Lead Free Cost Reduction

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 Lead
L d Free
F
Cost Reduction
 Direct Cost Drivers
Hi h T  L i t
–High Temp Laminates
Final Finishes
–Final Finishes

3
Indirect Cost Drivers
Increased Scrap Rate
–Increased Scrap Rate
• De-lamination
• Solderability

Pre Baking
–Pre‐Baking
g g
–Storage / Handling
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 S ti  
Section 1
Pb‐free 
bf
Assembly
sse b y
Capable Laminate 5
IPC 4101/99 /124 
from
Isola Group/ Insulectro

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 Current State
Audience Poll……

C  C ll
–Common Callouts
• IS410 / 370HR
• FR4
• RoHS Compliant
• 180ºC Tg
• 340ºC Td
• IPC 4101/126 or /129
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 Current State (cont.)
( )
Audience Poll……
• Effect of Common Callouts
1. Locked in to laminate by brand name
2  Typically Phenolic materials
2. Typically Phenolic
• Moisture absorption up to .45% on 0.028” core
• Less mechanical strength (interlaminate adhesion)
• More prone to de‐lamination during assembly
• Prone to pad cratering on BGA applications

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• Have you experienced delamination during Lead Free
Assembly?

• Yes
• No

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Poll Results

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 Current State (cont.)
( )

3. Non‐Pb Free capable material
3. Non Pb Free capable material
• FR4 is not capable
• RoHS Compliant can include standard FR4
• 180Tg does not guarantee adequate Td

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 Proposed Solution
• Mid‐Grade Pb‐free capable 
laminates
– IPC 4101 / 99 (filled) or /124 (unfilled)
• 150 Tg min.
 T   i
• 325 Td min.

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 Benefits
– 15‐20% Cost Savings on Raw Materials
– Lower Moisture Absorption (0.10%
Lower Moisture Absorption (0 10%‐
0.25%)
– Higher interlaminate adhesion
• Peel strength
• T‐288 >10 minutes
– Higher Copper to Laminate peel strength

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 Results
(using Isola IS400 as example)

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 Results
Test Group Results
Decomposition Temperature
Test 1 of 2 
Method of Determination: TGA
Decomposition Temperature: 331 C
Ramp Rate: 10 C/ min
Test 2 of 2
est o
Method of Determination: TGA
Decomposition Temperature: 334 C
Ramp Rate:
Ramp Rate: 10 C/ min
10 C/ min

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TGA

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 Results
Test Group
Test Group Results
Delta TG
Test 1 of 1
Method of Determination: DSC
TG Scan 1:  150 C
TG Scan 2: 154 C
Delta Tg: 4 C
Ramp Rate:      20 C/min
Analysis Method: Half Height

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DSC – (A)
DSC 

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DSC – (B)

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 Results
Test Group Results
Time to Decomposition at Temperature
Test 1 of 2
Method of Determination: TMA
Time to Decomposition: 35.9 minutes
Isothermal Temperature: 260 C
Test 2 of 2
Method of Determination: TMA
Time to Decomposition: 10.4 minutes
Isothermal Temperature:
Isothermal Temperature: 288 C
288 C

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T 260
T-260

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T 288
T‐288

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 Results
T Group
Test G R l
Results
Weight Loss % by TGA
Test 1 of 1
Percent Weight Loss: 0.2%
Start Temperature: 0º C
Stop Temperature:
Stop Temperature: 0º C
0º C
Comments: Moisture Method
% Weight Loss = 0.1717%

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Moisture Absorption (A)

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 Results
Test Group Results
Peel Strength

Condition: Condition A
Peel Strength Side 1: 11.73 lbs/in
Peel Strength Side 2:
Peel Strength Side 2: 10.95 lbs/in
10.95 lbs/in

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 6 X Reflow
6‐X Reflow
Pb f
Pb‐free Assembly Temperature
bl
– One board, 3 array
– One 4.25 x 9.5L”, Two 4.75 x 9.5L”
– Thickness + 0.0633
– TGA moisture = 0.2534%
– 260° Peak Temperature
p

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27
 Results
Conditioning As Received
Board # 14753-1
Material IS400
Thickness (mil)
( ) 0.063
Conveyor Speed (cm/min) 48
Peak Mean Temp (°C) 259.8
TC Temp Range
TC Temp Range 3.4
Rising time between 150C ‐ 200C 66.67 (sec)
Time above 217 101
Time above 255
Time above 19 69
19.69
Passes to Fail 6x‐Pass
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Coming Soon – FR406HR

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Section 2
Pb Free
Pb‐Free
HASL
Audience Poll
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• Have you ever tried and subsequently abandoned SN100CL?

