A Summer Training Report

Assembly Process on PCB

(Through Hole and Surface Mount Technologies)
Dixon Technologies (India) Pvt. Ltd.
B- 14 & 15, Phase I I , Noi da 201 305, (U. P. ) I ndi a
Under the guidance of
Mr. Nainko Singh and other Technicians
Department of Electronics & Communication Engineering
Amity School of Engineering & Technology
Mentor:
Mr. Sachin Kumar Compiled By
Puneet a!h"ani
#.Tech E&CE $#atch %&''(%&')*
Enrollment +o.:A,-&)''''.%
Ac/no"le!gement
I am very thankful to Di0on Technologies for giving me the
opportunity to undertake my summer training at their Noida unit. It
was a very good learning experience for me as the training gave me
a sense of working in the factory.
I would like to convey my heartiest thanks to Mr. Atul #. 1all
(Deputy Managing Director & Chief xecutive !fficer" and Mr.
2ineet Kr. Mishra (#ice $resident" who heartily welcomed me for
the Internship. I would also like to give my heartfelt thanks to Mr.
+ain/o Singh (ngineer" who guided and encouraged me
throughout and imparted in%depth knowledge of the work
environment.
I would like to thank Ms. Sonali Samanta (&'" and all the
department heads of Dixon (echnologies for giving their precious
time and valua)le guidance during my internship programme. I
would like to thank all the staff at Dixon* for )eing so helpful.
My due respect to my parents who provided me with all the
necessities re+uired.

