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PROBLEM 1.

60
KNOWN: Thickness and thermal conductivity, k, of an oven wall. Temperature and emissivity, , of
front surface. Temperature and convection coefficient, h, of air. Temperature of large surroundings.
FIND: (a) Temperature of back surface, (b) Effect of variations in k, h and .
SCHEMATIC:

ASSUMPTIONS: (1) Steady-state, (2) One-dimensional conduction, (3) Radiation exchange with large
surroundings.
ANALYSIS: (a) Applying an energy balance, Eq. 1.13, at an instant of time to the front surface and
substituting the appropriate rate equations, Eqs. 1.2, 1.3a and 1.7, find

T T
k 1 2 = h ( T2 T ) + T24 Ts4ur .
L
Substituting numerical values, find
T1 T2 =

W
W

4
4
8
20
100 K + 0.8 5.67 10
400 K ) ( 300 K ) = 200 K .
(

0.7 W/m K m 2 K

m2 K 4
0.05 m

<

Since T2 = 400 K, it follows that T1 = 600 K.

(b) Parametric effects may be evaluated by using the IHT First Law Model for a Nonisothermal Plane
Wall. Changes in k strongly influence conditions for k < 20 W/mK, but have a negligible effect for
larger values, as T2 approaches T1 and the heat fluxes approach the corresponding limiting values
10000
Heat flux, q''(W/m^2)

Temperature, T2(K)

600

500

8000
6000
4000
2000

400

0
0

100

200

300

400

Thermal conductivity, k(W/m.K)


300
0

100

200

300

Thermal conductivity, k(W/m.K)

400

Conduction heat flux, q''cond(W/m^2)


Convection heat flux, q''conv(W/m^2)
Radiation heat flux, q''rad(W/m^2)

Continued
Excerpts from this work may be reproduced by instructors for distribution on a not-for-profit basis for testing or instructional purposes only to students enrolled in
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PROBLEM 1.60 (Cont.)


The implication is that, for k > 20 W/mK, heat transfer by conduction in the wall is extremely efficient
relative to heat transfer by convection and radiation, which become the limiting heat transfer processes.
Larger fluxes could be obtained by increasing and h and/or by decreasing T and Tsur .
With increasing h, the front surface is cooled more effectively ( T2 decreases), and although qrad
decreases, the reduction is exceeded by the increase in qconv . With a reduction in T2 and fixed values
of k and L, qcond must also increase.

30000
Heat flux, q''(W/m^2)

Temperature, T2(K)

600

500

20000

10000

0
0

100

200

Convection coefficient, h(W/m^2.K)


400
0

100

Conduction heat flux, q''cond(W/m^2)


Convection heat flux, q''conv(W/m^2)
Radiation heat flux, q''rad(W/m^2)

200

Convection coefficient, h(W/m^2.K)

The surface temperature also decreases with increasing , and the increase in qrad exceeds the reduction
in qconv , allowing qcond to increase with .
10000
Heat flux, q''(W/m^2)

575

Temperature, T2(K)

570

565

560

8000
6000
4000
2000
0
0

555

0.2

0.4

0.6

0.8

Emissivity
550
0

0.2

0.4

0.6

Emissivity

0.8

Conduction heat flux, q''cond(W/m^2)


Convection heat flux, q''conv(W/m^2)
Radiation heat flux, q''rad(W/m^2)

COMMENTS: Conservation of energy, of course, dictates that, irrespective of the prescribed conditions,
qcond = qconv + qrad .

Excerpts from this work may be reproduced by instructors for distribution on a not-for-profit basis for testing or instructional purposes only to students enrolled in
courses for which the textbook has been adopted. Any other reproduction or translation of this work beyond that permitted by Sections 107 or 108 of the 1976
United States Copyright Act without the permission of the copyright owner is unlawful.

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