Professional Documents
Culture Documents
DATA SHEET
PCD8544
48 84 pixels matrix LCD
controller/driver
Product specification
File under Integrated Circuits, IC17
1999 Apr 12
Philips Semiconductors
Product specification
FEATURES
GENERAL DESCRIPTION
APPLICATIONS
ORDERING INFORMATION
BLOCK DIAGRAM
PINNING
6.1
6.1.1
6.1.2
6.1.3
6.1.4
6.1.5
6.1.6
6.1.7
6.1.8
6.1.9
6.1.10
6.1.11
6.1.12
Pin functions
R0 to R47 row driver outputs
C0 to C83 column driver outputs
VSS1, VSS2: negative power supply rails
VDD1, VDD2: positive power supply rails
VLCD1, VLCD2: LCD power supply
T1, T2, T3 and T4: test pads
SDIN: serial data line
SCLK: serial clock line
D/C: mode select
SCE: chip enable
OSC: oscillator
RES: reset
FUNCTIONAL DESCRIPTION
7.1
7.2
7.3
7.4
7.5
7.6
7.7
7.7.1
7.8
Oscillator
Address Counter (AC)
Display Data RAM (DDRAM)
Timing generator
Display address counter
LCD row and column drivers
Addressing
Data structure
Temperature compensation
1999 Apr 12
PCD8544
INSTRUCTIONS
8.1
8.2
8.3
8.3.1
8.3.2
8.3.3
8.4
8.4.1
8.5
8.6
8.7
8.8
8.9
Initialization
Reset function
Function set
Bit PD
Bit V
Bit H
Display control
Bits D and E
Set Y address of RAM
Set X address of RAM
Temperature control
Bias value
Set VOP value
LIMITING VALUES
10
HANDLING
11
DC CHARACTERISTICS
12
AC CHARACTERISTICS
12.1
12.2
Serial interface
Reset
13
APPLICATION INFORMATION
14
14.1
14.2
15
TRAY INFORMATION
16
DEFINITIONS
17
Philips Semiconductors
Product specification
FEATURES
PCD8544
GENERAL DESCRIPTION
Telecommunications equipment.
Mux rate: 48
APPLICATIONS
ORDERING INFORMATION
PACKAGE
TYPE NUMBER
NAME
PCD8544U
1999 Apr 12
DESCRIPTION
chip with bumps in tray; 168 bonding pads + 4 dummy pads
VERSION
Philips Semiconductors
Product specification
PCD8544
BLOCK DIAGRAM
VLCD2
C1 to C83
R0 to R47
COLUMN DRIVERS
ROW DRIVERS
BIAS
VOLTAGE
GENERATOR
SHIFT REGISTER
DATA LATCHES
VLCD1
VLCD
GENERATOR
RESET
RES
OSCILLATOR
OSC
TIMING
GENERATOR
VDD1 to VDD2
VSS1 to VSS2
DISPLAY
ADDRESS
COUNTER
ADDRESS COUNTER
T1
T2
T3
DATA
REGISTER
PCD8544
T4
I/O BUFFER
MGL629
SDIN
SCLK
D/C
SCE
1999 Apr 12
Philips Semiconductors
Product specification
PINNING
6.1.5
PCD8544
VLCD1, VLCD2: LCD POWER SUPPLY
R0 to R47
C0 to C83
6.1.6
VSS1, VSS2
ground
VDD1, VDD2
supply voltage
VLCD1, VLCD2
T1
test 1 input
6.1.7
T2
test 2 output
T3
test 3 input/output
T4
test 4 input
6.1.8
SDIN
SYMBOL
DESCRIPTION
SCLK
D/C
data/command
SCE
chip enable
OSC
oscillator
RES
6.1.9
6.1.11
Pin functions
R0 TO R47 ROW DRIVER OUTPUTS
6.1.12
1999 Apr 12
RES: RESET
OSC: OSCILLATOR
Philips Semiconductors
Product specification
7.4
FUNCTIONAL DESCRIPTION
7.5
7.6
1999 Apr 12
Timing generator
Oscillator
PCD8544
Philips Semiconductors
