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LPC1768 66 65 64
LPC1768 66 65 64
1. General description
The LPC1768/66/65/64 are ARM Cortex-M3 based microcontrollers for embedded
applications featuring a high level of integration and low power consumption. The ARM
Cortex-M3 is a next generation core that offers system enhancements such as enhanced
debug features and a higher level of support block integration.
The LPC1768/66/65/64 operate at CPU frequencies of up to 100 MHz. The ARM
Cortex-M3 CPU incorporates a 3-stage pipeline and uses a Harvard architecture with
separate local instruction and data buses as well as a third bus for peripherals. The ARM
Cortex-M3 CPU also includes an internal prefetch unit that supports speculative
branching.
The peripheral complement of the LPC1768/66/65/64 includes up to 512 kB of flash
memory, up to 64 kB of data memory, Ethernet MAC, USB Device/Host/OTG interface,
8-channel general purpose DMA controller, 4 UARTs, 2 CAN channels, 2 SSP controllers,
SPI interface, 3 I2C-bus interfaces, 2-input plus 2-output I2S-bus interface, 8-channel
12-bit ADC, 10-bit DAC, motor control PWM, Quadrature Encoder interface, 4 general
purpose timers, 6-output general purpose PWM, ultra-low power Real-Time Clock (RTC)
with separate battery supply, and up to 70 general purpose I/O pins.
The LPC1768/66/65/64 are pin-compatible to the 100-pin LPC236x ARM7-based
microcontroller series.
2. Features
n ARM Cortex-M3 processor, running at frequencies of up to 100 MHz. A Memory
Protection Unit (MPU) supporting eight regions is included.
n ARM Cortex-M3 built-in Nested Vectored Interrupt Controller (NVIC).
n Up to 512 kB on-chip flash programming memory. Enhanced flash memory accelerator
enables high-speed 100 MHz operation with zero wait states.
n In-System Programming (ISP) and In-Application Programming (IAP) via on-chip
bootloader software.
n On-chip SRAM includes:
u 32/16 kB of SRAM on the CPU with local code/data bus for high-performance CPU
access.
u Two/one 16 kB SRAM blocks with separate access paths for higher throughput.
These SRAM blocks may be used for Ethernet (LPC1768/66/64 only), USB, and
DMA memory, as well as for general purpose CPU instruction and data storage.
LPC1768/66/65/64
NXP Semiconductors
n Eight channel General Purpose DMA controller (GPDMA) on the AHB multilayer
matrix that can be used with the SSP, I2S-bus, UART, the Analog-to-Digital and
Digital-to-Analog converter peripherals, timer match signals, and for
memory-to-memory transfers.
n Multilayer AHB matrix interconnect provides a separate bus for each AHB master. AHB
masters include the CPU, General Purpose DMA controller, Ethernet MAC
(LPC1768/66/64 only), and the USB interface. This interconnect provides
communication with no arbitration delays.
n Split APB bus allows high throughput with few stalls between the CPU and DMA.
n Serial interfaces:
u Ethernet MAC with RMII interface and dedicated DMA controller (LPC1768/66/64
only).
u USB 2.0 full-speed device/Host/OTG controller with dedicated DMA controller and
on-chip PHY for device, Host, and OTG functions. The LPC1764 includes a device
controller only.
u Four UARTs with fractional baud rate generation, internal FIFO, DMA support, and
RS-485 support. One UART has modem control I/O, and one UART has IrDA
support.
u CAN 2.0B controller with two channels.
u SPI controller with synchronous, serial, full duplex communication and
programmable data length.
u Two SSP controllers with FIFO and multi-protocol capabilities. The SSP interfaces
can be used with the GPDMA controller.
u Two I2C-bus interfaces supporting fast mode with a data rate of 400 kbits/s with
multiple address recognition and monitor mode.
u One I2C-bus interface supporting full I2C-bus specification and fast mode plus with
a data rate of 1 Mbit/s with multiple address recognition and monitor mode.
u On the LPC1768/66/65 only, I2S (Inter-IC Sound) interface for digital audio input or
output, with fractional rate control. The I2S-bus interface can be used with the
GPDMA. The I2S-bus interface supports 3-wire and 4-wire data transmit and
receive as well as master clock input/output.
n Other peripherals:
u 70 General Purpose I/O (GPIO) pins with configurable pull-up/down resistors and a
new, configurable open-drain operating mode.
u 12-bit Analog-to-Digital Converter (ADC) with input multiplexing among eight pins,
conversion rates up to 1 MHz, and multiple result registers. The 12-bit ADC can be
used with the GPDMA controller.
u 10-bit Digital-to-Analog Converter (DAC) with dedicated conversion timer and DMA
support (LPC1768/66/65 only).
u Four general purpose timers/counters, with a total of eight capture inputs and ten
compare outputs. Each timer block has an external count input and DMA support.
u One motor control PWM with support for three-phase motor control.
u Quadrature encoder interface that can monitor one external quadrature encoder.
u One standard PWM/timer block with external count input.
u RTC with a separate power domain and dedicated RTC oscillator. The RTC block
includes 64 bytes of battery-powered backup registers.
u Watchdog Timer (WDT) resets the microcontroller within a reasonable amount of
time if it enters an erroneous state.
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n
n
n
n
n
n
n
n
n
n
n
n
n
n
n
n
n
n
3. Applications
n
n
n
n
n
n
eMetering
Lighting
Industrial networking
Alarm systems
White goods
Motor control
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4. Ordering information
Table 1.
Ordering information
Type number
Package
Name
Description
Version
LPC1768FBD100
LQFP100
plastic low profile quad flat package; 100 leads; body 14 14 1.4 mm
SOT407-1
LPC1766FBD100
LQFP100
plastic low profile quad flat package; 100 leads; body 14 14 1.4 mm
SOT407-1
LPC1765FBD100
LQFP100
plastic low profile quad flat package; 100 leads; body 14 14 1.4 mm
SOT407-1
LPC1764FBD100
LQFP100
plastic low profile quad flat package; 100 leads; body 14 14 1.4 mm
SOT407-1
Ordering options
Type number
Flash
Total
SRAM
Ethernet
USB
CAN
I2S
DAC
Package
Sampling
LPC1768FBD100
512 kB
64 kB
yes
Device/
Host/OTG
yes
yes
100 pins
Q2 2009
LPC1766FBD100
256 kB
64 kB
yes
Device/
Host/OTG
yes
yes
100 pins
Q1 2009
LPC1765FBD100
256 kB
64 kB
no
Device/
Host/OTG
yes
yes
100 pins
Q1 2009
LPC1764FBD100
128 kB
32 kB
yes
Device
only
no
no
100 pins
Q1 2009
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5. Block diagram
JTAG
interface
EMULATION
TRACE MODULE
debug
port
RMII pins
LPC1768/66/65/64
TEST/DEBUG
INTERFACE
I-code
bus
MPU
ARM
CORTEX-M3
D-code
bus
DMA
CONTROLLER
system
bus
USB PHY
CLOCK
GENERATION,
POWER CONTROL,
SYSTEM
FUNCTIONS
USB HOST/
DEVICE/OTG
CONTROLLER
WITH DMA(3)
ETHERNET
CONTROLLER
WITH DMA(2)
master
XTAL1
XTAL2
RESET
USB pins
master
CLKOUT
clocks and
controls
master
slave
ROM
slave
MULTILAYER AHB MATRIX
SRAM 32/64 kB
P0 to
P4
slave
HIGH-SPEED
GPIO
SCK1
SSEL1
MISO1
MOSI1
RXD0/TXD0
8 UART1
slave
FLASH
ACCELERATOR
FLASH
512/256/128 kB
SCK0
SSEL0
MISO0
MOSI0
SSP0
RXD2/3
TXD2/3
UART2/3
I2S(1)
3 I2SRX
3 I2STX
TX_MCLK
RX_MCLK
SPI0
I2C2
SCL2
SDA2
TIMER 0/1
RI TIMER
WDT
TIMER2/3
PWM1
EXTERNAL INTERRUPTS
12-bit ADC
SYSTEM CONTROL
PIN CONNECT
CAN1/2
I2C0/1
2 CAP0/1
PWM1[7:0]
PCAP1[1:0]
AD0[7:0]
RTCX2
AHB TO
APB
BRIDGE 1
UART0/1
SCK/SSEL
MOSI/MISO
2 MAT0/1
RTCX1
AHB TO
APB
BRIDGE 0
slave
SSP1
RD1/2
TD1/2
SCL0/1
SDA0/1
P0, P2
slave
4 MAT2
2 MAT3
2 CAP2
2 CAP3
EINT[3:0]
MC0A/B
MC1A/B
MC2A/B
MCFB1/2
MCABORT
VBAT
AOUT
RTC
PHA, PHB
INDEX
QUADRATURE ENCODER
BACKUP REGISTERS
(1)LPC1768/66/65 only
(2)LPC1768/66/64 only
(3)LPC1764 USB device only
002aad944
Fig 1.
