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Tda1562 PDF
Tda1562 PDF
Tda1562 PDF
DATA SHEET
TDA1562Q
70 W high efficiency power
amplifier with diagnostic facility
Preliminary specification
File under Integrated Circuits, IC01
1998 Apr 07
Philips Semiconductors
Preliminary specification
TDA1562Q
FEATURES
Fixed gain
Thermally protected
Flexible leads.
GENERAL DESCRIPTION
The device can be used for car audio systems (e.g. car,
radio and boosters) as well as mains fed applications (e.g.
midi/mini audio combinations and TV sound).
Temperature protection.
No switch-on or switch-off plops
PARAMETER
supply voltage
CONDITIONS
MIN.
TYP.
MAX.
UNIT
operating
14.4
18
non-operating
30
load dump
45
Iq(tot)
on and mute;
RL = open circuit
110
150
mA
Istb
standby current
standby
50
VOO
on and mute
100
mV
on mute
VOO
30
mV
Gv
voltage gain
25
26
27
dB
Zi(dif)
90
150
Po
output power
45
55
THD
THD = 0.5%
THD = 10%
60
70
Po = 1 W
0.03
Po = 20 W
0.06
DDD active
10
SVRR
on and mute
60
70
dB
CMRR
on
70
80
dB
ISRR
mute
80
90
dB
Vn(o)
on
100
150
1998 Apr 07
Philips Semiconductors
Preliminary specification
TDA1562Q
ORDERING INFORMATION
PACKAGE
TYPE NUMBER
NAME
TDA1562Q
DESCRIPTION
DBS17P
VERSION
SOT243-1
BLOCK DIAGRAM
C1
status I/O
mode
select
16
CLASS-B
CLASS-H
FAST MUTE
C1+
5
VP2
10
LOAD DUMP
PROTECTION
TEMPERATURE
SENSOR
disable
STANDBY
MUTE
ON
VP1
LIFT-SUPPLY
CURRENT
PROTECTION
VP*
IN+
+
PREAMP
75
k
75
k
Vref
PREAMP
+
TDA1562Q
LOAD
DETECTOR
DYNAMIC
DISTORTION
DETECTOR
11
POWERSTAGE
diagnostic
OUT
VP*
14
15 k
signal 17
GND
OUT+
DIAGNOSTIC
INTERFACE
FEEDBACK
CIRCUIT
IN
POWERSTAGE
disable
LIFT-SUPPLY
TEMPERATURE
PROTECTION
15
C2
6
PGND1
reference
voltage
MGL264
13
C2+
1998 Apr 07
12
PGND2
Philips Semiconductors
Preliminary specification
TDA1562Q
PINNING
SYMBOL
PIN
DESCRIPTION
IN+
IN
C1
MODE
C1+
PGND1
power ground 1
OUT+
positive output
DIAG
VP1
supply voltage 1
VP2
10
supply voltage 2
VP1 9
OUT
11
negative output
VP2 10
PGND2
12
power ground 2
OUT 11
C2+
13
Vref
14
C2
15
STAT
16
status I/O
SGND
17
signal ground
handbook, halfpage
IN+ 1
IN 2
C1 3
MODE 4
C1+ 5
PGND1 6
OUT+ 7
DIAG 8
TDA1562Q
PGND2 12
C2+ 13
Vref 14
C2 15
STAT 16
SGND 17
MGL263
1998 Apr 07
Philips Semiconductors
Preliminary specification
TDA1562Q
FUNCTIONAL DESCRIPTION
INPUT
This input has 3 possibilities:
1. LOW, fast mute: the circuit remains switched on, but
the input signal is suppressed
2. MID, class-B: the circuit operates as class-B
amplifier, the high power supply voltage is disabled,
independent of the case temperature
1998 Apr 07
Philips Semiconductors
Preliminary specification
supply
voltage
TDA1562Q
on
mute
0
HIGH
mode select
input
MID
LOW
Vref
reference
voltage
VRT
0
HIGH
status I/O
input
MID
LOW
HIGH
status I/O
output
MID
LOW
output voltage
across load
quick start
mute
zerocross change
class B/H-operation
fast mute
function
zerocross mute
function
supply mute
function
MGL272
1998 Apr 07
Philips Semiconductors
Preliminary specification
TDA1562Q
TEMPERATURE DETECTION
SHORT-CIRCUIT PROTECTION
HIGH
handbook, full pagewidth
mode select
input
MID
LOW
output voltage
across load
HIGH
diagnostic
output
no load
LOW
t
short-circuit to
supply or ground
clipping signal
1998 Apr 07
short-circuit
across load
MGL265
Philips Semiconductors
Preliminary specification
TDA1562Q
class-H
maximum output
voltage swing
class-B
0
HIGH
diagnostic
output
LOW
HIGH
status I/O
output
MID
LOW
100
120
145
150
160
Tj (C)
