NIT Syllabus

SCHEME
& SYLLABUS
Of
B.TECH.
ELECTRONICS & COMMUNICATION
ENGINEERING
DEPARTMENT OF ELECTRONICS & COMMUNICATION ENGG.

NATIONAL INSTITUTE OF TECHNOLOGY, HAMIRPUR-177 005 (HP)
New Scheme
(For Students Admitted in 2011 onwards)
Scheme of Courses and Syllabus for

B.Tech Electronics & Communication Engineering
ELECTRONICS & COMMUNICATION ENGINEERING DEPARTMENT
NATIONAL INSTITUTE OF TECHNOLOGY HAMIRPUR HP-177005
Preamble: The scheme for the course of B. Tech. Electronics & Communication Engineering
has been revised keeping in view the required shift in curriculum, arising due to developments in
the previous decade and changes foreseen to take place in near future. The scheme has been
prepared keeping in view the guidelines issued by AICTE from time to time. The scheme has
been prepared giving a proper proportionate weightage to Basic Sciences, Management and
Social Sciences, Technical Art and Professional Core and Elective Courses. To embark
flexibility in the scheme a number of elective courses have been introduced at an appropriate
level. This also provides freedom to students to study courses of his/her interest/ choice of
specialization at B. Tech level itself. The Scheme has 16 Basic core courses, 23 Professional core
courses and 7 elective courses (out of which 2 are Institute level Electives). Each course has been
assigned a unique course number based on following pattern.
EC
EC Stands for the offering Department i.e. Electronics & Communication Engineering in our
case.
@- indicates the Year of Instruction
# - indicates the semester, 1 if odd and 2 if even
$ - indicates subject specific number relating to specialization as given in following table.
It is proposed that the course numbers of these subjects shall remain unchanged. The scheme has
been designed keeping in view class strength as 45 students per course. The distribution of the
core and other courses are as follows.
Basic Core Courses

S. No
Course No.
Course Title
Credits
PH-101
Engineering Physics
MA-111
Engineering Mathematics-I
ME-101
Engineering Mechanics & Strength of Materials
EE-101
Basic Electrical Engineering
HS-101
Communication Skills
CS-101
Computer Fundamentals & Programming
MA-121
Engineering MathematicsII

8
CH-101
Engineering Chemistry
MS-101
Material Science and Engineering
10
EC-101
Basic Electronics Engineering
11
CE-101
Environmental Sciences & Disaster Management 4
12
AR-101
Engineering Drawing
13
MA-214
Mathematics -III
14
HS-201
Managerial Economics
15
HS-203
Professional Ethics and Human Values
16
HS-301
Principles of Management
17
ECA-201
Extra Curricular Activity
14
Laboratories
18
Total Credits
74
Professional Core Courses

S. No
Course No.
Course Title
Credits
EC-211
Analog Electronics
EC-212
Digital Electronics & Logic Design
EC-213
Communication Theory
EC -214
Electromagnetic Field Theory
EC-215
Network Analysis & Synthesis
EC-221
Linear Integrated Circuits
EC-222
Electronic Switching Circuits
EC-223
Analog Communication Systems
EC-224
VLSI & MEMS Technology
10
EC -225
Electronic Measurement & Instrumentation
11
EC -311
Microprocessor Theory & Applications
12
EC-312
Digital Communication Systems
13
EC-313
Antenna and Wave Propagation
14
EC-315
Signal and Wave Shaping
15
EC-321
Microcontroller & Embedded Systems

16
EC-322
Wireless Communication
17
EC -323
Industrial Electronics
18
EC-411
Data Communication & Computer Networks
19
EC-412
Digital Signal Processing
20
EC- 413
Optical & Network Communication Systems
21
EE- 416
Control Systems
22
EC-421
Microwave Devices & Systems
23
CS-426
Computer Architecture & Organization
Laboratories
14
25
Industrial Training
26
Seminar/ Colloquium
27
Project
Total Credits
116
Open Electives
Open
Electives
I
II
Course No.
Course Title
EC -310 (a)
Electronic Measurement & Instrumentation
EC-310 (b)
MEMS & Sensor Design
EC -320(a)
Biomedical Electronics
EC-320(b)
HDL based FPGA Design
EC-320(c)
Reliability Engineering
Total Credits
Credits
3

Department Electives
Department
Electives
Course No.
DE- I
EC -314 (a)
Electronic Device Modeling
EC -314 (b)
T.V. & Radar
EC -314 (c)
EC-324 (a)
Digital & Analog VLSI Design
EC-324 (b)
Satellite Communication
EC-415 (a)
System Design using HDL
EC-415 (b)
Mobile Communication
EC-415 (c)
Biomedical Electronics
EC-422 (a)
Image Processing
EC-422 (b)
Wireless Sensor Networks
EC-422 (c)
VLSI Testing & Testability
EC-423 (a)
Optical Networks
EC-423 (b)
Spread Spectrum & CDMA
EC-423 (c)
VLSI Interconnect & Packaging
EC-423 (d)
Nanoelectronics
DE- II
DE- III
DE- IV
DE- V
Course Title
Total Credits
Credits
3
3
3
15
Compulsory credits from basic and professional courses = 190

Credits for Department Elective & Open Elective Courses = 21
Total credits = 211

1st Semester
S.No.
1
2
3
4
5
Course No.
MA-111
CH-101
MS-101
EC-101
CE-101
AR-101
7
8
CH-101(P)
MS-101(P)
EC-101 (P)
10
WS-102
Subject
Engineering Mathematics-I
Engineering Chemistry
Environmental Sciences &
Disaster Management
Engineering Drawing
Practicals
Engineering Chemistry Lab
Lab
Lab
Workshop-II
Total
L
3
3
3
3
3
T
1
1
1
1
1
P
0
0
0
0
0
Hours
4
4
4
4
4
Credits
4
4
4
4
4
0
0
0
0
3
2
3
2
2
1
4
35
3
30
L
3
3
3
T
1
1
1
P
0
0
0
Hours
4
4
4
Credits
4
4
4
2
3
1
1
0
0
3
4
3
4
0
0
0
0
2
2
2
2
1
1
0
0
0
0
2
2
2
2
1
1
4
35
3
30
2nd Semester
S.No.
1
2
3
Course No.
MA-121
PH-101
CS-101
4
5
HS-101
ME-101
EE-101
7
8
PH-101(P)
CS-101(P)
9
10
HS-101(P)
EE-101(P)
11
WS-101
Subject
Engineering Mathematics-II
Engineering Physics
Computer Fundamentals &
Programming
Communication Skills
Engineering Mechanics &
Strength of Materials
Basic Electrical Engineering
Practicals
Engineering Physics Lab
Computer Fundamentals &
Programming Lab
Communication Skills Lab
Basic Electrical Engineering Lab
Workshop-I
Total

3rd Semester
S.No.
Course No.
Subject
MA-214
2
3
4
5
6
7
8
9
L T
Hours
Credits
Engineering Mathematics-III
EC-211
EC-212
EC-213
EC-214
EC-215
Analog Electronics
Digital Electronics & Logic Design
Communication Theory
Electromagnetic Field Theory
Network Analysis & Synthesis
3
3
3
3
1
1
1
1
0
0
0
0
4
4
4
4
4
4
4
4
HS-203
Professional Ethics and Human

Values
2
2
2
2
1
1
EC-211(P)
EC-212(P)
Practicals
Analog Electronics Lab
Digital Electronics & Logic
Design Lab
Total
0
0
0
0
27
4th Semester
S.No.
1
Course No.
EC-221
Subject
Linear Integrated Circuits
EC-222
Electronic Switching Circuits
3
4
EC-223
EC-224

VLSI & MEMS Technology
EC-225
6
7
HS-201
ECA-201
Electronic Measurement and

Instrumentation
Managerial Economics
Extra curricular Activities
8
9
EC-221 (P)
EC-223(P)
10.
EC-225 (P)
Practicals
Linear Integrated Circuits Lab
Lab
Electronic Measurement and
Instrumentation Lab
Total
Hours
Credits
0 0
0 0
2
2
2
2
1
1
0 0
1
28

5th Semester
S.No
Course No
Subject
Hours
Credits
EC-311
EC-312
Microprocessor Theory and

Applications
Digital Communication Systems
EC-313
Antenna & Wave Propagation
4
5
6
EC-314
EC-315
3
3
3
0
1
0
0
0
0
3
4
3
3
4
3
7
8
EC-311 (P)
EC-312 (P)
DE-I
Signal & Wave Shaping
Open Elective-I
Practicals
Microprocessor Lab
Digital Communication Lab
0
0
0
0
2
2
2
2
1
1
EC-314(P)
(a) Device Modeling Lab

(b) TV & Radar Lab
(c) MEMS and Sensor
Design Lab
Total
25
Department electives:
DE-I:
1. EC-314(a) Electronic Device Modeling
2. EC-314(b) T.V. & Radar
3. EC-314(c) MEMS & Sensor Design
Open Elective-I:
1. EC-310 (a) Electronic Measurement & Instrumentation
2. EC-310 (b) MEMS and Sensor Design
(Subject to be offered to CSED Department: EC-316 Communication Engineering)

6th Semester
S.No.
Course
Subject
Hours Credits
No.
1
EC-321
EC-322
Microcontroller and Embedded

System
Wireless Communication
EC-323
Industrial Electronics
EC-324
DE-II
HS-301
Principle of Management
Open Elective-II
EC-321 (P)
EC-323(P)
Practicals
Microcontroller and Embedded
System Lab
Industrial Electronics Lab
24
Total
Industrial Training of 6 to 8 weeks duration after 6th Semester

Open Elective-II offered by Department of Electronics & Communication Engineering to
students of other branches
DE-II :
1. EC-324(a) Digital & Analog VLSI Design
2. EC-324(b) Satellite Communication
Open Elective II:

1. EC-320 (a) Biomedical Electronics
2. EC-320 (b) HDL based FPGA Design
3. EC-320 (c) Reliability Engineering

7th Semester
S.No.
Course
Subject
L T
Hours Credits
3
3
1
0
0
0
4
3
4
3
0
0
0
0
2
2
2
2
1
1
0
0
0
0
3
6
3
6
No.
1
2
EC-411
Data Communication & Computer

Networks
Digital Signal Processing
EC-412
EC-413
4
5
EE -416
EC -415
6
7
EC- 412(P)
EC-413(P)
EC- 496
Optical & Network

Communication
Systems
Control Systems
DE-III
Practicals
DSP Lab
Optical & Network
Communication
Systems Lab
Industrial Training Viva
9
10
EC-497
EC-498
Seminar
Major Project-I
Total
2
2
3
28
DE -III :
1. EC-415 (a) System Design using HDL
2. EC-415 (b) Mobile Communication
3. EC-415 (c) Biomedical Electronics

8th Semester
S.No.
Subject
1.
Course
No.
EC-421
Hours Credits
2.
CS-426
Computer Architecture &
Organization
3.
EC-422
DE-IV
4.
EC-423
DE-V
Practicals
5.
EC-499
Major Project-II
6.
EC-421(P)
Lab
7.
EC-422(P)
Advanced Electronics Lab

Total
19
DE -IV
1.
2.
3.
EC-422(a)
EC-422(b)
EC-422(c)
Image Processing
Wireless Sensor Networks
VLSI Testing & Testability
DE -V
1.
2.
3.
4.
EC-423(a)
EC-423(b)
EC-423(c)
EC-423 (d)
Optical Networks
Spread Spectrum & CDMA
VLSI Interconnects & Packaging
Nanoelectronics
10

