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D D D D D: Description/ordering Information
D D D D D: Description/ordering Information
The ULN2001A is obsolete
and is no longer supplied.
SLRS027G DECEMBER 1976 REVISED JUNE 2004
ULN2001A . . . D OR N PACKAGE
ULN2002A . . . N PACKAGE
ULN2003A . . . D, N, NS, OR PW PACKAGE
ULN2004A . . . D, N, OR NS PACKAGE
ULQ2003A, ULQ2004A . . . D OR N PACKAGE
(TOP VIEW)
(Single Output)
High-Voltage Outputs . . . 50 V
Output Clamp Diodes
Inputs Compatible With Various Types of
Logic
Relay-Driver Applications
1B
2B
3B
4B
5B
6B
7B
E
description/ordering information
16
15
14
13
12
1C
2C
3C
4C
5C
6C
7C
COM
PDIP (N)
20C
20
C to 70
70C
C
ORDERABLE
PART NUMBER
PACKAGE
TA
Tube of 25
SOIC (D)
SOP (NS)
TSSOP (PW)
PDIP (N)
40C to 85C
SOIC (D)
ULN2002AN
ULN2002AN
ULN2003AN
ULN2003AN
ULN2004AN
ULN2004AN
Tube of 40
ULN2003AD
Reel of 2500
ULN2003ADR
Tube of 40
ULN2004AD
Reel of 2500
ULN2004ADR
Reel of 2000
TOP-SIDE
MARKING
ULN2003A
ULN2004A
ULN2003ANSR
ULN2003A
ULN2004ANSR
ULN2004A
Tube of 90
ULN2003APW
Reel of 2000
ULN2003APWR
UN2003A
ULQ2003AN
ULQ2003A
ULQ2004AN
ULQ2004AN
Tube of 40
ULQ2003AD
ULQ2003A
Reel of 2500
ULQ2003ADR
ULQ2003A
Tube of 40
ULQ2004AD
ULQ2004A
Reel of 2500
ULQ2004ADR
Tube of 25
ULQ2004A
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright 2004, Texas Instruments Incorporated
logic diagram
9
1B
2B
3B
4B
5B
6B
7B
16
15
14
13
12
11
10
COM
1C
2C
3C
4C
5C
6C
7C
COM
Output
C
Input
B
Output
C
7V
Input
B
10.5 k
7.2 k
E
7.2 k
3 k
3 k
ULN2001A
ULN2002A
COM
Input
B
ULN/ULQ2003A: RB = 2.7 k
ULN/ULQ2004A: RB = 10.5 k
Output
C
RB
7.2 k
3 k
TEST
FIGURE
ULN2001A
TEST CONDITIONS
VI(on)
IC = 300 mA
IC = 100 mA
VCE(sat)
Collector-emitter
saturation voltage
VCE = 2 V,
II = 250 A,
II = 350 A,
II = 500 A,
IC = 200 mA
IC = 350 mA
VF
8
1
ICEX
VCE = 50 V,
TA = 70C
VCE = 50 V,
TA = 70C
II(off)
II
Input current
IR
hFE
Static forward-current
transfer ratio
Ci
Input capacitance
IF = 350 mA
VCE = 50 V,
VI = 17 V
VR = 50 V,
MIN
TYP
MIN
TYP
0.9
1.1
0.9
1.1
1.3
1.3
1.2
1.6
1.2
1.6
1.7
1.7
50
100
100
50
65
50
VR = 50 V
VI = 0,
f = 1 MHz
V
V
A
A
A
65
0.82
IC = 350 mA
50
UNIT
500
TA = 70C
VCE = 2 V,
MAX
13
II = 0
II = 0
VI = 6 V
IC = 500 A,
