Dissolved silica affects the thermal oxidation process on the wafer's surface. Colloidal silica can act as an unwanted bridge between conducting surfaces. Ultraviolet radiation and ozone combine to remove colloidal byweight silica. Even minute traces of contamination can cause defects in the resulting semiconductor device.
Dissolved silica affects the thermal oxidation process on the wafer's surface. Colloidal silica can act as an unwanted bridge between conducting surfaces. Ultraviolet radiation and ozone combine to remove colloidal byweight silica. Even minute traces of contamination can cause defects in the resulting semiconductor device.
Dissolved silica affects the thermal oxidation process on the wafer's surface. Colloidal silica can act as an unwanted bridge between conducting surfaces. Ultraviolet radiation and ozone combine to remove colloidal byweight silica. Even minute traces of contamination can cause defects in the resulting semiconductor device.