Sensor Technologies

Phase Linearity
Describe how well a system preserves the phase relationship between frequency components of the input Phase linearity: f=kf Distortion of signal
Amplitude linearity Phase linearity

Sensor Technology - Terminology

Transducer is a device which transforms energy from one type to another, even if both energy types are in the same domain.
Typical energy domains are mechanical, electrical, chemical, magnetic, optical and thermal.

Transducer can be further divided into Sensors, which monitors a system and Actuators, which impose an action on the system.
Sensors are devices which monitor a parameter of a system, hopefully without disturbing that parameter.

Categorization of Sensor
Classification based on physical phenomena
Mechanical: strain gage, displacement (LVDT), velocity (laser vibrometer), accelerometer, tilt meter, viscometer, pressure, etc. Thermal: thermal couple Optical: camera, infrared sensor Others

Classification based on measuring mechanism

Resistance sensing, capacitance sensing, inductance sensing, piezoelectricity, etc.

Materials capable of converting of one form of energy to another are at the heart of many sensors.
Invention of new materials, e.g., smart materials, would permit the design of new types of sensors.

Paradigm of Sensing System Design

Zhang & Aktan, 2005

Instrumentation Considerations Sensor technology; Sensor data collection topologies; Data communication; Power supply; Data synchronization; Environmental parameters and influence; Remote data analysis.

Measurement
Physical phenomenon Measurement Output

Measurement output: interaction between a sensor and the environment surrounding the sensor compound response of multiple inputs Measurement errors: System errors: imperfect design of the measurement setup and the approximation, can be corrected by calibration Random errors: variations due to uncontrolled variables. Can be reduced by averaging.

Sensors
Definition: a device for sensing a physical variable of a physical system or an environment Classification of Sensors Mechanical quantities: displacement, Strain, rotation velocity, acceleration, pressure, force/torque, twisting, weight, flow Thermal quantities: temperature, heat. Electromagnetic/optical quantities: voltage, current, frequency phase; visual/images, light; magnetism. Chemical quantities: moisture, pH value

Specifications of Sensor
Accuracy: error between the result of a measurement and the true value being measured. Resolution: the smallest increment of measure that a device can make. Sensitivity: the ratio between the change in the output signal to a small change in input physical signal. Slope of the input-output fit line. Repeatability/Precision: the ability of the sensor to output the same value for the same input over a number of trials

Accuracy vs. Resolution

True value

measurement

Accuracy vs. Precision

Precision without accuracy

Accuracy without precision

Precision and accuracy

Specifications of Sensor
Dynamic Range: the ratio of maximum recordable input amplitude to minimum input amplitude, i.e. D.R. = 20 log (Max. Input Ampl./Min. Input Ampl.) dB Linearity: the deviation of the output from a best-fit straight line for a given range of the sensor Transfer Function (Frequency Response): The relationship between physical input signal and electrical output signal, which may constitute a complete description of the sensor characteristics. Bandwidth: the frequency range between the lower and upper cutoff frequencies, within which the sensor transfer function is constant gain or linear. Noise: random fluctuation in the value of input that causes random fluctuation in the output value

Attributes of Sensors
Operating Principle: Embedded technologies that make sensors function, such as electro-optics, electromagnetic, piezoelectricity, active and passive ultraviolet. Dimension of Variables: The number of dimensions of physical variables. Size: The physical volume of sensors. Data Format: The measuring feature of data in time; continuous or discrete/analog or digital. Intelligence: Capabilities of on-board data processing and decisionmaking. Active versus Passive Sensors: Capability of generating vs. just receiving signals. Physical Contact: The way sensors observe the disturbance in environment. Environmental durability: will the sensor robust enough for its operation conditions

Strain Gauges
Foil strain gauge
Least expensive Widely used Not suitable for long distance Electromagnetic Interference Sensitive to moisture & humidity

Vibration wire strain gauge

Determine strain from freq. of AC signal Bulky

Fiber optic gauge

Immune to EM and electrostatic noise Compact size High cost Fragile

Strain Sensing
Resistive Foil Strain Gage
Technology well developed; Low cost High response speed & broad frequency bandwidth A wide assortment of foil strain gages commercially available Subject to electromagnetic (EM) noise, interference, offset drift in signal. Long-term performance of adhesives used for bonding strain gages is questionable

