Tutorial: FLUENT, : Solving a Conjugate Heat Transfer Problem using Introduction The physics of conjugate heat tzausfer is common in many engineering applications, inelud- ing heat exchangers, HVAC, and electronic component design. The purpoce of this tutorial is to provide guidlines and rocotmendations for setting up and solving a conjugate boat transfer problem using FLUENT. The geometry snd flow dousin cousists of # fat elect board with 2 heat yeuereting elec luoaie chip mounted on i. eat is conducted chrough the source (chip) aud the board on which it ie mouuted. A leininar stam of air flows over the board sud the chip, anuzing oi ultancons cooling of the solid components and heating of the ar steain due to convvetion Thermal enesay is also transported due ta the complex flow fel. inh tutorial, you will «© Sot up appropriate boundary concitions for a conjugate heat trausfer simulation in FLUENT, © Enable sonree terms for specified zones. Periorma flow au exergy caleulatious using various matecials (both solid aud fuid) ¢ Manipulate mesh aulaption registers and perform Bodean operitions on the. ‘© Periorm mesh adaption and verify that the solution is mesh independ. Prerequisites ‘This cutortal assurnes that you are faniltar with the FLUENT interface and that you have «good mdertancding of the besie sotap ond ection procedunss. Some steps will not be shown explicel You will perform postprocessing related ouly to mesh wdaption ant verification of west iudepondent solution. For detailed portprocessing of this simulation, rofer to Tutorial 22 Posprocessing in the FLUENT 6.2 Tutorial Gui.Problem Description ‘The problem considered i shown schematically i Figure 1. The configuration consists of 4 series of heat-generating electronic chips mounted on a cirenit board. Air low, confined between the circuit beard aud an upper wall, cools the chips and the board. As the air lows over the chips aud the board, its temperature rises. Talcug the symmetry of the configuration ino cousideration, the model extends from the middle of one chip to the plaue of syimmetry between it aud the nest chip, As shown in Figure 1, each hal chip is ossumed to gonerate 1 Watt and have a shermel conductivity of 1.0 WyincK. The eivcnit board conductivity is assumed to be one order of magnitude lower, at 0.1 W/in-K. Ar enters the system at 208 K with a velocity of 0.5 m/s The inlet Reynclds number (based ow the spacing besween che upper aud lower walls) is aromud 87) and thus, the flow is treated as lanninat: ‘Symmetry planes. Top Wall Centemally egoled) Ras wre T= 298K 5 (one hall is modeled) pestats = Swans l Cirsuit Board : Ceoteraly cooled) 2 ee Wham hats wa 98k’ Figure 1: Problem Schematic Preparation 1. Copy the mesh file, chip3d sh. gz to your working directory: 2 Seart the aD version of FLUENT.Setup and Solution Step 1: Gi 41, Read the mesh file (chap9d.1sh.¢2) Sot inches as the working unit for length (a) Under Unit Conversion, selec: in from the Grid Was Created In drop-down list (b) Click Change Length Units 8. Chee the gti Ensure that there are no negative volusres. 4. Display the grid (Figure 2) Step 2: Models 1. Define the solver stings. (a) Under Gracient Option, velest Node-Based. (b) Retain the defiult seteings for the other pacauneters 2. Enable the Energy Equation 4. Define a laminar flow sinlation