Total No. of Questions : 12] ~ ON. 2010 [Total No. of Pages + 4 P1438 764]-223 B.E. (E & TC) ELECTRONIC PRODUCT DESIGN (2003 Course) Time : 3 Hours) {Max. Marks : 100 Instructions to the candidates: 1) Answer 3 questions from Section-I and 3 questions from Section-Il. 2) Answers to the two sections should be written in separate books. 3) Figures to the right indicate full marks. 4) Use of electronic pocket calculator is allowed. wv 5) Assume suitable data, if necessary. SECTION -1 QI) a) Draw a sketch of front panel of a Laboratory CRO and explain how derations ‘are taken care of this (10) ergonomic and aesthetic design consi instrument. Explain the Bathtub curve for reliability indicating all its regions. Also b duced prior to shipment of the product. [8] explain how failures are re OR pling mechanisms and also explain how to [6] For following situations, suggest suitable suppression device OF component/mechanism and also explain how it is effective in suppressing the EMI 12) i) The power transformer in PLC fails due to 1800V transient present on AC mains due to switching off a DC motor. ii) When these is call on cell phone of a person operating PC, the monitor looses synchronization. a multi PCB industrial DC converter housed in 19" rack, the e the driver circuit switches on four 02) 2) Discuss the noise cou minimize these at board level. b) ii) In CPU gets reset whenever on or more electroni¢ relays. P.T.O.90 nis 0) so 8] to 6) or in 12) ent the the our, ignal system on single PCB contains the following sub circui supply for analog section supply for digital circuits. conditioning circuit. controller lisplay circuit for digital circuits and microcontrollers liscuss in detail the recommended PCB design practices for e¢ ad draw sketch indicating’relative placement of these subcircu \r answer for placement. t OR tandard 35 p copper clad laminate, calculate the inductance Jong track on PCB having width 0.6 mm. ite the characteristic impedance for ripline geometry when the PCB laminate thickness is 1.61 id its relative permittivity is 4.2. The width of track is 1 mm4 ickness 70 pm. hat should be the width of track of microstrip geometry | il result in 75Q characteristic impedance when PCB lamin {ckness is 1.6 mm and its relative permittivity 4.2. Asst ckness of track 70 jim, fe the issues to be considered in ensuring signal integril ted circuits? M interface on microcontroller based circuit is suspected tioning due to setup and or hold time violation. Sugge ¥ diagnostic instrument with schematic arrangement to fi93) = Z en Sa Pi ea 'A mixed signal system on single PCB contains the following sub circuits. | 2) Power supply for analog section. | b) Power supply for digital circuits. ©) Signal conditioning circuit. d) ADC. e) Microcontroller. £) LCD display circuit g) Clock for digital circuits and microcontrollers. ‘Then discuss in detail the recommended PCB design practices for each of above and draw sketch indicating’ relative placement of these subcircitt Justify your answer for placement. (16) OR 04) a) Fora standard 35 y copper clad laminate, calculate the inductance of b). Calculate the characteristic impedance for 75 cm long track on PCB having width 0-6 mm. 16 j) Stripline geometry when the PCB laminate thicknes is 1.6 ma wind its relative permittivity is 4.2. The width of track is 1 mm a thickness 70 jm. | ii) What should be the width of track of microstrip geometry th will result in 75Q characteristic impedance when PCB lamina thickness is 1.6 mm and its relative permittivity 4.2. Ass thickness of track 70 ym. i Q5) 2) What are the issues to be considered in ensuring signal integrity high speed circuits? b) SD RAM interface on microcontroller based circuit 1s suspected to) ‘matfunctioning due to setup and or hold time violation. Sugeest type of diagnostic instrument with schematic arrangement (0 find! fault. [3764]-223 aOR 26) a) Explain limitations of following hardware diagnostic instruments for their use in mixed signal, high speed designs where signal. integrity is important. i) Analog oscilloscope Digital storage oscilloscope Logic analyser. Hence establish the need of MSO. [8] b) Explain the use and limitations of ) i) Operating point analysis ii) AC analysis with the help of one circuit. [8] SECTION - I 27) A 8 channel data logger has following components: a) Two RTD and two thermocouples. b) Four level sensors, ©) Signal conditioning circuit. d) ADC. ©) Microcontroller. f) LCD display g) Data memory. Explain in detail software design using top-down approach. Explain function of each software module, also indicate which modules will be coded in Assembly language and which ones in C. Justify your answer. 118] OR 28) a) Explain with the help of real life microprocessor based product how all recommended steps in software development are implemented, [12] b) In finding software faults explain features and limitations of debugger, simulator and emulators. g [6] [3764)-223 -3-9) Explain how environmental tests are related to warrantee of a product. What are different environmental tests performed on an electronic product? How severities of different tests are decided? 16] OR Q10) Explain the need for performing different EMV/EMC tests on an electronic product. Discuss various types of EMI and EMC tests carried out on. them. ‘Also explain how location and application of product will effect the nature and type of lest. [16] Q11) Foran universal counter, draw the block schematic and produce all necessary formatted documents:that will be send to production department for manufacturing, [16] oR Q12) Give reasons: (any 4) (16) a) A good service manual gives Fault tree. bb). Bare board testing is essential for PCBS with high track density. ©) Bill of material is considered to be basic document. 4) Multilayer PCBS must be used for ICS package as PLCC. e) Engineering notebook js a foundation of any engineering work. f) Paper phenolic laminates ate not suitable for industrial products. ooo [3764}-223 as