ULN2002A
MAX
1.25
100
100
50
50
mA
A
A
1000
15
25
15
25
pF
TEST
FIGURE
ULN2003A
TEST CONDITIONS
MIN
TYP
IC = 125 mA
IC = 200 mA
VI(on)
VCE(sat)
ICEX
Collector-emitter
saturation voltage
VCE = 2 V
MAX
IC = 250 mA
IC = 275 mA
2.7
IC = 300 mA
IC = 350 mA
6
7
1.1
1.3
1.3
IC = 350 mA
II = 0
1.2
1.6
1.2
1.6
II = 500 A,
VCE = 50 V,
VCE = 50 V,
TA = 70C
II = 0
VI = 1 V
VCE = 50 V,
TA = 70C
II
Input current
50
VI = 3.85 V
VI = 5 V
0.93
TA = 70C
f = 1 MHz
50
100
100
65
VI = 12 V
VR = 50 V
VR = 50 V,
VI = 0,
50
500
1.7
IC = 500 A,
8
0.9
II(off)
UNIT
5
2.4
1.1
IF = 350 mA
Input capacitance
TYP
0.9
Ci
MIN
IC = 100 mA
IC = 200 mA
MAX
II = 250 A,
II = 350 A,
VF
IR
ULN2004A
15
1.7
50
V
A
A
65
1.35
0.35
0.5
1.45
50
50
100
100
25
15
25
mA
A
A
pF
TEST
FIGURE
PARAMETER
TEST CONDITIONS
MIN
TYP
ULQ2004A
MAX
IC = 125 mA
IC = 200 mA
VI(on)
VCE(sat)
ICEX
Collector-emitter
saturation voltage
VCE = 2 V
1.4
1.3
IC = 350 mA
II = 0
1.2
1.7
1.2
1.6
II = 500 A,
VCE = 50 V,
VCE = 50 V
II = 0
VI = 1 V
VCE = 50 V,
VI = 3.85 V
100
50
100
500
1.7
A
IC = 500 A
2.3
65
0.93
1.7
50
VR = 50 V,
VR = 50 V
TA = 25C
VI = 0,
f = 1 MHz
V
A
A
65
1.35
VI = 5 V
VI = 12 V
Input capacitance
IC = 300 mA
IC = 350 mA
1.1
Ci
2.9
0.9
II(off)
IC = 250 mA
IC = 275 mA
1.2
IF = 350 mA
UNIT
5
2.7
0.9
IR
MAX
IC = 100 mA
IC = 200 mA
Input current
TYP
II = 250 A,
II = 350 A,
VF
II
MIN
15
0.35
0.5
1.45
100
50
100
100
25
15
25
mA
A
A
pF
TEST CONDITIONS
ULN2001A, ULN2002A,
ULN2003A, ULN2004A
MIN
tPLH
tPHL
VOH
See Figure 9
See Figure 9
VS = 50 V,
See Figure 10
IO 300 mA,
UNIT
TYP
MAX
0.25
0.25
VS20
mV
TEST CONDITIONS
MIN
TYP
MAX
UNIT
See Figure 9
10
See Figure 9
10
VS = 50 V,
See Figure 10
IO 300 mA,
VS500
mV
Open
VCE
ICEX
VCE
ICEX
Open
VI
VCE
Open
II(off)
IC
II(on)
Open
VI
Open
Open
IC
hFE =
II
VCE
II
IC
VI(on)
VCE
IC
VR
IR
VF
Open
IF
Open
50%
Input
50%
tPHL
tPLH
50%
Output
50%
VOLTAGE WAVEFORMS
Pulse
Generator
(see Note A)
2 mH
Open
1N3064
ULN2001A Only
2.7 k
200
Output
ULN2002A
ULN/ULQ2003A
ULN/ULQ2004A
CL = 15 pF
(see Note B)
TEST CIRCUIT
5 ns
10 ns
90%
1.5 V
Input
10%
VIH
(see Note C)
90%
1.5 V
10%
40 s
0V
VOH
Output
VOL
VOLTAGE WAVEFORMS
NOTES: A. The pulse generator has the following characteristics: PRR = 12.5 kHz, ZO = 50 .