Product specification
frame n + 1
frame n
ROW 0
R0 (t)
VLCD
V2
V3
V4
V5
VSS
ROW 1
R1 (t)
VLCD
V2
V3
V4
V5
VSS
COL 0
C0 (t)
VLCD
V2
V3
V4
V5
VSS
COL 1
C1 (t)
VLCD
V2
V3
V4
V5
VSS
PCD8544
Vstate1(t)
Vstate2(t)
VLCD
V3 - VSS
VLCD - V2
Vstate1(t)
V4 - V5
0V
VSS - V5
0V
V3 - V2
V4 - VLCD
VLCD
VLCD
V3 - VSS
VLCD - V2
Vstate2(t)
V4 - V5
0V
VSS - V5
0V
V3 - V2
V4 - VLCD
VLCD
01 2 3 45 6 7 8
... 47 0 1 2 3 4 5 6 7 8
1999 Apr 12
... 47
MGL637
Philips Semiconductors
Product specification
PCD8544
DDRAM
bank 0
top of LCD
R0
bank 1
R8
bank 2
R16
LCD
bank 3
R24
bank 4
R32
bank 5
R40
R47
MGL636
1999 Apr 12
Philips Semiconductors
Product specification
Addressing
PCD8544
DATA STRUCTURE
LSB
handbook, full
pagewidth
0
Y-address
MSB
5
X-address
83
MGL638
handbook, halfpage
2
Y-address
3
4
5
503
83
0
X-address
MGL639
Fig.5 Sequence of writing data bytes into RAM with vertical addressing (V = 1).
1999 Apr 12
Philips Semiconductors
Product specification
PCD8544
handbook, halfpage
84 85 86
168 169 170
Y-address
252 253 254
336 337 338
420 421 422
503
83
0
X-address
MGL640
Fig.6 Sequence of writing data bytes into RAM with horizontal addressing (V = 0).
7.8
Temperature compensation
VLCD
handbook,
halfpage
(1)
(2)
(3)
(4)
0 C
temperature
MGL641
1999 Apr 12
10
Philips Semiconductors
Product specification
PCD8544
INSTRUCTIONS
The level of the D/C signal is read during the last bit of data
byte.
handbook,MSB
halfpage
(DB7)
LSB (DB0)
data
data
MGL666
function set (H = 1)
bias system
set VOP
temperature control
function set (H = 0)
display control
Y address
X address
MGL642
1999 Apr 12
11
Philips Semiconductors
Product specification
PCD8544
SCE
D/C
SCLK
SDIN
DB7
DB6
DB5
DB4
DB3
DB2
DB1
DB0
MGL630
SCE
D/C
SCLK
SDIN
DB7 DB6
DB5 DB4
DB3 DB2
DB1 DB0
DB4
DB3
DB2 DB1
DB0
DB7 DB6
DB5
MGL631
1999 Apr 12
12
Philips Semiconductors
Product specification
PCD8544
SCE
D/C
RES
SCLK
SDIN
DB7 DB6
DB5 DB4
DB3 DB2
DB1 DB0
DB4
DB3
DB2 DB1
DB0
DB7 DB6
DB5
MGL632
SCE
RES
D/C
SCLK
SDIN
DB7 DB6
DB5 DB4
DB3
DB7
DB3
DB2
DB1 DB0
DB7
DB6 DB5
DB4
MGL633
1999 Apr 12
13
Philips Semiconductors
Product specification
PCD8544
Instruction set
INSTRUCTION
D/C
COMMAND BYTE
DB7
DB6
DB5
DB4
DB3
DB2
DB1
DB0
DESCRIPTION
(H = 0 or 1)
NOP
Function set
0
0
0
0
0
0
0
1
0
0
0
0
0
PD
0
V
0
H
Write data
D7
D6
D5
D4
D3
D2
D1
D0
0
0
0
0
0
0
0
0
0
0
0
1
0
0
0
0
0
0
1
0
0
1
X
0
1
D
X
Y2
X
0
X
Y1
X
E
X
Y0
X6
X5
X4
X3
X2
X1
X0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
0
1
TC1
1
X
TC0
0
0
0
0
0
0
0
1
0
0
1
VOP6
0
0
X
VOP5
0
1
X
VOP4
1
0
X
VOP3
X
BS2
X
VOP2
X
BS1
X
VOP1
X
BS0
X
VOP0
no operation
power down control; entry
mode; extended instruction set
control (H)
writes data to display RAM
(H = 0)
Reserved