,
Declaration
I* Puneet Wadhwani* student of lectronics & Communication
ngineering* )atch ,-..%,-./* 0mity 1niversity (1.$." here)y
declare that the 2ummer (raining 'eport entitled 3AssemblyProcess
on PCB4 is )ased on the information collected )y me during my
tenure at DIXON TECHNOO!IE" #I$ P%T& TD.* Noida from
-3
th
4une5 ,-.6 to -3
th
4uly5 ,-.6 which is produced in a )est
possi)le manner.
(his is a comprehensive study )ased on the practical knowledge
gained and data (theories and pictures" from Internet.
2ignature of (rainee
($uneet 7adhwani"
$lace8
Date8
6
CERT565CATE
!n the )asis of declaration su)mitted )y $uneet 7adhwani student of 9.
(ech (&C"* I here)y certify that the pro:ect titled ;0ssem)ly $rocess on
$C95 which is
su)mitted to Department of lectronics and Communication ngineering*
0mity 2chool of ngineering and (echnology* 0mity 1niversity 1ttar
$radesh* <ucknow * in partial fulfillment of the re+uirement of the award of
the degree of 9achelor of (echnology is an original contri)ution with existing
knowledge and faithful record of work carried out )y him under my guidance
and supervision.
<ucknow
Date8
Mr. !.$. 2ingh Mr. 2achin =umar
(&!D" ($rofessor"
Dept. &C Dept. of &C
0mity 2chool of ngineering & (echnology
0mity 1niversity* <ucknow* 1.$.
3
/
5n!e0
2. No. Contents $age No.
.. Introduction >
a" 0)out the company >
)" ?enesis >
c" 0wards & 0ccolades @
d" =ey $eople A
e" $resent Customers .-
f" $roducts and their Capacities ..
,. Introduction to (raining .,
a" $C9 $rinting ,.
)" 0utomatic Insertion of components ,,
c" Manual Insertion of components ,,
d" Inspection of 0ssem)ly ,3
e" 2oldering
f" Circuit testing ,3
g" $ackaging
6. 9asics .@
3. 7ork Instructions ,3%,/
/. $roducts
a" <? (# ,B%66
)" $hilips Induction Cooker 63%6/
c" <andis C ?yr 6B%6>
d" $hilips !DM 6@
B. Conclusion 6A
B
5ntro!uction
A7out The Company
&ead+uartered in Noida* Dixon is a leading lectronics Manufacturing
2ervices (M2" provider focused on delivering high +uality* Cost ffective
2olutions for Consumer electronics and home appliances for the Domestic
(India" and International markets. (hey run B state%of%art manufacturing
plants* where they manufacture C(#D<CD* 7asherD7ashing machine* D#D*
4uicerDMixerD?rinder* 2et (op 9oxes & <D <ighting 2olutions
Dixon is I2! A--- certified and also I2! .3--. certified. (hey are committed
to ?reen. In their Consumer lectronic 9usiness they are <ead Eree & 'o&2
('estriction of &aFardous 2u)stances Directive" compliant manufacturing
$rocess & are committed to education upliftment of )ackward class.
In India it is the largest !M to )ig names like <? lectronics* (ata 2ky*
7eston* 'eliance 'etail* 7almart* 0irtel* $hilips India and (C<.
!"#"S$S
.AA6 G sta)lishment of the Company
.AA/ G 0dded $hilips as a Customer
,--3 % sta)lished 2M( <ines
,--/ % .--H D#D 'e+uirement for $hilips
,--B % <. in ?lo)al tender of (N ?ovt.* for C(#Is
(../ million supplied"
,--> % 2et (op 9oxes Manufacturing
,--> % sta)lished <CD $roduction line for $hilips
,--@ % 2tarted CE< production for $hilips
,--@ % 2et up Design & Marketing company for 2(9
,--A % 2heet Metal & $lastic Molding
,--A % 's. 3- Cr. Investment )y M!$ (Moti <al !swal $rivate +uity".
,--A % 2et up New Eactory in Dehradun & Noida
,--A % !DM C(# 2et 0pproved )y $hilips
,--A % 7ashing Machine
>
A%A&'S ( ACC)*A'"S
DixonIs unwavering commitment to +uality has yielded outstanding
results. (oday it is recogniFed as the most preferred vendor with world class
+uality systems. Eor two consecutive years it has )een awarded )y the
?overnment of India for outstanding export performance in the field of
color (elevisions.
!ver the years* it has esta)lished strong associations with consumer
electronics giants in India. 2imply )ecause* this is due to the fact that the
company has* consistently excelled in their standards of safety* relia)ility
and on time delivery.
Some of the other a"ar!s that ha8e come Di0on9s "ay are:
J I2! A--.8,--@ D .3--.8,--3 accreditation for all units.
J 0ward from MI( (Ministry of Information (echnology" for excellence
in electronics.
J 9eing rated as K?reenK 2upplier )y $hilips continuously since 2eptem)er5
,--,
J 'ewarded )y <?I< as KChampionK of the year for achieving the targets in
all Ltrs.
J 2amman $atra award for highest tax payer in north region from ?ovt. of
India.
1ighting Science ties up "ith Di0on to enter 5n!ia
Mr. 4ames &aworth* C! and Chairman of the 9oard*
<ighting 2cience ?roup* with Mr. 2unil #achani* Chairman and MD* Dixon
(echnologies.
9ut the company is not resting on its laurels. &aving achieved a leadership
status in the domestic consumer electronics market with its alliance partners*
Dixon is now ready to repeat the performance in the international arena as
well.
@
Key People
Mr. Sunil Vachani (Chairman cum Managing Director)
Mr. 2unil #achani is one of the leading and most
respected Industrialists in the country today. &e is the Chairman of
the lectronics 2oftware xport $romotion Council of India. &e is
also the &onorary Counselor ?eneral for the 'epu)lic of 9enin.
Mr. Atul B. Lall (Deputy Managing Director &
Chief Executie !fficer)
Mr. 0tul 9. <all is one of the most experienced
professionals today with over ,/ years experience in the Consumer
lectronics Industry. &aving ?raduated from 9.I.(.2 $ilani* he is
now part of the faculty in many leading ducational Institutions
across the country.
A
C12(!M'2
P&)'UCT ( CAPAC$T+
.-
Capacity
Color (elevision , Million per annum
<CD /-*--- per annum
D#D , Million per annum
CE< <amps B- Million per annum
CE< Circuits B- Million per annum
lectronic 9allast B Million per annum
7ashing MachineD7asher ,*/-*--- per annum
2et (op 9oxes . Million per annum
At NOIDA
<ocated on the left )ank of the Mamuna river and is e+uidistant from
?haFia)ad and Delhi. It was developed near Delhi* across river Mamuna* in
the .A>-Is as a modern industrial city.
Caacit!
C(# $C9 6.B Million per annum
D#D , Million per annum
2et (op 9ox . Million per annum
CE< .B Million per annum
lectronic 9allast B Million per annum
CE< $C9 Capacity 6B Million $cs. per annum
..
5ntro!uction to Training
(ask8 $rinting* 0ssem)ling and (esting of $C9

