CHAPTER 8 ENVIRONMENTAL DATA ON ICs

page Introduction Explanation of the tables Substances not used by Philips Semiconductors Disposal Recycling General warnings Plastic ball grid array packages Low profile fine pitch ball grid array package Dual in-line packages Shrink dual in-line packages Small outline packages Shrink small outline packages Thin shrink small outline packages Plastic leaded carrier packages Quad flat packages Low profile quad flat packages Through hole power packages Through hole medium power packages Heatslug small outline packages Thin quad flat packages 8-2 8-2 8-5 8-6 8-6 8-6 8-7 8-8 8-9 8 - 10 8 - 11 8 - 12 8 - 13 8 - 14 8 - 15 8 - 16 8 - 17 8 - 18 8 - 19 8 - 20

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INTRODUCTION Nowadays, everyone must accept responsibility for keeping the environment clean, from individuals adopting a responsible attitude to their own waste disposal, however small that may be, to big industries who must take proper precautions to avoid releasing large amounts of damaging waste into the environment. As a leading electronic components manufacturer, Philips Semiconductors has always regarded environmental protection as a major issue. The electronics industry, like many others, produces its share of toxic and hazardous materials, and we have long made it our policy to follow working practices that cut the chance of these materials passing into the environment to the absolute minimum. Products supplied by Philips Semiconductors today offer no hazard to the environment in normal operation and when stored according to the instructions given in our data sheets. Inevitably, some products contain substances that are potentially hazardous to health if exposed by accident or misuse, but we ensure that users of these components receive clear warning of this in the data sheets. And where necessary, the warning notices contain safety precautions and disposal instructions. This Chapter supplements these notices and instructions by providing clear and comprehensive information on the composition of representative examples of ICs manufactured by Philips Semiconductors. This information should form a basis for answering questions on product safety and disposal and should, moreover, help to increase awareness of these aspects, not only throughout the Philips Semiconductors organization but throughout the semiconductor industry in general. EXPLANATION OF THE TABLES The following pages provide the chemical constituents of representative groups of IC packages down to minor percentages and traces, as far as these constituents may be important to the use, destruction or disposal of the components. The tables contain information about the materials used in the semiconductor devices themselves and in the packing used for storage, transport and assembly. Whenever possible, the devices have been grouped into families based on the similarity in composition, construction and packing method. In this way we were able to limit the number of tables. For each group, one representative is specified in mass percentages of its parts.

Chapter 8
In many cases, a single encapsulation type will contain a range of differing leadframes with different die-pad dimensions to accommodate the active devices. This, however, leads to only minor changes in the mass percentages. Different materials or techniques are sometimes used to assemble one encapsulation type, and whenever possible, alternative materials are included in the tables. In other cases only the standard or high-volume process is described. Per page, the product family is defined and the types identied by the Philips package code number. Additionally, reference is made to usual names or to the JEDEC code (when applicable). The mass (grams) and body dimensions (mm) and the packing quantity are also specied. The table itself shows the composition of the group representative broken down into the device-parts: metal parts crystal encapsulation (plastic, glass or ceramic) packing materials The device-parts are specified in milligrams (mg). These gures are as accurate as possible for the group representative shown. Other devices from the same group may differ considerably in mass. The amount of packing material, specied in grams, per device can be found by dividing the weight of the packing material by the packing quantity. For more detailed information on packing, refer to Chapter 7, Packing methods. Metal parts The composition of the leadframe material is indicated, when appropriate, by the method commonly used for alloys, e.g.: FeNi42 means iron alloy containing 42% of nickel (alloy 42). CuZn15 means copper alloy containing 15% zinc (tombac). Cu alloy indicates copper with a small amount of alloying elements such as Fe, Ni, Zn or Ag or combinations of some elements. Crystal The active device is usually a silicon chip doped with very small amounts of elements such as boron, arsenic or phosphorus. The back may be metallized with thin layers of titanium, nickel, platinum, gold or silver to enhance die-bonding to the leadframe.