Display control
Reserved
Set Y address of
RAM
Set X address of
RAM
do not use
sets display configuration
do not use
sets Y-address of RAM;
0Y5
sets X-address part of RAM;
0 X 83
(H = 1)
Reserved
Temperature
control
Reserved
Bias system
Reserved
Set VOP
Table 2
do not use
do not use
set Temperature Coefficient
(TCx)
do not use
set Bias System (BSx)
do not use
write VOP to register
PD
V
H
D and E
00
10
01
11
TC1 and TC0
00
01
10
11
1999 Apr 12
chip is active
horizontal addressing
use basic instruction set
display blank
normal mode
all display segments on
inverse video mode
VLCD temperature coefficient 0
VLCD temperature coefficient 1
VLCD temperature coefficient 2
VLCD temperature coefficient 3
14
Philips Semiconductors
Product specification
PCD8544
8.3.3
Initialization
BIT H
Display control
BITS D AND E
8.4.1
8.5
8.2
Table 3
Reset function
Y vector addressing
Y2
Y1
Y0
BANK
Address counter X6 to X0 = 0; Y2 to Y0 = 0
8.6
8.7
Function set
8.8
Bias value
n =
BIT V
1999 Apr 12
Temperature control
BIT PD
8.3.2
15
48 3 = 3.928 = 4
(1)
Philips Semiconductors
Product specification
Table 5
BS1
BS0
RECOMMENDED
MUX RATE
1 : 100
1 : 80
1 : 65/1 : 65
1 : 48
1 : 40/1 : 34
1 : 24
1 : 18/1 : 16
1 : 10/1 : 9/1 : 8
SYMBOL
BIAS VOLTAGES
V1
VLCD
(n + 3)/(n + 4)
VLCD
V3
(n + 2)/(n + 4)
VLCD
V4
2/(n + 4)
VLCD
V5
1/(n + 4)
VLCD
V6
VSS
V2
8.9
PCD8544
VSS
LCD
handbook,Vhalfpage
48
(2)
00 01 02 03 04 05 06 07 08 09 0A ...
MGL643
a = 3.06.
b = 0.06.
VOP6 to VOP0 (programmed) [00 to 7FH].
1999 Apr 12
16
Philips Semiconductors
Product specification
PCD8544
9 LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134); see notes 1 and 2.
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
VDD
supply voltage
note 3
0.5
+7
VLCD
note 4
0.5
+10
Vi
0.5
VDD + 0.5
ISS
50
+50
mA
II, IO
10
+10
mA
Ptot
300
mW
PO
30
mW
Tamb
25
+70
Tj
65
+150
Tstg
storage temperature
65
+150
Notes
1. Stresses above those listed under limiting values may cause permanent damage to the device.
2. Parameters are valid over operating temperature range unless otherwise specified. All voltages are with respect to
VSS unless otherwise noted.
3. With external LCD supply voltage externally supplied (voltage generator disabled). VDDmax = 5 V if LCD supply
voltage is internally generated (voltage generator enabled).
4. When setting VLCD by software, take care not to set a VOP that will exceed the maximum of 8.5 V when operating at
25 C, see Caution in Section 8.9.
10 HANDLING
Inputs and outputs are protected against electrostatic discharge in normal handling. However, to be totally safe, it is
desirable to take normal precautions appropriate to handling MOS devices (see Handling MOS devices).