• Yes
• No
• Never even tried it.

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Poll Results

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 Definition
SN100CL
‐this is a SnCu alloy stabilized with Ni, 
composed of:
• 99.3% Tin
• <0 7% Copper
<0.7% Copper
• 0.05% Nickel
• 60 ppm Germanium
pp

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 Industry 
y
Misconceptions
• Predictions of HASL’s Demise
• Solderability Issues
S ld bili  I
• Short Duration of Usage

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 Benefits
1. Lower Copper Erosion on PCB surface and vias
2. Q i k P
Quick Process
3. Long Shelf Life
4.   Cost
(< 1/14 ENIG)
5. Forgiving
a.) Humidityy
b.) Handling
c.) Temperature
6. Solder Joint Strength

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 Results
( using Florida CirTech HALT example )
Highly Accelerated Life Test

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Benefits – Solder Joint Strength
J g
HALT Test Results

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Benefits –HALT Test Results

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Benefits

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Benefits 

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 HALT Test Results
Lead-Free HASL, with all different solderpastes pooled together, required the most energy
(G-force + thermo-cycling) to break the solder joints.
Since this test takes out the failure effect of the components, we can conclude that lead-free
HASL solderjoints outperform all other surface finishes, including SnPb HASL.

Our thanks go to Tim Murphy of Thomson Lab Services and Florida CirTech for the report
abstract.
For a full report, please contact James Kelch @ jim@saturnelectronics.com

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 Drawbacks
• Not Planar
• Not Ideal for extremely fine pitch applications

• Past Solderability Issues
• HASL and Flow: A Lead-Free Alternative
addresses this in the February ’08 issue of

Request a copy from James Kelch or visit the

Lead Free Resource Center on our website.
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 Drawbacks  cont
Drawbacks, cont.
• Thermal Cycle
– SN100CL requires a Thermal Cycle in addition to 
Thermal Cycles in Assembly

• No Set Industry Standards
– Neither the IPC nor Nihon Superior had developed a 
Thickness Acceptability Criteria when SN100CL was 
introduced Audience Poll
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P lli  Q ti
Polling Question

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• What is your primary Lead Free finish?

• ENIG
• Lead Free HASL
• Immersion Silver
• Immersion Tin
• RoHS Compliant

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Poll Results

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No Standard ‐ Solutions
No Standard 
Trigger Event 
Solderability Issue at Customer
y

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No Standard  Solutions
No Standard ‐
• Goal
– Establish a Set Criteria

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 Thickness Criteria
• Generic Thickness Requirement
q
• Not proper to have only one
– Smaller Pads receive thicker solder deposition
• Solution
• Minimum Alloy Thickness should be        
segregated by Ranges of Pad Size

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Pad
ad S
Size
e ((mils)
s) Min. Thickness
c ess
126 x 131 50 uin

29 x 83 80 uin

17 x 36 100 uin

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 Implementation
• Alloy Control
• Lower copper content of alloy increases solderability
pp y y
• Standard Drossing of solder pot is not enough to 
keep copper content below 0.90%
• Recommend a  1/4 
1/4 ‐‐ 1/3 solder pot dump once weekly 
measurement reaches 0.90%

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 Implementation
• Specific Design Set
Specific Design Set‐Up
Up
– Each Design may require its own specific set‐up
– Adjustments
Adj t t
• Air Knife Pressure
• Retract Speed
• Dwell Time

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 Implementation
• In effect, since the operating window is 
smaller than with SnPB,…….

CONTROL The PROCESS!!!

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 SN100CL 
Study Conclusion
• No Solderability Issues at any customer
– Fab Notes
• Fab notes can specify the use of these coupons
or range of solder thickness standards
– Forcing your supplier to meet these specs will give
you:

C l    h  P
»Control over the Process
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 Conclusion
• By implementing one or both of these 
proposed solutions  you can:
proposed solutions, you can:
– Save up to 30% of your bare board cost
– Increase performance of your products
I   f   f    d
– Standardize your fab notes to remove risk of 
non‐performing products
f i   d t
– Improve your supply base

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• To view the archived version of this presentation, 
please email jim@saturnelectronics.com

• To sign up for our upcoming Lead Free Newsletter, 
please email jay@saturnelectronics.com
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 Thank You!
Saturn Electronics Corporation 
would like to thank our presenters:

 Dave Coppens / Isola
 Terry Staskowicz / Insulectro
 Glenn Sikorcin / Florida CirTech

*Don’t forget to visit the Lead Free Resource Center

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