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Encapsulation The chip is protected by a ceramic, plastic, glass or metal encapsulation. Glass will contain SiO2 plus a number of oxides of Ba, K, Pb, Zn and Mn. These elements are, however, immobilized and will not be extracted by acids, unless the glass is ground. The plastic encapsulation is usually based on ortho cresol novolac (OCN) -epoxy or on biphenyl-epoxy, filled with quartz particles (fused or crystalline) up to approximately 70 mass percent. In all cases (except SOT54), antimony trioxide and tetrabromobisphenol-A (TBBA) are present as flame retardants. The TBBA will be incorporated in the epoxy-polymer after curing so that no TBBA is present in the finished device. It has become a partially brominated epoxy. The flammability of all moulding compounds rates typically UL94-V0 at 1/8 inch. Packing material Cardboard and paper consist mainly of natural fibres. The carbon layer for ESD protection does not hamper the recyclability of the cardboard.

Chapter 8
Polyethylene, polypropylene and polystyrene are synthetic polymers made from hydrocarbons. Polyvinylchloride (PVC), a synthetic polymer made from chlorinated hydrocarbons, is used for the tubes in which many semiconductors are packed. PVC is hazardous to the environment when burned under certain, ill-controlled conditions. PVC is, however, readily recyclable when the material is collected separately (as a mono-material). Therefore the endpins, turnlocks and soft rubber stoppers in the PVC-tubes are now replaced by PVC to enhance recycling. The reuse of the polystyrene (PS) reels is encouraged by requesting all our customers to return the reels after use to Semi-cycle. Information and addresses are printed on the boxes in which the reels are delivered. Philips Semiconductors intention is to buy used reels, when available, thus closing the product life circle to lower the amount of wasted packing materials. To encourage recycling, Philips Semiconductors marks the packing materials according to ISO 11469 using the recycling symbols shown in Figs 1 to 8. Figure 1 shows the symbol for paper and cardboard, Figs 2 to 8 show the symbols for various plastics.

MGK022 MGK023

Fig.1 Paper and cardboard.

Fig.2 Polyethylene terephthalate.

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Chapter 8

MGK025 MGK024

Fig.3 Polyethylene, high density.

Fig.4 Polyvinylchloride.

MGK026

MGK027

Fig.5 Polyethylene, low density.

Fig.6 Polypropylene.

MGK028

MGK029

Fig.8 Fig.7 Polystyrene.

Other plastics. The acronym of the plastic is put under the recycling symbol. In this example: PA = polyamide.

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SUBSTANCES NOT USED BY PHILIPS SEMICONDUCTORS Below are listed the materials and substances that are not present in Philips Semiconductors products and processes. This information supplements the chemical contents tables that follow and is provided to enable equipment manufacturers to make a complete and confident assessment of the environmental impact of selecting products manufactured by Philips Semiconductors. Substances not used in products 4-aminodiphenyl and its salts ammonium salts arsenic asbestos benzene cadmium and compounds creosote cyantes cyanides 4,4-diaminophenyl methane dibenzofurans epichlorhydrine ethylene glycol ethers formaldehyde halogenated aliphatic hydrocarbons hydrazine mercury and compounds N-nitrosoamines 2-naphthylamine and its salts nickel tetracarbonyl N,N-dimethlformamide N,N-dimethylacetamide oils and greases organometallic compounds (e.g. org. tin compounds) ozone-depleting compounds pentachlorophenol phenol compounds (nonyl)-phenol ethoxylates phtalates picric acid polybrominated biphenyl oxides (PBBO) 2000 May 22 8-5