Block diagram
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6. Pinning information
76
100
6.1 Pinning
75
LPC176xFBD100
Fig 2.
50
51
26
25
002aad945
Pin description
Symbol
Pin
P0[0] to P0[31]
P0[0]/RD1/TXD3/
SDA1
P0[1]/TD1/RXD3/
SCL1
46[1]
47[1]
P0[2]/TXD0/AD0[7] 98[2]
P0[3]/RXD0/AD0[6] 99[2]
P0[4]/
I2SRX_CLK/
RD2/CAP2[0]
81[1]
Type
Description
I/O
Port 0: Port 0 is a 32-bit I/O port with individual direction controls for each bit. The
operation of port 0 pins depends upon the pin function selected via the pin connect
block. Pins 12, 13, 14, and 31 of this port are not available.
I/O
I/O
SDA1 I2C1 data input/output (this is not an I2C-bus compliant open-drain pin).
I/O
I/O
SCL1 I2C1 clock input/output (this is not an I2C-bus compliant open-drain pin).
I/O
I/O
I/O
I/O
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Table 3.
Symbol
Pin
Type
Description
P0[5]/
I2SRX_WS/
TD2/CAP2[1]
80[1]
I/O
I/O
I2SRX_WS Receive Word Select. It is driven by the master and received by the
slave. Corresponds to the signal WS in the I2S-bus specification. (LPC1768/66/65
only).
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I2STX_WS Transmit Word Select. It is driven by the master and received by the
slave. Corresponds to the signal WS in the I2S-bus specification. (LPC1768/66/65
only).
I/O
P0[6]/
I2SRX_SDA/
SSEL1/MAT2[0]
P0[7]/
I2STX_CLK/
SCK1/MAT2[1]
P0[8]/
I2STX_WS/
MISO1/MAT2[2]
P0[9]/
I2STX_SDA/
MOSI1/MAT2[3]
P0[10]/TXD2/
SDA2/MAT3[0]
P0[11]/RXD2/
SCL2/MAT3[1]
P0[15]/TXD1/
SCK0/SCK
79[1]
78[1]
77[1]
76[1]
48[1]
49[1]
62[1]
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
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Table 3.
Symbol
Pin
Type
Description
P0[16]/RXD1/
SSEL0/SSEL
63[1]
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
SDA1 I2C1 data input/output (this is not an I2C-bus compliant open-drain pin).
P0[17]/CTS1/
MISO0/MISO
P0[18]/DCD1/
MOSI0/MOSI
P0[19]/DSR1/
SDA1
61[1]
60[1]
59[1]
P0[20]/DTR1/SCL1 58[1]
P0[21]/RI1/RD1
P0[22]/RTS1/TD1
57[1]
56[1]
P0[23]/AD0[0]/
I2SRX_CLK/
CAP3[0]
9[2]
P0[24]/AD0[1]/
I2SRX_WS/
CAP3[1]
8[2]
P0[25]/AD0[2]/
I2SRX_SDA/
TXD3
7[2]
I/O
I/O
SCL1 I2C1 clock input/output (this is not an I2C-bus compliant open-drain pin).
I/O
I/O
I/O
I/O
I/O
I/O
I2SRX_WS Receive Word Select. It is driven by the master and received by the
slave. Corresponds to the signal WS in the I2S-bus specification. (LPC1768/66/65
only).
I/O
I/O
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Table 3.
Symbol
Pin
Type
Description
P0[26]/AD0[3]/
AOUT/RXD3
6[3]
I/O
I/O
I/O
I/O
USB_SDA USB port I2C serial data (OTG transceiver, LPC1768/66/65 only).
(LPC1768/66/65 only).
I/O
I/O
I/O
USB_SCL USB port I2C serial clock (OTG transceiver, LPC1768/66/65 only).
P0[27]/SDA0/
USB_SDA
P0[28]/SCL0/
USB_SCL
P0[29]/USB_D+
P0[30]/USB_D
25[4]
24[4]
29[5]
30[5]
P1[0] to P1[31]
P1[0]/
ENET_TXD0
95[1]
P1[1]/
ENET_TXD1
94[1]
P1[4]/
ENET_TX_EN
93[1]
P1[8]/
ENET_CRS
92[1]
P1[9]/
ENET_RXD0
91[1]
P1[10]/
ENET_RXD1
90[1]
P1[14]/
ENET_RX_ER
89[1]
P1[15]/
ENET_REF_CLK
88[1]
P1[16]/
ENET_MDC
87[1]
P1[17]/
ENET_MDIO
86[1]
I/O
I/O
I/O
I/O
I/O
Port 1: Port 1 is a 32-bit I/O port with individual direction controls for each bit. The
operation of port 1 pins depends upon the pin function selected via the pin connect
block. Pins 2, 3, 5, 6, 7, 11, 12, and 13 of this port are not available.
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
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Table 3.
Symbol
Pin
Type
Description
P1[18]/
USB_UP_LED/
PWM1[1]/
CAP1[0]
32[1]
I/O
I/O
USB_PPWR Port Power enable signal for USB port (LPC1768/66/65 only).
I/O
I/O
P1[19]/MC0A/
USB_PPWR
CAP1[1]
33[1]
P1[20]/MCFB0/
PWM1[2]/SCK0
34[1]
P1[21]/MCABORT/
PWM1[3]/
SSEL0
35[1]
P1[22]/MC0B/
USB_PWRD/
MAT1[0]
36[1]
P1[23]/MCFB1/
PWM1[4]/MISO0
37[1]
P1[24]/MCFB2/
PWM1[5]/MOSI0
P1[25]/MC1A/
MAT1[1]
P1[26]/MC1B/
PWM1[6]/CAP0[0]
38[1]
39[1]
40[1]
I/O
I/O
I/O
USB_PWRD Power Status for USB port (host power switch, LPC1768/66/65
only).
I/O
I/O
I/O
I/O
I/O
I/O
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Table 3.
Symbol
Pin
Type
Description
P1[27]/CLKOUT
/USB_OVRCR/
CAP0[1]
43[1]
I/O
P1[28]/MC2A
1[0]/
MAT0[0]
44[1]
P1[29]/MC2B/
PCAP1[1]/
MAT0[1]
45[1]
P1[30]/VBUS/
AD0[4]
21[2]
I/O
I/O
I/O
P1[31]/SCK1/
AD0[5]
20[2]
P2[0] to P2[31]
P2[0]/PWM1[1]/
TXD1
75[1]
P2[1]/PWM1[2]/
RXD1
74[1]
P2[2]/PWM1[3]/
CTS1/
TRACEDATA[3]
P2[3]/PWM1[4]/
DCD1/
TRACEDATA[2]
P2[4]/PWM1[5]/
DSR1/
TRACEDATA[1]
73[1]
70[1]
69[1]
I/O
I/O
I/O
Port 2: Port 2 is a 32-bit I/O port with individual direction controls for each bit. The
operation of port 2 pins depends upon the pin function selected via the pin connect
block. Pins 14 through 31 of this port are not available.
I/O
I/O
I/O
I/O
I/O
LPC1768_66_65_64_2
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Table 3.
