Cracking problem of Ni-Cr plating on plastic auto parts after Thermal cycle test

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Cracking problem of Ni-Cr plating on plastic auto parts after Thermal cycle test
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+++ Dear Sir/ madam, We are doing the Ni-Cr. plating on plastic automobile parts and we presently facing the problem of failure for "cracking" in performance test like Thermal cycle test. Normally specs are different for Th. cycle test but max duration is 10 hrs at 80 Deg. C. Earlier we were not facing this problem . Normally, the thickness given are, Coppper - 16-25 microns, Total Ni-9-20 microns, Chrome-0.2-0.4 microns.( for Ni, it is SBNI,BR.NI and microporous Ni) Also, this problem is not observed on 100% parts on the same rack plated under similar conditions. Why is it so? What could be the basic problem that it is failing for Thermal cycle test? Can somebody help me URGENTLY. Thanks, Prashant M. Ni-Cr. plater for plastic automobile parts - Pune, Maharashtra, India ++++ I can think of three possible reasons for cracking. I. Residual stresses in the placstic. Suggest better molding process anda stress releaf treatment. 2. High tensile stress in one or all the nickel deposits. Treat the nickel solutions, especially the last two before chrome plating. 3. chromium plating is too thick. Reduce the time in the chrome plating solution to produce 10-15 millionths inch. At 20 millionths (1/2 micon) inch chromium starts to crack, and will crack the thin nickel layer below it.

Don Baudrand Don Baudrand, Consultant Poulsbo, Washington

http://www.finishing.com/264/33.shtml

6/8/2012

Cracking problem of Ni-Cr plating on plastic auto parts after Thermal cycle test

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++++ Dear Sir, From the first while we can say it is ETCHING so you should examine the Cr+3 in your etching bath if it over the level you should replaced it . But you should take other considerations with you like activation: if you work with palladium - tin activator you should know that low palladium gave low EN adhesion and high E cupper adhesion acceleration: you have to remove all tin from deposit palladium- tin activator or you will faced bad adhesion. Passivation: cracking my be it due to some passivation between EN-cu-Ni layers Finally you should examine the agitation cycle in you etching bath so to be sure that heat distribute equally and the concentration of chromic acid on it . Regards, Raafat Albendary - Cairo, Egypt

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6/8/2012