Vibrating wire strain gages can NOT be used for dynamic application because of their low response speed. Optical fiber strain sensor

Strain Sensing
Piezoelectric Strain Sensor
Piezoelectric ceramic-based or Piezoelectric polymer-based (e.g., PVDF) Very high resolution (able to measure nanostrain) Excellent performance in ultrasonic frequency range, very high frequency bandwidth; therefore very popular in ultrasonic applications, such as measuring signals due to surface wave propagation When used for measuring plane strain, can not distinguish the strain in X, Y direction Piezoelectric ceramic is a brittle material (can not measure large deformation)

Courtesy of PCB Piezotronics

Acceleration Sensing
Piezoelectric accelerometer
Nonzero lower cutoff frequency (0.1 1 Hz for 5%) Light, compact size (miniature accelerometer weighing 0.7 g is available) Measurement range up to +/- 500 g Less expensive than capacitive accelerometer Sensitivity typically from 5 100 mv/g Broad frequency bandwidth (typically 0.2 5 kHz) Operating temperature: -70 150 C

Photo courtesy of PCB Piezotronics

Acceleration Sensing
Capacitive accelerometer
Good performance over low frequency range, can measure gravity! Heavier (~ 100 g) and bigger size than piezoelectric accelerometer Measurement range up to +/- 200 g More expensive than piezoelectric accelerometer Sensitivity typically from 10 1000 mV/g Frequency bandwidth typically from 0 to 800 Hz Operating temperature: -65 120 C

Photo courtesy of PCB Piezotronics

Accelerometer

Force Sensing
Metal foil strain-gage based (load cell)
Good in low frequency response High load rating Resolution lower than piezoelectricity-based Rugged, typically big size, heavy weight

Courtesy of Davidson Measurement

Force Sensing
Piezoelectricity based (force sensor)
lower cutoff frequency at 0.01 Hz
can NOT be used for static load measurement

Good in high frequency High resolution Limited operating temperature (can not be used for high temperature applications) Compact size, light

Courtesy of PCB Piezotronics

Displacement Sensing
LVDT (Linear Variable Differential Transformer):
Inductance-based ctromechanical sensor Infinite resolution
limited by external electronics

Limited frequency bandwidth (250 Hz typical for DC-LVDT, 500 Hz for AC-LVDT) No contact between the moving core and coil structure
no friction, no wear, very long operating lifetime

Photo courtesy of MSI

Accuracy limited mostly by linearity

0.1%-1% typical

Models with strokes from mms to 1 m available

Displacement Sensing
Linear Potentiometer
Resolution (infinite), depends on? High frequency bandwidth (> 10 kHz) Fast response speed Photo courtesy of Duncan Electronics Velocity (up to 2.5 m/s) Low cost Finite operating life (2 million cycles) due to contact wear Accuracy: +/- 0.01 % - 3 % FSO Operating temperature: -55 ~ 125 C

Displacement Transducer
Magnetostrictive Linear Displacement Transducer
Exceptional performance for long stroke position measurement up to 3 m Operation is based on accurately measuring the distance from a predetermined point to a magnetic field produced by a movable permanent magnet. Repeatability up to 0.002% of the measurement range. Resolution up to 0.002% of full scale range (FSR) Relatively low frequency bandwidth (-3dB at 100 Hz) Very expensive Operating temperature: 0 70 C

Photo courtesy of Schaevitz

Displacement Sensing
Differential Variable Reluctance Transducers
Relatively short stroke High resolution Non-contact between the measured object and sensor
Type of Construction
Fixing Mode Standard tubular by 8mm diameter No 0.1um -10 to +65 degrees C
Courtesy of Microstrain, Inc.