B. CL includes probe and jig capacitance.
C. For testing the ULN2001A, the ULN2003A, and the ULQ2003A, VIH = 3 V; for the ULN2002A, VIH = 13 V;
for the ULN2004A and the ULQ2004A, VIH = 8 V.
TYPICAL CHARACTERISTICS
COLLECTOR-EMITTER
SATURATION VOLTAGE
vs
TOTAL COLLECTOR CURRENT
(TWO DARLINGTONS IN PARALLEL)
COLLECTOR-EMITTER
SATURATION VOLTAGE
vs
COLLECTOR CURRENT
(ONE DARLINGTON)
VCE(sat)
VCE(sat) Collector-Emitter Saturation Voltage V
TA = 25C
2
II = 250 A
II = 350 A
II = 500 A
1.5
0.5
0
0
100
200
300
400
500
600
700
800
2.5
TA = 25C
II = 250 A
2
II = 350 A
1.5
II = 500 A
1
0.5
0
0
100
200
300
400
500
600
700
800
IC Collector Current mA
Figure 12
Figure 11
COLLECTOR CURRENT
vs
INPUT CURRENT
500
RL = 10
TA = 25C
450
IC
IC Collector Current mA
VCE(sat)
VCE(sat) Collector-Emitter Saturation Voltage V
2.5
400
VS = 10 V
350
VS = 8 V
300
250
200
150
100
50
0
0
25
50
75
100
125
150
175
200
II Input Current A
Figure 13
THERMAL INFORMATION
N PACKAGE
MAXIMUM COLLECTOR CURRENT
vs
DUTY CYCLE
D PACKAGE
MAXIMUM COLLECTOR CURRENT
vs
DUTY CYCLE
600
IIC
C Maximum Collector Current mA
IIC
C Maximum Collector Current mA
600
500
N=1
400
N=4
N=3
300
N=2
N=6
200 N = 7
N=5
100
TA = 70C
N = Number of Outputs
Conducting Simultaneously
500
400
N=4
300
N=5
N=6
N=7
200
100
TA = 85C
N = Number of Outputs
Conducting Simultaneously
0
0
10
20
30
40
50
60
70
80
90 100
10
20
30
40
50
60
70
Duty Cycle %
Duty Cycle %
Figure 14
10
N=1
N=3
N=2
Figure 15
80
90 100
APPLICATION INFORMATION
ULN2002A
VSS
P-MOS
Output
ULN2003A
ULQ2003A
VCC
16
16
15
15
14
14
13
13
12
12
11
11
10
10
9
Lamp
Test
TTL
Output
VDD
ULN2003A
ULQ2003A
VCC
16
16
15
15
14
14
13
13
12
12
11
11
10
10
RP
CMOS
Output
TTL
Output
11
27-Feb-2006
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Lead/Ball Finish
ULN2001AD
OBSOLETE
SOIC
16
TBD
Call TI
Call TI
ULN2001ADR
OBSOLETE
SOIC
16
TBD
Call TI
Call TI
ULN2001AN
OBSOLETE
PDIP
16
TBD
Call TI
Call TI
ULN2002AD
OBSOLETE
SOIC
16
TBD
Call TI
Call TI
ULN2002AN
ACTIVE
PDIP
16
25
Pb-Free
(RoHS)
CU NIPDAU
ULN2002ANE4
ACTIVE
PDIP
16
25
Pb-Free
(RoHS)
CU NIPDAU
ULN2003AD
ACTIVE
SOIC
16
40
CU NIPDAU
Level-1-260C-UNLIM
ULN2003ADE4
ACTIVE
SOIC
16
40
CU NIPDAU
Level-1-260C-UNLIM
ULN2003ADR
ACTIVE
SOIC
16
CU NIPDAU
Level-1-260C-UNLIM
ULN2003ADRE4
ACTIVE
SOIC
16
CU NIPDAU
Level-1-260C-UNLIM
ULN2003AJ