Chapter 8
polybrominated biphenyls (PBB/PBBE) polychlorinated triphenyls (PCT) polychlorinated napthalenes polychlorinated biphenyls (PCB) polycyclic compounds polyhalogenated dibenzofurans/dioxins polyhalogenated bi/triphenyl ethers selenium tellurium tetrabromobenzylimidazole tetrabromoethylene toluene triethylamine tris (aziridinyl) phosphinoxide tris (2,3-dibromopropyl) phosphate vinyl chloride monomer xylene Substances not used in manufacturing processes Philips Semiconductors has eliminated all Ozone Depleting Substances, referred to as Class I and II in the Montreal Protocol and its amendments. This means that our products, in compliance with the US Clean Air Act, do not have to be labelled. We have also eliminated, voluntarily, the use of chlorinated hydrocarbons such as perchloroethylene and trichloro- ethylene from our manufacturing processes. Below is a summary of the ozone-depleting substances we have eliminated. Class I substances: fully halogenated chlorofluorocarbons (CFC) halons carbontetrachloride 1,1,1-trichloroethane Class II substances: partially halogenated hydrocarbons (HCFC) Substances not used in packing materials laminates with paper bleached paper polystyrene akes (EPS)

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DISPOSAL Old or used products must be disposed of in accordance to national and local regulations. The products and packing materials must be disposed of as special waste. This is required, in particular, for parts containing environmentally hazardous materials, for example beryllium oxide, present in some RF-devices. Smaller quantities of material may be disposed of as domestic waste, provided national or local regulations permit this. RECYCLING Where legally required, we accept packing materials and products for recycling and/or disposal. However, since the cost of returning these materials to us must be borne by the customers, it is often more cost effective for them to look for a local recycle company. To assist in this we can provide customers with the names and addresses of local recycle companies in their areas. GENERAL WARNINGS Products Under the specified operating conditions, no hazardous materials will be liberated from the products. The general warnings describe phenomena that can be expected with

Chapter 8
abnormal use (outside the products specification). For example: If a product is exposed to strong acids, metals contained within it may be partially extracted. If a product with an epoxy moulded encapsulation is exposed to organic solvents, these may extract part of the resin contained in the encapsulation. If the product is incinerated, degradation and condensation reactions in the organic material it contains may cause a number of hazardous substances to be released into the air in unpredictable amounts. Moreover, metal oxides will be formed and may be released into the air as dust particles. If products with beryllium heatsinks (RF transistors) are damaged, toxic beryllium oxide dust may be released into the air. Packing material With adequate oxygen supply, packing materials will give off mainly carbon dioxide and water if burned. However, if they are burned in a limited oxygen supply (the general case in a re), hazardous compounds (for example carbon monoxide) may be emitted. PVC will form hydrochloric acid gas when incinerated. It will also generate a number of other chlorine compounds, among them the toxic dioxin, when the conditions (temperature, oxygen) are not well controlled.

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PLASTIC BALL GRID ARRAY PACKAGES REFERENCE(1) BGA156 BGA492 Note 1. All packages have a similar composition, quantities may vary. Chemical content GROUP REPRESENTATIVE: SOT514 (BGA492) Device parts SOURCE substrate solder balls encapsulation die-attach active device SnPb37 epoxy polymer (SiO2 approx. 78%, Sb < 1%, Br < 0.6%) epoxy, Ag lled doped silicon SUBSTANCE epoxy glass lled, with Cu, Ni, Au plated pattern PACKAGE CODE SOT472 SOT514 MASS (g) 0.5 4.7 BODY (mm) 15.00 15.00 1.15 35.00 35.00 1.75

Chapter 8

PACKING QUANTITY 630 120

MASS (g) 2.059 0.945 1.449 0.072 0.147

Packing material (tray pack, dry pack) PACKING PART box JEDEC trays bag drying agent humidity indicator strap labels seal cardboard copolymer, carbon loaded aluminium laminated polyethylene silica gel paper + CoCl2 polypropylene paper acrylate SUBSTANCE MASS (g) 113 846 47 88 1.2 2.2 6.8 0.2