Symbol
Pin
Type
Description
P2[5]/PWM1[6]/
DTR1/
TRACEDATA[0]
68[1]
I/O
P2[6]/PCAP1[0]/
RI1/TRACECLK
67[1]
I/O
I/O
P2[7]/RD2/
RTS1
66[1]
P2[8]/TD2/
TXD2
65[1]
P2[9]/
USB_CONNECT/
RXD2
64[1]
P2[10]/EINT0/NMI
53[6]
I/O
I/O
I/O
I
P2[11]/EINT1/
I2STX_CLK
P2[12]/EINT2/
I2STX_WS
P2[13]/EINT3/
I2STX_SDA
52[6]
51[6]
50[6]
P3[0] to P3[31]
P3[25]/MAT0[0]/
PWM1[2]
27[1]
I/O
I/O
I/O
I/O
I2STX_WS Transmit Word Select. It is driven by the master and received by the
slave. Corresponds to the signal WS in the I2S-bus specification. (LPC1768/66/65
only).
I/O
I/O
I/O
Port 3: Port 3 is a 32-bit I/O port with individual direction controls for each bit. The
operation of port 3 pins depends upon the pin function selected via the pin connect
block. Pins 0 through 24, and 27 through 31 of this port are not available.
I/O
LPC1768_66_65_64_2
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Table 3.
Symbol
Pin
Type
Description
P3[26]/STCLK/
MAT0[1]/PWM1[3]
26[1]
I/O
I/O
Port 4: Port 4 is a 32-bit I/O port with individual direction controls for each bit. The
operation of port 4 pins depends upon the pin function selected via the pin connect
block. Pins 0 through 27, 30, and 31 of this port are not available.
P4[0] to P4[31]
P4[28]/RX_MCLK/
MAT2[0]/TXD3
P4[29]/TX_MCLK/
MAT2[1]/RXD3
TDO/SWO
82[1]
85[1]
1[1]
I/O
I/O
TDI
2[1]
TMS/SWDIO
3[1]
I/O
TRST
4[1]
TCK/SWDCLK
5[1]
RTCK
100[1]
I/O
RSTOUT
14
RESET
17[7]
External reset input: A LOW on this pin resets the device, causing I/O ports and
peripherals to take on their default states, and processor execution to begin at
address 0. TTL with hysteresis, 5 V tolerant.
XTAL1
22[8]
XTAL2
23[8]
RTCX1
16[8]
RTCX2
18[8]
VSS
31, 41,
55, 72,
97, 83[8]
ground: 0 V reference.
VSSA
11[8]
analog ground: 0 V reference. This should nominally be the same voltage as VSS,
but should be isolated to minimize noise and error.
VDD(3V3)
28, 54,
71, 96[8]
3.3 V supply voltage: This is the power supply voltage for the I/O ports.
VDD(REG)(3V3)
42, 84[8]
3.3 V voltage regulator supply voltage: This is the supply voltage for the on-chip
voltage regulator only.
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Table 3.
Symbol
Pin
Type
Description
VDDA
10[8]
analog 3.3 V pad supply voltage: This should be nominally the same voltage as
VDD(3V3) but should be isolated to minimize noise and error. This voltage is used to
power the ADC and DAC.
VREFP
12[8]
ADC positive reference voltage: This should be nominally the same voltage as
VDDA but should be isolated to minimize noise and error. Level on this pin is used
as a reference for ADC and DAC.
VREFN
15
ADC negative reference voltage: This should be nominally the same voltage as
VSS but should be isolated to minimize noise and error. Level on this pin is used as
a reference for ADC and DAC.
VBAT
19[8]
RTC pin power supply: 3.3 V on this pin supplies the power to the RTC
peripheral.
n.c.
13
not connected
[1]
5 V tolerant pad providing digital I/O functions with TTL levels and hysteresis.
[2]
5 V tolerant pad providing digital I/O functions (with TTL levels and hysteresis) and analog input. When configured as a ADC input,
digital section of the pad is disabled.
[3]
5 V tolerant pad providing digital I/O with TTL levels and hysteresis and analog output function. When configured as the DAC output,
digital section of the pad is disabled.
[4]
Open-drain 5 V tolerant digital I/O pad, compatible with I2C-bus 400 kHz specification. This pad requires an external pull-up to provide
output functionality. When power is switched off, this pin connected to the I2C-bus is floating and does not disturb the I2C lines.
Open-drain configuration applies to all functions on this pin.
[5]
Pad provides digital I/O and USB functions. It is designed in accordance with the USB specification, revision 2.0 (Full-speed and
Low-speed mode only).
[6]
5 V tolerant pad with 5 ns glitch filter providing digital I/O functions with TTL levels and hysteresis.
[7]
5 V tolerant pad with 20 ns glitch filter providing digital I/O function with TTL levels and hysteresis.
[8]
7. Functional description
7.1 Architectural overview
The ARM Cortex-M3 includes three AHB-Lite buses: the system bus, the I-code bus, and
the D-code bus (see Figure 1). The I-code and D-code core buses are faster than the
system bus and are used similarly to TCM interfaces: one bus dedicated for instruction
fetch (I-code) and one bus for data access (D-code). The use of two core buses allows for
simultaneous operations if concurrent operations target different devices.
The LPC1768/66/65/64 use a multi-layer AHB matrix to connect the ARM Cortex-M3
buses and other bus masters to peripherals in a flexible manner that optimizes
performance by allowing peripherals that are on different slaves ports of the matrix to be
accessed simultaneously by different bus masters.
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Pipeline techniques are employed so that all parts of the processing and memory systems
can operate continuously. Typically, while one instruction is being executed, its successor
is being decoded, and a third instruction is being fetched from memory.
The ARM Cortex-M3 processor is described in detail in the Cortex-M3 Technical
Reference Manual that can be found on official ARM website.
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0x400F C000
31
4 GB
system control
reserved
30 - 16 not used
0x400C 0000
15
QEI
0x400B 8000
14
0x400B 4000
13
not used
0x400B 0000
0x400A C000
11
not used
AHB peripherals
0x400A 8000
10
I2S(1)
reserved
0x400A 4000
not used
0x400A 0000
I2C2
0x4009 C000
UART3
0x4009 8000
UART2
0x4009 4000
Timer 3
0x4009 0000
Timer 2
0x4008 C000
DAC(1)
0x4008 8000
SSP0
reserved
0x5020 0000
0x5000 0000
reserved
APB1 peripherals
APB0 peripherals
0x4008 0000
reserved
GPDMA controller
Ethernet controller(2)
I-code/D-code
memory space
16 of 72
+ 256 bytes
0x4006 0000
0x4005 C000
0x4004 C000
0x4004 4000
16
CAN common
0x4004 0000
0x200A 0000
15
CAN AF registers
0x4003 C000
0x2009 C000
14
CAN AF RAM
0x4003 8000
0x2008 4000
13
ADC
0x4003 4000
0x2000 4000
12
SSP1
0x4003 0000
0x2007 C000
11
pin connect
0x4002 C000
10
GPIO interrupts
0x4002 8000
0x4002 4000
0x1FFF 2000
SPI
0x4002 0000
0x1FFF 0000
not used
0x4001 C000
0x1000 8000
PWM1
0x4001 8000
0x1000 4000
not used
0x4001 4000
UART1
0x4001 0000
UART0
0x4000 C000
TIMER1
0x4000 8000
1
0
TIMER0
0x4000 4000
WDT
0x4000 0000
0x1000 0000
0x0008 0000
0x4008 0000
0x4004 8000
reserved
512 kB on-chip flash (LPC1768)
0x5000 0000
0x0004 0000
0x0002 0000
0x0000 0000
002aad946
LPC1768/66/65/64
0x5000 4000
reserved
22 - 19 not used
0x5000 8000
CAN1
reserved
8 kB boot ROM
I2C1
0x5000 C000
17
0x2200 0000
16 kB AHB SRAM
23
0x5001 0000
CAN2
reserved
31 - 24 not used
0x5020 0000
18
reserved
APB0 peripherals
0x4000 0000
0x2400 0000
0.5 GB
Fig 3.
0x4010 0000
reserved
(1)LPC1768/66/65 only
(2)LPC1768/66/64 only
0x0000 0000
USB controller
0x4200 0000
GPIO
0x0000 0100
0x4400 0000
peripheral bit band alias addressing
1 - 0 reserved
0x4008 0000
AHB peripherals
0xE010 0000
0x400B C000
1 GB
NXP Semiconductors
LPC1768_66_65_64_2
APB1 peripherals
0x4010 0000
LPC1768/66/65/64
NXP Semiconductors
7.7.1 Features
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7.9.1 Features
Scatter or gather DMA is supported through the use of linked lists. This means that
the source and destination areas do not have to occupy contiguous areas of memory.
