ASSIGNMENTS#1

FOR VLSI TECHNOLOGY

1) What is the clean room and give the safety requirements for it.

2) Explain the wafer cleaning process?

3) Define the chemical etching process?

4) Define the diffusion modelling and technology?

5) Explain the ion implantation modelling? and which type of technology is

used?

6) Define annealing and impurities?

7) What is oxidation? Explain it?

8) Define the growth of silicondioxide in thin films?

9) Define the growth of silicondioxide in thick films?

10) Define the growth of silicondioxide in thin films?

Assignment 2

1) Define the Photolithography

2) Define the E-beam lithography

3) Define the newer lithography techniques for vlsi

4) Define the newer lithography techniques for ulsi

5)Explain the Mask generation

6)Explain the Chemical Vapour Deposition techniques

7) Explain the CVD techniques for deposition of polysilicon

8) Explain the CVD techniques for deposition of silicon

dioxide

9) Explain the CVD techniques for deposition of silicon

nitride

10) Explain the CVD techniques for deposition of metal

films
 Assignment 3

11) Explain the Epitaxial growth of silicon modelling

and technology

12) Explain the Evaporation and sputtering techniques

13) Explain the Failure mechanisms in metal

interconnects

14) Explain the Multi-level metallisation schemes

15) Explain the High k and low k dielectrics for ULSI

16) Explain the Characterisation of oxide films

17) Explain the Oxidation technologies in VLSI and

ULSI

18) Define the Metal film deposition

 Assignment 4
1) Define the Plasma Thermal Processing

2) Define the Rapid Thermal Processing

3) Define the PECVD

4)Explain the Plasma etching

5)Explain the RIE techniques

6)Explain the RTP techniques for annealing

7)Explain the growth and deposition of various films for

use in ulsi

8)Define the Process integration for NMOS

9)Define the Process integration for CMOS and Bipolar

circuits.

10)Define the Advanced MOS technologies