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E 3
NOTES: 1. This value applies for tp ≤ 0.3 ms, duty cycle ≤ 10%.
2. Derate linearly to 150°C case temperature at the rate of 0.64 W/°C.
3. Derate linearly to 150°C free air temperature at the rate of 16 mW/°C.
4. This rating is based on the capability of the transistor to operate safely in a circuit of: L = 20 mH, IB(on) = -5 mA, RBE = 100 Ω,
VBE(off) = 0, RS = 0.1 Ω, VCC = -20 V.
AUGUST 1978 - REVISED SEPTEMBER 2002
Specifications are subject to change without notice.
1
TIP105, TIP106, TIP107
PNP SILICON POWER DARLINGTONS
thermal characteristics
PARAMETER MIN TYP MAX UNIT
RθJC Junction to case thermal resistance 1.56 °C/W
RθJA Junction to free air thermal resistance 62.5 °C/W
CθC Thermal capacitance of case 0.9 J/°C
AUGUST 1978 - REVISED SEPTEMBER 2002
2 Specifications are subject to change without notice.
TIP105, TIP106, TIP107
PNP SILICON POWER DARLINGTONS
TYPICAL CHARACTERISTICS
10000
-1·5
1000
-1·0
TC = -40°C
VCE = -4 V TC = 25°C
tp = 300 µs, duty cycle < 2% TC = 100°C
100 -0·5
-0·5 -1·0 -10 -0·5 -1·0 -10
IC - Collector Current - A IC - Collector Current - A
Figure 1. Figure 2.
TC = 25°C
TC = 100°C
-2·5
-2·0
-1·5
-1·0
IB = IC / 100
tp = 300 µs, duty cycle < 2%
-0·5
-0·5 -1·0 -10
IC - Collector Current - A
Figure 3.
AUGUST 1978 - REVISED SEPTEMBER 2002
Specifications are subject to change without notice.
3
TIP105, TIP106, TIP107
PNP SILICON POWER DARLINGTONS
MAXIMUM FORWARD-BIAS
SAFE OPERATING AREA
SAS135AA
-100
t p = 100 µs,
d = 0.1 = 10%
t p = 1 ms,
d = 0.1 = 10%
IC - Collector Current - A
t p = 5 ms,
-10 d = 0.1 = 10%
DC Operation
-1·0
TIP105
TIP106
TIP107
-0·1
-1·0 -10 -100 -1000
VCE - Collector-Emitter Voltage - V
Figure 4.
THERMAL INFORMATION
80
60
40
20
0
0 25 50 75 100 125 150
TC - Case Temperature - °C
Figure 5.
AUGUST 1978 - REVISED SEPTEMBER 2002
4 Specifications are subject to change without notice.
TIP105, TIP106, TIP107
PNP SILICON POWER DARLINGTONS
MECHANICAL DATA
TO-220
3-pin plastic flange-mount package
This single-in-line package consists of a circuit mounted on a lead frame and encapsulated within a plastic
compound. The compound will withstand soldering temperature with no deformation, and circuit performance
characteristics will remain stable when operated in high humidity conditions. Leads require no additional
cleaning or processing when used in soldered assembly.
TO220
4,70
4,20
6,6
6,0
15,90
14,55
see Note C
6,1
3,5
14,1
1,70 12,7
0,97 1,07
0,61
1 2 3
2,74 0,64
2,34 0,41
5,28 2,90
4,88 2,40
VERSION 1 VERSION 2
NOTES: A. The centre pin is in electrical contact with the mounting tab. MDXXBE
B. Mounting tab corner profile according to package version.
C. Typical fixing hole centre stand off height according to package version.
Version 1, 18.0 mm. Version 2, 17.6 mm.
AUGUST 1978 - REVISED SEPTEMBER 2002
Specifications are subject to change without notice.
5