One AHB bus master for transferring data. The interface transfers data when a DMA
request goes active.
Raw interrupt status. The DMA error and DMA count raw interrupt status can be read
prior to masking.
GPIO registers are a dedicated AHB peripheral and are accessed through the AHB
multilayer bus so that the fastest possible I/O timing can be achieved.
Mask registers allow treating sets of port bits as a group, leaving other bits
unchanged.
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Additionally, any pin on PORT0 and PORT2 (total of 42 pins) providing a digital function
can be programmed to generate an interrupt on a rising edge, a falling edge, or both. The
edge detection is asynchronous, so it may operate when clocks are not present such as
during Power-down mode. Each enabled interrupt can be used to wake up the chip from
Power-down mode.
7.10.1 Features
Bit level set and clear registers allow a single instruction to set or clear any number of
bits in one port.
7.11.1 Features
Memory management:
Independent transmit and receive buffers memory mapped to shared SRAM.
DMA managers with scatter/gather DMA and arrays of frame descriptors.
Memory traffic optimized by buffering and pre-fetching.
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Physical interface:
Attachment of external PHY chip through standard RMII interface.
PHY register access is available via the MIIM interface.
Features
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Supports DMA transfers with all on-chip SRAM blocks on all non-control endpoints.
Allows dynamic switching between CPU-controlled slave and DMA modes.
Double buffer implementation for Bulk and Isochronous endpoints.
7.12.2 USB host controller (LPC1768/66/65 only)
The host controller enables full- and low-speed data exchange with USB devices attached
to the bus. It consists of a register interface, a serial interface engine, and a DMA
controller. The register interface complies with the OHCI specification.
7.12.2.1
Features
OHCI compliant.
One downstream port.
Supports port power switching.
7.12.3 USB OTG controller (LPC1768/66/65 only)
USB OTG is a supplement to the USB 2.0 specification that augments the capability of
existing mobile devices and USB peripherals by adding host functionality for connection to
USB peripherals.
The OTG Controller integrates the host controller, device controller, and a master-only
I2C-bus interface to implement OTG dual-role device functionality. The dedicated I2C-bus
interface controls an external OTG transceiver.
7.12.3.1
Features
Fully compliant with On-The-Go supplement to the USB 2.0 Specification, Revision
1.0a.
Supports any OTG transceiver compliant with the OTG Transceiver Specification
(CEA-2011), Rev. 1.0.
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7.13.1 Features
7.14.1 Features
7.15.1 Features
10-bit DAC
Resistor string architecture
Buffered output
Power-down mode
Selectable output drive
Dedicated conversion timer
DMA support
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7.16 UARTs
The LPC1768/66/65/64 each contain four UARTs. In addition to standard transmit and
receive data lines, UART1 also provides a full modem control handshake interface.
Support for RS-485/9-bit mode allows both software address detection and automatic
address detection using 9-bit mode.
The UARTs include a fractional baud rate generator. Standard baud rates such as
115200 Bd can be achieved with any crystal frequency above 2 MHz.
7.16.1 Features
Fractional divider for baud rate control, auto baud capabilities and FIFO control
mechanism that enables software flow control implementation.
UART1 equipped with standard modem interface signals. This module also provides
full support for hardware flow control (auto-CTS/RTS).
7.17.1 Features
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7.18.1 Features
Compatible with Motorola SPI, 4-wire Texas Instruments SSI, and National
Semiconductor Microwire buses
7.19.1 Features
I2C0 is a standard I2C compliant bus interface with open-drain pins. I2C0 also
supports Fast mode plus with bit rates up to 1 Mbit/s.
I2C1 and I2C2 use standard I/O pins with bit rates of up to 400 kbit/s (Fast I2C-bus).
Easy to configure as master, slave, or master/slave.
Programmable clocks allow versatile rate control.
Bidirectional data transfer between masters and slaves.
Multi-master bus (no central master).
Arbitration between simultaneously transmitting masters without corruption of serial
data on the bus.
Serial clock synchronization allows devices with different bit rates to communicate via
one serial bus.
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The I2S-bus specification defines a 3-wire serial bus using one data line, one clock line,
and one word select signal. The basic I2S-bus connection has one master, which is
always the master, and one slave. The I2S-bus interface on the LPC1768/66/65 provides a
separate transmit and receive channel, each of which can operate as either a master or a
slave.
7.20.1 Features
The interface has separate input/output channels each of which can operate in master
or slave mode.
Two 8-word FIFO data buffers are provided, one for transmit and one for receive.
Generates interrupt requests when buffer levels cross a programmable boundary.
Two DMA requests, controlled by programmable buffer levels. These are connected to
the GPDMA block.
Controls include reset, stop and mute options separately for I2S-bus input and I2S-bus
output.
7.21.1 Features
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Toggle on match.
Do nothing on match.
7.22.1 Features
One PWM block with Counter or Timer operation (may use the peripheral clock or one
of the capture inputs as the clock source).
Supports single edge controlled and/or double edge controlled PWM outputs. Single
edge controlled PWM outputs all go high at the beginning of each cycle unless the
output is a constant low. Double edge controlled PWM outputs can have either edge
occur at any position within a cycle. This allows for both positive going and negative
going pulses.
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Pulse period and width can be any number of timer counts. This allows complete
flexibility in the trade-off between resolution and repetition rate. All PWM outputs will
occur at the same repetition rate.
Double edge controlled PWM outputs can be programmed to be either positive going
or negative going pulses.
Match register updates are synchronized with pulse outputs to prevent generation of
erroneous pulses. Software must release new match values before they can become
effective.
7.24.1 Features
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7.25.1 Features
7.27.1 Features
The Watchdog Clock (WDCLK) source can be selected from the Internal RC (IRC)
oscillator or the APB peripheral clock. This gives a wide range of potential timing
choices of Watchdog operation under different power reduction conditions. It also
provides the ability to run the WDT from an entirely internal source that is not
dependent on an external crystal and its associated components and wiring for
increased reliability.
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7.28.1 Features
Dedicated power supply pin can be connected to a battery or to the main 3.3 V.
Periodic interrupts can be generated from increments of any field of the time registers.
Backup registers (64 bytes) powered by VBAT.
RTC power supply is isolated from the rest of the chip.
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LPC17xx
usbclk
(48 MHz)
USB PLL
MAIN
OSCILLATOR
USB
CLOCK
DIVIDER
MAIN PLL
pllclk
system
clock
select
(CLKSRCSEL)
INTERNAL
RC
OSCILLATOR
USB BLOCK
CPU
CLOCK
DIVIDER
ARM
CORTEX-M3
ETHERNET
BLOCK
DMA
GPIO
NVIC
WATCHDOG
TIMER
CCLK/8
32 kHz
RTC
OSCILLATOR
PERIPHERAL
CLOCK
GENERATOR
pclkWDT
rtclk = 1Hz
REAL-TIME
CLOCK
CCLK/6
CCLK/4
CCLK/2
APB peripherals
CCLK
002aad947
Fig 4.
7.29.1.1
Internal RC oscillator
The IRC may be used as the clock source for the WDT, and/or as the clock that drives the
PLL and subsequently the CPU. The nominal IRC frequency is 4 MHz. The IRC is
trimmed to 1 % accuracy over the entire voltage and temperature range.
Upon power-up or any chip reset, the LPC1768/66/65/64 use the IRC as the clock source.
Software may later switch to one of the other available clock sources.
7.29.1.2
Main oscillator
The main oscillator can be used as the clock source for the CPU, with or without using the
PLL. The main oscillator also provides the clock source for the dedicated USB PLL.
The main oscillator operates at frequencies of 1 MHz to 25 MHz. This frequency can be
boosted to a higher frequency, up to the maximum CPU operating frequency, by the main
PLL. The clock selected as the PLL input is PLLCLKIN. The ARM processor clock
frequency is referred to as CCLK elsewhere in this document. The frequencies of
PLLCLKIN and CCLK are the same value unless the PLL is active and connected. The
clock frequency for each peripheral can be selected individually and is referred to as
PCLK. Refer to Section 7.29.2 for additional information.
