Electronic Packaging - MAE 478

Homework #5
(Submission on SAKAI preferred)
LSAXENA@rci.rutgers.edu)
Printed Circuit Boards and Solder Joints
References:
Chapters 16 & 17 of Fundamentals of Microsystems Packaging, Rao R. Tummala,
McGraw-Hill

http://www.pcstats.com/articleview.cfm?articleid=1722&page=15

http://en.wikipedia.org/wiki/Printed_circuit_board

http://encyclopedia2.thefreedictionary.com/printed+circuit+board

(Keep answers short)

1. What do the terms PWB, PCB, SMT, PTH, Via, DFM, CAD denote?
2. What are the following:
a) Blind Via
b) Through Via
c) Buried Via
3. What are Printed Circuit Boards made of? Name the materials used for
conductors and the insulators.
4. What determines the number of layers on a PC board?
5. What functions does a PC board perform?
6. What is FR-4?
7. What is glass transition temperature? What is it for FR-4?
8. What is CTE? What are the values of CTE for FR-4, copper and for silicon?
9. What is the relationship between drill-hole size and the cost on a PC Board?
10. How large is the PWB market?
11. What is the composition of the most commonly used solder? What is its melting
point?
12. What is wave soldering? For what type of components is it used?
13. What is the difference between surface mount and through-hole components?
What type of soldering process is used for each?
14. Which soldering process, surface mount or wave soldering, is harsher on the
components? Why?
15. What is the impact of the directive to remove lead from electronic assemblies, on
PC boards, the components that are mounted on the boards and solder?
16. What are the common lead-free solders? What are their melting points?