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LOW PROFILE FINE PITCH BALL GRID ARRAY PACKAGE REFERENCE LFBGA64 LFBGA96 Chemical content SOT536 (LFBGA96) Device parts SOURCE substrate solder balls encapsulation die attach active device SnPb37 OCN-epoxy polymer (SiO2 < 72%, Sb < 4%, Br < 0.6%) epoxy, Ag lled doped silicon SUBSTANCE epoxy glass lled, with Cu, Ni, Au plated pattern PACKAGE CODE SOT534 SOT536 MASS (g) 0.2 0.2 BODY (mm) 8.0 8.0 1.1 13.50 5.50 1.05

Chapter 8

PACKING QUANTITY 1740 1425

MASS (mg) 46 26 79 1 8

Packing material (tray pack, dry pack) PACKING PART box trays bag drying agent labels cardboard copolymer, carbon loaded aluminium laminated polyethylene silica gel paper SUBSTANCE MASS (g) 113 846 35 85 7

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DUAL IN-LINE PACKAGES REFERENCE(1) DIP8 DIP14 DIP16 DIP18 DIP20 DIP22 DIP24 DIP28 DIP32 DIP40 DIP48 HDIP18 Note 1. All packages have a similar composition, quantities may vary. Chemical content GROUP REPRESENTATIVE: SOT129 (DIP40) Device parts DEVICE PART leadframe active device encapsulation Note 1. Alternative: SnPb plated. Cu alloy(1) Sn plating doped Si OCN-epoxy polymer (SiO2 < 72%, Sb < 4%, Br < 0.6%) SUBSTANCE PACKAGE CODE SOT97 SOT27 SOT38 SOT102 SOT146 SOT116 SOT101 SOT117 SOT201 SOT129 SOT240 SOT398 MASS (g) 0.5 1.0 1.2 1.2 1.3 2.2 3.8 4.3 4.7 6.2 7.7 1.5 BODY (mm) 6.35 9.40 3.05 6.35 19.02 3.04 6.35 21.60 3.55 6.35 23.37 3.05 6.35 26.60 3.04 8.64 27.80 3.81 13.80 31.70 3.85 13.80 35.70 3.85 13.97 41.10 3.81 13.80 52.00 3.85 14.02 61.70 4.10 6.35 21.60 3.55

Chapter 8

PACKING QUANTITY 2000 1000 1000 800 720 720 360 312 264 216 168 1000

MASS (mg) 1294 20 30 4870

Packing material (tube pack) PACKING PART box tubes end pins strap labels seal polyvinylchloride polyvinylchloride polypropylene paper acrylate SUBSTANCE cardboard, carbon coated MASS (g) 145 840 5.6 0.7 1.7 0.2

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SHRINK DUAL IN-LINE PACKAGES REFERENCE SDIP24 SDIP32 SDIP42 SDIP52 SDIP56 SDIP64 Note 1. All packages have a similar composition, quantities may vary. Chemical content GROUP REPRESENTATIVE: SOT270 (SDIP42) Device parts DEVICE PART leadframe active device chip coating encapsulation Notes 1. Optional: SnPb plating. 2. Not used for all packages. Cu alloy Sn plating(1) doped Si silicon gel(2) OCN-epoxy polymer (SiO2 < 72%, Sb < 4%, Br < 0.6%) SUBSTANCE PACKAGE CODE SOT234 SOT232 SOT270 SOT247 SOT400 SOT274 MASS (g) 1.7 2.2 4.5 5.6 6.1 9.0 BODY (mm) 8.90 21.86 3.65 8.90 28.89 3.65 13.80 38.60 3.85 13.80 47.50 3.85 13.80 52.00 3.85 17.00 58.16 4.25

Chapter 8

PACKING QUANTITY 1000 760 420 330 216 160

MASS (mg) 1000 20 30 10 3520

Packing material (tube pack) PACKING PART box tubes end pins strap labels seal polyvinylchloride polyvinylchloride polypropylene paper acrylate SUBSTANCE cardboard, carbon coated MASS (g) 165 1200 6.8 1 1.7 0.2