7.29.1.3
RTC oscillator
The RTC oscillator can be used as the clock source for the RTC block, the main PLL,
and/or the CPU.
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whenever any of the aforementioned functions are turned off for any reason. Since the
oscillator and other functions are turned off during Power-down mode, any wake-up of the
processor from Power-down mode makes use of the wake-up Timer.
The Wake-up Timer monitors the crystal oscillator to check whether it is safe to begin
code execution. When power is applied to the chip, or when some event caused the chip
to exit Power-down mode, some time is required for the oscillator to produce a signal of
sufficient amplitude to drive the clock logic. The amount of time depends on many factors,
including the rate of VDD(3V3) ramp (in the case of power on), the type of crystal and its
electrical characteristics (if a quartz crystal is used), as well as any other external circuitry
(e.g., capacitors), and the characteristics of the oscillator itself under the existing ambient
conditions.
Sleep mode
When Sleep mode is entered, the clock to the core is stopped. Resumption from the Sleep
mode does not need any special sequence but re-enabling the clock to the ARM core.
In Sleep mode, execution of instructions is suspended until either a Reset or interrupt
occurs. Peripheral functions continue operation during Sleep mode and may generate
interrupts to cause the processor to resume execution. Sleep mode eliminates dynamic
power used by the processor itself, memory systems and related controllers, and internal
buses.
7.29.6.2
Deep-sleep mode
In Deep-sleep mode, the oscillator is shut down and the chip receives no internal clocks.
The processor state and registers, peripheral registers, and internal SRAM values are
preserved throughout Deep-sleep mode and the logic levels of chip pins remain static.
The output of the IRC is disabled but the IRC is not powered down for a fast wake-up later.
The RTC oscillator is not stopped because the RTC interrupts may be used as the
wake-up source. The PLL is automatically turned off and disconnected. The CCLK and
USB clock dividers automatically get reset to zero.
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The Deep-sleep mode can be terminated and normal operation resumed by either a
Reset or certain specific interrupts that are able to function without clocks. Since all
dynamic operation of the chip is suspended, Deep-sleep mode reduces chip power
consumption to a very low value. Power to the flash memory is left on in Deep-sleep
mode, allowing a very quick wake-up.
On wake-up from Deep-sleep mode, the code execution and peripherals activities will
resume after 4 cycles expire if the IRC was used before entering Deep-sleep mode. If the
main external oscillator was used, the code execution will resume when 4096 cycles
expire. PLL and clock dividers need to be reconfigured accordingly.
7.29.6.3
Power-down mode
Power-down mode does everything that Deep-sleep mode does, but also turns off the
power to the IRC oscillator and the flash memory. This saves more power but requires
waiting for resumption of flash operation before execution of code or data access in the
flash memory can be accomplished.
On the wake-up of Power-down mode, if the IRC was used before entering Power-down
mode, it will take IRC 60 s to start-up. After this 4 IRC cycles will expire before the code
execution can then be resumed if the code was running from SRAM. In the meantime, the
flash wake-up timer then counts 4 MHz IRC clock cycles to make the 100 s flash start-up
time. When it times out, access to the flash will be allowed. Users need to reconfigure the
PLL and clock dividers accordingly.
7.29.6.4
7.29.6.5
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LPC17xx
VDD(3V3)
to I/O pads
to core
VSS
3.3 V REGULATOR
to memories,
peripherals,
oscillators,
PLLs
VDD(REG)(3V3)
VBAT
POWER
SELECTOR
ULTRA-LOW
POWER
REGULATOR
BACKUP REGISTERS
RTCX1
RTCX2
32 kHz
OSCILLATOR
REAL-TIME CLOCK
DAC
VDDA
VREFP
ADC
VREFN
VSSA
ADC POWER DOMAIN
002aad978
Fig 5.
Power distribution
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8. Limiting values
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).[1]
Symbol
Parameter
Conditions
Min
Max
Unit
VDD(3V3)
2.4
3.6
VDD(REG)(3V3)
2.4
3.6
VDDA
0.5
+4.6
Vi(VBAT)
0.5
+4.6
Vi(VREFP)
0.5
+4.6
VIA
on ADC related
pins
0.5
+5.1
VI
input voltage
5 V tolerant I/O
pins; only valid
when the VDD(3V3)
supply voltage is
present
[2]
0.5
+6.0
[2][3]
0.5
VDD(3V3) +
0.5
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Table 4.
Limiting values continued
In accordance with the Absolute Maximum Rating System (IEC 60134).[1]
Symbol
IDD
Parameter
Conditions
supply current
Min
Max
Unit
[4]
100
mA
[4]
100
mA
100
mA
ISS
ground current
Ilatch
(0.5VDD(3V3)) < VI
< (1.5VDD(3V3));
Tj < 125 C
[5]
Tstg
storage temperature
Ptot(pack)
based on package
heat transfer, not
device power
consumption
Vesd
human body
model; all pins
[6]
65
+150
1.5
2000
+2000
[1]
[2]
[3]
[4]
[5]
[6]
Human body model: equivalent to discharging a 100 pF capacitor through a 1.5 k series resistor.
9. Thermal characteristics
9.1 Thermal characteristics
The average chip junction temperature, Tj (C), can be calculated using the following
equation:
T j = T amb + ( P D R th ( j a ) )
(1)
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Table 5.
Thermal characteristics
VDD = 2.4 V to 3.6 V; Tamb = 40 C to +85 C; unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Rth(j-a)
LQFP100 package
<tbd>
C/W
Tj(max)
maximum junction
temperature
150
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Parameter
Conditions
Min
Typ[1]
Max
Unit
VDD(3V3)
2.4
3.3
3.6
VDD(REG)(3V3)
2.4
3.3
3.6
VDDA
2.7
3.3
3.6
Vi(VBAT)
2.1
3.3
3.6
Vi(VREFP)
2.7
3.3
VDDA
[2]
IIH
IOZ
OFF-state output
current
VO = 0 V; VO = VDD(3V3);
on-chip pull-up/down
resistors disabled
VI
input voltage
5.5
VO
output voltage
output active
VDD(3V3)
VIH
HIGH-level input
voltage
2.0
VIL
0.8
Vhys
hysteresis voltage
[3][4][5]
0.4
VDD(3V3)
0.4
VOH
HIGH-level output
voltage
IOH = 4 mA
[6]
VOL
LOW-level output
voltage
IOL = 4 mA
[6]
0.4
IOH
HIGH-level output
current
[6]
mA
IOL
LOW-level output
current
VOL = 0.4 V
[6]
mA
IOHS
[7]
45
mA
IOLS
LOW-level short-circuit
output current
VOL = VDDA
[7]
50
mA
Ipd
pull-down current
VI = 5 V
10
50
150
Ipu
pull-up current
VI = 0 V
15
50
85
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Table 6.
Static characteristics continued
Tamb = 40 C to +85 C unless otherwise specified.
Min
Typ[1]
Max
Unit
CCLK = 10 MHz
<tbd>
mA
<tbd>
mA
sleep mode;
VDD(REG)(3V3) = 3.3 V;
Tamb = 25 C
<tbd>
<tbd>
power-down mode;
VDD(REG)(3V3) = 3.3 V;
Tamb = 25 C
<tbd>
<tbd>
0.8
< 0.8
A
V
Symbol
Parameter
Conditions
IDD(REG)(3V3)
while(1){}
executed from flash; all
peripherals enabled
IBATact
I2C-bus
RTC running;
VDD(REG)(3V3) present
[8]
RTC running;
VDD(REG)(3V3) not present
[8]
VIH
HIGH-level input
voltage
0.7VDD(3V3) -
VIL
0.3VDD(3V3) V
Vhys
hysteresis voltage
VOL
LOW-level output
voltage
IOLS = 3 mA
[6]
ILI
VI = VDD(3V3)
[9]
VI = 5 V
0.5VDD(3V3) -
0.4
10
22
Oscillator pins
Vi(XTAL1)
1.8
Vo(XTAL2)
1.8
Vi(RTCX1)
1.8
Vo(RTCX2)
1.8
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Table 6.