MGL266
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
VP
IOSM
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
operating
18
non-operating
30
45
10
supply voltage
Vsc
18
Tstg
storage temperature
55
+150
Tamb
ambient temperature
40
Tj
junction temperature
150
Ptot
60
note 1
Note
1. Tj is a theoretical temperature which is based on a simplified representation of the thermal behaviour of the device.
Tj = Tc + P Rth(j-c), where Rth(j-c) is a fixed value to be used for the calculation of Tj. The rating for Tj limits the
allowable combinations of power dissipation P and case temperature Tc (in accordance with IEC 747-1).
1998 Apr 07
Philips Semiconductors
Preliminary specification
TDA1562Q
THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
CONDITIONS
Rth(j-c)
Rth(j-a)
VALUE
in free air
UNIT
1.5
K/W
40
K/W
DC CHARACTERISTICS
VP = 14.4 V; RL = 4 ; Tamb = 25 C; measurements in accordance with Fig.10; unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
supply voltage
Vth+
mute on
Vth
on mute
VPH1
Iq
quiescent current
on and mute;
RL = open circuit
Istb
standby current
14.4
18
200
mV
110
150
mA
standby
50
DC output voltage
on and mute
6.5
VOO
on and mute
100
mV
VOO
on mute
30
mV
Vp
II
input current
VMODE = 14.4 V
20
Vth1+
threshold voltage
standby mute
Vth1
threshold voltage
mute standby
VmsH1
200
mV
Vth2+
threshold voltage
mute on
4.2
Vth2
threshold voltage
on mute
3.3
VmsH2
200
mV
VP
input voltage
IstH
VSTAT = 14.4 V
mA
IstL
VSTAT = 0 V
400
Vth1+
threshold voltage
Vth1
threshold voltage
VstH1
200
mV
Vth2+
threshold voltage
class B class H
4.2
Vth2
threshold voltage
class H class B
3.3
VstH2
200
mV
1998 Apr 07
Philips Semiconductors
Preliminary specification
TDA1562Q
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Vst(mute)
Ist(clB)
Vst(clB)
Ist(clH)
Vst(clH)
Tc(th)
Ist = 2.2 mA
IIst = 15 AI
Ist = 140 A
2.2
mA
0.5
15
2.0
3.0
140
VP 2.5
120
0.6
output voltage
RL
100
Tj(th)
145
1998 Apr 07
active LOW
10
Philips Semiconductors
Preliminary specification
TDA1562Q
on-mode
fast mute
VPH1
Vth
VP
Vth+
MGL267
on-mode
mute
standby
VmsH2
VmsH1
Vth1
Vth2
Vth1+
Vms
Vth2+
MGL268
class-H
class-B
fast mute
VstH1
Vth1
VstH2
Vth2
Vth1+
Vst
Vth2+
MGL269
1998 Apr 07
11
Philips Semiconductors
Preliminary specification
TDA1562Q
AC CHARACTERISTICS
VP = 14.4; RL = 4 ; Rs = 0 ; f = 1 kHz; Tamb = 25 C; measurements in accordance with Fig.10; unless otherwise
specified.
SYMBOL
Po
PARAMETER
output power
CONDITIONS
MIN.
TYP.
MAX.