EC-101
BASIC ELECTRONICS ENGINEERING

L T P
3 1 0
1. Semiconductors
Insulators, semiconductors and metals, Mobility and conductivity, Intrinsic and extrinsic
semiconductors, Charge Densities in Semiconductors, Mass action Law, Current Components in
Semiconductors, The Continuity Equation, Injected minority Charge Carrier, Hall effect.
2. PN Junction Diode
Characteristic and analysis, Types of diodes Zener diodes, Photodiodes, Light emitting diodes
(LEDs), Varactor diodes and tunnel diodes. Rectifiers and filter circuit: Half wave, full wave
and Bridge rectifier circuits and their analysis, L, C and Pi filters, Basic regulator supply using
zener diode, Clipping and clamping circuits.
3. Transistors
Construction and characteristics of bipolar junction, transistors (BJTs)-Comm. Base, Comm.
emitter, Comm. Collector configuration. Transistor at low frequencies small signal low
frequency transistor model (h-parameters). Analysis of transistor amplifier circuit using hparameters. Transistor biasing and bias stabilization: the operating point, stability factor,
analysis of fixed base bias, collector to base bias, Emitter resistance bias circuit and self bias
circuit. Bias compensation techniques.
4. Field Effect Transistor
Construction and characteristics of JFET, JFET biasing circuit, JFET amplifier, MOSFET
construction and characteristics.
5. Amplifiers And Oscillators
Classification of amplifiers, concept of feed back, general characteristics of feedback amplifiers,
Single stage RC coupled amplifier. Oscillators Criterion for Oscillation, type of oscillators:
Hartley oscillator, Colpitt Oscillator, RC Phase shift oscillator, Crystal oscillator.
6.Operational Amplifiers:
Introduction to Op-amp, Inverting and non-inverting configuration, Applications adder,
subtractor, integrator, differentiator.
Text Books
1.
Integrated devices & Circuits by Millman & Halkias..
2.
Electronics Devices and Circuit Theory by R. Boylestad
Reference Books
1.
Electronics Devices and Circuits-II by A.P.Godre & U.A. Bakshi.
2.
Electronics Devices and Circuit by G.K. Mithal
11

EC-211
ANALOG ELECTRONICS
1. Low Frequency Transistor Amplifier

Equivalent circuit of BJT using h-parameter for CB, CE and CC & configuration,
calculation of transistor parameter for CB, CE & CC using h-parameters, comparison of
transistor amplifier configuration.
2. Multistage Amplifier
General cascaded system, RC coupled amplifier and its frequency response, merits and
demerits, cascode amplifier, Darlington compound configuration, multistage frequency
effect.
3. High Frequency Response of Transistor Amplifier
High frequency model for CE configuration, approximate CE high frequency model with
resistive load, CE short circuit current gain, HF current gain with resistive load.
4. Large Signal Amplifier
Analysis and design of class A, B, AB, C amplifiers, push pull amplifiers, transformer
less output stages, distortion calculations.
5. Tuned Amplifier
General behavior of tuned amplifiers, resonance-series and parallel resonant circuit,
calculations of circuit impedance at resonance. Variation of impedance with frequency,
Q-factor of a circuit & coil, Band width of series & parallel resonant circuit, advantages
and disadvantages of tuned amplifiers. Single tuned amplifiers, voltage gain & frequency
response of single tuned amplifiers, double tuned amplifiers. Analysis & design of class
C amplifiers.
6. Feedback Amplifier
Feedback concept, characteristics of negative and positive feedback. Effect of negative
and positive feedback on input impedance, output impedance, gain, and noise and
frequency response.
7. Oscillators
Classification of Oscillators, frequency and frequency stability of oscillatory circuits,
Tuned based Oscillators, Hartley Oscillator, Colpitts Oscillators Clapp Oscillator, Crystal
Oscillator, Phase Shift Oscillator, Wein Bridge Oscillator
TEXT BOOKS
1. Integrated devices & circuits by Millman & Halkias.
2. Electronic Devices & circuit theory by R. Boylestad.
12

EC-212
DIGITAL ELECTRONICS & LOGIC DESIGN
1.
Number System & Codes

Number systems and their inter-conversion, Binary Arithmetic (Addition, Subtraction,
Multiplication and Division), Diminished radix and radix compliments, BCD codes,
Excess-3 code, Gray code, Hamming code, error detection and correction.
2.
Logic Gates & Logic Families

Digital Logic Gates, Various Logic Families like RTL, DTL, TTL and ECL, I2L, working
and their characteristics, MOS and CMOS devices, TTL CMOS Interfacing, IEEE/ANSIrepresentation of Logic Families.
3.
Combinational Logic Design

Boolean Algebra, Basic Theorems and properties of Boolean Algebra, Boolean
Functions, Canonical and Standard forms-map method, Two, Three, Four and Five
variable maps, Sum of products and Product of Sums Simplification, NAND and NOR
implementation, incompletely specified functions, Ex-OR functions, The tabulation
method, Determination of Prime implicants, Selection of Essential Prime implicants, The
cube notation, Sharp operation, Iterative Consensus, Generalized Consensus,
Minimization of Multiple output switching functions, Determining Prime implicants
using Generalized Consensus, Finding a Minimum cover, Breaking cyclic and similar
structures, Standard ICs and their applications
4.
MSI and PLD Components

Binary adder and subtractor, Multiplexers, Decoders/Demultiplexers, Read Only
Memory, Programmable Logic Arrays, Programmable Array Logic, Implementation of
Combinatorial Logic using these devices.
5.
Sequential Logic Design

Introduction, S-R Flip-flops, JK flip-flop, D flip-flop, T flip-flop, master slave flip-flop.
Flip-flop excitation table, Interconversion of flip-flop, Classification of sequential
circuits, Register and Counter circuits. A to D and D to A converter circuits.
Text Books:
1. Digital Design: M. Morris Mano, Prentice Hall of India.
2. Modern Digital Electronic: R.P.Jain (TMH)
References:
1. Digital Principle and Applications Malvino and Leach- (TMH)
2. Modern Digital Systems Design: Cheung (WPC)
3. Fundamentals of Digital Electronics: Anand Kumar (PHI)
13

EC-212 (P)
DIGITAL ELECTRONICS LAB

L
0
T
0
P
2
1. To verify the truth table of logic gates realize AND, OR, NOT gates
2. To realize AND, OR gates using diodes and resistors
3. To verify the Boolean algebra function using digital IC gates (consensus theorem)
only
4. To realize the function F (A, B, C, D) =(C+D) (A+B) (B+D) using NOR gates only
5. Design a half/full adder circuit using FF for 2 bits
6. Design a half/full sub tractor circuit using FF for 2 bits
7. Use Quine Mclusky method for designing F (A,B,C,D)= m(1,3,5,7,9,15)+d(4,6,12,13)
realize it NOR-OR implementation.
8. Design a binary to gray code converter.
9. Design a function using K-map and verify its performance using SOP and POS form
10. Design BCD to seven-segment display using 7447 IC
11. Implement F (A, B, C) =E (1, 3, 4, 5, 6) with a multiplexer.
12. Design a modulus N counter and a ring counter.
13. Design a shift register using flip-flops
14

EC-213
COMMUNICATION THEORY
1. Frequency and Time Domain Representation and Analysis

Introduction to information, messages & signals, Classification of signals and systems,
The discrete and Continuous spectrum, Fourier Transform, Fourier Series,
Power spectrum, Energy density spectrum, Dirac delta functions, Sampling theory and
approximations, Convolution and correlation of signals, LTI systems.
2. Random Signal Theory
Discrete probability theory, Continuous random variables, Statistically independent
random variables, Probability density functions of sums, Transformation of density
functions, Ergodic process, Correlation functions, Spectral density.
3. Basic Information Theory
Definition of information, Units of information, Entropy, Uncertainty and information
rate of communication system, Redundancy, Relation between system capacity and
information content of messages, Shannons theorem, Discrete noisy channel, Channel
capacity for different discrete channels.
4. Noise
White Noise, Atmospheric, Thermal, Shot and Partition noise, Noise figure and
experimental determination of noise figure, Shot noise in temperature limited diode,
Space charge limited diodes, Pulse response and Digital noise, noise analysis for RC
filters .
5. Transmission Through Networks
LTI network with random input, Mean, Auto-correlations, Spectral density and
Probability density function input-output relationships, Optimum system and Non-Linear
systems, Maximum SNR criterion, Equivalent noise bandwidth.
Textbooks
1. J.C. Hancock,"Elements of Communication Theory"
2. B.P Lathi, Modern Digital and Analog Communication Systems
References
1. Swartz, "Information & Transmission"
2. Taub & Schilling, "Principals of Communication System"
3. Simon Hay Kin Communication Systems
15

EC-214
ELECTROMAGNETIC FIELD THEORY
1.
Introduction
Review of vector analysis, Scalar & vector products, gradient, divergent and curl of a
vector and their physical explanation-Transformation amongst rectangular, cylindrical
and spherical co-ordinate system.
2.
Electrostatics
Coulomb's law, electric field intensity from point charges, field due to continuous
distribution of charges, gausss law, Electric displacement and displacement density
potentialfunction, potential field of a point charge, laplaces and poisons equations.
3.
Magnetostatics
Magnetic field intensity and magneto motive force, Amperes Circuital law, Energy
stored, Biot-savart law, vector potential, magnetic dipole.
4.
Time Dependent Fields

Ampere's work law in differential vector form, continuity of currents, conduction and
displacement current. Maxwell's equations and their interpretations, boundaryconditions.
Wave equations, sinusoidal time varying fields, uniform plane wave in dielectric and
conductormedia, skin effect and depth of penetration, reflection and refraction of plane
waves at boundaries for normal and oblique incidence surface impedance.
5.
Energy Flow and Poynting Vector

Pointing theorem, interpretation of E H, Simple application, complex pointing vector.
6.
Transmission Lines
Transmission line theory from the circuit concept, properties; constants, transmission line
equations; infinite line; reflections in transmission lines; voltage, current and
impedancerelations-open and short circuit lines; Experimental determination of line
constants. Standing wave ratio; impedance matching, quarter and half wave lines single
stub and double stub matching; circle diagram - Smithchart.
Text Books:
1. Electromagnetic waves & radio system by Jorden R.F.
2. Principle and applications of Electromagnetic fields by Ptonsey R and Collin R.P
References:
1. Applied Electromagnetic by Planus M.A.
2. Electromagnetic Field theory by William Hayt
3. Electromagnetics, JD Kraus, McGraw-Hill
4. Electromagnetic Field Theory Fundamentals by Bhag Singh Guru and Hseyin R.
Hiziroglu, Cambridge University Press
16

EC-215
NETWORK ANALYSIS & SYNTHESIS
1. Introduction
Review of circuit analysis using Kirchoffs laws, nodal and mesh analysis, solution by
classical method and Laplace transform, concept of independent and dependent sources,
analysis of special signal waveforms, and duality of networks, Brief review of Signals and
Systems.
2. Network Theorems
Superposition and Reciprocity theorem, Thevenins and Nortons theorem, Millmans
theorem, maximum power transfer theorem, compensation, Tellegans theorem, analysis of
circuits using theorems.
3. Transient Analysis Of Networks
Network elements, Transient response of R-L, R-C, R-L-C for DC and sinusoidal excitation,
Initial condition, Solution using differential equation approach and Laplace transform
method.
4. Network Analysis
State variable method, Analytic and numerical solutions, Two Port Networks, Graph
theoretic analysis for large scale networks, Formulation and solution of network graph of
simple networks, State space representation, Analysis using PSPICE.
5. Network Synthesis
Network realizability, Hurwitz Polynomials, Positive real functions, Properties of RC, RL &
LC networks, Foster and Cauer forms of realization, Transmission zeroes, Synthesis of
transfer functions.
6. Passive Filter Design
Butter worth and Chebyshev approximations, Normalized specifications, Frequency
transformations, Frequency and impedance denormalisation, Types of frequency selective
filters, Linear phase filters.
Text Books:
1. Network and systems by D.Roy - Choudhary
2. Someshwar C. Gupta, Jon W. Bayless, Behrouz Peikari ", Circuit Analysis - with computer
applications to problemsovling".
References:
1. Franklin F. Kuo, Network Analysis and Synthesis ", John Wiley.
2. Vanvalkenburg, Network Analysis ", Printice Hall of India Pvt. Ltd., New Delhi, 1994.
17

