MCT6, MCT61, MCT62 Dual Phototransistor Optocouplers: Features Description

MCT6, MCT61, MCT62
Dual Phototransistor Optocouplers

Features
Description
Two isolated channels per package
The MCT6X Optocouplers have two channels for density

applications. For four channel applications, two-packages
fit into a standard 16-pin DIP socket. Each channel is an
NPN silicon planar phototransistor optically coupled to a
gallium arsenide infrared emitting diode.
Two packages fit into a 16 lead DIP socket

Choice of three current transfer ratios
Underwriters Laboratory (U.L.) recognized File E90700
VDE approved for IEC60747-5-2
Applications
AC line/digital logic isolate high voltage transients
Digital logic/digital logic eliminate spurious grounds
Digital logic/AC triac control isolate high voltage
transients
Twisted pair line receiver eliminate ground loop
feedthrough
Telephone/telegraph line receiver isolate high
voltage transients
High frequency power supply feedback control
maintain floating grounds and transients

Relay contact monitor isolate floating grounds and
transients
Power supply monitor isolate transients
Schematic
Package Outlines
ANODE 1
8 EMITTER
8
1
CATHODE 2
7 COLLECTOR
CATHODE 3
6 COLLECTOR
8
1
ANODE 4
5 EMITTER
Equivalent Circuit
2006 Fairchild Semiconductor Corporation

MCT6, MCT61, MCT62 Rev. 1.0.5
www.fairchildsemi.com
MCT6, MCT61, MCT62 Dual Phototransistor Optocouplers
February 2010
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.
In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability.
The absolute maximum ratings are stress ratings only.
Symbol
Rating
Value
Unit
Storage Temperature
-55 to +150
TOPR
Operating Temperature
-55 to +100
TSOL
Lead Solder Temperature

(Refer to Reflow Temperature Profile)
260 for 10 sec
400
mW
5.33
mW/C
Forward Current Continuous
60
mA
Forward Current Peak (PW = 1s, 300pps)
Reverse Voltage
3.0
LED Power Dissipation @ TA = 25C
100
mW
Derate above 25C (Total Input)
1.3
mW/C
Collector Current Continuous
30
mA
Detector Power Dissipation @ TA = 25C
150
mW
2.0
mW/C
TOTAL DEVICE
TSTG
PD
Total Device Power Dissipation @ TA = 25C

Derate above 25C
EMITTER (Each channel)

IF
IF(pk)
VR
PD
DETECTOR (Each channel)

IC
PD
Derate above 25C

2
Absolute Maximum Ratings
Individual Component Characteristics

Symbol
Parameter
Test Conditions
Min.
Typ.*
Max.
Units
1.2
1.5
10
EMITTER
VF
Input Forward Voltage
IF = 20mA
VR
Reverse Voltage
IR = 10A
IR
Reverse Current
VR = 5V
CJ
Junction Capacitance
VF = 0V, f = 1MHz
3.0
25
0.001
50
pF
DETECTOR
BVCEO
Collector-Emitter Breakdown Voltage
IC = 1.0mA, IF = 0
30
85
BVECO
Emitter-Collector Breakdown Voltage
IE = 100A, IF = 0
13
ICEO
Collector-Emitter Dark Current
VCE = 10V, IF = 0
CCE
Capacitance
VCE = 0V, f = 1MHz
100
nA
pF
Transfer Characteristics
Symbol
Characteristic
Test Conditions
Min.
Typ.*
Max.
Units
SWITCHING CHARACTERISTICS (AC)

ton
Non-Saturated Turn-on Time
toff
Non-Saturated Turn-off Time
RL = 100, IC = 2mA, VCC = 10V
2.4
2.4
CURRENT TRANSFER RATIO, COLLECTOR-EMITTER (DC)

CTR
MCT6
IF = 10mA, VCE = 10V
20
MCT61
IF = 5mA, VCE = 5V
50
MCT62
VCE(sat)
Saturation Voltage
100
IF = 16mA, IC = 2mA
0.15
0.40
Isolation Characteristics
Symbol
VISO
Characteristic
Input-Output Isolation Voltage
Test Conditions
Min.
Typ.*
Max.
Units
II-O 10A, t = 1min.
5000
Vac(rms)
1011
RISO
Isolation Resistance
VI-O = 500VDC
CISO
Isolation Capacitance
f = 1MHz
0.5
pF
*All typicals at TA = 25C

