VPI

With heated molds

Resin Rich With asphalt pressure molding

Strand insulation - dielectric strength

Insulation tape

Negligible difference between systems Mica paper with glass fabric carrier and without resin

Mica paper with reset and

cfass earner
Multiturn coils - No Stator bars - Yes
Yes Yes

Mica paper 'Mth resin and

class earner
Yes

Number of insulation lavers Internal potential grading for optimized field distribution in the main insulation
Corona protection \'lith tapes

Dependinq on rated voltaqe no appreciable difference between systems

Yes

Yes Yes

Yes

Vacuum impregnation with epoxy resin WirKling overhang section of bar

Y - resin pre-loaded in es tapes Winding overhang and slot

Winding overhang and slot

Winding overhang and SIO l

section - same materials

section - different material for coils only to impr ve o

windabilitv

section - same materials

Composition of main insulation mica content glass content resin content

approx. 65% approx.7% approx. 28%

approx. 65% approx. 10% approx.25% Negligible difference between systems

Main insulation dielectric strength Partial Discharges within the insulation (PO levet Advantages

Very low. no micro voids: Pressed - si ghtly higher due PD/single bar lower than 2 nC to lack of vacuum Void-free insulation by removal of air through the vacuum process Penetration of impregnating resin into the insulation to fill the voids Minimization of corona activity Achieve verylow levels of PO Low viscosity resin during heating results in very few retained voids Insulation system results in very high dielectric strength l ow POsystem High temperature capabuty

Very low, no micro voids; PO/single bar lower than 2 nC Void-free insulation by removal of air through the vacuum process Presence of pre-enpreqnated tapes ensures maximum void fill particularly near bare bar Achieve extremely low levels of PD High temperature capability

Hig h temperature capability

Comparison of VPI and Resin-Rich insulat ion systems