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SMALL OUTLINE PACKAGES REFERENCE(1) SO8 SO8 SO14 SO16 SO16 SO20 SO24 SO28 SO32 VSO40 VSO56 Note 1. All packages have a similar composition, quantities may vary. Chemical content GROUP REPRESENTATIVE: SOT163 (SO20) Device parts DEVICE PART leadframe active device chip coating encapsulation Notes 1. Leadframe for VSO is FeNi. 2. Not used for all packages. Cu alloy SnPb15 plating(1) doped Si silicone gel(2) OCN-epoxy polymer (SiO2 < 72%, Sb < 4%, Br < 0.6%) SUBSTANCE PACKAGE CODE SOT96 SOT176 SOT108 SOT109 SOT162 SOT163 SOT137 SOT136 SOT287 SOT158 SOT190 MASS (mg) 0.1 0.3 0.1 0.1 0.4 0.5 0.6 0.7 0.8 0.6 1.3 BODY (mm) 3.90 4.90 1.35 7.50 7.50 2.35 3.90 8.65 1.35 3.90 9.90 1.47 7.50 10.20 2.35 7.50 12.70 2.35 7.50 15.30 2.35 7.50 17.90 2.35 7.50 20.50 2.35 7.50 15.30 2.35 11.00 21.50 2.85

Chapter 8

PACKING QUANTITY 2500 1000 2500 2500 1000 1000 1000 1000 1000 500 500

MASS (mg) 130 5 15 5 370

Packing material (reel pack) PACKING PART box reel carrier tape cover tape labels seal polystyrene polystyrene, carbon loaded polyester paper acrylate SUBSTANCE cardboard, carbon coated MASS (g) 174 260 112 17 1 0.2

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SHRINK SMALL OUTLINE PACKAGES REFERENCE(1) SSOP14 SSOP16 SSOP16 SSOP20 SSOP20 SSOP24 SSOP28 SSOP48 SSOP56 Note 1. All packages have a similar composition, quantities may vary. Chemical content GROUP REPRESENTATIVE: SOT339 (SSOP20) Device parts DEVICE PART leadframe active device encapsulation Cu alloy SnPb15 plating doped Si biphenyl-epoxy polymer (SiO2 approx. 80%, Sb < 2%, Br < 0.6%) SUBSTANCE PACKAGE CODE SOT337 SOT338 SOT369 SOT266 SOT339 SOT340 SOT341 SOT370 SOT371 MASS (mg) 0.1 0.1 0.1 0.1 0.1 0.2 0.2 0.6 0.7 BODY (mm) 5.30 6.20 1.75 5.30 6.20 1.75 4.40 5.20 1.25 4.40 6.50 1.25 5.30 7.20 1.73 5.30 8.20 1.73 5.30 10.20 1.73 7.50 15.90 2.30 7.50 18.40 2.30

Chapter 8

PACKING QUANTITY 2000 2000 2500 2500 2500 2000 2000 1000 1000

MASS (mg) 40 4.5 2.5 107

Packing material (reel pack) PACKING PART box reel carrier tape cover tape labels seal polystyrene polystyrene, carbon loaded polyester paper acrylate SUBSTANCE cardboard, carbon coated MASS (g) 165 250 177 25 1 0.2

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THIN SHRINK SMALL OUTLINE PACKAGES REFERENCE(1) TSSOP14 TSSOP16 TSSOP20 TSSOP24 TSSOP28 TSSOP32 TSSOP48 TSSOP56 Note 1. All packages have a similar composition, quantities may vary. Chemical content GROUP REPRESENTATIVE: SOT355 (TSSOP24) Device parts DEVICE PART leadframe active device encapsulation CuNi3 SnPb15 plating doped Si biphenyl-epoxy polymer (SiO2 approx. 80%, Sb < 2%, Br < 0.6%) SUBSTANCE PACKAGE CODE SOT402 SOT403 SOT360 SOT355 SOT361 SOT487 SOT362 SOT364 MASS (mg) 0.1 0.1 0.1 0.1 0.1 0.2 0.2 0.2 BODY (mm) 4.40 5.00 0.90 4.40 5.00 0.90 4.40 6.50 0.90 4.40 7.80 0.90 4.40 9.70 0.90 6.10 11.00 0.90 6.10 12.50 0.90 6.10 14.00 0.90

