2

1
REVISIONS
ECN NO.

DATE

DESCRIPTION

APPROVED

PRODUCTION RELEASE

6.000

PIN #1 ID

3.000

0.400 X 45

3X R 0.500

CHAMFER

4.400

0.203 REF

4.340

5.574

REF 6.000

4.140

0.490
0.340
TOP VIEW

0.200

0.350
TYP

0.400

REF 0.800

0.150

d 0.08

NOTES

BOTTOM VIEW

1. MATERIALS:

LEAD FRAME: COPPER 194FH, THK = 0.2030.008

5.300

BODY: SEMICONDUCTOR MOLDING EPOXY, CONTACT QUIK-PAK FOR DETAILS.

2. FINISH:

12

LEAD FRAME: ELECTROLESS NICKEL PER MIL-C-26074, CLASS 1,

0.597

100 TO 300 MICROINCHES (2.5um - 7.6um) THICK.

GOLD PLATE PER MIL-G-45204, TYPE 3, GRADE A, CLASS 1

0.800

(40 TO 80 MICROINCHES (1um - 2um) THICK).

BODY SURFACE FINISH: VDI 21-24 (1.12-1.6 Ra).

4.140
4.340

4.640

3. PACKAGE MISMATCH: BODY OFFSET TO LEAD FRAME = 0.076mm MAX

5.300

4. UNLESS OTHERWISE SPECIFIED, RADIUS ON ALL MOLDED EDGES

AND CORNERS = 0.25mm MAX.

SECTION A-A

QUIK-PAK

5. PACKAGE CONFORMS TO JEDEC MO-220.

www.icproto.com

DRAWN
THIRD ANGLE

DATE

CAD DEPT.

BY

PROJECTION
APP
BY

DATE

STEVE S.

UNLESS OTHERWISE SPECIFIED

DIMENSIONS ARE IN

MILLIMETER

0.15

X.XXX 0.050

X.XXXX
ANGLES:

-- 1

DO NOT SCALE DRAWING

4/29/10

6mm

4/29/10

6mm

QFN 48 LEAD OmPP

CUSTOMER
---

TOLERANCES ARE:
X.XX

10987 VIA FRONTERA

SAN DIEGO, CA. 92127
PHONE: (858) 674-4676
FAX: (858) 674-4681

SIZE
THIS DOCUMENT CONTAINS INFORMATION PROPRIETARY

TO QUIK-PAK, AND REPRODUCTION IN ANY FORM

IS NOT PERMITTED WITHOUT WRITTEN AUTHORIZATION

FROM QUIK-PAK, DIV OF DELPHON IND.

SCALE

PART NO.

NONE

CAD
FILE

REV

QP-QFN48-6MM-.4MM

A1
SHEET

OF