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Freescale Semiconductor
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MPX4250
Rev 7, 1/2009
MPX4250
Series
0 to 250 kPa (0 to 36.3 psi)
0.2 to 4.9 V Output
Application Examples
Ideally Suited for Microprocessor or
Microcontroller-Based Systems
Features
Package
Device Name
Options
Unibody Package (MPX4250 Series)
MPX4250D
Tray
MPX4250GP
Tray
Case
No.
None
867
MPX4250DP
867C
Tray
867B
# of Ports
Single
Dual
Gauge
Pressure Type
Differential Absolute
MPX4250D
MPX4250GP
MPX4250DP
UNIBODY PACKAGES
MPX4250D
CASE 867
MPX4250GP
CASE 867B
Device Marking
MPX4250DP
CASE 867C
Pressure
Operating Characteristics
Table 1. Operating Characteristics (VS = 5.1 Vdc, TA = 25C unless otherwise noted, P1 > P2.
Decoupling circuit shown in Figure 3 required to meet electrical specifications.)
Characteristic
Pressure Range
Supply Voltage
Symbol
Min
Typ
Max
Unit
POP
250
kPa
VS
4.85
5.1
5.35
Vdc
Io
7.0
10
mAdc
(0 to 85C)
Voff
0.139
0.204
0.269
Vdc
(0 to 85C)
VFSO
4.844
4.909
4.974
Vdc
(0 to 85C)
VFSS
4.705
Vdc
(0 to 85C)
1.4
%VFSS
V/P
18.8
mV/kPa
tR
1.0
ms
Io+
0.1
mAdc
20
ms
0.5
%VFSS
(1)
(2)
Supply Current
Minimum Pressure Offset @ VS = 5.1 Volts(3)
Full Scale Output @ VS = 5.1 Volts
(4)
(6)
Sensitivity
Response Time
(7)
(8)
Stability(9)
Output deviation from a straight line relationship with pressure over the specified pressure range.
Output deviation at any temperature within the operating temperature range, after the temperature is cycled to
and from the minimum or maximum operating temperature points, with zero differential pressure applied.
Output deviation at any pressure within the specified range, when this pressure is cycled to and from the
minimum or maximum rated pressure, at 25C.
Output deviation over the temperature range of 0 to 85C, relative to 25C.
Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85C, relative to 25C.
The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS, at 25C.
7. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a
specified step change in pressure.
8. Warm-up Time is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized.
9. Offset Stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.
MPX4250
2
Sensors
Freescale Semiconductor
Pressure
Maximum Ratings
Symbol
Value
Unit
PMAX
1000
kPa
Storage Temperature
TSTG
40 to +125
TA
40 to +125
Operating Temperature
1. Exposure beyond the specified limits may cause permanent damage or degradation to the device.
Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip.
VS
Thin Film
Temperature
Compensation
and
Gain Stage #1
Sensing
Element
GND
Gain Stage #2
and
Ground
Reference
Shift Circuitry
Vout
MPX4250
Sensors
Freescale Semiconductor
Pressure
On-chip Temperature Compensation and Calibration
Figure 2 illustrates the differential/gauge pressure sensing
chip in the basic chip carrier (Case 867). A fluorosilicone gel
isolates the die surface and wire bonds from the environment,
while allowing the pressure signal to be transmitted to the
sensor diaphragm.
The MPX4250 series pressure sensor operating
characteristics and internal reliability and qualification tests
are based on use of dry air as the pressure media. Media,
other than dry air, may have adverse effects on sensor
.
Fluoro Silicone
Die Coat
Stainless Steel
Metal Cover
Die
P1
Wire Bond
Epoxy Case
Lead Frame
P2
Output
Vs
IPS
1.0 F
GND
0.01 F
470 pF
3.5
Transfer Function:
Vout = Vs* (0.00369*P + 0.04) Error
VS = 5.1 Vdc
Temperature = 0 to 85C
TYP
3.0
2.5
2.0
MAX
MIN
1.5
1.0
0.5
0
10
20
30
40
50
60
70
80
90
100
110
120
130
140
150
160
170
180
190
200
210
220
230
240
250
260
0
Pressure in kPa
MPX4250
4
Sensors
Freescale Semiconductor
Pressure
Transfer Function (MPX4250)
Nominal Transfer Value: Vout = VS x (0.00369 x P + 0.04)
(Pressure Error x Temp. Factor x 0.00369 x VS)
VS = 5.1 0.25 Vdc
4.0
3.0
Temperature
Error
Factor
2.0
Temp
Multiplier
40
0 to 85
+125
3
1
3
1.0
0.0
40
20
20
40
60
80
100
120
140
Temperature in C
NOTE: The Temperature Multiplier is a linear response from 0C to 40C and from 85C to 125C.
