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VOUT
ADJ
ADJ
VIN
VOUT
VIN
VOUT
VOUT
ADJ
VIN
TO-252
Pass
VIN Element VOUT
Overtemp &
Overcurrent 1.2V 10A
ADJ
LR8
Notice: Stresses above those listed under Maximum Ratings may cause permanent damage to the device. This is
a stress rating only and functional operation of the device at those or any other conditions above those indicated in the
operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods
may affect device reliability.
*
VOUT
VIN VIN VOUT
ADJ R1
C1 C2
LR8 RLOAD
R2
R2
* Required for conditions where VIN is less than VOUT VOUT = 1.20V 1+ + IADJ
R1
+
VIN = (VOUT + 12V) to 450V
VAUXILIARY
VOUT1
+
VIN VOUT
VOUT1
LR8 ADJ
VCC -
FB PWM IC
1.20V
IOUT =
R R
+ VIN VOUT
LR8 ADJ
VIN =
(VOUT + 12V) to 450V
Load
1.0F
-
Temperature Variation
1.30
1.25
VIN VOUT = 1.2V
LR8 1.20
VOUT (V)
ADJ
1.15
12V 2.4k 1.0F
1.10
1.05
1.00
-50 -25 0 25 50 75 100 125
T (junction) (OC)
Adjustment Current
12
11
VIN = 12V
12V, ADJ 9
VIN = 200V
7
6
-50 -25 0 25 50 75 100 125
T (junction) (OC)
Load Regulation
5.2
6.04k
ADJ
1%
VOUT (V)
4.8
0 2 4 6 8 10
IOUT (mA)
VOUT (V)
0V to 50V 1.0F 1k 3
18.2k
1% 2
0
0 10 20 30 40 50
VIN (V)
Ripple Rejection
-65
LR8
ADJ 6.04k -63
20VP-P
1%
@ 60Hz
1.0F
RLOAD -62
65V 18.2k
1%
-61
-60
0 2 4 6 8 10
IOUT (mA)
25
lCL (mA)
20
15
10
-40 -20 0 20 40 60 80 100
Temperature (OC)
18.2k
1% 0V
VOUT
0V
400V 400V
VIN VIN
0V 0V
5.0V 5.0V
VOUT VOUT
0V 0V
XXXXXX LR8
XXXX e3 N3 e3 XXXYYWW LR8516
YWWNNN 516343 NNN 343
XXXX LR
XXXXX e3 8K4 e3
YYWWNNN 1516343
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for product code or customer-specific information. Package may or
not include the corporate logo.
Note: For the most current package drawings, see the Microchip Packaging Specification at www.microchip.com/packaging.
D
D1 C
E H E1
1 2 3
L
b b1 A
e
e1
Note: For the most current package drawings, see the Microchip Packaging Specification at www.microchip.com/packaging.
Symbol A b b1 C D D1 E E1 e e1 H L
MIN 1.40 0.44 0.36 0.35 4.40 1.62 2.29 2.00 3.94 0.73
Dimensions 1.50 3.00
NOM - - - - - - - - - -
(mm) BSC BSC
MAX 1.60 0.56 0.48 0.44 4.60 1.83 2.60 2.29 4.25 1.20
JEDEC Registration TO-243, Variation AA, Issue C, July 1986.
This dimension differs from the JEDEC drawing
Drawings not to scale.
Note: For the most current package drawings, see the Microchip Packaging Specification at www.microchip.com/packaging.
Package: N3 = TO-92
K4 = TO-252 (D-PAK)
N8 = TO-243AA (SOT-89)
Note the following details of the code protection feature on Microchip devices:
Microchip products meet the specification contained in their particular Microchip Data Sheet.
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchips Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as unbreakable.
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchips code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
QUALITY MANAGEMENT SYSTEM Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
CERTIFIED BY DNV Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Companys quality system processes and procedures
are for its PIC MCUs and dsPIC DSCs, KEELOQ code hopping
== ISO/TS 16949 == devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchips quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.