3
Electrical Characteristics (TA = 25C unless otherwise specified)
Typical Performance Curves

Fig. 2 Normalized CTR vs. Ambient Temperature
Fig. 1 Normalized CTR vs. Forward Current
1.6
1.4
VCE = 5.0V
TA = 25C
1.4
1.0
NORMALIZED CTR
NORMALIZED CTR
1.2
Normalized to
IF = 10mA
0.8
0.6
0.4
IF = 5mA
1.2
1.0
IF = 10mA
0.8
0.6
0.2
0.0
0
5
10
15
IF - FORWARD CURRENT (mA)
Normalized to
IF = 10mA
TA = 25C
0.4
-75
20
-50
-25
0
25
50
75
100
TA - AMBIENT TEMPERATURE (C)
IF = 10mA
VCC = 10V
TA = 25C
VCE = 10V
SWITCHING SPEED (s)
ICEO - COLLECTOR-EMITTER DARK CURRENT (A)
1000
10 0
10 -1
10 -2
10
-3
10 -4
10
125
Fig. 4 Switching Speed vs. Load Resistor
Fig. 3 Dark Current vs. Ambient Temperature

10
IF = 20mA
100
Toff
Tf
10
Ton
Tr
-5
10 -6
25
50
75
100
0.1
125
0.1
1
10
R - LOAD RESISTOR (k)
TA - AMBIENT TEMPERATURE (C)
100
Fig. 6 Collector-Emitter Saturation Voltage

vs. Collector Current
Fig. 5 LED Forward Voltage vs. Forward Current

1.8
100
TA = 25C
VCE (SAT) - COLLECTOR-EMITTER

SATURATION VOLTAGE (V)
VF - FORWARD VOLTATGE (V)
1.7
1.6
1.5
1.4
TA = 55C
1.3
TA = 25C
1.2
10
1
IF = 2.5mA
0.1
IF = 20mA
0.01
IF = 10mA
1.1
IF = 5mA
TA = 100C
1.0
1
10
IF - LED FORWARD CURRENT (mA)

0.001
0.01
100
0.1
10
IC - COLLECTOR CURRENT (mA)
4
Through Hole
Surface Mount
9.18~10.18
(0.405)
9.18~10.18
(0.405)
Pin 1
Pin 1
6.00~7.00
6.00~7.00
3.00~4.00
1.15~1.35
3.00~4.00
4.50
(Typ.)
1.15~1.35
0.35
Typ.
1.00
(Typ.)
2.30~3.30
3.85
Typ.
0.26 Typ.
2.29~2.79
0.40~0.60
7.62 (Typ.)
0.40~0.60
15
(Max.)
2.29~2.79
0.75~1.25
(Both sides
8.15 (Typ.)
9.86~10.46
0.26 (Typ.)
0.4" Lead Spacing

Recommend Pad Layout for Surface
Mount Leadform
9.18~10.18
(0.405)
Pin 1
(1.50)
(2.54)
6.00~7.00
(1.30)
(10.50)
(7.90)
3.00~4.00
1.15~1.35
4.60
(Typ.)
(1.04)
15
(Max.)
1.10
(Typ.)
2.30~3.30
2.29~2.79
0.40~0.60
10.16 (Typ.)
0.26 (Typ.)
Note:
All dimensions are in millimeters.

5
Package Dimensions
Option
Example Part Number
No Option
MTC6
MTC6S
Description
Standard Through Hole
Surface Mount Lead Bend
SD
MTC6SD
Surface Mount; Tape and Reel
300
MCT6300
VDE Approved
3S
MCT63S
Surface Mount Lead Bend; VDE Approved
3SD
MCT63SD
300W
MTC6300W
Surface Mount; Tape and Reel; VDE Approved

0.4" Lead Spacing; VDE Approved
Marking Information
V
3
MCT6
XX YY T1
Definitions
1
Fairchild logo
Device number
VDE mark (Note: Only appears on parts ordered with VDE

option See order entry table)
Two digit year code, e.g., 03
Two digit work week ranging from 01 to 53
Assembly package code

6
Ordering Information
12.0 0.1
4.90 0.20
0.30 0.05
4.0 0.1
4.0 0.1
1.55 0.05
1.75 0.10
7.5 0.1
13.2 0.2
10.30 0.20
0.1 MAX
10.30 0.20
16.0 0.3
1.6 0.1
User Direction of Feed
Note:
All dimensions are in inches (millimeters)

7
Carrier Tape Specifications
Reflow Profile
Temperature (C)
TP
260
240
TL
220
200
180
160
140
120
100
80
60
40
20
0
Max. Ramp-up Rate = 3C/S

Max. Ramp-down Rate = 6C/S
tP
Tsmax
tL
Preheat Area
Tsmin
ts
120
240
360
Time 25C to Peak
Time (seconds)
Profile Feature
Pb-Free Assembly Profile
Temperature Min. (Tsmin)
150C
Temperature Max. (Tsmax)
200C
Time (tS) from (Tsmin to Tsmax)
60120 seconds
Ramp-up Rate (tL to tP)
3C/second max.
Liquidous Temperature (TL)
217C
Time (tL) Maintained Above (TL)
60150 seconds
Peak Body Package Temperature
260C +0C / 5C
Time (tP) within 5C of 260C
30 seconds
Ramp-down Rate (TP to TL)
6C/second max.
Time 25C to Peak Temperature