Chapter 8

PACKING QUANTITY 2500 2500 2500 2500 2500 2000 2000 2000

MASS (mg) 32 8 6 48

Packing material (reel pack, dry pack) PACKING PART box reel carrier tape cover tape bag drying agent humidity indicator labels cardboard polystyrene polystyrene, carbon loaded polyester aluminium laminated polyethylene silica gel paper + CoCl2 paper SUBSTANCE MASS (g) 203 288 177 16 94 88 1.2 3.7

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PLASTIC LEADED CHIP CARRIER PACKAGES REFERENCE(1) PLCC28 PLCC44 PLCC52 PLCC52 PLCC68 PLCC84 Note 1. All packages have a similar composition, quantities may vary. Chemical content GROUP REPRESENTATIVE: SOT187 (PLCC44) Device parts DEVICE leadframe active device chip coating encapsulation Note 1. Not used for all packages. Cu alloy SnPb15 plating doped Si silicone gel(1) OCN-epoxy polymer (SiO2 < 72%, Sb < 1.2%, Br < 1.3%) SUBSTANCE PACKAGE CODE SOT261 SOT187 SOT238 SOT433 SOT188 SOT189 MASS (mg) 1.2 2.3 2.9 1.9 2.3 6.7 BODY (mm) 11.48 11.48 3.86 16.56 16.56 3.86 19.15 19.15 3.86 19.05 19.05 2.43 24.18 24.18 3.81 29.24 29.24 3.68

Chapter 8

PACKING QUANTITY 2368 1300 1012 1242 648 420

MASS (mg) 390 25 70 25 1770

Packing material (tube pack) PACKING PART box tubes end plugs strap labels seal polyvinylchloride polyvinylchloride polypropylene paper acrylate SUBSTANCE cardboard, carbon coated MASS (g) 145 1050 126 0.7 1.8 0.2

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QUAD FLAT PACKAGES REFERENCE(1) QFP44 QFP44 QFP52 QFP64 QFP64 QFP80 QFP80 QFP100 QFP100 QFP128 QFP160 SQFP128 SQFP208 Note 1. All packages have a similar composition, quantities may vary. Chemical content GROUP REPRESENTATIVE: SOT319 (QFP64) Device parts DEVICE PART leadframe active device chip coating encapsulation Note 1. Not used for all packages. Cu alloy SnPb15 plating doped Si silicone gel(1) biphenyl-epoxy polymer (SiO2 approx. 80%, Sb < 2%, Br < 0.6%) SUBSTANCE PACKAGE CODE SOT205 SOT307 SOT379 SOT319 SOT393 SOT310 SOT318 SOT317 SOT382 SOT320 SOT322 SOT387 SOT316 MASS (g) 0.9 0.4 0.5 1.7 1.2 1.8 1.8 1.7 1.8 5.1 5.1 1.7 5.1 BODY (mm) 14.00 14.00 2.20 10.00 10.00 1.75 10.00 10.00 2.00 14.00 20.00 2.75 14.00 14.00 2.67 14.00 20.00 3.00 14.00 20.00 2.75 14.00 20.00 2.75 14.00 20.00 2.80 28.00 28.00 3.35 28.00 28.00 3.35 14.00 20.00 2.72 28.00 28.00 3.35

