R. Ludwig and G.

Bogdanov
RF Circuit Design: Theory and Applications
2nd edition

Figures for Chapter 1

Antenna

Mixer
DAC PA

Transmitter Bandpass Switch

Digital Circuitry

Digital-to-Analog Power Amplifier Filter

Converter OSC.

Local Oscillator

ADC LNA

Low-Pass Receiver Low

Analog-to-Digital Filter Noise Amplifier
Converter

Mixed Signal Analog Circuits

Circuits

Figure 1-1 Block diagram of a generic RF system.

 RF Blocking
Networks
100 pF 100 pF

+ +
VB VC
8.2 pF 8.2 pF
RFC RFC
Stability CB
Resistor To the Second
R Stage
CB
RFin C3 C4
Interstage
DC Blocking C1 C2 Blocking Capacitor
Capacitor BFG425W Interstage Matching
Network
Input Matching
Network

Figure 1-2(a) Simplified circuit diagram of the first stage of a 2 GHz power
amplifier for a mobile phone.
 0.5 inch Interstage Matching
Network

First Stage
Transistor
BFG425 Second Stage
Input Matching

BFG21
Transistor
Network
Output
Matching
Network

RFin RFout

Dual Transistor IC DC Bias Network

Figure 1-2(b) Printed circuit board layout of the power amplifier.

 x
E = Ex x

y
H = Hy y

Figure 1-3 Electromagnetic wave propagation in free space. The electric and mag-
x, ^
netic fields are shown at a fixed instance in time as a function of space ( ^ y are unit
vectors in x- and y-direction).
.
Table 1-1 Frequency bands and their applications

Frequency Band Frequency Typical Application

VHF (Very High Frequency) 88 108 MHz FM broadcasting

UHF (Ultrahigh Frequency)
UHF (Ultrahigh Frequency)
SHF (Superhigh Frequency)
SHF (Superhigh Frequency)
SHF (Superhigh Frequency)
X Band
Ku Band
K Band
Ka Band
824 894 MHz CDMA mobile phone service
810 956 MHz GSM mobile phone service
2,400 MHz WLAN
5,000 5,850 MHz Unlicensed National
Information Infrastructure
6,425 6,523 MHz Cable Television Relay
3,700 4,200 MHz Geostationary fixed satellite
service
8 12.5 GHz Marine and airborne radar
12.5 18 GHz Remote sensing radar
18 26.5 GHz Radar
26.5 40 GHz Remote sensing radar
.
2

1.5
Solder
, mm

1
Al
Au
0.5

Cu
0 4
10 105 106 107 108 109
f, Hz

6
Figure 1-4 Skin depth behavior of copper Cu = 64.5 10 S/m, aluminum
6 6
Al = 40.0 10 S/m, gold Au = 48.5 10 S/m, and typical solder
6
solder = 6.38 10 S/m.
 High current Low current
2a density density

|Jz| /Jz0

r
Current Flow a a

Figure 1-5(a) Schematic cross-sectional AC current density representation

normalized to DC current density.
 2
1.8
1.6
1.4
1 kHz
1.2
|Jz| /Jz0

1
0.8
10 kHz 100 MHz
0.6
0.4 100 kHz 1 GHz

0.2 1 MHz 10 MHz

0
0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1
r, mm

Figure 1-5(b) Frequency behavior of normalized AC current density for a copper

wire of radius a = 1 mm.
 101

Cu, 0.1 mm

100
R, /m

101 Solder, 1 mm

Al, 1 mm Cu, 1 mm
102

100 101 102 103 104 105 106 107 108 109
f, Hz

Figure 1-6 The exact theoretical per-unit-length resistance as a function of

frequency for round wires of varying materials and radii. The dashed lines represent
the DC and skin depth based resistance approximations.
Figure 1-7 One- and quarter-watt thin-film chip resistors in comparison with a
conventional quarter-watt resistor.
 Ca

L R L

Cb

Figure 1-8 Electric equivalent circuit representation of a high frequency resistor.

 C1

L2 R L1 L2

C2

Figure 1-9 Electric equivalent circuit representation of a wire-

wound resistor at high frequency.
 104

Inductive effect
103
Ideal resistance

102 Capacitive effect

|Z|,

101

100 4
10 105 106 107 108 109 1010
f, Hz

Figure 1-10 Absolute impedance value of a 2000- thin-film resistor as

a function of frequency.
 C
L Rs
Re

Figure 1-11 Electric equivalent circuit of a capacitor at high frequency.

 104

103 Real capacitor

102
|Z|,

101

100

Ideal capacitor
1
10

102 6
10 107 108 109 1010
f, Hz

Figure 1-12 Absolute value of the capacitor impedance as a func-

tion of frequency.
 Terminations

Electrodes

Ceramic material

Figure 1-13 Actual construction of a surface-mounted ceramic multilayer capacitor.

 Cd Cd

Rd Rd

Figure 1-14 Distributed capacitance and series resistance in the inductor coil.
 L Rs

Cs

Figure 1-15 Equivalent circuit of the high-frequency inductor.

 l

2a

2r
d

Figure 1-16 Inductor dimensions of an air-core coil.

 105

Ideal
4
10 inductor

103
|Z|,

102

Real inductor
1
10

100 7
10 108 109 1010
f, Hz

Figure 1-17 Frequency response of the impedance of an RFC.

 Table 1-2 Standard sizes of chip resistors
Geometry Size Code Length L, mils Width W, mils
0402 40 20
0603 60 30
0805 80 50
1206 120 60
L W
1812 120 180
 Marking
Protective coat
Resistive layer

End contact
End contact
Inner electrodes Ceramic substrate

Figure 1-18 Cross-sectional view of a typical chip resistor.

 Chip capacitor Ribbon lead or wire

Circuit traces

Figure 1-19 Cross section of a typical single-plate capacitor connected to the

board.
 Dual capacitor Quadrupole capacitor

Figure 1-20 Clusters of single-plate capacitors sharing a common dielectric

material.
Figure 1-21 Typical size of an RF wire-wound air-core inductor (courtesy of Coil-
craft, Inc.).
 Terminal Terminal
Air bridge

Figure 1-22 Flat coil configuration. An air bridge is made by using either a wire or a
conductive ribbon.
 Surface-mounted
active devices

Buried
Capacitor
Vias

Buried
Resistor
Metalization
on
Ceramic
Metal
Core

Figure 1-23 Construction of a three-dimensional LTCC/HTCC module made out of

individual layers of ceramic tape that are collated, stacked, and fired (courtesy of
Lamina Ceramics Inc.).
 105 102
Self resonance
104 101

103 100
|Z|,

Inductive behavior

Q
2
10 101
Resistance Capacitive
101 dominates behavior 102

100 1 2 3 4 5 6 7
103 1
10 10 10 10 10 10 10 10 102 103 104 105 106 107
f, Hz f, Hz

Figure 1-24 Impedance and quality factor behavior of a real, non-magnetic core in-
ductor as measured by the HP 4192A LCR meter.
Figure 1-25 LCR meter with a plastic core torroidal inductor con-
nected to the test fixture and a measurement taken at 100 kHz.