Total Measuring Range 2(+/-1)mm Pneumatic Retraction Repeatability Operating Temperature Limits

Velocity Sensing
Scanning Laser Vibrometry
No physical contact with the test object; facilitate remote, mass-loading-free vibration measurements on targets measuring velocity (translational or angular) automated scanning measurements with fast scanning speed However, very expensive (> $120K)

Photo courtesy of Bruel & Kjaer

Photo courtesy of Polytec

Laser Vibrometry
References
Structural health monitoring using scanning laser vibrometry, by L. Mallet, Smart Materials & Structures, vol. 13, 2004, pg. 261 the technical note entitled Principle of Vibrometry from Polytec

Shock (high-G) Sensing

Shock Pressure Sensor
Measurement range up to 69 MPa (10 ksi) High response speed (rise time < 2 sec.) High frequency bandwidth (resonant frequency up to > 500 kHz) Operating temperature: -70 to 130 C Light (typically weighs ~ 10 g)
Photo courtesy of PCB Piezotronics

Shock Accelerometer
Measurement range up to +/- 70,000 g Frequency bandwidth typically from 0.5 30 kHz at -3 dB Operating temperature: -40 to 80 C Light (weighs ~ 5 g)

Angular Motion Sensing (Tilt Meter)

Inertial Gyroscope (e.g., http://www.xbow.com)
used to measure angular rates and X, Y, and Z acceleration.

Tilt Sensor/Inclinometer (e.g., http://www.microstrain.com)

Tilt sensors and inclinometers generate an artificial horizon and measure angular tilt with respect to this horizon.

Rotary Position Sensor (e.g., http://www.msiusa.com)

includes potentiometers and a variety of magnetic and capacitive technologies. Sensors are designed for angular displacement less than one turn or for multi-turn displacement.
Photo courtesy of MSI and Crossbow

MEMS Technology
What is MEMS? Acronym for Microelectromechanical Systems MEMS is the name given to the practice of making and combining miniaturized mechanical and electrical components. K. Gabriel, SciAm, Sept 1995. Synonym to: Micromachines (in Japan) Microsystems technology (in Europe) Leverage on existing IC-based fabrication techniques (but now extend to other non IC techniques) Potential for low cost through batch fabrication Thousands of MEMS devices (scale from ~ 0.2 m to 1 mm) could be made simultaneously on a single silicon wafer

MEMS Technology
Co-location of sensing, computing, actuating, control, communication & power on a small chip-size device High spatial functionality and fast response speed
Very high precision in manufacture miniaturized components improve response speed and reduce power consumption

MEMS Fabrication Technique

Courtesy of A.P. Pisano, DARPA

Distinctive Features of MEMS Devices

Miniaturization
micromachines (sensors and actuators) can handle microobjects and move freely in small spaces

Multiplicity
cooperative work from many small micromachines may be best way to perform a large task inexpensive to make many machines in parallel

Microelectronics
integrate microelectronic control devices with sensors and actuators Fujita, Proc. IEEE, Vol. 86, No 8

MEMS Accelerometer
Capacitive MEMS accelerometer
High precision dual axis accelerometer with signal conditioned voltage outputs, all on a single monolithic IC Sensitivity from 20 to 1000 mV/g High accuracy High temperature stability Low power (less than 700 uA typical) 5 mm x 5 mm x 2 mm LCC package Low cost ($5 ~ $14/pc. in Yr. 2004)
Courtesy of Analog Devices, Inc.

MEMS Accelerometer
Piezoresistive MEMS accelerometer
Operating Principle: a proof mass attached to a silicon housing through a short flexural element. The implantation of a piezoresistive material on the upper surface of the flexural element. The strain experienced by a piezoresistive material causes a position change of its internal atoms, resulting in the change of its electrical resistance low-noise property at high frequencies

Courtesy of JP Lynch, U Mich.

MEMS Dust
MEMS dust here has the same scale as a single dandelion seed - something so small and light that it literally floats in the air.

Source: Distributed MEMS: New Challenges for Computation, by A.A. BERLIN and K.J. GABRIEL, IEEE Comp. Sci. Eng., 1997

Sensing System
Reference
Zhang, R. and Aktan, E., Design consideration for sensing systems to ensure data quality, Sensing issues in Civil Structural Health Monitoring, Eded by Ansari, F., Springer, 2005, P281-290