OBSOLETE
CDIP
16
TBD
Call TI
ULN2003AN
ACTIVE
PDIP
16
25
Pb-Free
(RoHS)
CU NIPDAU
ULN2003ANE4
ACTIVE
PDIP
16
25
Pb-Free
(RoHS)
CU NIPDAU
ULN2003ANSR
ACTIVE
SO
NS
16
CU NIPDAU
Level-1-260C-UNLIM
ULN2003ANSRE4
ACTIVE
SO
NS
16
CU NIPDAU
Level-1-260C-UNLIM
ULN2003ANSRG4
ACTIVE
SO
NS
16
CU NIPDAU
Level-1-260C-UNLIM
ULN2003APW
ACTIVE
TSSOP
PW
16
90
CU NIPDAU
Level-1-260C-UNLIM
ULN2003APWE4
ACTIVE
TSSOP
PW
16
90
CU NIPDAU
Level-1-260C-UNLIM
ULN2003APWG4
ACTIVE
TSSOP
PW
16
90
CU NIPDAU
Level-1-260C-UNLIM
ULN2003APWR
ACTIVE
TSSOP
PW
16
CU NIPDAU
Level-1-260C-UNLIM
ULN2003APWRE4
ACTIVE
TSSOP
PW
16
CU NIPDAU
Level-1-260C-UNLIM
ULN2004AD
ACTIVE
SOIC
16
40
CU NIPDAU
Level-1-260C-UNLIM
ULN2004ADE4
ACTIVE
SOIC
16
40
CU NIPDAU
Level-1-260C-UNLIM
ULN2004ADR
ACTIVE
SOIC
16
CU NIPDAU
Level-1-260C-UNLIM
ULN2004ADRE4
ACTIVE
SOIC
16
CU NIPDAU
Level-1-260C-UNLIM
ULN2004AN
ACTIVE
PDIP
16
25
Pb-Free
(RoHS)
CU NIPDAU
ULN2004ANE4
ACTIVE
PDIP
16
25
Pb-Free
(RoHS)
CU NIPDAU
Addendum-Page 1
Call TI
27-Feb-2006
Orderable Device
Status (1)
Package
Type
Package
Drawing
ULN2004ANSR
ACTIVE
SO
NS
16
CU NIPDAU
Level-1-260C-UNLIM
ULN2004ANSRG4
ACTIVE
SO
NS
16
CU NIPDAU
Level-1-260C-UNLIM
ULQ2003AD
ACTIVE
SOIC
16
40
Pb-Free
(RoHS)
CU NIPDAU
Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
ULQ2003ADR
ACTIVE
SOIC
16
2500
Pb-Free
(RoHS)
CU NIPDAU
Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
ULQ2003AN
ACTIVE
PDIP
16
25
Pb-Free
(RoHS)
CU NIPDAU
ULQ2004AD
ACTIVE
SOIC
16
40
Pb-Free
(RoHS)
CU NIPDAU
Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
ULQ2004ADR
ACTIVE
SOIC
16
2500
Pb-Free
(RoHS)
CU NIPDAU
Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
ULQ2004AN
ACTIVE
PDIP
16
25
Pb-Free
(RoHS)
CU NIPDAU
Lead/Ball Finish
(1)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
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incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
MECHANICAL DATA
MTSS001C JANUARY 1995 REVISED FEBRUARY 1999
PW (R-PDSO-G**)
14 PINS SHOWN
0,30
0,19
0,65
14
0,10 M
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
7
0 8
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
14
16
20
24
28
A MAX
3,10
5,10
5,10
6,60
7,90
9,80
A MIN
2,90
4,90
4,90
6,40
7,70
9,60
DIM
4040064/F 01/97
NOTES: A.
B.
C.
D.
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