Static characteristics continued
Tamb = 40 C to +85 C unless otherwise specified.
Parameter
Conditions
Min
Typ[1]
Max
Unit
IOZ
OFF-state output
current
10
VBUS
5.25
VDI
differential input
sensitivity voltage
|(D+) (D)|
0.2
VCM
differential common
mode voltage range
0.8
2.5
Vth(rs)se
single-ended receiver
switching threshold
voltage
0.8
2.0
VOL
LOW-level output
voltage for
low-/full-speed
RL of 1.5 k to 3.6 V
0.18
VOH
HIGH-level output
voltage (driven) for
low-/full-speed
RL of 15 k to GND
2.8
3.5
Ctrans
20
pF
ZDRV
36
44.1
Rpu
pull-up resistance
1.1
1.9
Symbol
USB pins
[10]
SoftConnect = ON
[1]
Typical ratings are not guaranteed. The values listed are at room temperature (25 C), nominal supply voltages.
[2]
[3]
[4]
[5]
[6]
[7]
Allowed as long as the current limit does not exceed the maximum current allowed by the device.
[8]
On pin VBAT.
[9]
To VSS.
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X
X
(X)
X
<tbd>
X
X
X
X (X)
Conditions: Tamb = 25 C; active mode entered executing code from flash; core voltage 2.7 V; all
peripherals enabled but not configured to run.
Fig 6.
001aac984
X
X
(X)
X
<tbd>
X
X
X
X (X)
Conditions: Tamb = 25 C; active mode entered executing code from flash; all peripherals enabled
but not configured to run.
Fig 7.
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001aac984
X
X
(X)
X
<tbd>
X
X
X
X (X)
Conditions: active mode entered executing code from flash; core voltage 2.7 V; all peripherals
enabled but not configured to run.
Fig 8.
001aac984
X
X
(X)
X
<tbd>
X
X
X
X (X)
Conditions: active mode entered executing code from flash; Tamb = 25 C; RTC running;
Fig 9.
Table 7.
Typical peripheral current consumption
Core voltage 3.3 V; Tamb = 25 C; all measurements in A; PCLK = CCLK8; all peripherals enabled.
Peripheral
CCLK = 10 MHz
active mode
sleep mode
Timer0
<tbd>
<tbd>
<tbd>
<tbd>
Timer1
<tbd>
<tbd>
<tbd>
<tbd>
Timer2
<tbd>
<tbd>
<tbd>
<tbd>
Timer3
<tbd>
<tbd>
<tbd>
<tbd>
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Table 7.
Typical peripheral current consumption continued
Core voltage 3.3 V; Tamb = 25 C; all measurements in A; PCLK = CCLK8; all peripherals enabled.
Peripheral
CCLK = 10 MHz
active mode
sleep mode
RIT
<tbd>
<tbd>
<tbd>
<tbd>
UART0
<tbd>
<tbd>
<tbd>
<tbd>
UART1
<tbd>
<tbd>
<tbd>
<tbd>
UART2
<tbd>
<tbd>
<tbd>
<tbd>
UART3
<tbd>
<tbd>
<tbd>
<tbd>
PWM1
<tbd>
<tbd>
<tbd>
<tbd>
<tbd>
<tbd>
<tbd>
<tbd>
Quadrature encoder
<tbd>
<tbd>
<tbd>
<tbd>
I2C0-bus
<tbd>
<tbd>
<tbd>
<tbd>
I2C1-bus
<tbd>
<tbd>
<tbd>
<tbd>
I2C2-bus
<tbd>
<tbd>
<tbd>
<tbd>
<tbd>
<tbd>
<tbd>
SPI
<tbd>
<tbd>
<tbd>
<tbd>
SSP0
<tbd>
<tbd>
<tbd>
<tbd>
SSP1
<tbd>
<tbd>
<tbd>
<tbd>
CAN1
<tbd>
<tbd>
<tbd>
<tbd>
CAN2
<tbd>
<tbd>
<tbd>
<tbd>
ADC
<tbd>
<tbd>
<tbd>
<tbd>
<tbd>
<tbd>
<tbd>
<tbd>
USB
<tbd>
<tbd>
<tbd>
<tbd>
<tbd>
<tbd>
<tbd>
<tbd>
GPDMA controller
<tbd>
<tbd>
<tbd>
<tbd>
I2S-interface
Table 8.
Typical RTC power consumption
Vi(VBAT) = 3.3 V; Tamb = 25 C; all measurements in A; RTC clock = 1 Hz; VDD(REG)(3V3) not present.
Power modes
IBAT in A
active
sleep
deep-sleep
power-down
deep
power-down
<tbd>
<tbd>
<tbd>
<tbd>
<tbd>
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X
X
(X)
X
<tbd>
X
X
X
X (X)
Fig 10. Typical LOW-level output IOL current versus LOW-level output VOL
001aac984
X
X
(X)
X
<tbd>
X
X
X
X (X)
Fig 11. Typical HIGH-level output IOH current versus HIGH-level output voltage VOH
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001aac984
X
X
(X)
X
<tbd>
X
X
X
X (X)
001aac984
X
X
(X)
X
<tbd>
X
X
X
X (X)
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Parameter
Conditions
Min
Typ
Nendu
endurance
40 C to +85 C
10000
100000
cycles
25 C to +85 C
100000
cycles
10
years
retention time
tret
Max
Unit
Typ[2]
Max
Unit
oscillator frequency
25
MHz
Tcy(clk)
42
1000
ns
tCHCX
Tcy(clk) 0.4
ns
tCLCX
Tcy(clk) 0.4
ns
tCLCH
ns
tCHCL
ns
Symbol
Parameter
fosc
Conditions
[1]
Parameters are valid over operating temperature range unless otherwise specified.
[2]
Typical ratings are not guaranteed. The values listed are at room temperature (25 C), nominal supply voltages.
tCHCL
tCHCX
tCLCH
tCLCX
Tcy(clk)
002aaa907
Fig 14. External clock timing (with an amplitude of at least Vi(RMS) = 200 mV)
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Parameter
Conditions
Min
Typ[2]
Max
Unit
fosc(RC)
<tbd>
<tbd>
<tbd>
MHz
fi(RTC)
<tbd>
<tbd>
<tbd>
MHz
[1]
Parameters are valid over operating temperature range unless otherwise specified.
[2]
Typical ratings are not guaranteed. The values listed are at room temperature (25 C), nominal supply voltages.
001aac984
X
X
(X)
X
<tbd>
X
X
X
X (X)
Conditions: <tbd>.
001aac984
X
X
(X)
X
<tbd>
X
X
X
X (X)
Conditions: <tbd>.
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11.4 I2C-bus
Table 12. Dynamic characteristic: I2C-bus pins
Tamb = 40 C to +85 C; VDD(3V3) over specified ranges.[1]
Symbol
I2C-bus
Parameter
Conditions
Min
Typ[2]
VIH to VIL
20 + 0.1 Cb[3]
Max
Unit
tf(o)
ns
tr
rise time
<tbd>
<tbd>
<tbd>
ns
tf
fall time
<tbd>
<tbd>
<tbd>
ns
tBUF
<tbd>
<tbd>
<tbd>
ns
tLOW
<tbd>
<tbd>
<tbd>
ns
tHD;STA
<tbd>
<tbd>
<tbd>
ns
tHIGH
<tbd>
<tbd>
<tbd>
ns
tSU;DAT
<tbd>
<tbd>
<tbd>
ns
tSU;STA
<tbd>
<tbd>
<tbd>
ns
tSU;STO
<tbd>
<tbd>
<tbd>
ns
[1]
Parameters are valid over operating temperature range unless otherwise specified.
[2]
Typical ratings are not guaranteed. The values listed are at room temperature (25 C), nominal supply voltages.
[3]
SDA
tBUF
tLOW
tr
tf
tHD;STA
SCL
P
S
tHD;STA
S
tHD;STA
tHIGH
tSU;DAT
tSU;STA
tSU;STO
002aad985
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Parameter
Conditions
Min
Typ[2]
Max
Unit
11
ns
SSP interface
tsu(SPI_MISO)
[1]
Parameters are valid over operating temperature range unless otherwise specified.