UNIT
16
20
60
70
45
55
fro(h)(P)
20
kHz
THD
Po = 1 W
0.03
Po = 20 W
0.06
DDD active
10
25
26
27
dB
20
kHz
90
150
60
70
dB
90
dB
Gv
voltage gain
fro(h)(G)
Zi(dif)
differential input
impedance
SVRR
Gv (1 dB); note 2
CMRR
on; note 4
70
80
dB
ISRR
mute; note 5
80
90
dB
Vn(o)
on; note 6
100
150
60
Notes
1. The low frequency power roll-off is determined by the value of the electrolytic lift capacitors.
2. The low frequency gain roll-off is determined by the value of the input coupling capacitors.
3. Supply voltage ripple rejection is measured across RL; Vripple = Vripple max. = 2 VPP.
4. Common mode rejection ratio is measured across RL; Vcm = Vcm max. = 2 VPP. CMMR [dB] = differential gain
(Gv) + common mode attenuation (Ac), (Test setup according Fig. 9; mismatch of input coupling capacitors
excluded).
5. Input signal rejection ratio is measured across RL; Vi = Vi(max) = 2 VPP. ISSR [dB] = different gain (Gv) + mute
attenuation (Am)
6. Noise output voltage is measured in a bandwidth of 20 Hz to 20 kHz.
7. Noise output voltage is independent of source impedance Rs.
1998 Apr 07
12
Philips Semiconductors
Preliminary specification
TDA1562Q
+ VP
9
Ci
Ci
VCM
10
supply
7
RL
TDA1562
11
2
14
SGND
17
PGND1 PGND2
6
12
GND
MGL270
QUALITY SPECIFICATION
Quality in accordance with SNW-FQ-611 part E, if this type is used as an audio amplifier.
1998 Apr 07
13
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mode
select
100 nF
16
CLASS-B
CLASS-H
FAST MUTE
1/2*Rs
LIFT-SUPPLY
75
k
CURRENT
PROTECTION
AMP.
75
k
IN
AMP.
TDA1562Q
LOAD
DETECTOR
+ VP
10
k
DYNAMIC
DISTORTION
DETECTOR
RL =
4
diagnostic
11
OUT
VP*
14
Vref
15 k
17
OUT+
POWERSTAGE
disable
LIFT-SUPPLY
TEMPERATURE
PROTECTION
reference
voltage
signal GND
13
C2+
12
PGND2
GND
MGL271
TDA1562Q
4700 F
6
PGND1
Preliminary specification
15
C2
handbook, full pagewidth
14
FEEDBACK
CIRCUIT
1/2*Rs
POWERSTAGE
DIAGNOSTIC
INTERFACE
audio
source
10 F
disable
VP*
1
IN+
100 nF
LOAD DUMP
PROTECTION
TEMPERATURE
SENSOR
STANDBY
MUTE
ON
VP1
Philips Semiconductors
status I/O
C1+
3
+ VP
1998 Apr 07
C1
2200
F
100
nF
VP2
10
4700 F
Philips Semiconductors
Preliminary specification
TDA1562Q
PACKAGE OUTLINE
DBS17P: plastic DIL-bent-SIL power package; 17 leads (lead length 12 mm)
SOT243-1
non-concave
Dh
Eh
A2
B
j
E
A
L3
Q
c
v M
17
e1
bp
e2
w M
10 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A2
bp
D (1)
Dh
E (1)
mm
17.0
15.5
4.6
4.2
0.75
0.60
0.48
0.38
24.0
23.6
20.0
19.6
10
12.2
11.8
2.54
e1
e2
1.27 5.08
Eh
L3
Z (1)
3.4
3.1
12.4
11.0
2.4
1.6
4.3
2.1
1.8
0.8
0.4
0.03
2.00
1.45
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
REFERENCES
IEC
JEDEC
EIAJ
ISSUE DATE
95-03-11
97-12-16
SOT243-1
1998 Apr 07
EUROPEAN
PROJECTION
15
Philips Semiconductors
Preliminary specification
TDA1562Q
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (Tstg max). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
This data sheet contains target or goal specifications for product development.
Preliminary specification
This data sheet contains preliminary data; supplementary data may be published later.
Product specification
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
1998 Apr 07
16
Philips Semiconductors
Preliminary specification
TDA1562Q
NOTES
1998 Apr 07
17
Philips Semiconductors
Preliminary specification
TDA1562Q
NOTES
1998 Apr 07
18
Philips Semiconductors
Preliminary specification
TDA1562Q
NOTES
1998 Apr 07
19
Internet: http://www.semiconductors.philips.com
SCA59
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The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
545102/1200/01/pp20