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2013 Nanotechnology 24 165402
(http://iopscience.iop.org/0957-4484/24/16/165402)
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IOP PUBLISHING
NANOTECHNOLOGY
doi:10.1088/0957-4484/24/16/165402
Thin Film Laboratory, Department of Physics, Indian Institute of Technology Delhi, Hauz Khas,
New Delhi 110016, India
2
Department of Physics and Astrophysics, University of Delhi, Delhi 110007, India
E-mail: brmehta@physics.iitd.ernet.in
1. Introduction
Graphene with its two-dimensional honeycomb lattice of
tightly packed carbon atoms has attracted phenomenal
interest due to its new physics and unique electronic,
electrical, mechanical and optical properties. The mobility
of charge carriers in suspended graphene samples goes up
to 200 000 cm2 V1 s1 for carrier densities below 5
109 cm2 at temperatures near absolute zero [1, 2]. The
experimentally measured values of thermal conductivity (at
room temperature) and the thermoelectric power of graphene
are 30005000 W mK1 [3] and 50100 V K1 [4, 5],
respectively. Recent experiments have established graphene
as the strongest material with second-, third-order elastic
stiffness and intrinsic strength for monolayer graphene of
0957-4484/13/165402+08$33.00
R Kumar et al
2. Experimental details
Two types of graphene layers (i) prepared using the MPCVD
technique (designated as G1) and (ii) prepared using a
chemical route (RGO) procured from ACS Materials USA
(designated as G2) were used in this study.
The graphene films were grown on 25 m thick Cu foil
(99.98%, Sigma Aldrich, item no. 349208) using the MPCVD
technique with CH4 , H2 and Ar as the precursor forming
gases. Before deposition, Cu foil was cleaned in acetic acid
followed by de-ionized water and isopropyl alcohol to remove
the copper oxide present at the surface. Keeping the copper
foil substrate at a temperature of about 750 C, a plasma was
created by using H2 (400 sccm) and Ar (30 sccm) at a gas
pressure of 30 Torr with a microwave (2.45 GHz) power of
1.5 kW. After annealing the Cu foil for about 20 min, CH4
(10 sccm) was introduced and a graphene layer was deposited
for 5 min. The substrate was allowed to cool down naturally.
2
R Kumar et al
Figure 1. The Raman spectra, AFM micrograph and section profile are shown in (a), (b) and (c) for G1; and (d), (e) and (f) for G2,
respectively.
R Kumar et al
Figure 2. FESEM micrograph of MPCVD prepared graphene film G1 transferred on (a) polished Si (G1PS) and (b) textured Si (G1TS)
substrate and chemically prepared graphene film G2 spin coated on (c) polished Si (G2PS) and (d) textured Si (G2TS) substrate,
respectively.
R Kumar et al
Figure 3. (a) Measured transmittance and reflectance as a function of wavelength of a MPCVD prepared graphene layer (G1) deposited on
quartz glass (G1Q) and polished Si (G1PS) textured Si substrate (G1TS), respectively. (b) Measured transmittance and reflectance as a
function of wavelength of a chemically prepared graphene layer (G2) deposited on quartz glass (G2Q) and polished Si (G2PS) textured Si
substrate (G2TS), respectively. (c) Measured reflectance as a function of wavelength of reference silicon nitride ARC on textured Si
(SNTS) MPCVD prepared graphene layer (G1) and chemically prepared graphene layer (G2) deposited on textured Si substrate.
R Kumar et al
R Kumar et al
Figure 5. FDTD simulated electric field intensity distribution for different model configurations: (a) M1, silicon nitride reference
antireflection coating on textured Si (TS + SN); (b) M2, polished Si with SiO2 and then two graphene layers (PS + SO + G + G); and
(c) M3, textured Si with SiO2 and then two graphene layers (TS + SO + G + G). The vertical scale Y (m) is the silicon to source stack
height and the horizontal scale X (m) is material width.
4. Conclusion
Acknowledgments
R Kumar et al
References