Chapter 8

PACKING QUANTITY 420 480 600 330 600 330 330 330 330 120 120 500 120

MASS (mg) 320 10 20 10 1360

Packing material (tray pack, dry pack) PACKING PART box JEDEC trays bag drying agent humidity indicator strap labels seal 2000 May 22 cardboard copolymer, carbon loaded aluminium laminated polyethylene silica gel paper + CoCI2 polypropylene paper acrylate 8 - 15 SUBSTANCE MASS (g) 113 850 47 88 1.2 2.2 2.6 0.2

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Environmental data on ICs

LOW PROFILE QUAD FLAT PACKAGES REFERENCE(1) LQFP32 LQFP32 LQFP44 LQFP48 LQFP64 LQFP64 LQFP80 LQFP100 LQFP128 LQFP128 LQFP144 LQFP160 LQFP176 LQFP208 Note 1. All packages have a similar composition, quantities may vary. Chemical content GROUP REPRESENTATIVE: SOT315 (LQFP80) Device parts SOURCE leadframe active device chip coating encapsulation Note 1. Not used for all packages. Cu alloy SnPb15 plating doped Si silicone gel(1) biphenyl-epoxy polymer (SiO2 approx. 80%, Sb < 2%, Br < 0.6%) SUBSTANCE PACKAGE CODE SOT358 SOT401 SOT389 SOT313 SOT314 SOT414 SOT315 SOT407 SOT420 SOT425 SOT486 SOT435 SOT506 SOT459 MASS (mg) 0.2 0.1 2.6 0.2 0.4 0.3 0.5 0.7 0.6 0.8 1.2 1.8 1.9 2.4 BODY (mm) 7.00 7.00 1.40 5.00 5.00 1.40 10.00 10.00 1.40 7.00 7.00 1.40 10.00 10.00 1.40 7.00 7.00 1.40 12.00 12.00 1.40 14.00 14.00 1.40 14.00 14.00 1.40 14.00 20.00 1.40 20.00 20.00 1.40 24.00 24.00 1.40 24.00 24.00 1.40 28.00 28.00 1.40

Chapter 8

PACKING QUANTITY 2000 2000 1500 2000 1500 1250 1000 1000 1000 1000 300 200 200 180

MASS (mg) 140 50 40 10 220

Packing material (reel pack, dry pack) PACKING PART box reel bag drying agent humidity indicator carrier tape cover tape labels 2000 May 22 cardboard polystyrene aluminium laminated polyethylene silica acid paper + CoCl2 polystyrene polyester paper 8 - 16 SUBSTANCE MASS (g) 203 348 68 88 1.2 165 16 3.7

Philips Semiconductors

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THROUGH HOLE POWER PACKAGES REFERENCE(1) DBS9P DBS13P DBS17P DBS17P DBS23P RDBS13P SIL9P SIL13P SMS9P SMS13P Note 1. All packages have a similar composition, quantities may vary. Chemical content GROUP REPRESENTATIVE: SOT243 (DBS17P) Device parts SOURCE leadframe(1) heatsink die attach active device chip coating encapsulation Notes 1. Alternative: epoxy, Ag filled. 2. Not used for all packages. Cu alloy Sn plating Cu SnAg25Sb10(1) doped Si silicone gel(2) OCN-epoxy polymer (SiO2 < 72%, Sb < 4%, Br < 0.6%) SUBSTANCE PACKAGE CODE SOT157 SOT141 SOT243 SOT475 SOT411 SOT462 SOT131 SOT193 SOT354 SOT517 MASS (g) 4.8 4.8 4.7 4.7 6.0 4.8 4.3 3.0 4.7 4.7 BODY (mm) 12.00 23.70 4.40 12.00 23.70 4.40 12.00 23.70 4.40 12.00 23.70 4.40 12.00 30.20 4.45 12.00 23.70 4.40 12.00 23.70 4.40 12.00 23.70 4.40 12.00 23.70 4.40 1.002 23.70 4.40

