Professional Documents
Culture Documents
PN2222A PZT2222A MMBT2222A: NPN General Purpose Amplifier
PN2222A PZT2222A MMBT2222A: NPN General Purpose Amplifier
MMBT2222A
PZT2222A
C
E
C
TO-92
BE
SOT-23
SOT-223
Mark: 1P
MMPQ2222
SOIC-16
NMT2222
C2
E1
C1
C
B2
E2
SOT-6
B1
Mark: .1B
Parameter
Value
Units
V
VCEO
Collector-Emitter Voltage
40
VCBO
Collector-Base Voltage
75
VEBO
Emitter-Base Voltage
6.0
IC
TJ, Tstg
1.0
-55 to +150
*These ratings are limiting values above which the serviceability of any semiconductor device may be impaired.
NOTES:
1) These ratings are based on a maximum junction temperature of 150 degrees C.
2) These are steady state limits. The factory should be consulted on applications involving pulsed or low duty cycle operations.
(continued)
Electrical Characteristics
Symbol
Parameter
Test Conditions
Min
Max
Units
OFF CHARACTERISTICS
V(BR)CEO
I C = 10 mA, IB = 0
40
V(BR)CBO
I C = 10 A, IE = 0
75
V(BR)EBO
I E = 10 A, I C = 0
VCE = 60 V, VEB(OFF) = 3.0 V
6.0
ICEX
ICBO
IEBO
VCB = 60 V, IE = 0
VCB = 60 V, I E = 0, TA = 150C
VEB = 3.0 V, IC = 0
IBL
V
10
nA
0.01
10
10
A
A
nA
20
nA
ON CHARACTERISTICS
hFE
DC Current Gain
VCE(sat )
VBE( sat)
35
50
75
35
100
50
40
0.6
300
0.3
1.0
1.2
2.0
V
V
V
V
fT
Cobo
Output Capacitance
8.0
pF
Cibo
rbCC
Input Capacitance
25
pF
150
pS
NF
Noise Figure
4.0
dB
Re(hie)
IC = 100 A, VCE = 10 V,
RS = 1.0 k, f = 1.0 kHz
IC = 20 mA, VCE = 20 V, f = 300 MHz
60
10
ns
ns
SWITCHING CHARACTERISTICS
300
MHz
td
Delay Time
tr
Rise Time
25
ts
Storage Time
225
ns
tf
Fall Time
I B1 = IB2 = 15 mA
60
ns
Spice Model
NPN (Is=14.34f Xti=3 Eg=1.11 Vaf=74.03 Bf=255.9 Ne=1.307 Ise=14.34f Ikf=.2847 Xtb=1.5 Br=6.092 Nc=2 Isc=0
Ikr=0 Rc=1 Cjc=7.306p Mjc=.3416 Vjc=.75 Fc=.5 Cje=22.01p Mje=.377 Vje=.75 Tr=46.91n Tf=411.1p Itf=.6
Vtf=1.7 Xtf=3 Rb=10)
(continued)
Thermal Characteristics
Symbol
PD
Characteristic
Max
RJC
RJA
Symbol
PD
PN2222A
625
5.0
83.3
*PZT2222A
1,000
8.0
200
125
Characteristic
mW
mW/C
C/W
C/W
Max
**MMBT2222A
350
2.8
357
RJA
Units
Units
MMPQ2222
1,000
8.0
mW
mW/C
C/W
C/W
C/W
125
240
*Device mounted on FR-4 PCB 36 mm X 18 mm X 1.5 mm; mounting pad for the collector lead min. 6 cm2.
**Device mounted on FR-4 PCB 1.6" X 1.6" X 0.06."
500
VCE = 5V
400
125 C
300
200
25 C
100
- 40 C
0
0.1
0.3
1
3
10
30
100
I C - COLLECTOR CURRENT (mA)
300
P 19
= 10
- 40 C
0.8
25 C
0.6
125 C
0.4
1
IC
10
100
- COLLECTOR CURRENT (mA)
Collector-Emitter Saturation
Voltage vs Collector Current
0.4
= 10
0.3
125 C
0.2
25 C
0.1
- 40 C
10
100
I C - COLLECTOR CURRENT (mA)
500
P 19
Base-Emitter Saturation
Voltage vs Collector Current
1
500
Typical Characteristics
Base-Emitter ON Voltage vs
Collector Current
1
VCE = 5V
0.8
- 40 C
0.6
25 C
125 C
0.4
0.2
0.1
1
10
I C - COLLECTOR CURRENT (mA)
P 19
25
(continued)
Typical Characteristics
(continued)
500
100
CB
20
= 40V
CAPACITANCE (pF)
Collector-Cutoff Current
vs Ambient Temperature
10
1
0.1
f = 1 MHz
16
12
C te
8
C ob
4
25
50
75
100
125
TA - AMBIENT TEMPERATURE ( C)
150
0.1
1
10
REVERSE BIAS VOLTAGE (V)
100
P 19
Switching Times
vs Collector Current
10
320
TIME (nS)
V cc = 25 V
240
160
t off
80
V cc = 25 V
240
ts
160
tr
tf
80
td
t on
0
10
Ic
IB1 = IB2 =
100
I C - COLLECTOR CURRENT (mA)
0
10
1000
100
I C - COLLECTOR CURRENT (mA)
P 19
Power Dissipation vs
Ambient Temperature
1
PD - POWER DISSIPATION (W)
TIME (nS)
320
400
Ic
10
SOT-223
0.75
TO-92
0.5
SOT-23
0.25
25
50
75
100
o
TEMPERATURE ( C)
125
150
1000
(continued)
Test Circuits
30 V
200
16 V
1.0 K
0
200ns
500
6.0 V
- 15 V
1k
30 V
1.0 K
0
200ns
50
37