1999 Apr 12
17
Philips Semiconductors
Product specification
PCD8544
11 DC CHARACTERISTICS
VDD = 2.7 to 3.3 V; VSS = 0 V; VLCD = 6.0 to 9.0 V; Tamb = 25 to +70 C; unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
VDD1
supply voltage 1
2.7
3.3
VDD2
supply voltage 2
2.7
3.3
VLCD1
6.0
9.0
VLCD2
6.0
8.5
IDD1
240
300
IDD2
320
IDD3
1.5
IDD4
25
ILCD
42
VSS
0.3VDD
Logic
VIL
VIH
IL
leakage current
VI = VDD or VSS
0.7VDD
VDD
+1
12
20
Ro(R)
12
20
Vbias(tol)
100
+100
mV
1999 Apr 12
18
Philips Semiconductors
Product specification
PARAMETER
PCD8544
CONDITIONS
MIN.
TYP.
MAX.
UNIT
300
mV
TC0
mV/K
TC1
mV/K
TC2
17
mV/K
TC3
24
mV/K
Notes
1. The maximum possible VLCD voltage that may be generated is dependent on voltage, temperature and (display) load.
2. Internal clock.
3. RAM contents equal 0. During power-down, all static currents are switched off.
4. If external VLCD, the display load current is not transmitted to IDD.
5. Tolerance depends on the temperature (typically zero at 27 C, maximum tolerance values are measured at the
temperate range limit).
1999 Apr 12
19
Philips Semiconductors
Product specification
PCD8544
12 AC CHARACTERISTICS
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
fOSC
oscillator frequency
20
34
65
kHz
fclk(ext)
10
32
100
kHz
fframe
frame frequency
67
Hz
30
ms
ns
tVHRL
Fig.16
0(2)
tWL(RES)
Fig.16
100
clock frequency
4.00
MHz
Tcy
250
ns
tWH1
100
ns
tWL1
100
ns
tsu2
60
ns
th2
100
ns
tWH2
100
ns
th5
100
ns
tsu3
100
ns
th3
100
ns
tsu4
100
ns
th4
100
ns
Notes
1.
f clk ( ext )
T frame = ------------------480
1999 Apr 12
20
Philips Semiconductors
Product specification
PCD8544
Serial interface
tsu2
th2
tWH2
SCE
tsu3
th5
th3
th5
D/C
tWL1
tsu2
tWH1
Tcy
SCLK
tsu4
th4
SDIN
MGL644
12.2
Reset
DD
tWL(RES)
tRW
RES
MGL645
1999 Apr 12
21
Philips Semiconductors
Product specification
PCD8544
13 APPLICATION INFORMATION
Table 6
Programming example
SERIAL BUS BYTE
STEP
DISPLAY
D/C
DB7
DB6
DB5
DB4
DB3
DB2
DB1
OPERATION
DB0
SCE is going LOW
start
function set
PD = 0 and V = 0, select
extended instruction set
(H = 1 mode)
function set
PD = 0 and V = 0, select
normal instruction set
(H = 0 mode)
data write
MGL674
data write
MGL675
data write
MGL675
10
data write
MGL676
1999 Apr 12
22
Philips Semiconductors
Product specification
PCD8544
DISPLAY
D/C
DB7
DB6
DB5
DB4
DB3
DB2
DB1
DB0
OPERATION
data write
MGL677
12
data write
MGL678
13
14
MGL679
15
data write
MGL680
The pinning is optimized for single plane wiring e.g. for chip-on-glass display modules. Display size: 48 84 pixels.
The required minimum value for the external capacitors is:
Cext = 1.0 F.