Pressure
Error
(kPa)
4.0
3.0
2.0
1.0
0
1.0
2.0
25
50
Pressure
(kPa)
3.0
4.0
5.0
Pressure
Error (Max)
0 to 250 kPa
3.45 kPa
MPX4250
Sensors
Freescale Semiconductor
Pressure
PACKAGE DIMENSIONS
C
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION -A- IS INCLUSIVE OF THE MOLD
STOP RING. MOLD STOP RING NOT TO EXCEED
16.00 (0.630).
R
POSITIVE PRESSURE
(P1)
M
B
-AN
PIN 1
SEATING
PLANE
DIM
A
B
C
D
F
G
J
L
M
N
R
S
-TG
J
S
F
D 6 PL
0.136 (0.005)
STYLE 1:
PIN 1.
2.
3.
4.
5.
6.
STYLE 2:
PIN 1.
2.
3.
4.
5.
6.
VOUT
GROUND
VCC
V1
V2
VEX
T A
STYLE 3:
PIN 1.
2.
3.
4.
5.
6.
OPEN
GROUND
-VOUT
VSUPPLY
+VOUT
OPEN
INCHES
MILLIMETERS
MAX
MIN
MAX MIN
16.00
0.595
0.630 15.11
13.56
0.514
0.534 13.06
5.59
0.200
0.220
5.08
0.84
0.027
0.033
0.68
1.63
0.048
0.064
1.22
0.100 BSC
2.54 BSC
0.40
0.014
0.016
0.36
18.42
0.695
0.725 17.65
30 NOM
30 NOM
12.57
0.475
0.495 12.07
11.43
0.430
0.450 10.92
0.090
0.105
2.29
2.66
OPEN
GROUND
+VOUT
+VSUPPLY
-VOUT
OPEN
P
0.25 (0.010)
T Q
-A-
U
W
X
R
PORT #1
POSITIVE
PRESSURE
(P1)
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCH.
L
V
PORT #2 VACUUM (P2)
PORT #1 POSITIVE
PRESSURE (P1)
-Q-
PORT #2
VACUUM
(P2)
B
PIN 1
C
SEATING
PLANE
-T-
-TJ
S
SEATING
PLANE
G
F
D 6 PL
0.13 (0.005)
DIM
A
B
C
D
F
G
J
K
L
N
P
Q
R
S
U
V
W
X
INCHES
MIN
MAX
1.145
1.175
0.685
0.715
0.405
0.435
0.027
0.033
0.048
0.064
0.100 BSC
0.014
0.016
0.695
0.725
0.290
0.300
0.420
0.440
0.153
0.159
0.153
0.159
0.063
0.083
0.220
0.240
0.910 BSC
0.182
0.194
0.310
0.330
0.248
0.278
STYLE 1:
PIN 1.
2.
3.
4.
5.
6.
MILLIMETERS
MIN
MAX
29.08
29.85
17.40
18.16
10.29
11.05
0.68
0.84
1.22
1.63
2.54 BSC
0.36
0.41
17.65
18.42
7.37
7.62
10.67
11.18
3.89
4.04
3.89
4.04
1.60
2.11
5.59
6.10
23.11 BSC
4.62
4.93
7.87
8.38
6.30
7.06
VOUT
GROUND
VCC
V1
V2
VEX
MPX4250
6
Sensors
Freescale Semiconductor
Pressure
PACKAGE DIMENSIONS
PAGE 1 OF 2
MPX4250
Sensors
Freescale Semiconductor
Pressure
PACKAGE DIMENSIONS
PAGE 2 OF 2
MPX4250
8
Sensors
Freescale Semiconductor
MPX4250
Rev. 7
1/2009