Duration8 . month
2teps8
I. $C9 $rinting
II. 0utomatic Insertion of components (via machines 2M( &
(&("
III. Manual Insertion of components ((&("
I#. Inspection of 0ssem)ly
#. 2oldering
#I. Circuit testing
.,
#II. $ackaging
Process 6lo" chart
Kitting of components
.. (ake relevant drawing of the )oard to )e assem)led.
,. Calculate the components +uantity%wise and pitch%wise.
6. $ut the components in transparent envelop.
3. $ut sticker on each envelops mentioning card name* +uantity* pitch and
name of the
forming machine on which the components are to )e formed.
B. <oad the components for forming
.6
T " S T $ # !
$ $ S T A ! " $ # S " & T $ ) #
$ # S P " C T $ ) #
% A , " S ) * ' " & $ # !
$ # S P " C T $ ) # ) - A S S +
$ S A T ! " C ) M P ) # " # T S $ # S " & T $ ) #
P C B P & " P A & A T $ ) #
C ) M P ) # " # T S - ) & M $ # !
. $ T T $ # ! ) - C ) M P ) # " # T S
T " S T $ # !
$ $ S T A ! " $ # S " & T $ ) #
$ # S P " C T $ ) #
% A , " S ) * ' " & $ # !
$ # S P " C T $ ) # ) - A S S +
$ S A T ! " C ) M P ) # " # T S $ # S " & T $ ) #
P C B P & " P A & A T $ ) #
C ) M P ) # " # T S - ) & M $ # !
. $ T T $ # ! ) - C ) M P ) # " # T S
Tape an! Reel
a8e Sol!er Machine layout
.3
a8e Sol!ering Process
6lu0ing Process
./
Sol!ering Process
Common Defects in Assem7ly

N 7rong polarity
.B
N 7rong value
N Component leg )end
N Improper insertion
N 2older 9ridging
N Dry solder
N No 2older
N <essDxcess 2older
Re"or/ an! Repair Steps
.>
E0ternal features of a PC#
#asics
$C9
0 'rinted circuit board or PCB is used to mechanically support and
electrically connect electronic components using conductive pathways* tracks
or signal traces etched from copper sheets laminated onto a non%conductive
su)strate. (he 0ustrian engineer $aul isler invented the printed circuit while
working in ngland around .A6B as part of a radio set.
(here are three )asic varieties of printed circuit )oards8 singlesided* dou)le
sided and multilayered
.@
.. 2ingle sided $C98 conductors on only one surface of a dielectric
)ase.
,. Dou)le sided $C98 conductors on )oth sides of a dielectric )ase*
usually the two layers are interconnected )y platedthroughholes
($(&s".
6. Multilayer8 conductors on 6 or more layers separated )y
dielectric material and the layers are interconnected )y $(& or pads.
3 layers $C9 is a sandwich of , dou)le layered $C9s. <ikewise B layer
$C9 is a sandwich of 6 dou)le layered $C9. (his sandwiching is done )y
placing oxidiFing material )etween dou)le layered $C9s. (he spatial and
density re+uirement and the circuitry complexity determine the type of )oard
to )e produced.
Through :ole Technology
N (his is the technology used world wide for the assem)ly of electronic )oard.
N ?radually this technology is disappearing and it is overcoming )y 2urface
Mount (echnology.
N <arge varieties of leaded components are used for the assem)ly of the
electronic )oard )y inserting the leads of the components into the holes of the
$C9.
N (he electronic components are inserted into plated through holes ($(&2" in
the $C9 and soldered on )ottom side using wave soldering
.A
SMDs VERSUS CONVENTIONAL COMPONENTS
(he compact siFe of 2MD components greatly reduces the area in a $rinted
circuit )oard* thus increasing packaging density.
In surface mount technology* )oth components as
conductive paths on
$C9 are installed on the same side where
0s in thru hole technology* the components are mounted on the one side and
conductive paths are on the other side of a $C9*
0 circuit assem)led with 2MD components is much more
complex than
0n identical circuit assem)led with conventional
components. 1se of 2MDs
reduces the $C9 siFe in e+uipment which in turn
minimiFes the
e+uipment
siFe.
,-
Advantages of Using SMT
$C9 siFe reduction.
'<C losses reduction.
Component density increases
More function can )e incorporated in product.
0ssem)ly cost cheaper.
Initial capital cost is cheaper.
$roduction is faster.
Disadvantages of Using SMT
Component identification is difficult.
Component inspection is difficult.
'ework is difficult & fre+uently impossi)le.
Capital e+uipment costs very high.
Inflexi)le not easy to make changes excellent skilled.
Maintenance re+uired.
T:T an! SMT Comparison
,.
PC# Printing
Machine used8 &oriFon $rinter

