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Preferred Devices
TO−225AA
CASE 077
STYLE 2
1. Cathode
YWW
2. Anode
C106xxG
3. Gate
Y = Year
WW = Work Week
C106xx = Device Code
xx = B, D, D1, M, M1
G = Pb−Free Package
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
ORDERING INFORMATION
Device Package Shipping†
C106B TO−225AA 500 Units / Box
C106BG TO−225AA 500 Units / Box
(Pb−Free)
C106D TO−225AA 500 Units / Box
C106DG TO−225AA 500 Units / Box
(Pb−Free)
C106D1* TO−225AA 500 Units / Box
C106D1G* TO−225AA 500 Units / Box
(Pb−Free)
C106M TO−225AA 500 Units / Box
C106MG TO−225AA 500 Units / Box
(Pb−Free)
C106M1* TO−225AA 500 Units / Box
C106M1G* TO−225AA 500 Units / Box
(Pb−Free)
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*D1 signifies European equivalent for D suffix and M1 signifies European equivalent for M suffix.
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2
C106 Series
DYNAMIC CHARACTERISTICS
Critical Rate−of−Rise of Off−State Voltage dv/dt − 8.0 − V/ms
(VAK = Rated VDRM, Exponential Waveform, RGK = 1 kW,
TJ = 110°C)
3. Pulse Test: Pulse Width ≤ 2.0 ms, Duty Cycle ≤ 2%.
4. RGK is not included in measurement.
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3
C106 Series
110 10
JUNCTION TEMPERATURE ≈ 110°C
90 8
DC HALF SINE WAVE
80
RESISTIVE OR INDUCTIVE LOAD
70 6 50 TO 400Hz.
60
DC
50 4
HALF SINE WAVE
40 RESISTIVE OR INDUCTIVE LOAD.
30 50 to 400 Hz 2
20
10 0
0 .4 .8 1.2 1.6 2.0 2.4 2.8 3.2 3.6 4.0 0 .4 .8 1.2 1.6 2.0 2.4 2.6 3.2 3.6 4.0
IT(AV) AVERAGE ON‐STATE CURRENT (AMPERES) IT(AV) AVERAGE ON‐STATE CURRENT (AMPERES)
100 1000
IGT, GATE TRIGGER CURRENT ( mA)
10 100
1 10
-40 -25 -10 5 20 35 50 65 80 95 110 -40 -25 -10 5 20 35 50 65 80 95 110
TJ, JUNCTION TEMPERATURE (°C) TJ, JUNCTION TEMPERATURE (°C)
Figure 3. Typical Gate Trigger Current versus Figure 4. Typical Holding Current versus
Junction Temperature Junction Temperature
1.0 1000
0.9
VGT , GATE TRIGGER VOLTAGE (V)
I L , LATCHING CURRENT (m A)
0.8
0.7
0.6 100
0.5
0.4
0.3
0.2 10
-45 -25 -10 5 20 35 50 65 80 95 110 -40 -25 -10 5 20 35 50 65 80 95 110
TJ, JUNCTION TEMPERATURE (°C) TJ, JUNCTION TEMPERATURE (°C)
Figure 5. Typical Gate Trigger Voltage versus Figure 6. Typical Latching Current versus
Junction Temperature Junction Temperature
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4
C106 Series
PACKAGE INTERCHANGEABILITY
The dimensional diagrams below compare the critical dimensions of the ON Semiconductor C-106 package with
competitive devices. It has been demonstrated that the smaller dimensions of the ON Semiconductor package make it
compatible in most lead-mount and chassis-mount applications. The user is advised to compare all critical dimensions for
mounting compatibility.
.400
____
.295
____ .360
.305 .115
____ .095 .127
____ .135
____ ____ DIA
.145
____ .130 .123 .026
____
.105 .115
.155 .019
.148
____
.158 .520
____
.425
____ 5_ TYP .480
.435
1 2 3 .385
____ .315
____
.365 .285
.050
____
.095 .575
____
.655 .420
____
.400
.105
____
.015
____ .105
____ .095
.040 .095 .190
____
.025
.094 BSC .054
____ .170
.045
____
.025
____ .055 .046
.035
.020
____
.026
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C106 Series
PACKAGE DIMENSIONS
TO−225
CASE 77−09
ISSUE Z
−B− NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
U F C Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
Q 3. 077-01 THRU -08 OBSOLETE, NEW STANDARD
M 077-09.
−A−
INCHES MILLIMETERS
1 2 3
DIM MIN MAX MIN MAX
A 0.425 0.435 10.80 11.04
B 0.295 0.305 7.50 7.74
H C 0.095 0.105 2.42 2.66
K D 0.020 0.026 0.51 0.66
F 0.115 0.130 2.93 3.30
G 0.094 BSC 2.39 BSC
H 0.050 0.095 1.27 2.41
J 0.015 0.025 0.39 0.63
V J K 0.575 0.655 14.61 16.63
G R M 5 _ TYP 5 _ TYP
Q 0.148 0.158 3.76 4.01
S 0.25 (0.010) M A M B M R 0.045 0.065 1.15 1.65
S 0.025 0.035 0.64 0.88
D 2 PL U 0.145 0.155 3.69 3.93
V 0.040 --- 1.02 ---
0.25 (0.010) M A M B M
STYLE 2:
PIN 1. CATHODE
2. ANODE
3. GATE
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
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