EC-221
LINEAR INTEGRATED CIRCUITS
1. DIFFERENTIAL AND CASCODE AMPLIFIERS

Emitter coupled differential amplifiers & its circuit configurations, FET differential amplifier, Differential
amplifier with swamping resistor, constant current bias & current mirror. Cascade differential amplifier
stages. Level translator, Cascode configuration.
2. INTRODUCTION TO OPERATIONAL AMPLIFIERS
The basic operational amplifier & its schematic symbol, Block diagram representation of OP-AMP,
Power supply requirements of an OP-AMP, Evolution of OP-AMP., Specification of a typical OP-AMP
(741).
3. THE PRACTICAL OP-AMP
Input offset voltage, input bias current, input offset current. Total output offset voltage, thermal drift,
error voltage, variation of OP-AMP parameter with temperature & supply voltage. Supply voltage
rejection ration (SVRR), CMRR-Measurement of OP-AMP parameters.
4. FREQUENCY RESPONSE OF AN OP-AMP
Frequency response compensator networks. Frequency response of internally compensated OP-AMP &
non-compensated OP-AMP. High frequency OP-AMP equivalent circuit, open loop voltage gain as a
function of frequency. Slew rate, causes of slew rates and its effects in application.
5. OPERATIONAL AMPLIFIER CONFIGURATIONS & LINEAR APPLICATION
Open loop OP-AMP configurations- The differential amplifier, inverting amplifier, non-inverting
amplifier, negative feed back configurations - inverting and non inverting amplifiers, voltage followers &
high input impedance configuration, differential amplifiers, closed loop frequency response & circuit
stability, single supply operation of OP-AMP, summing, scaling and averaging amplifier, voltage to
current & current to voltage converters, integrators & differentiators, logarithmic & anti logarithmic
amplifiers
6. ACTIVE FILTERS & OSCILLATORS
Advantages of active filters, classification of filters, response characteristics of butter worth, chebyshev,
causal filters, first order and second order butter worth filters- low pass and high pass types. Band pass &
band reject filters. Oscillator principles, types of oscillators - phase shift, Wein Bridge & quadrature.
Square wave, triangular wave and saw tooth wave generators, voltage controlled oscillator.
7. COMPARATORS & CONVERTERS
Basic comparator & its characteristics, zero crossing detector, voltage limiters, clippers & clampers, small
signal half wave & full wave rectifiers, absolute value detectors, sample and hold circuit.
Text Books:
1. OP-AMP and linear integrated circuits 2nd edition, PHI by Ramakant A. Gayakwad.
2. Design with operation amplifiers and Analog Integrated circuits by Sergei Franco.
References:
1. Integrated Electronics: Analog and Digital circuits & system by Millman & Halkias.
2. Linear Integrated Circuits by D.R.Chaudhary & Sahil Jain(WEL).
18

EC-222
ELECTRONIC SWITCHING CIRCUITS
1.
Introduction to Sequential Circuits

Flip Flops, Flip-Flop conversions, Classification of Sequential Circuits. Registers and
Counter circuits.
2.
Design & Analysis of Synchronous Sequential Circuits

Sequential circuits introductory examples, Counters, Finite state Machines, Sequence
Detector and Sequence Generator circuits, Definite state model Basic definition,
Capabilities & Limitation of finite state machines, state equivalence & machine
minimization, simplification of incompletely specified machines, Extraction of maximum
compatibles, synthesis & analysis of synchronous sequential circuits.
3.
Design & Analysis of Asynchronous Sequential Circuits

Introduction to asynchronous circuits, timing diagram, state diagram & flow tables,
fundamental mode circuits, synthesis, state assignment in asynchronous sequential
circuits.
4.
Hazards
Introduction, gate delays, generation of spikes, production of static hazards in
combinational networks, elimination of static hazards, design of hazard free
combinational networks, hazard free asynchronous circuit design, dynamic hazards,
essential hazards.
5.
Contact Networks & Symmetric Networks

Relay contents, analysis & Synthesis of contact Networks, Properties of symmetric
functions Synthesis &identification of symmetric functions, Iterative Networks.
Text Books
1. Switching and finite automata theory by ZVI Kohavi
2. Logical design of switching circuits by Douglas Lewin.
References
1. Logic Design by N.N Biswas
19

EC-223
ANALOG COMMUNICATION SYSTEMS
1. Modulation Techniques
Various frequency bands used for communication, Types of Communication and need of
modulation. Introduction to AM, FM, PM, frequency spectrum of AM Waves,
Representation of AM, Power relation in AM waves, Need and description of SSB,
Suppression of carrier, Suppression of unwanted side-bands, Independent sideband system,
Vestigial sideband system, Mathematical representation of FM, Frequency spectrum of AM
waves, Phase Modulation, Comparison between analog and digital modulation, wideband
and narrow band FM.
2. AM Transmitters and Receivers
AM Transmitters: Generation of AM, low level and high level modulation, comparison of
levels, AM transmitter block diagram, collector class C modulator, Base Modulator,
Transistor Vander Bil modulator, DSB S/C modulator. AM Receiver: Tuned radio frequency
(TRF) receiver. Super heterodyne receiver, RF section and characteristics, mixers, frequency
changing and tracking, IF rejection and IF amplifiers. Detection and automatic gain control
(AGC), AM receiver characteristics.
3. FM Transmitters and Receivers
FM Transmitters: Basic requirements and generation of FM, FM Modulation methods:
Direct methods, Variable capacitor Modulator, Varactor Diode Modulator, FET Reactance
Modulator, Transistor Reactance Modulator, Pre-emphasis, Direct FM modulator, AFC in
reactance modulator, Disadvantages of direct method, Indirect modulators, RC-phase shift
modulators, Armstrong FM systems. FM Receivers: Limiters, single and double-tuned
demodulators, balanced slope detector, Foster-Seely or Phase Discriminator, De-emphasis,
ratio Detector, Block diagram of FM Receivers, RF Amplifiers, FM Receiver characteristics.
4. SSB Transmitters and Receivers
Generator of SSB, balanced modulator circuit, filter method, phase shift method, third
method, Phase cancellation method, Demodulation of SSB, product demodulator, Diode
detection technique of SSB.
5. Pulse Modulation Techniques
Pulse amplitude modulation and demodulation, Pulse width modulation and
demodulation, Pulse position modulation and demodulation, Sampling theorem, Time
Division Multiplexing, Frequency Division Multiplexing.
Textbooks
1. Electronic communication systems by George Kennedy.
2. Principle of communication systems by Taub and schilling
References
1. Electronic communication systems by Tomasi.
20

EC-224
VLSI & MEMS TECHNOLOGY
1. Miniaturization of Electronic Systems & its impact on characterization

Introduction, Trends & Projections in microelectronics. Semiconductor materials and their
merits and demerits. Monolithic chips trends. Advantages, limitations & classification of ICs.
2. Monolithic Fabrication Techniques
Crystal growth: Source of silicon; Single crystalline and Poly crystalline; Requirement of
purity for electronics industry; Electronics grade silicon production; Crystal growth
techniques: Bridgeman method, float zone method, Czocharalski method, Modified
Czocharalski method; refining; Silicon Wafer Preparation & Crystal Defects.
Epitaxial Process: Need of epitaxial layer; vapors phase epitaxy -reactor design, chemistry
of epitaxial process, transport mechanism doping & auto doping; selective epitaxy, epitaxial
process induced defects, molecular beam epitaxy, merits and demerits among epitaxial
processes; recent trends in Epitaxy.
Oxidation: Importance of oxidation; types of oxidation techniques; growth mechanism &
kinetics; factors affecting the growth mechanisms; silicon oxidation model, dry & wet
oxidation; oxidation induced faults; recent trends in oxidation.
Lithography: Basic steps in lithography; lithography techniques-optical lithography,
electron beam lithography, x-ray lithography, ion beam lithography; resists and mask
preparation of respective lithographies, printing techniques-contact, proximity printing and
projection printing; merits and demerits of lithographies; recent trends in lithography at nano
regime.
Etching: Performance metrics of etching; types of etching- wet and dry etching; dry etching
techniques-ion beam or ion-milling, sputter ion plasma etching and reactive ion etching
(RIE); merits and demerits of etching; etching induced defects; recent trends in epitaxy.
Diffusion and Ion Implantation: Diffusion mechanisms; diffusion reactor; diffusion profile;
diffusion kinetics; parameters affecting diffusion profile; Dopants and their behavior, choice
of dopants; Ion Implantation- reactor design, impurity distribution profile, properties of ion
implantation, low energy and high energy ion implantation.
Metallization: Desired properties of metallization for VLSI; metallization choices;
metallization techniques vacuum evaporation, sputtering.
3. Monolithic Components & their Isolation
Diodes and Transistors, MOSFETs (Enhancement and depletion mode), Resistors,
Capacitors, MOS, CMOS. Various isolation techniques.
4. Assembly Techniques & Packaging of VLSI chip
Introduction to packaging; packaging process; package design considerations, various
package types.
5. Fundamentals of MEMS/NEMS Design & Fabrication
Needs for MEMS, MEMS material, MEMS Features, MEMS design limits and safety
factors, Basic MEMS operating principles. MEMS processing techniques: Lithography
Galvanik Abforming (LIGA), Lift-off, Chemical Mechanical Polishing, Surface
micromachining, Bulk micromachining, Deep Reactive Ion Etching, Packaging of MEMS
Devices, CAD for MEMS, MEMS reliability issues, Application of MEMS, Recent trends in
21

MEMS/NEMS. Challenges and opportunities associated with bringing MEMS to market,
Recent trends in MEMS/ NEMS. Introduction to Bio-MEMS.
Text Books
1. S.M. Sze, VLSI Technology, TMH
2. S.K. Gandhi, VLSI Fabrication Principles, John Willey & Sons
3. S.D Senturia, Microsystems design. Kluwer Academic Publishers,2001
References
1. G.T.A. Kovacs, Micromachined transducer, McGraw Hill, 1998.
2. Botkar, Integrated Circuits, Khanna Publishers
3. D. Nagchoudhuri, Principles of Microelectronics Technology PHI
22

EC-225
1.
ELECTRONIC MEASUREMENT & INSTRUMENTATION
Instrumentation Scheme & Characteristics

Definition, Application and Methods of measurements, instrument classification,
Functional Elements of an instrument, input output configuration of measuring
instruments, Methods of Correction for interfering and modifying inputs, Standards,
calibration, Accuracy, Precision, Loading effects, selection of instruments, Measurement
systemsStatic and dynamic characteristics, Zero order, first order and second order
systems & their response.
2.
Error analysis
Types of errors, Methods of error analysis, uncertainty analysis, statistical analysis,
Gaussian Error distribution, Rejection of data, method of least square, curve fitting,
graphical analysis, General consideration in data analysis.
3.
DC & AC Measurement:
Analog Ammeter, Voltmeter and Ohmmeters, PMMC, Moving Iron, Electrodynamometer, Electrostatic, Ohmmeter, Digital type voltmeter, AC voltmeter using
rectifier, true RMS voltmeter, Digital VOM meter.
4.
Transducers:
Principles, classification, Guidelines for selection, Requirements, Types and Application
of Transducers, Resistance, Capacitance, inductance Transducers, Potentiometer, Strain
gauges, LVDT, Piezo Electric transducers, Resistance Thermometers, Thermocouples,
Thermistors, Photosensitive Device, Capacitive transducer, Hall Effect transducers,
Micro-sensors (Pyroelectric sensors, Thermo sensors using Semiconductor devices,
Thermal radiation sensor), Measurement of physical parameters force, pressure, velocity,
humidity, moisture, speed, Proximity and displacement.
5.
Display and Indicating Devices:

Telemetry & Remote sensing, GIS (Geographical information System), Digital display
devices & Recorder, CRO.
6.
Signal Generators & Analyzers

Function generators, RF signal generators, Sweep Frequency generator, Frequency
synthesizer, Wave analyzer, Harmonic distortion analyzer, Spectrum analyzer.
Text Books:
1. Electronic Instrumentation& Measurement by William D Cooper & Albert C.
Helfric, PHI Pub.
2. Electrical and Electronic Measurements and Instrumentation by A. K Sawhney
References
1. Instruments & Measurement for Electronic by Clyde N. Herrick
23

EC-311
MICROPROCESSOR THEORY & APPLICATIONS
1.
Introduction to Microprocessors & Microcomputers

History and Evolution, types of microprocessors, Microcomputer Programming
Languages, Microcomputer Architecture, Intel 8085 Microprocessor, Register
Architecture, Bus Organization, Registers, ALU, Control section, Instruction set of 8085,
Instruction format, Addressing modes, Types of Instructions.
2.
Assembly Language Programming and Timing Diagram

Assembly language programming in 8085, Macros, Labels and Directives,
Microprocessor timings,Micro instructions, Instruction cycle, Machine cycles, T-states,
State transition diagrams, Timing diagram for different machine cycles.
3.
Serial I/O, Interrupts and Comparison of Contemporary Microprocessors

Serial I/O using SID, SOD. Interrupts in 8085, RST instructions, Issues in implementing
interrupts, Multiple interrupts and priorities, Daisy chaining, interrupt handling in 8085,
Enabling, Disabling & masking of interrupts. Brief comparison of contemporary 8-bit
microprocessors like Z-80, M68000 with 8085.
4.
Data Transfer techniques

Data transfer techniques, Parallel & Programmed data transfer using 8155. Programmable
parallel ports & handshake input/output, Asynchronous and Synchronous data transfer
using 8251. PIC (8259), PPI (8255), DMA controller (8257).
5.
Microprocessor Interfacing Techniques

