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sm1 71 PDF
71
KNOWN: Surface-mount transistor with prescribed dissipation and convection cooling conditions.
FIND: (a) Case temperature for mounting arrangement with air-gap and conductive paste between case
, subject to the constraint that T = 40C.
and circuit board, (b) Consider options for increasing E
g
c
SCHEMATIC:
ASSUMPTIONS: (1) Steady-state conditions, (2) Transistor case is isothermal, (3) Upper surface
experiences convection; negligible losses from edges, (4) Leads provide conduction path between case
and board, (5) Negligible radiation, (6) Negligible energy generation in leads due to current flow, (7)
Negligible convection from surface of leads.
PROPERTIES: (Given): Air, k g,a = 0.0263 W/mK; Paste, k g,p = 0.12 W/mK; Metal leads, k A =
25 W/mK.
ANALYSIS: (a) Define the transistor as the system and identify modes of heat transfer.
E in E out + E g = E st = 0
Tc = hAsT + k g As /t + 3 ( k A Ac /L ) Tb + E g / hAs + k g As /t + 3 ( k A Ac /L )
Substituting numerical values, with the air-gap condition ( k g,a = 0.0263 W/mK)
8 2
3
D
3
3
3
+3 25 W/m K 25 10 m /4 10 m 35 C / 1.600 10 + 4.208 10 + 4.688 10 W/K
Tc = 47.0D C .
<
Continued..
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0.7
0.6
0.5
0.4
0.3
50
100
150
200
250
As indicated by the energy balance, the power dissipation increases linearly with increasing h, as well as
with increasing k A . For h = 250 W/m2K (enhanced air cooling) and k A = 400 W/mK (copper leads),
the transistor may dissipate up to 0.63 W.
COMMENTS: Additional benefits may be derived by increasing heat transfer across the gap separating
the case from the board, perhaps by inserting a highly conductive material in the gap.
Excerpts from this work may be reproduced by instructors for distribution on a not-for-profit basis for testing or instructional purposes only to students enrolled in
courses for which the textbook has been adopted. Any other reproduction or translation of this work beyond that permitted by Sections 107 or 108 of the 1976
United States Copyright Act without the permission of the copyright owner is unlawful.