Higher capacitor values are recommended for ripple
reduction.
handbook, halfpage
DISPLAY 48 84 pixels
24
84
24
14.1
PCD8544
PARAMETER
8
Cext
I/O
MGL635
1999 Apr 12
23
SIZE
Pad pitch
min. 100 m
80 100 m
Bump dimensions
59 89 17.5 (5) m
Wafer thickness
max. 380 m
This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here in
_white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here inThis text is here in
white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader. white to force landscape pages to be ...
pitch
y
24
1
13
12
11
10
9
8
7
6
5
4
3
2
18
17
16
15
14
23
22
21
20
19
26
25
24
27
28
29
30
31
32
172
160
161
162
163
164
165
166
167
168
169
170
171
132
133
134
135
136
137
138
139
140
141
142
143
144
145
146
147
148
149
150
151
152
153
154
155
156
157
158
159
104
105
106
107
108
109
110
111
112
113
114
115
116
117
118
119
120
121
122
123
124
125
126
127
128
129
130
131
0
76
77
78
79
80
81
82
83
84
85
86
87
88
89
90
91
92
93
94
95
96
97
98
99
100
101
102
103
63
64
65
66
67
68
69
70
71
72
73
74
75
PCD8544-1
2.5
mm
33
38
37
36
35
34
39
43
42
41
40
44
45
46
47
48
49
61
60
59
58
57
56
55
54
53
52
51
50
62
Philips Semiconductors
PCD8544-1
2.5 mm
14.2
1999 Apr 12
12.97 mm
12.97 mm
MGR935
Product specification
PCD8544
Philips Semiconductors
Product specification
PCD8544
PAD
PAD NAME
PAD
PAD NAME
dummy1
+5932
+1060
39
T4
2709
+1085
R36
+5704
+1060
40
VSS1
2876
+1085
VSS1
2976
+1085
R37
+5604
+1060
41
R38
+5504
+1060
42
VSS1
3076
+1085
R39
+5404
+1060
43
VSS1
3176
+1085
T1
3337
+1085
R40
+5304
+1060
44
R41
+5204
+1060
45
VLCD2
3629
+1085
R42
+5104
+1060
46
VLCD2
3789
+1085
VLCD1
4231
+1085
R43
+5004
+1060
47
10
R44
+4904
+1060
48
VLCD1
4391
+1085
11
R45
+4804
+1060
49
T2
4633
+1085
R23
4894
+1060
12
R46
+4704
+1060
50
13
R47
+4604
+1060
51
R22
4994
+1060
14
VDD1
+4330
+1085
52
R21
5094
+1060
15
VDD1
+4230
+1085
53
R20
5194
+1060
R19
5294
+1060
16
VDD1
+4130
+1085
54
17
VDD1
+4030
+1085
55
R18
5394
+1060
18
VDD1
+3930
+1085
56
R17
5494
+1060
R16
5594
+1060
19
VDD2
+3750
+1085
57
20
VDD2
+3650
+1085
58
R15
5694
+1060
21
VDD2
+3550
+1085
59
R14
5794
+1060
R13
5894
+1060
+1060
22
VDD2
+3450
+1085
60
23
VDD2
+3350
+1085
61
R12
5994
24
VDD2
+3250
+1085
62
dummy2
6222
+1060
dummy3
6238
738
R0
5979
738
25
VDD2
+3150
+1085
63
26
VDD2
+3050
+1085
64
27
SCLK
+2590
+1085
65
R1
5879
738
R2
5779
738
28
SDIN
+2090
+1085
66
29
D/C
+1090
+1085
67
R3
5679
738
30
SCE
+90
+1085
68
R4
5579
738
31
RES
910
+1085
69
R5
5479
738
32
OSC
1410
+1085
70
R6
5379
738
33
T3
1826
+1085
71
R7
5279
738
34
VSS2
2068
+1085
72
R8
5179
738
35
VSS2
2168
+1085
73
R9
5079
738
36
VSS2
2268
+1085
74
R10
4979
738
37
VSS2
2368
+1085
75
R11
4879
738
VSS2
2468
+1085
76
C0
4646
746
38
1999 Apr 12
25
Philips Semiconductors
Product specification
PAD NAME
C1
x
4546
PCD8544
PAD
PAD NAME
746
118
C42
296
746
78
C2
4446
746
119