Interfacing Traffic Light Interface, Stepper Motor ,4 Digit 7 Segment LED , Elevator
,Musical Tone Generator & 8 Channel 12Bit ADC with Multiplexor & A/D converters,
D/A converters.
6.
Architecture of Typical 16-Bit Microprocessors (Intel 8086)

Introduction to a 16 bit microprocessor, Memory address space and data organization,
Segment registers and Memory segmentation, Generating a memory address, I/O address
space, Addressing modes, Comparison of 8086 & 8088, Basic configurations of
8086/8088, Min. Mode, Max. Mode & System timing, Introduction to Instruction Set of
8086.
Text Books:
1. R.S. Gaonkar, Microprocessor Architecture, Programming & Applications with the 8085/8080A,
Wiley Eastern Ltd.
2. A.H. Mukhopadhyay, Microprocessor, Microcomputer and Their Applications, 3rd Edition Alpha
Science International, Ltd.
References:
1. M. Rafiquzzman: Microprocessors: Theory & Applications (Intel & Motorola), PHI.
2. Berry .B. Bray INTEL 8086/88, 80186, 286, 386, 486, Pentium Pro & Pentium IV.
24

EC-312
DIGITAL COMMUNICATION SYSTEMS
1.
Analog to Digital Conversion

Noisy communications channels, The sampling Theorem, low pass signals and band pass
signals, pulse Amplitude modulation, channel bandwidth for a PAM signal, Natural
sampling, Flat top sampling, signal recovery & holding, Quantization of signal,
Quantization error, pulse code modulation (PCM), Delta Modulation, adaptive delta
modulation.
2.
Digital Modulation Techniques:

Binary phase shift keying, differential phase shift keying, differential encoded PSK,
QPSK, Quadrate Amplitude shift keying (QASK) Binary frequency shift keying.
3.
Data Transmission:
Base band signal receiver, probability of error, the optimum filter, and white noise-the
matched filter, probability of error of the matched filter, coherent reception: correlation,
application of coherent reception in PSK and FSK. Correlation receiver for QPSK.
4.
Noise in Pulse Code & Delta Modulation Systems:

PCM transmission, calculation of quantization noise, the O/P signal power, the effect of
thermal noise, O/P signal to noise ratio in PCM, Delta Modulation, Quantization noise in
delta modulation, the O/P signal to quantization noise ratio in delta modulation, O/P
signal to noise ratio in delta modulation.
5.
Information Coding and Decoding:

Coding for error detection and correction, Block coding coding, anticoding, Hadamard
code, Hamming code, Cyclic Codes, Convolution coding and decoding, Viterbi
algorithm, Shannon Fano and Hoffman Codes.
Text Books:
1. Taub & Schilling: Principles of communication systems- McGraw-Hill Education (India)
2. Simon Haykin: Communication systems - John-Wiley & sons, Inc.
Reference Books:
1. Couch: Digital and Analog Communication Systems, 6th edn. Pearson Education.
2. Bernard Sklar: Digital Communication, 2nd Edn. Pearson Education.
3. Marvin K. Simon, Sami M. Hinedi, William C. Lindsey: Digital Communication
Techniques, PHI.
25

EC-313
ANTENNA AND WAVE PROPOGATION
1. RADIATION
Retarded potentials, radiation from an oscillation dipole in free space, induction and radiation fields.
Radiated power from a current element, radiation resistance, short antennas, radiation from a quarter
wave monopole and half wave dipole.
2.ANTENNA FUNDAMENTALS
Reciprocity properties of antennas, radiation patterns, directional properties of dipole antennas. antenna
gain and aperture, antenna terminal impedance, self and mutual impedance, front to back ratio, antenna
beam width and bandwidth, antenna efficiency, antenna beam area, polarization, antenna temperature and
signal to noise ratio.
3. ANTENNA ARRAYS
Various forms of arrays, Arrays of two point sources, linear arrays of n-point sources, pattern
multiplication Arrays of equal amplitude and spacing (Broadside and end fire arrays), array factor,
directivity and beam width, Binomial array.
4. PRACTICAL ANTENNAS
VLF and LF antennas(Hertz and Marconi antennas),effects of antenna height and effect of ground on
performance of antenna , medium frequency antenna and Rhombic antennas, Loop antennas , receiving
antenna and radio direction finders.
VHF, UHF and SHF antennas: Folded dipole antennas, Yagi-uda antenna, slotted and horn antennas,
microwave dish, helical antennas, frequency independent antennas, turnstile antenna, microstrip antennas,
fractal antennas.
5. GROUND WAVE PROPAGATION

Characteristics for ground wave propagation, reflection at the surface of a finitely conducting plane, earth
(on ground), Attenuation Calculation of field strength at a distance.
6. IONOSPHERE PROPAGATION
The ionosphere, formation of the various layers, their effective characteristics, reflection and refraction of
waves by ionosphere, virtual height, maximum frequency, skip distance, regular and irregular variation
of ionosphere, Fading and Diversity reception, ordinary and extraordinary waves.
7. SPACE WAVE PROPAGATION

Space wave, range and effect of earth, Troposphere waves-reflection, refraction, duct propagation,
Troposphere scatter propagation link
Text Book
1. J.D. Kraus, "Antennas, "McGraw Hill.

2. C.A. Balanis Antennas Theory and Design, Willey
3. K D Prasad Antenna & Wave Propagation
Reference Book
1. E.C. Jorden & B.C.Balmann," Electromagnetic waves & radiating System", P.H.I.
2. R.E.Collins, 'Antennas and Radio Propagation ", McGraw-Hill, 1987.
26

EC-314(a)
ELECTRONIC DEVICE MODELLING
1. Introduction to SPICE
AC, DC, Transient, noise, temperature analysis.
2. Junction Diodes
Depletion region of a p-n junction, Depletion-region capacitance, DC, small signal, large
signal, high frequency and noise models of diodes. Measurement and extraction of diode
model-parameters.
3. BJT & JFETs
DC, small signal, high frequency and noise models of bipolar junction transistors. Extraction
of BJT model parameters, Transistor frequency response, JFETs and MESFET characteristics
4. MOSFETs
MOSFET fundamentals, Types of MOSFETs, Concept of threshold voltage, Large signal
behavior MOSFETs, Comparison of operating regions of Bipolar and MOS Transistors,
Shichman Hodges and Level-1 MOS Models, Introduction to ChargeSheet Models.
5. Short & Narrow Channel Effects in MOSFETs
Velocity saturation from horizontal field, Mobility degradation from the vertical field, Weak
Inversion in MOS Transistors, Transistor frequency in weak inversion, Narrow & Short
Channel Effects in MOSFETs.
6. HBTs & High speed Devices
Principal of hetrojunction devices, HBTs, HEMT, High speed compound devices.
7. Circuit Design using Device Models
MOS differential pair, Small-signal operation of the MOS Differential pair, CMRR and
related design parameters and analysis of the differential amplifier.
Text Books:
1. S.M.Kang & Y.Leblibici, CMOS Digital Integrated Circuits-Analysis & Design, TMH, 3rd Ed.
2. S.M. Sze, Physics of Semiconductor Devices, Wiley Pub.
References
1. H.M. Rashid, Introduction to PSPICE, PHI.
2. B.G. Streetman & S. Baneerjee, Solid State Electronic Devices, PHI.
3. B. Razavi, Design of Analog CMOS Integrated Circuits,TMH.
27

EC-314(b)
T.V. and Radar
1. Basics of TV
Theory of Scanning, Blanking, Synchronization, Nature of picture signals line and field
frequency, Interlacing, Resolution, Introduction to Display System Technology.
2. Transmitter & Receiver
Modulation system for sound and video, Vestigial side bands, TV transmitter, Receiver
response characteristics.
3. Color T.V. and Applications
Operation of color T.V: Hue, Saturation and Luminance, Color signal generation , Color
picture tubes (Basic principle), Color television systems, N.T.S.C., PAL and SECAM,
Color TV Receiver, Video tape recording, VCR, Merits of Digital Processing, Block
Diagram of Digital T.V.
4. Basic Principles of Radar System
Radar, Radar frequencies, Application of radar, Radar Equation, Prediction of range,
Minimum detectable signal, Receiver noise, Transmitter power, Pulse repetition
frequency, Range ambiguity, Antenna parameters, System losses and Propagation effects.
5. Doppler effect and its Applications
Doppler effect and its application to CW radar, FM CW radar, Radar altimeters, MTI and
Pulse Doppler radar, Tracking radar, Navigational Aids.
6. Receivers
Noise figure, Radar mixers, Duplexers, A scope and PPI display, Matched Filter,
Modulators and Pulse Forming Networks.
Text Books:
1. Introduction to Radar Systems, by Merill. I Skolnik.
2. Monochrome & Colour T.V. by R.R.Gulati.
References
1. Basic Television by G.M.Grobe.
2. Radar Handbook by Merrill Skolnik.
28

EC-314(c)
1. Introduction to MEMS
Introduction to MEMS and Microsystems, Materials and Substrates for MEMS,
Sensors/Transducers, Sensors characterization and classifications, microactuators, Application of
MEMS.
2. Material Properties
MEMS materials, structural and sacrificial materials, properties of silicon, mechanical, electrical
and thermal properties of materials, Basic modeling of elements in electrical and mechanical
systems.
3. MEMS Fabrication
MEMS Fabrication Technologies, single crystal growth, micromaching, photolithography,
microsterolithography, thin film deposition, impurity doping, diffusion, etching, bulk and surface
micromaching, etch stop technique and microstructure, LIGA.
4. Mechanical Sensors & Actuators
Stress and Strain, Hooke's Law. Stress and Strain of Beam Structures, Cantilever, Pressure
sensors, Piezoresistance Effect, Piezoelectricity, Piezoresistive Sensor, capacitive sensors,
Inductive sensors, MEMS inertial sensors, micromachined microaccelerometer for MEMS,
Parallel-plate Actuator, piezoactuators.
5. Magnetic Sensors
Magnetic material for MEMS, magnetic sensing and detection, mannetoresistive sensors, hall
effect, magnetodiode, megnetotransitors, MEMS magnetic sensors, RF MEMS.
6. Thermal Sensors:
Temperature coefficient of resistance, Thermo-electricity, Thermocouples, Thermal and
temperature sensors, heat pump, micromachined thermocouple probe, thermal flow sensors,
shape memory allloy.
Text Books:
1. Analysis and Design Principles of MEMS Devices by Minhang Bao, ELSEVIER.
2. M. J. Usher, Sensors and Transducers, McMillian Hampshire.
3. N. P. Mahalik, MEMS Tata McGraq Hill
References
1. R.S. Muller, Howe, Senturia and Smith, Microsensors, IEEE Press.
2. S. M. Sze, Semiconductor Sensors, Willy Interscience Publications
29

EC-310(a) ELECTRONIC MEASUREMENT & INSTRUMENTATION
1.
Instrumentation Scheme & Characteristics

Definition, Application and Methods of measurements, instrument classification,
Functional elements of an instrument, input output configuration of measuring
instruments, Methods of correction for interfering and modifying inputs, Standards,
calibration, Accuracy, Precision, Loading effects, selection of instruments.
2.
Error analysis
Types of errors, Methods of error analysis, uncertainty analysis, statistical analysis,
Gaussian Error distribution, Rejection of data, method of least square, graphical analysis,
General Consideration in data analysis.
3.
DC & AC Measurement
Analog Ammeter, Voltmeter and Ohmmeters, PMMC, Moving Iron, Electrodynamometer, Electrostatic, Ohmmeter, Digital type voltmeter, AC voltmeter using
rectifier, true RMS Voltmeter, Digital VOM meter.
4.
Transducers
Principles, classification, Guidelines for selection, Requirements, Types and Application
of Transducers, Resistance, Capacitance, inductance Transducers, Potentiometer, Strain
gauges, LVDT, RVDT, Piezo Electric transducers, Resistance Thermometers,
Thermocouples, Thermistors, Photosensitive Device, Capacitive transducer, Hall effect
transducers.
5.
Display and Indicating Devices

Telemetry & Remote sensing, GIS (Geographical information System), Digital display
devices & Recorder, CRO.
Text Books
1. Electronic Instrumentation& Measurement by William D Cooper & Albert C.
Helfric, PHI Pub.
2. Electrical and Electronic Measurements and Instrumentation by A. K Sawhney.
Reference Books:
1. Instruments & Measurement for Electronic by Clyde N. Herrick.
30