[2]
Typical ratings are not guaranteed. The values listed are at room temperature (25 C), nominal supply voltages.
shifting edges
SCK
sampling edges
MOSI
MISO
tsu(SPI_MISO)
002aad326
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Parameter
Conditions
Min
Typ
Max
Unit
tr
rise time
10 % to 90 %
8.5
13.8
ns
tf
fall time
10 % to 90 %
7.7
13.7
ns
tFRFM
tr / tf
109
VCRS
1.3
2.0
tFEOPT
160
175
ns
tFDEOP
+5
ns
tJR1
18.5
+18.5
ns
tJR2
see Figure 19
10 % to 90 %
tEOPR1
[1]
tEOPR2
[1]
[1]
+9
ns
40
ns
82
ns
TPERIOD
crossover point
extended
crossover point
differential
data lines
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11.7 SPI
Table 15. Dynamic characteristics of SPI pins
Tamb = 40 C to +85 C.
Symbol
Parameter
Min
Typ
Max
Unit
SPI master
TSPICYC
<tbd>
<tbd>
<tbd>
ns
tSPICLKH
<tbd>
<tbd>
<tbd>
ns
tSPICLKL
<tbd>
<tbd>
<tbd>
ns
tSPIDSU
<tbd>
<tbd>
<tbd>
ns
tSPIDH
<tbd>
<tbd>
<tbd>
ns
tSPIQV
<tbd>
<tbd>
<tbd>
ns
tSPIOH
<tbd>
<tbd>
<tbd>
ns
TSPICYC
<tbd>
<tbd>
<tbd>
ns
tSPICLKH
<tbd>
<tbd>
<tbd>
ns
tSPICLKL
<tbd>
<tbd>
<tbd>
ns
tSPIDSU
<tbd>
<tbd>
<tbd>
ns
tSPIDH
<tbd>
<tbd>
<tbd>
ns
tSPIQV
<tbd>
<tbd>
<tbd>
ns
tSPIOH
<tbd>
<tbd>
<tbd>
ns
SPI slave
TSPICYC
tSPICLKH
tSPICLKL
SCK (CPOL = 0)
SCK (CPOL = 1)
tSPIOH
tSPIQV
MOSI
DATA VALID
DATA VALID
tSPIDSU
MISO
DATA VALID
tSPIDH
DATA VALID
002aad986
Fig 20.
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TSPICYC
tSPICLKH
tSPICLKL
SCK (CPOL = 0)
SCK (CPOL = 1)
tSPIOH
tSPIQV
MOSI
DATA VALID
DATA VALID
tSPIDSU
MISO
DATA VALID
tSPIDH
DATA VALID
002aad987
Fig 21.
TSPICYC
tSPICLKH
tSPICLKL
tSPIDSU
tSPIDH
SCK (CPOL = 0)
SCK (CPOL = 1)
MOSI
DATA VALID
DATA VALID
tSPIOH
tSPIQV
MISO
DATA VALID
DATA VALID
002aad988
Fig 22.
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TSPICYC
tSPICLKH
tSPICLKL
SCK (CPOL = 0)
SCK (CPOL = 1)
tSPIDSU
MOSI
DATA VALID
tSPIDH
DATA VALID
tSPIQV
MISO
DATA VALID
tSPIOH
DATA VALID
002aad989
Fig 23.
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Symbol
Parameter
Conditions
Min
Typ
Max
Unit
on pin ENET_MDC
<tbd>
<tbd>
<tbd>
ns
tv(Q)
<tbd>
<tbd>
ns
tQZ
<tbd>
<tbd>
<tbd>
ns
tsu(D)
<tbd>
<tbd>
ns
th(D)
<tbd>
<tbd>
ns
<tbd>
<tbd>
<tbd>
ns
<tbd>
<tbd>
<tbd>
ns
<tbd>
<tbd>
<tbd>
ns
<tbd>
<tbd>
<tbd>
ns
<tbd>
<tbd>
<tbd>
ns
<tbd>
<tbd>
<tbd>
ns
<tbd>
<tbd>
<tbd>
ns
<tbd>
<tbd>
<tbd>
ns
<tbd>
<tbd>
<tbd>
ns
<tbd>
<tbd>
<tbd>
ns
th(D)
td(QV)
th(Q)
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Tcy(clk)
ENET_MDC
tv(Q)
ENET_MDIO(O)
tQZ
tsu(D)
th(D)
ENET_MDIO(I)
002aad990
Fig 24.
ENET_REF_CLK
td(QV)
th(Q)
ENET_TX_EN
ENET_TXD[1:0]
tsu(D)
th(D)
ENET_CRS
ENET_RXD[1:0]
ENET_RX_ER
002aad991
Fig 25.
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Parameter
Conditions
Min
Typ
Max
Unit
<tbd>
<tbd>
<tbd>
<tbd>
tf
fall time
<tbd>
<tbd>
<tbd>
<tbd>
tr
rise time
<tbd>
<tbd>
<tbd>
<tbd>
tWH
<tbd>
<tbd>
<tbd>
<tbd>
tWL
<tbd>
<tbd>
<tbd>
<tbd>
tv(Q)
on pin I2STX_SDA
<tbd>
<tbd>
<tbd>
<tbd>
on pin I2STX_WS
<tbd>
<tbd>
<tbd>
<tbd>
on pin I2SRX_SDA
<tbd>
<tbd>
<tbd>
<tbd>
on pin I2SRX_WS
<tbd>
<tbd>
<tbd>
<tbd>
on pin I2SRX_SDA
<tbd>
<tbd>
<tbd>
<tbd>
on pin I2SRX_WS
<tbd>
<tbd>
<tbd>
<tbd>
Output
Input
tsu(D)
th(D)
Tcy(clk)
tf
tr
I2STX_CLK
tWH
tWL
I2STX_SDA
tv(Q)
I2STX_WS
tv(Q)
002aad992
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Tcy(clk)
tf
tr
I2SRX_CLK
tWH
tWL
I2SRX_SDA
tsu(D)
th(D)
I2SRX_WS
tsu(D)
tsu(D)
002aae159
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Parameter
VIA
Cia
ED
EL(adj)
Conditions
Min
Typ
Max
Unit
VDDA
<tbd>
pF
[1][2][3]
<tbd>
LSB
integral non-linearity
[1][4]
<tbd>
LSB
offset error
[1][5]
<tbd>
LSB
EG
gain error
[1][6]
<tbd>
ET
absolute error
[1][7]
<tbd>
LSB
[8]
<tbd>
EO
Rvsi
SRin
<tbd>
<tbd>
<tbd>
V/ms
Tcy(ADC)
<tbd>
<tbd>
<tbd>
ns
tADC
<tbd>
<tbd>
<tbd>
ns
[1]
[2]
[3]
The differential linearity error (ED) is the difference between the actual step width and the ideal step width. See Figure 28.
[4]
The integral non-linearity (EL(adj)) is the peak difference between the center of the steps of the actual and the ideal transfer curve after
appropriate adjustment of gain and offset errors. See Figure 28.
[5]
The offset error (EO) is the absolute difference between the straight line which fits the actual curve and the straight line which fits the
ideal curve. See Figure 28.
[6]
The gain error (EG) is the relative difference in percent between the straight line fitting the actual transfer curve after removing offset
error, and the straight line which fits the ideal transfer curve. See Figure 28.
[7]
The absolute error (ET) is the maximum difference between the center of the steps of the actual transfer curve of the non-calibrated ADC
and the ideal transfer curve. See Figure 28.
