Professional Documents
Culture Documents
DC &
Transient
Response
Outline
Pass Transistors
DC Response
Logic Levels and Noise Margins
Transient Response
RC Delay Models
Delay Estimation
Pass Transistors
We have assumed source is grounded
What if source > 0?
VDD
e.g. pass transistor passing VDD
VDD
Vg = VDD
If Vs > VDD-Vt, Vgs < Vt
Hence transistor would turn itself off
nMOS pass transistors pull no higher than VDD-Vtn
Called a degraded 1
Approach degraded value slowly (low Ids)
pMOS pass transistors pull no lower than Vtp
Transmission gates are needed to pass both 0 and 1
5: DC and Transient Response
VDD
VDD
VDD
VDD
VDD
Vs = VDD-Vtn
VDD-Vtn VDD-Vtn
VDD
VDD-Vtn
VDD-Vtn
Vs = |Vtp|
VDD
VDD-2Vtn
VSS
DC Response
DC Response: Vout vs. Vin for a gate
Ex: Inverter
When Vin = 0
->
Vout = VDD
When Vin = VDD
->
Vout = 0
VDD
In between, Vout depends on
Idsp
transistor size and current
Vin
Vout
By KCL, must settle such that
Idsn
Idsn = |Idsp|
We could solve equations
But graphical solution gives more insight
5: DC and Transient Response
Transistor Operation
Current depends on region of transistor behavior
For what Vin and Vout are nMOS and pMOS in
Cutoff?
Linear?
Saturation?
nMOS Operation
Cutoff
Vgsn < Vtn
Vin < Vtn
Linear
Vgsn > Vtn
Vin > Vtn
Vdsn < Vgsn Vtn
Vout < Vin - Vtn
Saturated
Vgsn > Vtn
Vin > Vtn
Vdsn > Vgsn Vtn
Vout > Vin - Vtn
VDD
Vgsn = Vin
Vdsn = Vout
5: DC and Transient Response
Vin
Idsp
Vout
Idsn
CMOS VLSI Design 4th Ed.
pMOS Operation
Cutoff
Vgsp > Vtp
Vin > VDD + Vtp
Linear
Vgsp < Vtp
Vin < VDD + Vtp
Vdsp > Vgsp Vtp
Vout > Vin - Vtp
Saturated
Vgsp < Vtp
Vin < VDD + Vtp
Vdsp < Vgsp Vtp
Vout < Vin - Vtp
VDD
Vtp < 0
Vin
Idsp
Vout
Idsn
CMOS VLSI Design 4th Ed.
I-V Characteristics
Make pMOS is wider than nMOS such that n = p
Vgsn5
Idsn
Vgsn4
Vgsn3
Vgsn2
Vgsn1
-Vdsp
Vgsp1
Vgsp2
-VDD
0
VDD
Vdsn
Vgsp3
Vgsp4
-Idsp
Vgsp5
Idsn, |Idsp|
Vin0
Vin5
Vin1
Vin4
Vin2
Vin3
Vin3
Vin4
Vin2
Vin1
Vout
VDD
10
Idsn, |Idsp|
Vin0
Vin5
Vin1
Vin4
Vin2
Vin3
Vin3
Vin4
Vin2
Vin1
Vout
VDD
Vin
Idsp
Vout
Idsn
VDD
11
|
Idsn
dsn, |Idsp
dsp
Vin0
Vin5
in5
Vin1
Vin4
Vin2
Vin3
Vin3
Vin4
Vin2
Vin1
in0
Vout
out
VDD
DD
12
DC Transfer Curve
Transcribe points onto Vin vs. Vout plot
Vin0
Vin5
Vin1
Vin4
Vin2
Vin3
Vin3
Vin4
Vin2
Vin1
Vout
VDD
Vin0
Vin1
Vin2
B
A
Vout
C
Vin3
D
0
VDD
Vtn
VDD/2
Vin4
E
VDD+Vtp
Vin5
VDD
Vin
13
Operating Regions
Revisit transistor operating regions
VDD
Vout
Vin
Region
nMOS
pMOS
Cutoff
Linear
Saturation
Linear
Saturation
Saturation
Linear
Saturation
Linear
Cutoff
VDD
A
Vout
D
0
Vtn
VDD/2
E
VDD+Vtp
VDD
Vin
14
Beta Ratio
If p / n 1, switching point will move from VDD/2
Called skewed gate
Other gates: collapse into equivalent inverter
VDD
p
= 10
n
Vout
2
1
0.5
p
= 0.1
n
0
Vin
5: DC and Transient Response
VDD
15
Noise Margins
How much noise can a gate input see before it does
not recognize the input?