O
&ere $C9 )oard is printed with the re+uired circuit design and after
visualiFation it is passed further for 0utomatic Insertion of components.
Automatic 5nsertion $A5*
In this process computeriFed machines are used to insert components from the
reel of components over the $C9.
,,
Manual 5nsertion $M5*
$C9 from 0I reaches to MI for manual insertion of some components. 9elow
is the machine to cut extra leads from some components.
5nspection of Assem7ly
5nspection !ocument
N 9oard inspection document is known as Cronar sheet. !n a transparent
plastic sheet the physical geography of the assem)led )oard is photographed .
It is made to the siFe of the )oard.
N Detail of the each component is mentioned on the figure of each component.
N (he cronar sheet is superimposed on the )oard and the value of the
components are compared.
N 0s per the cronar sheet of the )oard* it is inspected and sent for wave
soldering. If any pro)lem is found it is sent )ack to the operator.
,6
N (he inspected )oard is sending for testing on respective machine.
Circuit Testing
(esting of components location and soldering takes place.
or/ 5nstructions:
7ear wrist )and8
0n antistatic wrist stra', E"D wrist stra'* or (round bracelet is an antistatic
device used to safely ground a person working on very
sensitive electronic e+uipment* to prevent the )uildup of static electricity on
hisDher )ody* which can result in electrostatic discharge(2D" It is used in the
,3
electronics industry )y workers working on electronic devices which can )e damaged
)y 2D.

Check Iron (emp.* Iron ?rounding
1se cali)rated multimeter
Check for any N? or faulty component
Check replaced component with 9!M (9ill !f Materials % 0 document
that sets out +uantity re+uired* manufacturerIs part num)ers* device descriptions*
value* type or siFe* and reference designators.".
Check component value
1se 2older wire 20CP 6-> lead free* 'o&2
<ead%free solders are )ased on A/H tin metal with the addition of small amounts
(around .H" of silver* copper* )ismuth and other metals. 2tandard tinDlead solder is
B-H tin* 3-H lead. Most lead%free solders have a melting point some 6-D6/ QC
a)ove that of B-D3- tinDlead solder. (herefore the soldering process has to )e
performed at temperatures of around ,// QC rather than the more normal ,6/ QC.
(he maximum temperature rating of most components is ,B- QC* thus restricting
the use of an optimum temperature.
1se Elux @.6 <
1se 0ntistatic )rush and gloves8
0n antistatic agent is a compound used for treatment of materials or their
surfaces in order to reduce or eliminate )uildup of static electricity generally
caused )y the tur)oelectric effect. Its role is to make the surface or the material
itself slightly conductive* either )y )eing conductive itself* or )y
a)sor)ing moisture from the air* so some humectants can )e used. (he
,/
molecules of an antistatic agent often have )oth hydrophilic and hydropho)ic
areas* similar to those of a surfactantR the hydropho)ic side interacts with the surface
of the material* while the hydrophilic side interacts with the air moisture and
)inds the water molecules.
1se $C9 cleaning thinner 'E @-- % 0<$&0 'E%@--8
It provides the )roadest process window for a no%clean flux with less than /H solids
content. 0<$&0 'E%@-- is designed to provide excellent soldering results (low
defects rates"* even when the surfaces to )e soldered (component leads and pads"
are not highly soldera)le. 'E@-- works particularly well with )are copper )oards
protected with organic or rosinDresin coatings and with tin%lead coated $C9Is.
0<$&0 'E%@-- is used successfully in )oth tin%lead and lead%free applications.
$roduct8 <? (# 9oard ,. inches

