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MPSA92, MPSA93 High Voltage Transistors: PNP Silicon
MPSA92, MPSA93 High Voltage Transistors: PNP Silicon
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Symbol
VCEO
VCBO
Value
Unit
Vdc
200
300
5.0
Vdc
IC
500
mAdc
PD
625
5.0
mW
mW/C
PD
1.5
12
W
mW/C
55 to
+150
TJ, Tstg
THERMAL CHARACTERISTICS
Characteristic
12
VEBO
TO92
(TO226AA)
CASE 2911
Vdc
200
300
Symbol
Max
Unit
Thermal Resistance,
JunctiontoAmbient
RqJA
200
C/W
Thermal Resistance,
JunctiontoCase
RqJC
83.3
C/W
3
STRAIGHT LEAD
BULK PACK
COLLECTOR
3
2
BASE
1
EMITTER
3
BENT LEAD
TAPE & REEL
AMMO PACK
MARKING
DIAGRAM
MPS
A9x
AYWWG
G
x
= 2 or 3
A
= Assembly Location
Y
= Year
WW
= Work Week
G
= PbFree Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 3 of this data sheet.
*For additional information on our PbFree strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
MPSA92, MPSA93
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)
Characteristic
Symbol
Min
Max
Unit
300
200
300
200
5.0
0.25
0.25
0.1
25
40
25
25
0.5
0.4
VBE(sat)
0.9
Vdc
fT
50
MHz
6.0
8.0
OFF CHARACTERISTICS
Collector Emitter Breakdown Voltage (Note 1)
(IC = 1.0 mAdc, IB = 0)
MPSA92
MPSA93
MPSA92
MPSA93
V(BR)CEO
V(BR)CBO
V(BR)EBO
MPSA92
MPSA93
ICBO
IEBO
Vdc
Vdc
Vdc
mAdc
mAdc
ON CHARACTERISTICS (Note 1)
DC Current Gain
(IC = 1.0 mAdc, VCE = 10 Vdc)
(IC = 10 mAdc, VCE = 10 Vdc)
All Types
All Types
hFE
MPSA92
MPSA93
MPSA92
MPSA93
VCE(sat)
Vdc
SMALLSIGNAL CHARACTERISTICS
Current Gain Bandwidth Product
(IC = 10 mAdc, VCE = 20 Vdc, f = 100 MHz)
CollectorBase Capacitance
(VCB = 20 Vdc, IE = 0, f = 1.0 MHz)
MPSA92
MPSA93
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2
Ccb
pF
MPSA92, MPSA93
ORDERING INFORMATION
Package
Shipping
MPSA92G
TO92
(PbFree)
MPSA92RL1G
TO92
(PbFree)
MPSA92RLRA
TO92
MPSA92RLRAG
TO92
(PbFree)
MPSA92RLRMG
TO92
(PbFree)
MPSA92RLRPG
TO92
(PbFree)
MPSA92ZL1G
TO92
(PbFree)
MPSA93G
TO92
(PbFree)
MPSA93RLRMG
TO92
(PbFree)
Device
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
300
250
hFE , DC CURRENT GAIN
VCE = 10 Vdc
TJ = +125C
200
25C
150
-55C
100
50
0
0.1
1.0
10
IC, COLLECTOR CURRENT (mA)
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3
100
MPSA92, MPSA93
f,
T CURRENT-GAIN BANDWIDTH (MHz)
100
C, CAPACITANCE (pF)
Cib @ 1MHz
10
Ccb @ 1MHz
1.0
0.1
0.1
1.0
10
100
VR, REVERSE VOLTAGE (VOLTS)
150
130
110
90
70
50
TJ = 25C
VCE = 20 Vdc
F = 20 MHz
30
10
1000
Figure 2. Capacitance
11
13
15
7
9
IC, COLLECTOR CURRENT (mA)
17
19
21
1.4
VCE(sat) @ 25C, IC/IB = 10
VCE(sat) @ 125C, IC/IB = 10
VCE(sat) @ 55C, IC/IB = 10
VBE(sat) @ 25C, IC/IB = 10
1.0
0.8
0.6
0.4
0.2
0.0
0.1
1.0
10
IC, COLLECTOR CURRENT (mA)
100
Figure 4. ON Voltages
1
IC, COLLECTOR CURRENT (A)
V, VOLTAGE (VOLTS)
1.2
10 ms
0.1
1.0 s
0.01
0.001
10
100
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4
1000
MPSA92, MPSA93
PACKAGE DIMENSIONS
TO92 (TO226)
CASE 02911
ISSUE AM
A
STRAIGHT LEAD
BULK PACK
R
P
L
SEATING
PLANE
X X
G
J
H
V
C
SECTION XX
BENT LEAD
TAPE & REEL
AMMO PACK
P
T
SEATING
PLANE
X X
J
V
1
DIM
A
B
C
D
G
H
J
K
L
N
P
R
V
INCHES
MIN
MAX
0.175
0.205
0.170
0.210
0.125
0.165
0.016
0.021
0.045
0.055
0.095
0.105
0.015
0.020
0.500
--0.250
--0.080
0.105
--0.100
0.115
--0.135
---
MILLIMETERS
MIN
MAX
4.45
5.20
4.32
5.33
3.18
4.19
0.407
0.533
1.15
1.39
2.42
2.66
0.39
0.50
12.70
--6.35
--2.04
2.66
--2.54
2.93
--3.43
---
STYLE 14:
PIN 1. EMITTER
2. COLLECTOR
3. BASE
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. CONTOUR OF PACKAGE BEYOND DIMENSION R
IS UNCONTROLLED.
4. LEAD DIMENSION IS UNCONTROLLED IN P AND
BEYOND DIMENSION K MINIMUM.
C
N
SECTION XX
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. CONTOUR OF PACKAGE BEYOND
DIMENSION R IS UNCONTROLLED.
4. LEAD DIMENSION IS UNCONTROLLED IN P
AND BEYOND DIMENSION K MINIMUM.
DIM
A
B
C
D
G
J
K
N
P
R
V
MILLIMETERS
MIN
MAX
4.45
5.20
4.32
5.33
3.18
4.19
0.40
0.54
2.40
2.80
0.39
0.50
12.70
--2.04
2.66
1.50
4.00
2.93
--3.43
---
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
Typical parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including Typicals must be validated for each customer application by customers technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
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5
MPSA92/D