C43
196
746
79
C3
4346
746
120
C44
96
746
80
C4
4246
746
121
C45
+4
746
81
C5
4146
746
122
C46
+104
746
82
C6
4046
746
123
C47
+204
746
83
C7
3946
746
124
C48
+304
746
84
C8
3846
746
125
C49
+404
746
85
C9
3746
746
126
C50
+504
746
86
C10
3646
746
127
C51
+604
746
87
C11
3546
746
128
C52
+704
746
88
C12
3446
746
139
C53
+804
746
89
C13
3346
746
130
C54
+904
746
90
C14
3246
746
131
C55
+1004
746
91
C15
3146
746
132
C56
+1254
746
92
C16
3046
746
133
C57
+1354
746
93
C17
2946
746
134
C58
+1454
746
94
C18
2846
746
135
C59
+1554
746
95
C19
2746
746
136
C60
+1654
746
96
C20
2646
746
137
C61
+1754
746
97
C21
2546
746
138
C62
+1854
746
98
C22
2446
746
139
C63
+1954
746
99
C23
2346
746
140
C64
+2054
746
100
C24
2246
746
141
C65
+2154
746
101
C25
2146
746
142
C66
+2254
746
102
C26
2046
746
143
C67
+2354
746
103
C27
1946
746
144
C68
+2454
746
104
C28
1696
746
145
C69
+2554
746
105
C29
1596
746
146
C70
+2654
746
106
C30
1496
746
147
C71
+2754
746
107
C31
1396
746
148
C72
+2854
746
108
C32
1296
746
149
C73
+2954
746
109
C33
1196
746
150
C74
+3054
746
110
C34
1096
746
151
C75
+3154
746
111
C35
996
746
152
C76
+3254
746
112
C36
896
746
153
C77
+3354
746
113
C37
796
746
154
C78
+3454
746
114
C38
696
746
155
C79
+3554
746
115
C39
596
746
156
C80
+3654
746
116
C40
496
746
157
C81
+3754
746
117
C41
396
746
158
C82
+3854
746
1999 Apr 12
26
Philips Semiconductors
Product specification
PAD NAME
C83
x
+3954
y
746
160
R35
+4328
738
161
R34
+4428
738
162
R33
+4528
738
163
R32
+4628
738
164
R31
+4728
738
165
R30
+4828
738
166
R29
+4928
738
167
R28
+5028
738
168
R27
+5128
738
169
R26
+5228
738
170
R25
+5328
738
171
R24
+5428
738
172
dummy4
+5694
738
1999 Apr 12
27
PCD8544
Philips Semiconductors
Product specification
LCD O/Ps
VDD SUPPLY
PCD8544
VDD1, VDD2
VLCD2
VSS1
VSS1
VLCD SUPPLY
VLCD1, VLCD2
T2, T3
VSS1
VDD2
INPUT PINS
VDD1
VSS1
SCLK, SDIN, OSC,
RES, D/C, SCE,
T1, T4
VSS2
VSS1
VSS1
VLCD2
VLCD1
VSS1
VSS1
VDD1
VSS2
MGL634
1999 Apr 12
28
Philips Semiconductors
Product specification
PCD8544
15 TRAY INFORMATION
B
F
E
MGL646
Table 8
DIM.
PCD8544-1
handbook, halfpage
MGL647
1999 Apr 12
29
Dimensions
DESCRIPTION
VALUE
14.82 mm
4.39 mm
13.27 mm
2.8 mm
50.67 mm
50.67 mm
11
Philips Semiconductors
Product specification
PCD8544
16 DEFINITIONS
Data sheet status
Objective specification
This data sheet contains target or goal specifications for product development.
Preliminary specification
This data sheet contains preliminary data; supplementary data may be published later.
Product specification
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
17 LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
1999 Apr 12
30
Philips Semiconductors
Product specification
1999 Apr 12
31
PCD8544
Internet: http://www.semiconductors.philips.com
SCA63
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
465008/750/01/pp32