EC-310(b)
MEMS & SENSOR DESIGN
1. Introduction to MEMS
Introduction to MEMS and Microsystems, Materials and Substrates for MEMS,
Sensors/Transducers, Sensors characterization and classifications, microactuators, Application of
MEMS.
2. Material Properties
MEMS materials, structural and sacrificial materials, properties of silicon, mechanical, electrical
and thermal properties of materials, Basic modeling of elements in electrical and mechanical
systems.
3. MEMS Fabrication
MEMS Fabrication Technologies, single crystal growth, micromaching, photolithography,
microsterolithography, thin film deposition, impurity doping, diffusion, etching, bulk and surface
micromaching, etch stop technique and microstructure, LIGA.
4. Mechanical Sensors & Actuators
Stress and Strain, Hooke's Law. Stress and Strain of Beam Structures, Cantilever, Pressure
sensors, Piezoresistance Effect, Piezoelectricity, Piezoresistive Sensor, capacitive sensors,
Inductive sensors, MEMS inertial sensors, micromachined microaccelerometer for MEMS,
Parallel-plate Actuator, piezoactuators.
5. Magnetic Sensors
Magnetic material for MEMS, magnetic sensing and detection, mannetoresistive sensors, hall
effect, magnetodiode, megnetotransitors, MEMS magnetic sensors, RF MEMS.
6. Thermal Sensors:
Temperature coefficient of resistance, Thermo-electricity, Thermocouples, Thermal and
temperature sensors, heat pump, micromachined thermocouple probe, thermal flow sensors,
shape memory allloy.
Text Books:
1. Analysis and Design Principles of MEMS Devices by Minhang Bao, ELSEVIER.
2. M. J. Usher, Sensors and Transducers, McMillian Hampshire.
3. N. P. Mahalik, MEMS Tata McGraq Hill
References
1. R.S. Muller, Howe, Senturia and Smith, Microsensors, IEEE Press.
2. S. M. Sze, Semiconductor Sensors, Willy Interscience Publications
31

EC-315
1.
2.
3.
4.
5.
6.
7.
SIGNAL AND WAVE SHAPING
Linear Wave Shaping

High pass, low pass RC circuits, their response for sinusoidal, step, pulse, square and
ramp inputs. RC network as differentiator and integrator, attenuators, its applications in
CRO probe, RL and RLC circuits and their response for step input, Ringing circuit.
Non- Linear Wave shaping
Diode clippers, Transistor clippers, clipping at two independent levels, Transfer
characteristics of clippers, Emitter coupled clipper, Comparators, applications of voltage
comparators, clamping operation, clamping circuits using diode with different inputs,
Clamping circuit theorem, practical clamping circuits, effect of diode characteristics on
clamping voltage, Transfer characteristics of clampers.
Switching characteristics & Devices
Diode as a switch, piecewise linear diode characteristics, Transistor as a switch, Break
down voltage consideration of transistor, saturation parameters of Transistor and their
variation with temperature, Design of transistor switch, transistor-switching times.
Multivibrator
Analysis and Design of Bistable, Monostable, Astable Multivibrators and Schmitt trigger
using transistors.Multivibrator Circuits using 555 Timer.
Time Base Generators
General features of a time base signal, methods of generating time base waveform, Miller
and Bootstrap time base generators basic principles, Transistor miller time
base generator,Transistor Bootstrap time base generator, Current time base generators.
Synchronization & frequency Shaping
Principles of Synchronization, Frequency division in sweep circuit, Astable relaxation
circuits, Monostable relaxation circuits, Synchronization of a sweep circuit with
symmetrical signals, Sine wave frequency division with a sweep circuit.
Sampling gate
Basic operating principles of sampling gates, Unidirectional and Bi-directional sampling
gates, Reduction of pedestal in gate circuits, Applications of sampling gates.
TEXT BOOKS:
1.Pulse, Digital and Switching Waveforms - J. Millman and H. Taub, McGraw-Hill.
2. Solid State Pulse circuits - David A. Bell, PHI.
REFERENCES:
1. Pulse and Digital Circuits A. Anand Kumar.
2. Wave Generation and Shaping - L. Strauss.
32

(Subject to be offered to CSED)
EC-316
LTP
310
COMMUNICATION ENGINEERING
1. Introduction to communications systems

Communication process, sources of information, communication channels, base band and
pass band signals, representation of signals and systems, switched communication
systems.
2. Continuous-wave modulation
Amplitude modulation (AM), frequency spectrum of the AM wave, representation of
AM, power relations in the AM wave, AM detector, vestigial side-band modulation.
3. Angle Modulation
Frequency spectrum of Frequency Modulation (FM) and Phase Modulation, generation of
FM (direct and indirect method), demodulation of FM signal.
4. Radio receiver
Tuned Radio-Frequency (TRF) receiver, Super heterodyne receiver.
5. Pulse Modulation
Sampling process, Pulse Amplitude Modulation (PAM), Time Division Multiplexing
(TDM), Frequency Division Multiplexing (FDM), Pulse Width Modulation (PWM),
Pulse Position Modulation (PPM).
6.
Digital Modulation Techniques

Quantization process, Pulse Code Modulation (PCM), Differential Pulse Code
Modulation (DPCM), Delta Modulation (DM), Adaptive Delta Modulation, Amplitude
Shift Keying (ASK), Frequency-Shift Keying (FSK), Phase-Shift Keying (PSK), QPSK.
7. Advanced Communication
Satellite communications, earth station, CDMA.
TEXT BOOKS
1.
Electronic Communication Systems: George Kennedy
2.
Communication Systems :Simon Haykin
REFERENCES
1. An Introduction to Analog and Digital Communications: Haykin
2. Principles of Communication Systems: H. Taub and D.L. Schilling
3. Principles of Communication Engineering: Anokh Singh
33

EC-321
MICROCONTROLLER & EMBEDDED SYSTEMS
1.
Microcontroller
Introduction to Microcontrollers, Evolution, Microprocessors vs. Microcontrollers, MCS-51
Family Overview, Important Features, Architecture. 8051 Pin Functions, Architecture,
Addressing Modes, Instruction Set, Instruction Types.
2.
Programming
Assembly Programming, Timer Registers, Timer Modes, Overflow Flags, Clocking Sources,
Timer Counter Interrupts, Baud Rate Generation. Serial Port Register, Modes of Operation,
Initialization, Accessing, Multiprocessor Communications, Serial Port Baud Rate.
3.
Interrupts
Interrupt Organization, Processing Interrupts, Serial Port Interrupts, External Interrupts, and
Interrupt Service Routines. Microcontroller Specification, Microcontroller Design, Testing,
Timing Subroutines, Look-up Tables, Serial Data Transmission.
4.
Introduction to Embedded Systems

Background and History of Embedded Systems, Definition and Classification, Programming
languages for embedded systems: desirable characteristics of programming languages for
embedded systems, Low-level versus high-level languages, Main language implementation
issues: control typing. Major programming languages for embedded systems. Embedded Systems
on a Chip (SoC) and the use of VLSI designed circuits.
5.
Real Time Operating Systems (RTOS)

Architecture of an RTOS, Important features of VxWorks and Montavista Linux, Embedded
Systems Programming, Locks and Semaphores, Operating System Timers and Interrupts,
Exceptions, Tasks: Introduction, Defining a task, Task states and scheduling, Task structures,
Synchronization, Communication and concurrency, Kernel objects: Semaphores, Queues, Pipes,
Event registers, Signals, And condition variables. Real-time clock and system clock,
Programmable interval timers, Timer ISRs, Timing wheels, Soft timers.
6.
32-Bit RISC Based ARM Architecture

Important features, Instruction set, Programming Examples, Core based Embedded Systems, Soft
and Hard Cores, Xilinx FPGA architectures, 8-bit Picoblaze Microcontroller Core, 32-bit
Microblaze Soft Core, Power PC
Text Books:
1.
2.
Mckenzie, Scott, The 8051 Microcontroller, PHIs, (1995) 5th ed.

Simon, David E., An Embedded System Primer, Pearson Education, (2005) 4th ed.
References:
1.
Ayala, Kenneth J., The 8051 Microcontroller: Architecture, Programming, and
Application, (2008) 2nd ed.
34

EC-322
WIRELESS COMMUNICATION
1. Introduction
Evolution of wireless communication systems, Examples of wireless communication systems.
2. The cellular concept system design fundamentals
Concept of frequency reuse, Channel assignment strategies, Handoff strategies, Interference and
system capacity, Trunking and grade of service, Improving coverage and capacity in cellular
systems.
3. Propagation models
Free space propagation model, Two-ray ground reflection model, Distance power loss, Macrocell propagation model, Micro-cell propagation model, Shadowing model, Multipath effects in
mobile communication, Models for multipath reception.
4. Equalization, diversity and channel coding
Fundamentals of equalization, Adaptive equalizers, Linear and nonlinear equalization,
Algorithms for adaptive equalization, Diversity techniques, Fundamentals of channel coding,
Overview of error detection and correction codes.
5. Multiple access techniques
Introduction to multiple access, Frequency division multiple access, Time division multiple
access, Spread spectrum multiple access, Space division multiple access, Packet radio,
Orthogonal frequency division multiple access; Introduction to wireless systems and standards.
Text Book:
1. Wireless Communications: Principles and Practice by Theodore S. Rappaport;
/ PHI Publication
Pearson
References:
1. Wireless Communications and Networks: 3G and Beyond by Iti Saha Misra;
Tata
McGraw Hill Publication
2. Mobile Cellular Telecommunications: Analog and Digital Systems by William C. Y. Lee;
Tata McGraw Hill Publication
3. Wireless and Digital Communications by Dr. Kamilo Feher; PHI Publication
35

EC-323
INDUSTRIAL ELECTRONICS
1. Power semiconductor devices

Thyristor: Thyristor characteristics, Thyristor turn-on methods, Thyristor protection, Series and
parallel operation of thyristors, Thyristor commutation; Characteristics of Diac and Triac; Power
diode; Power transistor; Power MOSFET; IGBT.
2. Phase controlled converters
Principle of phase control, Single-phase half-wave circuit with different types of load, Singlephase full-wave mid-point converter, Single-phase full-wave bridge converters, Single-phase
semiconverter, Three-phase thyristor converters, Single-phase and three-phase dual converters.
3. DC choppers
Principle of chopper operation and control strategies, Step-up and step-down choppers, Types of
chopper circuits, Voltage-commutated chopper, Current-commutated chopper, Load-commutated
chopper.
4. Inverters
Single-phase voltage source inverters, Modified McMurray half-bridge and full-bridge inverter,
McMurray-Bedford half-bridge and full-bridge inverter, Pulse-width modulated inverters,
Current source inverters, Series inverters, Parallel inverter.
5. Applications of industrial electronics
Switched mode power supply (SMPS), Uninterruptible power supplies, Solid state relays.
Text Books:
1. Power Electronics: Circuits, Devices and Applications by Muhammad H. Rashid;
Pearson / PHI Publication
2. Power Electronics by Dr. P. S. Bimbhra; Khanna Publishers
Reference Books:
1. Power Electronics by P. C. Sen; Tata McGraw Hill Publication
2. Power Electronics by C. W. Lander; McGraw Hill Publication
36

EC- 324(a)
DIGITAL & ANALOG VLSI DESIGN
1. MOSFETS
Fundamentals of Enhancement Mode MOSFETs, Depletion Mode MOSFETs, Weak &
strong Inversion Conditions, Threshold Voltage Concept in MOSFETs, Current-Voltage (IV)
Characteristics of a MOSFET, Limitations in IV Model and MOSFET Parasitics. Trends &
Projections in VLSI Design & Technology, Flow of VLSI Circuit Design. Scaling in MOS
devices.
2. VLSI Design Styles
NMOS, CMOS Process flow, Noise Margin, Inverter Threshold Voltage, NMOS Inverter
design and characteristics, CMOS Inverter Design and Properties, Delay and Power
Dissipation. Parallel & Series Equivalent circuits, Static CMOS Circuit Design.
3. VLSI Physical Design
Stick Diagrams, Physical Design Rules, Layout Designing, Eulers Rule for Physical Design.
VLSI Interconnects. Reliability issues in CMOS VLSI, Latching, Electromigration.
4. High Speed Dynamic CMOS Logic Families
Precharge-Evaluate logic, Dynamic CMOS logic circuits, Cascading, Charge redistribution,
Voltage Bootstraping.
5. Memory Design
ROM Design, SRAM Design.
6. Analog Design Techniques
Single Stage MOS Amplifier, Differential Amplifier and their analysis.
Text Books
1. B.G. Streetman & S. Banerjee, Solid State Electronic Devices, PHI.
2. S.M. Kang & Y. Leblebici, CMOS Digital Integrated Circuits-Analysis & Design,
TMH, Ed. 2003.
References
1. K. Eshraghian & Pucknell, Introduction to VLSI, PHI.
2. B. Razavi, Design of Analog CMOS Integrated Circuits, TMH.
37