Manual Insertion8
Clenching stage
,B
Components8
&!<D'%M!<D 092 <D
<D (<ight mitting Diode" D< ..- DE12I!N(
, ,%$IN for checking ckt in 4I?
$C9 :igs are used to test $C9s. (hey have a dump )oard inside the
:ig which can find faults in the $C9s.
C!NN. ('MIN0< .%$IN
CID 2!C=( @%$IN to attach to picture tu)e
0# (0udio%#ideo" 4ack 'C0%$$.* .,B%-3 $0''
, ,%$IN wafer assem)ly plug 6BB%-3* 3%$IN plug
(uner
0n electronic receiver that detects and demodulates and amplifies
transmitted signals of particular fre+uency.
$ower switch
,>
4I? machine to tight components
Molding 2tage
Components
Diode%'130M 'ectifier* Diode '160M* Diode '13D
2implest type of electronic valve having two electrodes* an
anode and a cathode* )etween which a current can flow only
in one direction* used as rectifier.
2upporter G protects ckt from touching to each other.
'emova)le
Euse 3--- m0 ,/- #
2park ?ap .k# >./mm
'es ../ D.7* ,k>D,7* ../-&MD.7* .--k-&M* ,7*
,@
'es ..@D,7
Mylar .-6DB6- #*3>6DB6- #* ,,6D3-- #* .-,D.B-- #*
,-3DB6- #* .B3D.3-- #* @B6DB6- #* ./3D..-- #
lectronics manufacturers use Mylar (a trade name for polyester" in general%
purpose* low%cost capacitors. 0vaila)le in a wide range of values* designers
use Mylar capacitors in non%critical parts of circuits* such as for audio*
radio* and digital applications.
IC (Integrated Circuit"8 <(# @.>M%#9, 0(,3C B% $C* >@-B*
...>66 >@'-/* mounted on &eat 2ink% (D0 >,A> (2ound IC"*
#ertical <0>@.3.* 2(' B//3(2ilicon (ransistor 'egulator"
C!NN%CI'C
Capacitor8 3>- pE .-H ,---#* ,k#D,---# .,nE
,A
$.(.C .3M@6
lco8.---D,/ #* 3>-D,/ #* ,,-D.B- #* ,,-D/-- # @/ SC
207 (2urface 0coustic 7ave" Eilter D,A.-&
6-
#aristor 6=
0 8aristor is an electronic component with a Kdiode%likeK
nonlinear currentGvoltage characteristic. #aristors are often
used to protect circuits against excessive transient voltages
)y incorporating them into the circuit in such a way that*
when triggered* they will shunt the current created )y the
high voltage away from sensitive components. 0 varistor is
also known as Voltage Dependent Resistor or 2DR. 0
varistor5s function is to conduct significantly increased
current when voltage is excessive.
Crysa! 24.5"#$ 3%
0 +uartF crystal oscillator* inside its metal can* it
mechanically resonates at a very precise fre+uency. (he 6
most common applications for that fre+uency are8 pacing
(synchroniFation"* timekeeping* and radio communication
fre+uency matching.
9ox -..TE D ,>/ #
Coil >--.* /A-.
$oly ,,3D.-- #
6.
&ylco ' .,6D,--- #
<ine Noise Eilter >M&
'esistor Cement .-&M >7
A $IN wire
9ipolar (ransistor npn A #* ,/- #
2M$2 2witch
D.C. to D.C. converters and D.C. to 0.C. Converters
)elong to the category of "witched )ode Power "u''lies
#")P"$&
$ower 2upply
>-6 (ransformer
6,
Diode 'ectifierC&eat 2ink 2E0E /-3 ?
IC #ideo 0mplifier C&eat 2ink
E9( (ransformer
&arness
Einal #isual 2tage (<ocation Check"
<ead free 2oldering Machine 2ystem


