A PRESENTATION ON SURFACE MOUNT TECHNOLOGY

Presented By:
Alok kumar (08EC045) ECE

CONTENTS

What is SMT??? Characterisitics of SMT Placement of Components Soldering Surface Mount Design Advantages Conclusion

WHAT IS SMT ??

A method for constructing electronic circuits in which the components (SMC, or Surface Mounted Components) are mounted directly onto the surface of printed circuit boards (PCBs). devices made for this purpose are called surface-mount devices or SMDs. And this technique is known as Surface Mount Technology.

Electronic

CHARACTERISTICS OF
SMT
Allows production of more reliable assemblies Higher I/O Increased board density Reduced weight, volume, and cost.

PLACEMENT OF COMPONENTS
Requirements

for accuracy make it necessary to use auto-placement machines for placing surface mount components on the PCB. selection of appropriate auto placement machine is depends on the type of component which have to be placed.

The

 There

are different types of auto-placement machines available on the market today: (A) In-line (B) Sequential (A) In- line: It employs a series of fixed-position placement stations. (B) Sequential: Components are individually placed on the PC board in succession.

SOLDERING

A Process of joining metallic surfaces with solder, without melting the base material. Type of soldering depends upon the component which have to be solder. 1. Wave soldering 2. Reflow soldering

WAVE SOLDERING
Wave soldering is a large-scale soldering process, used to solder the electronic components on PCB.

The name is derived from the use of waves of molten solder.

 The process uses a tank to hold a quantity of molten solder; the components are inserted into or placed on the PCB and the loaded PCB is passed across a pumped wave or waterfall of solder. Used for both through-hole printed circuit assemblies, and surface mount.

Solder Types:
Many different types of solder that can be used in wave soldering, tin/lead-based solders are the most common.

But these are replaced by Lead free solder pastes, Because of highly toxic in nature. The next best metals to use are nickel, brass, aluminum, tungsten, and lastly steel.

A coil of Lead free solder

A coil of pure tin solder wire

REFLOW SOLDERING:
Reflow soldering contains the steps as same as as wave soldering. But the soldering plate source is different. It can be done by 2heating sources those are
Vapour Phase Infrared

Steps Included In Reflow Soldering:

1. Pre Heating 2. Soldering 3. Cooling Pre Heating Soldering Cooling

ADVANTAGES
Ease in automation results in higher production throughput and better yields. Closer spacing of components coupled with the ability to use both sides of the PCB for component mounting results in significant savings in board real estate. Board rework costs and time are significantly reduced.

 The components are glued by the placement equipment onto the printed circuit board surface before being run through the molten solder wave.

CONCLUSION
At last we conclude that this technology will be very useful & effective in the fabrication of electronics circuits on PCB.

Throuh hole component technique has been replaced by SMT, with higher I/O capacity, and high efficiency. Weight and volume reduced.