EC-324 (b)
SATELLITE COMMUNICATION
1. An overview of space and satellite

Introduction, Basic Definition, Brief History, Satellite in Orbit, Keplers Law,
Orbital Parameters, Orbital Perturbations, Station Keeping, Coverage and Slot Range, Geo
Stationary & Non Geo Stationary Orbits, Sun Transit Outrage, Eclipses , Sub Satellite Point.
Space Radio Communication, Frequency Selection, Communication Subsystems and
Spacecraft, Frequency Plans, Transponder.
2. Satellite link design.
Basic Need of Satellite & Ground Station, Basic Transmission Theory, Single Conversion
Transponder, Transponder Assignment within the Satellite
3. System noise temperatures.
Noise Sources, Effective Noise Temperatures, Noise Figure Of Cascade Network, Noise
Due to Lossy Network, System Noise Temperature, Figure Of Merit, (G/T
Ratio),Calculations For The Overall Career To Noise Ratio (C/N).
4. Design aspects of satellite receiver:
Low Noise Amplifier, Mixer, L.O., I.F. Amplifier, Demodulator.
5. GPS
Basic Principles of GPS Operations: Ranging From Space; Satellite, Control and User
Segments; GPS Satellite Navigation Message; GPS Time, Fundamental and Derived
Frequencies
Textbooks
1. D. Roddy, Satellite Communication, McGraw Hill International, 4th Edition, 2006.
2. T. Pratt, and C.W. Boston, Satellite Communication, John Wiley & Sons.
3. W. L. Pritchard, H. G. Suyderhoud, R. A. Nelson, Satellite Communication Systems
Engineering , Prentice Hall/Pearson, 2007.
References
1. N. Agarwal, Design of Geosynchronous Space Craft, Prentice Hall, 1986.
2. Bruce R. Elbert, The Satellite Communication Application Hand Book, Artech House
Boston London, 1997.
38

EC-320 (a)
BIOMEDICAL ELECTRONICS
1. Bioelectronics signal
Origins of Bioelectric signals, The Human Body Overview. The heart and circulatory
system. Electrodes, Sensors and Transducers, Bio electric Amplifiers Electrocardio
graphsElectrocardiogram (ECG), Electromyogram (EMG). Recording Electrodes: Silversilver Electrodes, Electrodes for ECG, EEG and EMG, Physiological Transducers:
Pressure Transducers, Temperature sensors, Pulse sensors.
2. Recording and Monitoring Instruments
Biomedical Recorders: Block diagrams of electrocardiogram phonocardiograph,
Electroencephalograph, Electromyography., measurement of heart rate, blood pressure
measurement, and temperature measurement respiration rate. Foetal Monitoring System:
Methods of monitoring Foetal Heart Rate, Abdomen Foetal Electrocardiogram and Foetal
Phonocardiogram. Biomedical Telemetry: Introduction, block diagram and description of
single channel/multi channel telemetry systems.
3. Imaging Systems
Introduction, Basic principle and block diagram of x-ray machine, x-ray computed
topography (C.T. Scanner) and Nuclear Magnetic resonance (NMR) Topography,
Ultrasonic Imaging System: Introduction, medical ultrasound, block diagram of pulse
echo-system.
4. Therapeutic and Physiotherapy Equipments
Type of cardiac Pacemakers, Cardiac Defibrillator, Kidney Machine, Short-wave
Diathermy, Microwave Diathermy, Ultrasound Therapy unit.
5. Patient Safety
Electric shock hazard, leakage currents, Test Instruments for checking safety parameters
of Biomedical Equipments.
Text Books:
1. R.S.Khandpur. Handbook of Biomedical Instrumentation, Tata McGraw Hill, New
Delhi.Simon Haykin: Communication systems - John-Wiley & sons, Inc.
2. Leslie Cromwell, Fred J.Weibell and Erich A.Pferffer. Biomedical Instrumentation and
Measurements Prentice Hall of India, New Delhi.
Reference:
1. Joseph J Carr & John M Brown Introduction to Biomedical Equipment Technology,
4th edn., Pearson Education.
2. T. K. Attuwood & D J Pary Smith, Introduction to Bioinformatics, 1999, Pearson
Education.
39

EC -320 (b)
HDL BASED FPGA DESIGN
1.
Introduction to VLSI Design
2.
Introduction to HDL
Introduction and levels of abstraction, modeling and hierarchical design concepts
Languages, Compilation & Simulation, concurrency, Logic value system.
3.
Language Concepts
Lexical conventions, data types, modules and ports, behavioral modeling, dataflow
modeling, structural modeling.
4.
RTL Design
Control & Data partitioning, Synthesis concepts, non synthesizable constructs
operators, expressions, conditional statements, post synthesis simulation
5.
Hardware modules
Boolean equations, Encoders, Decoders, multiplexers, cascaded multiplexers, adders,
comparators, multipliers, shifters, Mealy & Moore finite state machine, Implementation
on FPGA, FPGA architectures, Programming Resources.
Text Books:
1.
2.
3.
Peter J. Ashenden, The Designer's Guide to VHDL, 2nd Edition Morgan Kaufmann
Publishers, 2001
J. Bhasker, A Verilog HDL Primer, Star Galaxy Press, 1996
Samir Palnitkar, Verilog HDL: A Guide to Digital Design and Synthesis, Prentice Hall,
1996
References:
1.
Vivek Sagdeo, The Complete Verilog Book, Kluwer Academic Publishers.
2.
Douglas J. Smith, HDL Chip Design: A Practical guide for Designing, Synthesizing and
Simulating ASICs and FPGAs using VHDL or Verilog, Doone Pubns, 1996.
3.
Ben Cohen, VHDL Coding Styles and Methodologies, Kluwer Academic Publishers,
1999.
4.
J. Bhasker, A VHDL Primer, Third Edition, Prentice Hall, 1998.
40

EC-320(c)
1.
RELIABILITY ENGINEERING
Introduction
Definition; Probability Concept; Addition of Probabilities; Complimentary Events;
Kolmogorov Axioms, Conditional Probability, Multiplication Rule, Independent Events,
Venn Diagram, Bayes Theorem
2.
Failure Data Analysis

Introduction, Mean Failure Rate, Mean Time to Failure ( MTTF ), Mean Time between
Failures ( MTBF), Graphical Plots, MTTF in terms of Failure Density, MTTF in Integral
Form.
3.
Hazard Models
Introduction, Constant Hazard; Linearly Increasing Hazard, The Weibull Model, Density
Function and Distribution Function, Reliability Analysis, Important Distributions and
their Choice.
4.
System Reliability
Series, Parallel and Mixed Configurations, Complex Systems, Logic Diagrams, FaultTree Analysis and Other Techniques: Fault-tree Construction, Calculation of Reliability,
Tie- set and Minimal Tie-set, Markov Models.
5.
Reliability Improvement & Repairable Systems

Redundancy, Element, Unit and Standby Redundancy, Optimization; Reliability cost
trade- off, Introduction to Repairable Systems, Instantaneous Repair Rate, MTTR,
Important Applications.
6.
Maintainability and Availability

Introduction, Reliability and Availability Functions, Types of availability and factors
affecting it, Maintenance Planning, Reliability and Maintainability trade off.
Text Books:
1. Reliability Engineering, L.S. Srinath, Affiliated East-West Press, New Delhi.
2. Reliability Engineering, A.K.Govil, Tata Mc-Graw Hill, New Delhi.
References:
1. Reliability Engineering, L.Balagurusamy, Tata Mc-Graw Hill, New Delhi, 1984.
2. Reliability Based Design, S. Rao, Mc-Graw Hill, 1992.
41

EC-411
1.
DATA COMMUNICATION & COMPUTER NETWORKS
Introduction to Data Communication

Goals and Applications of Networks, Wireless Network, Interfaces and services.
Reference Models: The OSI reference model, TCP/IP reference model.
2.
Physical Layer
Data and Signals, Digital and Analog transmission, Transmission Media, Wireless
transmission, Switching
3.
Data Link Layer

Data link layer design issues, Services provided to Network layers, Framing, Error
control, Flow control, Error detection and correction, Elementary data link protocols, An
unrestricted Simplex protocol, A Simplex Stop-and-Wait protocol, Simplex Protocol for
a noisy channel, Sliding Window protocols, A protocol using go-back-N, A protocol
using selective repeat, Example data link protocol-HDLC, PPP.
4.
Medium Access Sublayer

Channel Allocations, Random Access, ALOHA, Carrier Sense Multiple Access
Protocols, Collision free Protocols, Limited contention protocols, Controlled Access,
Channelization, Wired LANs: Ethernet, Wireless LANs.
5.
Network Layer
Network Layer Design issue, Logical Addressing, Address Mapping, Error Reporting and
Multicasting, Delivery Forwarding and Routing.
6.
Transport Layer
Process to Process Delivery: UDP,TCP and SCTP.
7.
Application Layer
Design issues of the layer, Domain Name systems, File Transfer, http, web documents,
Virtual Terminals.
Text Books
1. J Frauzon Computer Communication and Networks
2. W. Stallings, Data and computer communication, PHI
References
1. S. Keshav, An Engineering Approach on Computer Networking, Addison Welsey.
2. Wayne Tomasi Introduction to Data Communications and Networking Pearson
3. A.S. Tanenbaum, Computer Networks, PHI
42

EC-412
DIGITAL SIGNAL PROCESSING
1. Discrete-time signals and systems

Basic elements of a digital signal processing system, Advantages of digital signal processing,
Classification of signals, The concept of frequency in continuous-time and discrete-time domain,
Discrete-time signals and systems, Analysis of discrete-time linear shift-invariant systems,
Linearity, Causality and stability criterion, Discrete-time systems described by difference
equations.
2. Discrete-time Fourier transform
The Fourier transform of discrete-time signals (DTFT), Properties of the DTFT, The frequency
response of an LTI discrete-time system, Sampling and reconstruction of signals.
3. Discrete Fourier transform
Frequency domain sampling and the DFT, Properties of the DFT, Linear filtering methods based
on the DFT, Efficient computation of the DFT: Decimation-in-time and
decimation-infrequency fast Fourier transform algorithms.
4. z-transform
Introduction to the z-transform & the inverse z-transform, Properties of the z-transform,
Relationship between the Fourier transform and the z-transform, Rational z-transforms & the
system function, Analysis of linear time-invariant systems in the z-domain.
5. Digital filter structures
Digital filter categories, Realization structures for FIR & IIR digital filters, Implementation of
digital filters.
6. Digital filter design
General considerations, Review of analog filter design, Design of IIR digital filters: IIR digital
filter design using the impulse invariance method and the bilinear transformation method, Design
of linear phase FIR digital filters: FIR digital filter design using the windows method and the
frequency-sampling method.
Text Books:
1. Digital Signal Processing: Principles, Algorithms and Applications by John G. Proakis &
Dimitris G. Manolakis; Pearson Education
2. Digital Signal Processing by Sanjit K. Mitra; Tata McGraw Hill Publication
References:
1. Digital Signal Processing by Alan V. Oppenheim & Ronald W. Schafer; PHI Publication
2. Theory & Application of Digital Signal Processing by Rabiner & Gold; PHI Publication
43