8 minutes max.
8
AccuPower
Auto-SPM
Build it Now
CorePLUS
CorePOWER
CROSSVOLT
CTL
Current Transfer Logic
DEUXPEED
Dual Cool
EcoSPARK
EfficientMax
Fairchild
Fairchild Semiconductor
FACT Quiet Series
FACT
FAST
FastvCore
FETBench
FlashWriter*
FPS
F-PFS
FRFET
SM
Global Power Resource
Green FPS
Green FPS e-Series
Gmax
GTO
IntelliMAX
ISOPLANAR
MegaBuck
MICROCOUPLER
MicroFET
MicroPak
MicroPak2
MillerDrive
MotionMax
Motion-SPM
OptoHiT
OPTOLOGIC
OPTOPLANAR
PDP SPM
Power-SPM
PowerTrench
PowerXS
Programmable Active Droop
QFET
QS
Quiet Series
RapidConfigure
Saving our world, 1mW/W/kW at a time
SignalWise
SmartMax
SMART START
SPM
STEALTH
SuperFET
SuperSOT -3
SuperSOT -6
SuperSOT -8
SupreMOS
SyncFET
Sync-Lock
The Power Franchise
TinyBoost
TinyBuck
TinyCalc
TinyLogic
TINYOPTO
TinyPower
TinyPWM
TinyWire
TriFault Detect
TRUECURRENT *
SerDes
UHC
Ultra FRFET
UniFET
VCX
VisualMax
XS
* Trademarks of System General Corporation, used under license by Fairchild Semiconductor.

DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE
RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR
CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE
SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILDS WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN,
WHICH COVERS THESE PRODUCTS.
LIFE SUPPORT POLICY
FAIRCHILDS PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE
EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.
As used herein:
1. Life support devices or systems are devices or systems which, (a) are
intended for surgical implant into the body or (b) support or sustain life,
and (c) whose failure to perform when properly used in accordance
with instructions for use provided in the labeling, can be reasonably
expected to result in a significant injury of the user.
2. A critical component in any component of a life support, device, or

system whose failure to perform can be reasonably expected to
cause the failure of the life support device or system, or to affect its
safety or effectiveness.
ANTI-COUNTERFEITING POLICY
Fairchild Semiconductor Corporation's Anti-Counterfeiting Policy. Fairchild's Anti-Counterfeiting Policy is also stated on our external website, www.fairchildsemi.com,
under Sales Support.
Counterfeiting of semiconductor parts is a growing problem in the industry. All manufacturers of semiconductor products are experiencing counterfeiting of their parts.
Customers who inadvertently purchase counterfeit parts experience many problems such as loss of brand reputation, substandard performance, failed applications,
and increased cost of production and manufacturing delays. Fairchild is taking strong measures to protect ourselves and our customers from the proliferation of
counterfeit parts. Fairchild strongly encourages customers to purchase Fairchild parts either directly from Fairchild or from Authorized Fairchild Distributors who are
listed by country on our web page cited above. Products customers buy either from Fairchild directly or from Authorized Fairchild Distributors are genuine parts, have
full traceability, meet Fairchild's quality standards for handling and storage and provide access to Fairchild's full range of up-to-date technical and product information.
Fairchild and our Authorized Distributors will stand behind all warranties and will appropriately address any warranty issues that may arise. Fairchild will not provide
any warranty coverage or other assistance for parts bought from Unauthorized Sources. Fairchild is committed to combat this global problem and encourage our
customers to do their part in stopping this practice by buying direct or from authorized distributors.
PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet Identification
Product Status
Advance Information
Formative / In Design
Preliminary
First Production
No Identification Needed
Full Production
Obsolete
Not In Production
Definition
Datasheet contains the design specifications for product development. Specifications may change in
any manner without notice.
Datasheet contains preliminary data; supplementary data will be published at a later date. Fairchild
Semiconductor reserves the right to make changes at any time without notice to improve design.
Datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes
at any time without notice to improve the design.
Datasheet contains specifications on a product that is discontinued by Fairchild Semiconductor.
The datasheet is for reference information only.
Rev. I47

9
TRADEMARKS
The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global subsidiaries, and is not
intended to be an exhaustive list of all such trademarks.

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MCT6, MCT61, MCT62 Dual Phototransistor Optocouplers: Features Description

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Available Formats

MCT6, MCT61, MCT62

Dual Phototransistor Optocouplers

Two isolated channels per package

The MCT6X Optocouplers have two channels for density

Two packages fit into a 16 lead DIP socket

maintain floating grounds and transients

2006 Fairchild Semiconductor Corporation