - Xian
Tel: 86-29-8833-7250
Fax: 86-29-8833-7256
10/19/06
DS21034D-page 28