EC-413
Optical & Network Communication Systems
1. Overview
The Electromagnetic Spectrum, Properties of Light, Dual Nature of Light Concept of a photon,
Wave Model, Characteristics of light waves. Concepts of information, general communication
systems, evolution of Basic Fiber Optic Communication System, Benefits and disadvantages of
Fiber Optics. Transmission Windows. Transmission Through Optical Fiber, The Laws of
Reflection and Refraction, Light rays and light waves, Reflection of light from optical surfaces,
Refraction of light from optical interfaces, The Numerical Aperture (NA), The Optical Fiber,
Types of Fiber.
2. Losses in Optical Fiber
Attenuation, Material absorption losses, linear and non linear scattering losses, fiber bend loss,
dispersion viz. inter modal dispersion and intra modal dispersion, overall fiber dispersion and
polarization, Dispersion shifted and dispersion flattened fibers, attenuation and dispersion limits
in fibers, Kerr nonlinearity, self phase modulation, combined effect of dispersion and self phase
modulation.
3. Fiber Material, Couplers and Connectors
Preparation of optical fiber: liquid-phase techniques, vapor phase deposition techniques,
Connector Principles, Fiber End Preparation, splices, connectors.
4. Optical Sources and Detectors
Sources: Basic principle of surface emitter LED and edge emitter LED- material used, structure,
internal quantum efficiency and characteristics, LASER Diode - material used, structure, internal
quantum efficiency and characteristics, working Principle and characteristics of Distributed
feedback (DFB) laser. Detectors: PIN photodiode - material used, working principle &
characteristics, Avalanche Photodiode: - material used, working principle and characteristics
5. Advanced Topics
Optical TDM, SCM, WDM and Hybrid multiplexing methods, Fiber Optic Networks,
Transreceivers for Fiber-Optic Networks, Semiconductor Optical Amplifiers, Erbium Doped
Fiber Amplifiers (EDFAs).
6. Optical Networks
Elements and Architecture of Fiber-Optic Network, SONET/SDH, ATM, IP, Optical Line
Terminals (OLT), Optical Add-Drop Multiplexers, Optical Cross Connects.
Text Books:
1. Optical Fiber Communication Principles & Practice by John M.Senior, PHI Publication
2. Optical Communication Systems by John Gowar, PHI Publications.
References:
1. Optical Fiber Communication by Gerd Keiser, Mc Graw Hill International Publications.
2. Fundamentals of Fibre Optics in Telecommunication and sensor systmes by Bishnu P.Pal,
New Age International (P) Ltd.
3. Optical Networks Practical Perspective 3rd Edition by Rajiv Ramaswami, Kumar N. Sivarajan, Elsevier.
44

EC-415 (a)
SYSTEM DESIGN USING HDL
2. Introduction
Introduction and levels of abstraction, modeling and hierarchical design concepts,
Languages, Compilation & Simulation, concurrency, Logic value system.
3. Language concepts
Lexical conventions, data types, modules and ports, behavioral modeling, dataflow modeling,
structural modeling.
3. RTL Design
Control & Data partitioning, Synthesis concepts, non synthesizable constructs, operators,
expressions, conditional statements, post synthesis simulation.
4. Advanced Design Techniques
Procedures and timing control, procedural blocks, loops, Tasks and functions, Test bench
modeling techniques, Path delay modeling, Timing analysis, User defined primitives,
compiler directives, system tasks,
5. Hardware modules
Boolean equations, Encoders, Decoders, multiplexers, cascaded multiplexers, adders,
comparators, multipliers, sorters, shifters, static and dynamic memories, Mealy & Moore finite
state machine, Implementation on FPGA
Text Books:
1.
Peter J. Ashenden, The Designer's Guide to VHDL, 2nd Edition Morgan Kaufmann
Publishers, 2001
2.
J. Bhasker, A Verilog HDL Primer, Star Galaxy Press, 1996
3.
Samir Palnitkar, Verilog HDL: A Guide to Digital Design and Synthesis, Prentice Hall,
1996
References:
1.
2.
3.
4.
Vivek Sagdeo, The Complete Verilog Book, Kluwer Academic Publishers.

Douglas J. Smith, HDL Chip Design: A Practical guide for Designing, Synthesizing and
Simulating ASICs and FPGAs using VHDL or Verilog, Doone Pubns, 1996.
Ben Cohen, VHDL Coding Styles and Methodologies, Kluwer Academic Publishers,
1999.
J. Bhasker, A VHDL Primer, Third Edition, Prentice Hall, 1998.
45

EC415(b)
MOBILE COMMUNICATION
1. Introduction
Basic cellular systems, Performance criteria, Uniqueness of mobile radio environment, Operation
of cellular systems, Concept of frequency reuse channels, Cochannel interference reduction
factor, Desired C/I from a normal case in an omnidirectional antenna system, Handoff
mechanism, Cell splitting.
2. Cell coverage for signal and traffic
General introduction, Obtaining the mobile point-to-point model, Propagation over water or flat
open area, Foliage loss, Propagation in near-in distance, Long-distance propagation, Obtain path
loss from a point-to-point prediction model, Cell-site antenna heights and signal coverage cells.
3. Cochannel and adjacentchannel interference
Cochannel interference, Design of an omnidirectional antenna system in the worst case, Design
of a directional antenna system, Lowering the antenna height, Power control, Diversity receiver,
Adjacent-channel interference, Near-end far-end interference, Effect on near-end mobile units.
4. Frequency management, channel assignment and handoffs
Frequency management, Frequency-spectrum utilization, Set-up channels, Definition of channel
assignment, Fixed channel assignment schemes, Nonfixed channel assignment schemes, Concept
of handoff, Initiation of a hard handoff, Delaying a handoff, Forced handoffs, Queuing of
handoffs, Power-difference handoffs, Mobile assisted handoff, Soft handoffs, Cell-site handoff
only, Intersystem handoff.
5. Digital cellular systems
Global system for mobile (GSM): GSM system architecture, GSM radio subsystem, GSM
channel types, Frame structure for GSM, Signal processing in GSM; GPRS; EDGE; CDMA
digital cellular standard: Frequency and channel specifications, Forward CDMA channel,
Reverse CDMA channel; Overview of third generation (3G) wireless networks.
Text Books:
1. Mobile Cellular Telecommunications: Analog and Digital Systems by William C. Y. Lee;
Tata McGraw Hill Publication
2. Wireless Communications: Principles and Practice by Theodore S. Rappaport; Pearson /
PHI Publication
References:
4. Wireless Communications and Networks: 3G and Beyond by Iti Saha Misra;
McGraw Hill Publication
5. Wireless and Digital Communications by Dr. Kamilo Feher; PHI Publication
46
Tata

EC-415(c)
BIOMEDICAL ELECTRONICS
1. Bioelectronics signal
Origins of Bioelectric signals, The Human Body Overview. The heart and circulatory
system. Electrodes, Sensors and Transducers, Bio electric Amplifiers Electrocardio
graphsElectrocardiogram (ECG), Electromyogram (EMG). Recording Electrodes: Silversilver Electrodes, Electrodes for ECG, EEG and EMG, Physiological Transducers:
Pressure Transducers, Temperature sensors, Pulse sensors.
2. Recording and Monitoring Instruments
Biomedical Recorders: Block diagrams of electrocardiogram phonocardiograph,
Electroencephalograph, Electromyography., measurement of heart rate, blood pressure
measurement, and temperature measurement respiration rate. Foetal Monitoring System:
Methods of monitoring Foetal Heart Rate, Abdomen Foetal Electrocardiogram and Foetal
Phonocardiogram. Biomedical Telemetry: Introduction, block diagram and description of
single channel/multi channel telemetry systems.
3. Imaging Systems
Introduction, Basic principle and block diagram of x-ray machine, x-ray computed
topography (C.T. Scanner) and Nuclear Magnetic resonance (NMR) Topography,
Ultrasonic Imaging System: Introduction, medical ultrasound, block diagram of pulse
echo-system.
4. Therapeutic and Physiotherapy Equipments
Type of cardiac Pacemakers, Cardiac Defibrillator, Kidney Machine, Short-wave
Diathermy, Microwave Diathermy, Ultrasound Therapy unit.
5. Patient Safety
Electric shock hazard, leakage currents, Test Instruments for checking safety parameters
of Biomedical Equipments.
Text Books:
1. R.S.Khandpur. Handbook of Biomedical Instrumentation, Tata McGraw Hill, New
Delhi.Simon Haykin: Communication systems - John-Wiley & sons, Inc.
2. Leslie Cromwell, Fred J.Weibell and Erich A.Pferffer. Biomedical Instrumentation and
Measurements Prentice Hall of India, New Delhi.
Reference:
1. Joseph J Carr & John M Brown Introduction to Biomedical Equipment Technology,
4th edn., Pearson Education.
2. T. K. Attuwood & D J Pary Smith, Introduction to Bioinformatics, 1999, Pearson
47

Education.
48

EC-421
MICROWAVE DEVICES & SYSTEMS
1.
Waveguides
Frequency allocations and frequency plans, Rectangular waveguide and its mathematical
analysis, circular waveguide, modes of propagation, dominant modes, cut off wavelength,
mode excitation.
2.
Microwave passive devices

Scattering matrix of microwave junction, cavity resonators, E-plane tee, H-plane tee, magic
tee, phase shifters, attenuators, directional couplers, ferrite devices, Faraday rotation, gyrator,
isolator, circulators and detector.
3.
Microwave generators and amplifiers

limitations of conventional tubes, reflex klystron, two and multi cavity klystron amplifiers
and oscillators, backward wave oscillators, Magnetrons, cross field amplifiers & the
MASER.
4.
Microwave solid-state devices

Gunn diode and its modes of operation, Avalanche IMPATT diode, TRAPATT diode,
Tunnel diode, Schottky diode, Backward diode, Varactor diodes, PIN diode
5.
Microwave Link
Microwave radio station, microwave transmitter and receiver, multiplexing equipment,
microwave link.
6.
Microwave Measurements
Measurement of standing wave ratio, measurement of frequency, measurement of power,
phase shift, antenna pattern measurement.
7.
Micro-Strip Lines
Introduction, Micro strip lines, parallel strip lines, coplanar strip lines, shielded strip lines,
characteristic impedance of micro strip lines, losses in micro strip lines, quality factor of
micro strip lines.
Text Books:
1. Foundations for Microwave Engineering, International student edition, R E.Collins
2. Microwave Devices and Circuits 3rd edition Samuel Y Liao.
Reference Books:
1. Microwave and Radar Engg, M Kulkarni, Umesh Publication.
2. Microwave Engg, David M. Pozar, Wily Publication
3. Microwave Engineering by A Das and S K Das
4. Microwave Engineering Rajeswari Chatterjee
5. Microwaves by M.L.Sisodiya and Vijay Laxmi Gupta
49

ECE-421 (P)
MICROWAVE DEVICES & SYSTEMS LAB

L T P
0 0 2
1. To study the microwave components, sources and different types of loads.

2. To study the characteristics of reflex klystron and determine its electronic and mechanical
tuning range.
3. To study the characteristics of gunn diode.
4. To measure the coupling and directivity of a directional coupler.
5. To study various tees i.e.: - E-plane, H-plane and magic tees.
6. To measure VSWR of an unknown load and determine its impedance .
7. To measure large standing wave ratio.
8. To determine the gain of a pyramidal horn and plot its beam pattern and find its lobe width.
9. To measure VSWR, insertion loss and attenuation of fixed and variable attenuator.
10. To measure the frequency of microwave source and demonstrate the relation ship among the
frequency, free space wavelength and guide wavelength.
11. To determine the insertion loss, isolation of a three port circulator.
50

EC-422(a)
IMAGE PROCESSING
1. Digital Image Fundamentals and Transforms

Elements of visual perception, Image sampling and quantization, Basic relationship
between pixels, Basic geometric transformations, Introduction to Fourier Transform and
DFT, Properties of 2-D Fourier Transform , FFT, Separable Image Transforms, Walsh
Hadamard, Discrete Cosine Transform, Haar Transform, Slant Karhunen Loeve
transforms.
2. Image Enhancement Techniques
Spatial Domain methods: Basic grey level transformation, Histogram equalization, Image
subtraction, Image averaging, Spatial filtering: Smoothing, Sharpening filters, Laplacian
filters, Frequency domain filters: Smoothing, Sharpening filters, Homomorphic filtering.
3. Image Restoration
Model of Image Degradation/Restoration process, Noise models, Inverse filtering, Least
mean square filtering, Constrained least mean square filtering, Blind image restoration,
Pseudo inverse, Singular value decomposition.
4. Image Compression
Lossless compression: Variable length coding, LZW coding, Bit plane coding, Predictive
coding-DPCM, Lossy Compression: Transform coding, Wavelet coding, Basics of Image
compression standards: JPEG, MPEG, Basics of Vector quantization.
5. Image Segmentation and Representation
Edge detection, Thresholding, Region Based segmentation, Boundary representation:
Chair codes, Polygonal approximation, Boundary segments, Boundary descriptors:
Simple descriptors, Fourier descriptors, Regional descriptors, Simple descriptors,Texture
Textbooks
1. Rafael C Gonzalez, Richard E Woods 2nd Edition, Digital Image Processing - Pearson
Education 2003.
References
1. William K Pratt, Digital Image Processing John Willey (2001)
2. Image Processing Analysis and Machine Vision by Millman Sonka, Vaclav hlavac,
Roger Boyle, Broos/colic, Thompson Learniy (1999).
51