Chapter 8

PACKING QUANTITY 552 552 552 552 432 552 552 552 552 552

MASS (mg) 900 20 2350 25 30 10 1375

Packing material (tube pack) PACKING PART box tubes end plugs strap labels seal polyvinylchloride polyvinylchloride polypropylene paper acrylate SUBSTANCE cardboard, carbon coated MASS (g) 145 792 21.6 0.7 1.7 0.2

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THROUGH HOLE MEDIUM POWER PACKAGES REFERENCE(1) DBS9MPF RBS9MPF SIL9MP SIL9MPF Note 1. All packages have a similar composition, quantities may vary. Chemical content GROUP REPRESENTATIVE: SOT110 (SIL9MPF) Device parts SOURCE leadframe active device chip coating encapsulation Note 1. Not used for all packages. Cu alloy Sn plating doped Si silicone gel(1) OCN-epoxy polymer (SiO2 < 72%, Sb < 4%, Br < 0.6%) SUBSTANCE PACKAGE CODE SOT111 SOT352 SOT142 SOT110 MASS (g) 1.8 1.8 1.4 1.8 BODY (mm) 6.35 21.60 3.55 6.35 21.60 3.55 6.35 21.60 3.55 6.35 21.60 3.55

Chapter 8

PACKING QUANTITY 748 924 748 748

MASS (mg) 1000 20 30 10 1375

Packing material (tube pack) PACKING PART box tubes end plugs foam strap labels seal polyvinylchloride polyvinylchloride polyethylene polypropylene paper acrylate SUBSTANCE cardboard, carbon coated MASS (g) 145 1925 27.2 7.5 15 1.8 0.2

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HEATSLUG SMALL OUTLINE PACKAGES REFERENCE(1) HSOP20 HSOP20 Note 1. All packages have a similar composition, quantities may vary. Chemical content GROUP REPRESENTATIVE: SOT418 (HSOP20) Device parts SOURCE leadframe heatsink die attach active device chip coating encapsulation Notes 1. Alternative: epoxy, Ag filled. 2. Not used for all packages. Cu alloy SnPb15 plating Cu SnAg25Sb10(1) doped Si silicone gel(2) OCN-epoxy polymer (SiO2 < 72%, Sb < 4%, Br < 0.6%) SUBSTANCE PACKAGE CODE SOT397 SOT418 MASS (g) 2.1 2.1 BODY (mm) 11.00 15.90 3.15 11.00 15.90 3.15

Chapter 8

PACKING QUANTITY 500 500

MASS (mg) 130 13 1190 10 30 10 700

Packing material (reel) PACKING PART box reel carrier tape cover tape labels seal polystyrene polystyrene, carbon loaded polyester paper acrylate SUBSTANCE cardboard, carbon coated MASS (g) 174 260 150 14 1.3 0.2

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THIN QUAD FLAT PACKAGES REFERENCE(1) TQFP44 TQFP64 TQFP80 TQFP100 HTQFP80 Note 1. All packages have a similar composition, quantities may vary. Chemical content GROUP REPRESENTATIVE: SOT376 (TQFP44) Device parts SOURCE leadframe active device encapsulation Cu alloy SnPb15 plating doped Si biphenyl-epoxy polymer (SiO2 approx. 80%, Sb <2%, Br < 0.6%) SUBSTANCE PACKAGE CODE SOT376 SOT357 SOT375 SOT386 SOT513 MASS (g) 0.3 0.3 0.4 0.5 0.5 BODY (mm) 10.00 10.00 1.00 10.00 10.00 1.00 12.00 12.00 1.00 14.00 14.00 1.00 14.00 14.00 1.00

Chapter 8

PACKING QUANTITY 1500 1500 595 450 450

MASS (mg) 90 15 8 180

Packing material (reel dry pack) PACKING PART box reel carrier tape cover tape labels seal polystyrene polystyrene, carbon loaded polyester paper acrylate SUBSTANCE cardboard, carbon coated MASS (g) 139 280 180 39 1 0.2

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