$re%&eater%. (emp. 2et #alue U 3--QC
$re%&eater%, (emp. 2et value U 6B-QC
66
2older &eater (emp. 2et #alue U ,B-QC
$ulse meter U ..B mDmin
Elux Vone8 Elux ?ravity U -.@--%-.@6-
0ir pressureU ,.6 kgf
Dip (ime U ,./%3.- sec.
Cutting 2tage
Dou)le soldering
(ouch%up (remove shorting"
2ticker (e.g. .6-B DP i.e. yrWdateWDixon"
In circuit testing
?lue (on I.'.* <D* 'esistance 66- X
9ase )reaking stage
9ar Code 2tage
<? 4I? Eunction
$ower Cod Insertion
Checking (visual"
$roduct8 $hilips Induction Cooker
63
Components8
Euse .,./ 0* .,-- #
(hermistor &C(?6A (, +ty."
(ransistor IC >@,-/* /@-/-
'esistor .-- D . 7* .-- -./ 7* /. -./ 7
Cap $oly ,,-- pE D /- #*
&igh #olt
$eer
$reset .k
&eader $!2.6 G PN* 6 $IN
lco 3.>3 ED.3-- #
<ine Eilter* 9lue
0C <ine
6/
Choke Coil
9uFFer
2oldering Machine
2older &eater (emp. 2et value ,//QC
$re &eater (emp. 2et #alue 66-QC
$roduct8 <andis C ?yr

Model8 C! 2(0' G 2tarlight
6B
Materials8
Crystal 6,%>B@ k&F
Cap .-- pED , k#* 9ox ,./ nE
#D' 2%.3k/.B
lco .--TE D ,/ #* .-- TE D 3- #* 3>- TE D ,/ #* .--- TE D.- #
=ey 2witch
Eerrite 9ead <eaded Coil
Coil $C9 .- (urn
7ooden 2upport for Coil $C9
2oldering Machine
2older &eater (emp. 2et value ,3AQC
$re &eater (emp. 2et #alue 6.-QC
$ulse ..>A m D min
6>
Cutting % $C9 separator machine
&ole & (rack check
<D insertion ($hototransistor & $hotodiode" and 2oldering

In Circuit (esting 2ystem
<CD fitting and soldering
ED( 2imple Interface G programming
$C9 (esting
9attery Insertion and soldering 6.B # and 6 #
!$(! (esting
2canning of 9ar Cod
$roduct8 $hilips !DM
6@
Model8 M$? 6B-@ D 6B.@
Materials8
'C0 type 2ocket8 3 ways (79D'="* 6 ways (N7DM'"
2eparator
(ransistor npn VN6A-3 to A, 'o&2
Crystal ,> M&F &C3A12 CD% 6@ $$M
(ransistor pnp 2/@//- (, Lty."
&eader connector 3 $in ,./ mm DI$* / $in* B $in
'esistance8 ,., !& DI$ . 7 CD% /H* /.B- &M DI$ , 7 CD% /H ('o&2"
6A
Conclusion
It was a wonderful learning experience at Dixon (echnologies for a
month at Noida. I gained a lot of insight regarding almost every
aspect of factory. (he friendly welcome from all the employees is
appreciating* sharing their experience and giving their peace of
wisdom which they have gained in long :ourney of work. I hope this
experience will surely help me in my future and also in shaping my
carrier.
3-