Output Characteristics
Logical High
Output Range
VDD
Input Characteristics
Logical High
Input Range
VOH
NMH
VIH
VIL
Indeterminate
Region
NML
Logical Low
Output Range
VOL
Logical Low
Input Range
GND
5: DC and Transient Response
16
Logic Levels
To maximize noise margins, select logic levels at
unity gain point of DC transfer characteristic
Vout
Unity Gain Points
Slope = -1
VDD
VOH
p/ n > 1
Vin
VOL
Vout
Vin
0
Vtn
17
Transient Response
DC analysis tells us Vout if Vin is constant
Transient analysis tells us Vout(t) if Vin(t) changes
Requires solving differential equations
Input is usually considered to be a step or ramp
From 0 to VDD or vice versa
18
Vin (=
t ) u(t t0 )VDD
Vin(t)
Vout(t)
Cload
dVout (t )
I dsn (t )
=
dt
Cload
I dsn (t )
V
V
(
)
DD
2
V (t )
VDD Vt out
2
5: DC and Transient Response
Idsn(t)
Vin(t)
t t0
Vout > VDD Vt
V (t ) V < V V
out
t
out
DD
Vout(t)
t0
19
Delay Definitions
tpdr: rising propagation delay
From input to rising output
crossing VDD/2
tpdf: falling propagation delay
From input to falling output
crossing VDD/2
tpd: average propagation delay
tpd = (tpdr + tpdf)/2
tr: rise time
From output crossing 0.2
VDD to 0.8 VDD
tf: fall time
From output crossing 0.8
VDD to 0.2 VDD
5: DC and Transient Response
20
Delay Definitions
tcdr: rising contamination delay
From input to rising output crossing VDD/2
tcdf: falling contamination delay
From input to falling output crossing VDD/2
tcd: average contamination delay
tpd = (tcdr + tcdf)/2
21
1.5
1.0
(V)
Vin
tpdf = 66ps
tpdr = 83ps
Vout
0.5
0.0
0.0
200p
400p
600p
800p
1n
t(s)
22
Delay Estimation
We would like to be able to easily estimate delay
Not as accurate as simulation
But easier to ask What if?
The step response usually looks like a 1st order RC
response with a decaying exponential.
Use RC delay models to estimate delay
C = total capacitance on output node
Use effective resistance R
So that tpd = RC
Characterize transistors by finding their effective R
Depends on average current as gate switches
5: DC and Transient Response
23
Effective Resistance
Shockley models have limited value
Not accurate enough for modern transistors
Too complicated for much hand analysis
Simplification: treat transistor as resistor
Replace Ids(Vds, Vgs) with effective resistance R
Ids = Vds/R
R averaged across switching of digital gate
Too inaccurate to predict current at any given time
But good enough to predict RC delay
24
RC Delay Model
Use equivalent circuits for MOS transistors
Ideal switch + capacitance and ON resistance
Unit nMOS has resistance R, capacitance C
Unit pMOS has resistance 2R, capacitance C
Capacitance proportional to width
Resistance inversely proportional to width
d
d
k
s
s
kC
R/k
kC
2R/k
g
kC
kC
d
k
s
kC
g
kC
d
25
RC Values
Capacitance
C = Cg = Cs = Cd = 2 fF/m of gate width in 0.6 m
Gradually decline to 1 fF/m in nanometer techs.
Resistance
R 6 K*m in 0.6 m process
Improves with shorter channel lengths
Unit transistors
May refer to minimum contacted device (4/2 )
Or maybe 1 m wide device
Doesnt matter as long as you are consistent
5: DC and Transient Response
26
2 Y
2C
2C
2C
2C
Y
R
R
C
C
C
d = 6RC
5: DC and Transient Response
27
28
2
3
3
3
29
5C
2C
2
2C
2C
3C
5C
3C
5C
3C
2C
2C
2C
3
3
3
9C
3C
3C
3C
3C
30
Elmore Delay
ON transistors look like resistors
Pullup or pulldown network modeled as RC ladder
Elmore delay of RC ladder
t pd
Ri to sourceCi
nodes i
R2
R3
C1
C2
RN
C3
CN
31
9C
5hC
n2
3C
3 n1
h copies
t pdr=
( 9 + 5h ) RC
=
t pdf
=
3C
( 3C ) ( R3 ) + ( 3C ) ( R3 + R3 ) + ( 9 + 5h ) C ( R3 + R3 + R3 )
(11 + 5h ) RC
32
Delay Components
Delay has two parts
Parasitic delay
9 or 11 RC
Independent of load
Effort delay
5h RC
Proportional to load capacitance
33
Contamination Delay
Best-case (contamination) delay can be substantially less than
propagation delay.
Ex: If all three inputs fall simultaneously
2
9C
5hC
n2
3C
3 n1
3
3C
tcdr
5
R
=
( 9 + 5h ) C =
3 + h RC
3
3
34
Diffusion Capacitance
We assumed contacted diffusion on every s / d.
Good layout minimizes diffusion area
Ex: NAND3 layout shares one diffusion contact
Reduces output capacitance by 2C
Merged uncontacted diffusion might help too
2C
2C
Shared
Contacted
Diffusion
Isolated
Contacted
Diffusion
Merged
Uncontacted
Diffusion
2
3
3
3C 3C 3C
7C
3C
3C
35
Layout Comparison
Which layout is better?
VDD
VDD
GND
5: DC and Transient Response
GND
CMOS VLSI Design 4th Ed.
36