[8]
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offset
error
EO
gain
error
EG
4095
4094
4093
4092
4091
4090
(2)
7
code
out
(1)
5
(5)
4
(4)
3
(3)
1 LSB
(ideal)
0
1
4090
4091
4092
4093
4094
4095
4096
VIA (LSBideal)
offset error
EO
1 LSB =
VDDA VSSA
4096
002aad948
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LPC17XX
x k
AD0[y]
AD0[y]SAMPLE
x pF
Rvsi
x pF
VEXT
VSS
002aad949
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Parameter
Conditions
Min
Typ
Max
Unit
PSRR
VDDA = 100 mV
<tbd>
<tbd>
<tbd>
dB
VO
output voltage
count = maximum
VDDA k
count = minimum
VSSA + k
ED
LSB
EL(adj)
integral non-linearity
LSB
EO
offset error
LSB
EG
gain error
0.5
ET
absolute error
LSB
CL
load capacitance
100
pF
RO
output resistance
ton
turn-on time
<tbd>
<tbd>
<tbd>
ns
ts
settling time
<tbd>
<tbd>
<tbd>
ns
<tbd>
<tbd>
<tbd>
ns
SR
slew rate
<tbd>
<tbd>
<tbd>
V/ms
<tbd>
<tbd>
<tbd>
nV.s
3 dB bandwidth
<tbd>
<tbd>
<tbd>
kHz
full scale
small change
B3dB
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USB_UP_LED
USB_CONNECT
LPC17xx
SoftConnect switch
R1
1.5 k
VBUS
USB_D+ RS = 33
USB_D
USB-B
connector
RS = 33
VSS
002aad939
VDD(3V3)
R2
LPC17xx
USB_UP_LED
R1
1.5 k
VBUS
USB_D+ RS = 33
USB-B
connector
USB_D RS = 33
VSS
002aad940
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VDD
R1
R2
R3
RSTOUT
R4
RESET_N
VBUS
ADR/PSW
ID
OE_N/INT_N
VDD
SPEED
SUSPEND
LPC17xx
R4
R5
DP
33
DM
33
Mini-AB
connector
ISP1302
R6
VSS
SCL
USB_SCL
SDA
USB_SDA
INT_N
EINTn
USB_D+
USB_D
002aad941
VDD
USB_UP_LED
VSS
USB_D+
33
D+
USB_D
33
LPC17xx
15 k
USB-A
connector
15 k
VDD
VBUS
USB_PWRD
USB_OVRCR
USB_PPWR
FLAGA
ENA
5V
IN
LM3526-L
OUTA
002aad942
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VDD
USB_UP_LED
VDD
USB_CONNECT
LPC17xx
VSS
USB_D+
33
D+
USB_D
33
VBUS
USB-B
connector
VBUS
002aad943
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SOT407-1
y
X
A
51
75
50
76
ZE
e
E HE
A A2
(A 3)
A1
w M
bp
Lp
pin 1 index
100
detail X
26
1
25
ZD
v M A
w M
bp
D
HD
v M B
10 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
D (1)
E (1)
mm
1.6
0.15
0.05
1.45
1.35
0.25
0.27
0.17
0.20
0.09
14.1
13.9
14.1
13.9
0.5
HD
HE
16.25 16.25
15.75 15.75
Lp
0.75
0.45
0.2
0.08
0.08
Z D (1) Z E (1)
1.15
0.85
1.15
0.85
7o
o
0
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT407-1
136E20
MS-026
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
00-02-01
03-02-20
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16. Abbreviations
Table 20.
Abbreviations
Acronym
Description
ADC
Analog-to-Digital Converter
AHB
AMBA
APB
BOD
BrownOut Detection
CAN
DAC
Digital-to-Analog Converter
DCC
DMA
DSP
EOP
End Of Packet
ETM
GPIO
IRC
Internal RC
IrDA
JTAG
MAC
MIIM
OHCI
OTG
On-The-Go
PHY
Physical Layer
PLL
Phase-Locked Loop
PWM
RIT
RMII
SE0
SPI
SSI
SSP
TCM
TTL
Transistor-Transistor Logic
UART
USB
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Revision history
Document ID
Release date
Change notice
Supersedes
LPC1768_66_65_64_2
20090211
LPC1768_66_65_64_1
Modifications:
LPC1768_66_65_64_1
20090115
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Product status[3]
Definition
Development
This document contains data from the objective specification for product development.
Qualification
Production
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
19.1 Definitions
Draft The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
19.2 Disclaimers
General Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
Right to make changes NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
19.3 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
I2C-bus logo is a trademark of NXP B.V.
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21. Contents
1
General description . . . . . . . . . . . . . . . . . . . . . . 1
2
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
3
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
4
Ordering information . . . . . . . . . . . . . . . . . . . . . 4
4.1
Ordering options . . . . . . . . . . . . . . . . . . . . . . . . 4
5
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 5
6
Pinning information . . . . . . . . . . . . . . . . . . . . . . 6
6.1
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
6.2
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 6
7
Functional description . . . . . . . . . . . . . . . . . . 14
7.1
Architectural overview. . . . . . . . . . . . . . . . . . . 14
7.2
ARM Cortex-M3 processor . . . . . . . . . . . . . . . 14
7.3
On-chip flash program memory . . . . . . . . . . . 15
7.4
On-chip SRAM . . . . . . . . . . . . . . . . . . . . . . . . 15
7.5
Memory Protection Unit (MPU). . . . . . . . . . . . 15
7.6
Memory map. . . . . . . . . . . . . . . . . . . . . . . . . . 15
7.7
Nested Vectored Interrupt Controller (NVIC) . 17
7.7.1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
7.7.2
Interrupt sources. . . . . . . . . . . . . . . . . . . . . . . 17
7.8
Pin connect block . . . . . . . . . . . . . . . . . . . . . . 17
7.9
General purpose DMA controller . . . . . . . . . . 17
7.9.1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
7.10
Fast general purpose parallel I/O . . . . . . . . . . 18
7.10.1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
7.11
Ethernet (LPC1768/66/64 only) . . . . . . . . . . . 19
7.11.1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
7.12
USB interface . . . . . . . . . . . . . . . . . . . . . . . . . 20
7.12.1
USB device controller . . . . . . . . . . . . . . . . . . . 20
7.12.1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
7.12.2
USB host controller (LPC1768/66/65 only). . . 21
7.12.2.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
7.12.3
USB OTG controller (LPC1768/66/65 only) . . 21
7.12.3.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
7.13
CAN controller and acceptance filters . . . . . . 21
7.13.1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
7.14
12-bit ADC . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
7.14.1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
7.15
10-bit DAC (LPC1768/66/65 only) . . . . . . . . . 22
7.15.1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
7.16
UARTs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
7.16.1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
7.17
SPI serial I/O controller. . . . . . . . . . . . . . . . . . 23
7.17.1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
7.18
SSP serial I/O controller . . . . . . . . . . . . . . . . . 23
7.18.1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
7.19
I2C-bus serial I/O controllers. . . . . . . . . . . . . . 24
7.19.1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
24
25
25
25
26
26
27
27
27
28
28
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28
29
29
29
29
30
30
30
31
31
31
31
32
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continued >>
LPC1768_66_65_64_2
71 of 72
LPC1768/66/65/64
NXP Semiconductors
10.1
10.2
11
11.1
11.2
11.3
11.4
11.5
11.6
11.7
11.8
11.9
12
13
14
14.1
15
16
17
18
19
19.1
19.2
19.3
20
21
Power consumption . . . . . . . . . . . . . . . . . . . .
Electrical pin characteristics . . . . . . . . . . . . . .
Dynamic characteristics . . . . . . . . . . . . . . . . .
Flash memory. . . . . . . . . . . . . . . . . . . . . . . . .
External clock . . . . . . . . . . . . . . . . . . . . . . . . .
Internal oscillators. . . . . . . . . . . . . . . . . . . . . .
I2C-bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
SSP interface . . . . . . . . . . . . . . . . . . . . . . . . .
USB interface . . . . . . . . . . . . . . . . . . . . . . . . .
SPI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Ethernet (LPC1768/66/64 only) . . . . . . . . . . .
I2S-bus interface (LPC1768/66/65 only) . . . . .
ADC electrical characteristics . . . . . . . . . . . .
DAC electrical characteristics
(LPC1768/66/65 only) . . . . . . . . . . . . . . . . . . . .
Application information. . . . . . . . . . . . . . . . . .
Suggested USB interface solutions . . . . . . . .
Package outline . . . . . . . . . . . . . . . . . . . . . . . .
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . .
Revision history . . . . . . . . . . . . . . . . . . . . . . . .
Legal information. . . . . . . . . . . . . . . . . . . . . . .
Data sheet status . . . . . . . . . . . . . . . . . . . . . .
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . .
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . .
Contact information. . . . . . . . . . . . . . . . . . . . .
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
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48
48
49
50
51
52
53
56
58
60
63
64
64
67
68
69
70
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71
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section Legal information.