EC-422(b)
WIRELESS SENSOR NETWORKS
1.
Introduction
Wireless sensor networks: the vision, Networked wireless sensor devices Applications of
wireless sensor networks, Key design challenges
2.
Network deployment
Structured versus randomized deployment, Network topology, Connectivity in geometric
random graphs, Connectivity using power control, Coverage metrics, Mobile deployment
3.
Localization and Time synchronization

Key issues, Localization approaches, Coarse-grained node localization using minimal
information, Fine-grained node localization using detailed information, Network- wide
localization, Theoretical analysis of localization techniques, Key issues of time
synchronization, Traditional approaches, Fine-grained clock synchronization, Coarsegrained data synchronization
4.
Wireless characteristics and Medium-access

Wireless link quality, Radio energy considerations, The SINR capture model for
interference, Traditional MAC protocols, Energy efficiency in MAC protocols,
Asynchronous sleep techniques, Sleep-scheduled techniques, and Contention-free
protocols.
5.
Sleep-based topology control and Energy-efficient routing

Constructing topologies for connectivity, Constructing topologies for coverage, Set Kcover algorithms, Cross-layer issues, Metric-based approaches, Routing with diversity,
Multi-path routing, Lifetime-maximizing energy-aware routing techniques, Geographic
routing, Routing to mobile sinks
6.
Data-centric networking
Data-centric routing, Data-gathering with compression, Querying, Data-centric storage
and retrieval, the database perspective on sensor networks
7.
Transport reliability and congestion control

Basic mechanisms and tunable parameters, Reliability guarantees, Congestion control,
Real-time scheduling
Textbooks/References:
1. Bhaskar Krishnamachari: Networking Wireless Sensors- Cambridge University Press
2. Kazem Sohraby, Daniel Minoli, Taieb Znati: Wireless Sensor Networks: Technology,
Protocols, and Applications- John Wiley & Sons
52

EC-422(c)
VLSI TESTING & TESTABILITY
Motivation for testing and design for testability, the problems of digital and analog testing,
Design for test, Software testing.
Faults in Digital circuits: General introduction, Controllability and Observability, Fault models
- Stuck-at faults, Bridging faults, intermittent faults
Digital test pattern generation: Test pattern generation for combinational logic circuits, Manual
test pattern generation, Automatic test pattern generation - Roth's D-algorithm, Developments
following Roth's D-algorithm, Pseudorandom test pattern generation, Test pattern generation for
sequential circuits , Exhaustive, non-exhaustive and pseudorandom 70 test pattern Generation,
Delay fault testing
Signatures and self test: Input compression Output compression Arithmetic, Reed-Muller and
spectral coefficients, Arithmetic and Reed-Muller coefficients, Spectral coefficients, Coefficient
test signatures, Signature analysis and Online self test
Testability Techniques: Partitioning and ad hoc methods and Scan-path testing , Boundary scan
and IEEE standard 1149.1 ,Offline built in Self Test (BIST), Hardware description languages and
test
Test generation algorithms: For combinational logic circuits fault table, Boolean difference,
Path sensitilization, D-algorithm, Podem; Fault simulation techniques serial single fault
propagation, Deductive, Parallel and concurrent simulation; test generation for a sequential logic;
Design for testability Adhoc and structured methods, scan design, partial scan, boundary scan,
Pseudo-random techniques for test vector generation and response compression, Built in-Selftest, PLA test and DFT.
Text Books:
1.
2.
Abramovici, M, Breuer, M.A and Friendman, A.D., Digital systems and Testing and
Testable Design, Computer Science Press 1990.
VLSI Testing: digital and mixed analogue digital techniques Stanley L. Hurst
Pub: Inspec / IEE, 1999
53

EC-423(a)
OPTICAL NETWORKS
1. Introduction
Services, Circuit Switching, Packet Switching, Optical Networks, Optical Layer,
Transparency and All Optical Networks, Optical Packet Switching, Transmission Basics,
Network Evolution.
2. Optical Amplifiers
Stimulated Emission, Spontaneous Emission, Erbium Doped Fiber amplifiers, Raman
amplifiers, Semiconductor Optical Amplifiers, Cross talk in SOAs.
3. Multiplexers and Filters
Gratings, Diffraction Pattern, Bragg Gratings, Fiber Gratings, Fabry-Perot filters,
Multilayer Dielectric Thin-Film Filters, Mach-Zehnder Interferometers, Arrayed
Waveguide Grating, Acousto-Optic Tunable Filter, High channel Count Multiplexer
Architectures, Optoelectronics Approach, Optical Gating, Interferometric Techniques,
Wave Mixing.
4. Transmission System Engineering
System Model, Power Penalty, Transmitter, Receiver, Optical Amplifiers, Cross talk,
Dispersion, Fiber Nonlinearities, Wavelength Stabilization Design of Soliton Systems,
Design of Dispersion Managed Soliton Systems.
5. Client Layers
SONET/SDH, ATM, IP, Storage Area Networks, Gigabit and 10-Gigabit Ethernet.
6. WDM Network Elements & Design
Optical Line Terminals, Optical Line Amplifiers, Optical Add/Drop Multiplexers, Optical
Cross connects. Cost Trade-Offs: A Detailed Ring Network Example, LTD and RWA
Problems, Dimensioning Wavelength-Routing Networks, Statistical Dimensioning
Models, Maximum Load Dimensioning Models
7. Access Networks
Network Architecture Overview, Enhanced HFC, fiber to the Curb (FTTC).
Text Books:
1. Optical Networks: A practical Perspective. Ramaswami & K.N. Sivarajan.
2. Multiwavelength Optical Neworks: A Layered Approach. Thomas E. Stern and Krishna
Bala, Addison Wiley.
References
1. Introduction to Optical Fiber Communication Systems-William B. Jones HRW.
2. Optical WDM Network Principles and Practice Edited by K.M. Sivalingam & S.
Subramanian, Kluwer Academic Publishers.
54

EC-423 (b)
SPREAD SPECTRUM & CDMA
1. Introduction
Software approach, Hardware approach, Basic idea of spread spectrum technology, Main
features, Process gain, Important terms such as Direct sequence bandwidth, Frequency
Hopper, Bandwidth, Information role, chip rate, Post correlation bandwidth, Spread
spectrum techniques such as DSSS, Frequency hopping, Time hopping etc.
2. Principles of Direct Spread Spectrum
Direct spectrum system: Definition and concepts, Spreading Sequences and Waveforms,
Random Binary Sequence, Shift-Register Sequences, Periodic Autocorrelations,
Polynomials over the Binary Field, Systems with PSK Modulation, Power spectral
density of DSS-CDMA, Pulsed Interference, Despreading with Matched Filter.
3. Frequency Hoped Systems
Concepts and Characteristics, Modulations, MFSK, Soft-Decision Decoding,
Narrowband Jamming Signals, Hybrid Systems, Codes for Partial-Band Interference
Reed-Solomon Codes, Trellis-Coded Modulation, Turbo Codes, Frequency Synthesizers
Direct Frequency Synthesizer, Digital Frequency Synthesizer,Indirect Frequency
Synthesizers.
4. Spreading Code Acquisition and Tracking
Initial code acquisition, Acquisition strategy: serial search, parallel search, multi-dwell
detection, False alarm and miss probability for matched filter receiver, False alarm and
miss probability for radiometer, mean overall acquisition time for serial search
5. Performance of Spread Spectrum System
Link performance of direct sequence spread spectrum CDMA in (i) Additive White Noise
Channel (ii) Multipath fading channel. Concept of Rake receiver,performance of RAKE
receiver in multipath fading channel.
6. CDMA Systems
CDMA-IS-95: Forward link channels, Reverse link channels, Power controls and handoff
procedure in IS-95. Over view of CDMA based 3G systems.
Text Book
1. Don Torrieri : Principles Of Spread-Spectrum Communication Systems- Springer Science
& Business Media, Inc.
2. Andrew J. Viterbi : CDMA: Principles of Spread Spectrum Communication-AddisonWesley Publishing Company.
References
1. Mosa Ali Abu-Rgheff, Introduction to CDMA Wireless Communications, Elsevier
Academic Press.
2. R. Michael Buehrer, Code Division Multiple Access-CDMA,Morgan & Claypool
Publishers series.
55

EC-423(c)
VLSI INTERCONNECTS & PACKAGING
1. Interconnects: Small, Intermediate and long interconnects in VLSI, Interconnect

Parasitics: Resistance, Inductance and Capacitance. Interconnect RC Delays: Elmore
Delay Calculation. Interconnect Models: Lumped RC Model, Distributed RC Model,
Transmission line model. SPICE Wire Models: Distributed RC lines in SPICE,
Transmission line models in SPICE.
2. Scaling issues in VLSI Devices and Interconnects: Scaling and its effect on
performance parameters.
3. Interconnect Delay: Methods for improving interconnect RC delay
4. CMOS Repeater Driven Interconnects: The Static Behavior- Switching Threshold,
Noise Margins, The Dynamic Behavior- Computing the capacitances, Propagation Delay:
First order Analysis, Propagation Delay from a Design perspective. Power, energy and
Energy-Delay- Dynamic Power Consumption, Static Consumption, Transient analysis of
repeater loaded interconnects and analysis of Power Consumption using SPICE
5. Transmission line model of Interconnects: Lossy line, Termination Conditions,
Crosstalk and Noise in interconnects.
6. Advanced Interconnect Techniques: Reduced-swing Circuits, Current-mode
Transmission Techniques, Clocking of high-speed systems, CNT and Optical
Interconnects.
7. Packaging Techniques
Introduction to packaging, Package design considerations, VLSI Assembly Techniques,
Packaging fabrication technology, THM, Surface Mounting.
Text Books:
1.
2.
H.K. Bakoglu, Circuits, Interconnections & Packaging for VLSI, Addison Wesley
Publication Company Inc.
A.K. Goel, High-Speed VLSI Interconnections, Wiley Interscience, 2nd Edition, 2007.
Reference Books:
1.
2.
3.
M. A. Elgamel, M. A. Bayoumi, Interconnect Noise Optimization in Nanometer

Technologies, Springer
Jan M. Rabaey, Analysis and Design of Digital Integrated Circuits A design
Perspective, TMH, 2nd Edition 2003.
F.Moll, M.Roca, Interconnection Noise in VLSI Circuits, Kluwer Academic Publishers.
56

EC-423 (d)
1.
2.
3.
4.
5.
6.
NANOELECTRONICS
Introduction of Nanoelectronics
The Top-Down Approach; The Bottom-Up Approach; Why Nanoelectronics;
Nanotechnology Potential; MOS Scaling theory-Issues in scaling MOS transistors; Short
channel effects; Requirements for non-classical MOS transistor; Metal gate transistorMotivation, requirements, Integration Issues; High-k gate based MOSFET-Motivation,
requirements, integration issues of high-k.
Quantum Mechanics of Electrons
General postulates of quantum mechanics; Time-independent Schrodingers equationboundary conditions on the Wave function; Analogies between quantum mechanics and
classical electromagnetic; probabilistic current density; Multiple particle systems; Spin
and angular Momentum.
Free and Confined Electrons
Free Electrons; Free electron gas theory of metals; Electrons confined to a bounded
region of space and quantum numbers; Partially confined electrons- finite potential wells;
Quantum wells; Quantum wires; Quantum dots.
Tunnel Junctions and Applications of Tunneling
Tunneling through a potential barrier; Potential energy profiles for material interfaces;
Applications of tunneling; Coulomb blockade, Single-Electron Transistor (SET).
Germanium Nano MOSFETs
Strain, Quantization; Advantages of germanium over silicon; PMOS versus NMOS;
Compound semiconductors - material properties; MESFETs; Compound semiconductors
MOSFETs in the context of channel quantization and strain; Hetero structure MOSFETs
exploiting novel materials, strain, quantization.
Non-Conventional MOSFET Structures
SOI-PDSOI and FDSOI; Ultrathin body SOI-double gate transistors, integration issues;
Vertical transistorsFinFET and Surround gate FET; Carbon Nanotube Transistors
(CNT); Semiconductor Nanowire FETs and SETs; Molecular SETs and Molecular
Electronics.
Text Books:
1. Fundamentals of Modern VLSI Devices, Y. Taur and T Ning, Cambridge University
Press.
2. Fundamental of Nanoelectronics, George W. Hanson Pearson Education.
References
1. Silicon VLSI Technology, Plummer, Deal, Griffin, Pearson Education India.
2. Encyclopedia of Materials Characterization, Edited by Brundle, C.Richard; Evans,
Charles A. Jr.; Wilson, Shaun, Elsevier.
57

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