Professional Documents
Culture Documents
THIRD SEMESTER
Economics
EO1423 [3003]
Definition, nature and scope of Economics. Introduction to Micro and Macro Economics. Law of
demand and supply, Elasticity of demand and supply. Cardinal and ordinal approaches of Utility.
Production: Laws of production, Cost and revenue analysis, Various market situations, Break-even
analysis, Capital Budgeting Macro Economics: National Income and it’s Concepts, Value of money
and its Changes, Foreign Exchange Rate, Monetary and fiscal Policies and other Macro concepts
(Balance of Payment, Business Cycle etc.)
MA1309 [2 1 0 3]
Complex Variables: C-R equations, conformal mappings, bilinear transformation, Taylor’s and
Laurent series, Residues. Laplace Transforms: Transforms of elementary functions, inverse
transforms, convolution theorem. Application of Laplace transforms in the solutions of differential
equations. Fourier series: Fourier series, Dirichlet’s condition, even and odd functions, half Range
series. Fourier Transforms: Fourier integrals, Complex Fourier transform, Fourier sine & cosine
transforms, solution of heat and wave equations. Vector calculus & Tensor: Gradient, Divergence
and curl, Line, surface and volume integrals, related theorems. Transformation of co-ordinates:
Curvilinear, Cylindrical, Spherical Co-ordinate systems.
EC1304 [3 1 0 4]
Basic structure and operation of Computers: Introduction to the basic operational concepts of
digital computer, Von-Neumann and Harvard Architecture, Overview of typical computer
architecture: Accumulator based, General Register based and Stack based; Instruction Set:
Instruction formats, types and addressing modes, Reverse Polish notation, Opcode Encoding
techniques, Stack Addressing, RISC and CISC architecture; Data Path and Control Unit Design:
Basic concepts, Data path: Fast adders, subtractors, Types of Bus structures, Control Unit design
methods-Hardwired and micro programmed; Computer Arithmetic: Multiplication of signed and
unsigned integers, Booths Multiplication algorithm, Division, Floating Point Arithmetic Operation;
Memory Organization: Memory hierarchies: types of ROMs, Main memory: SRAM and DRAM,
Memory Address Map; Cache memory: mapping functions – associative, direct and set-associative;
Input/Output Organization: Introduction to Input/output Organization: Types of I/O: Isolated I/O,
memory mapped I/O, programmed I/O, Interrupt driven I/O; Introduction to Direct Memory Access
(DMA) & DMA Controller, DMA transfer methods; Introduction to Arbiters and Bus Arbitration
methods; Introduction to Multicore and Multi-processor Systems: Parallel Processing, Pipelining
Structure of General-purpose Multiprocessor, Interconnection networks, Memory organization in
Multiprocessors, Cache Coherence, Multicore organization: hardware and software performance
issues.
EC1306 [3 1 0 4]
Junction Diode Analysis: Built in voltage, Transition and diffusion capacitances; Introduction to BJT:
hybrid model, Hybrid – TT model, analysis of CE, CB, and CC configurations of BJT amplifiers, Miller’s
theorem; Multistage amplifiers: Distortion in amplifiers, Frequency response of
an amplifier, bandwidth of cascaded amplifiers, frequency response of an RC coupled, direct coupled
and transformer coupled stages; Power amplifiers: Classification of large signal amplifiers, Analysis
and design with respect to efficiency, linearity and harmonic distortions of classes of Amplifier; FET:
Structure of JFET and MOSFET, Characteristics, FET biasing, small signal, Analysis of CS, CD and
CG amplifiers at low and high frequencies; Feedback amplifiers: Concept of feedback, types of
feedback – their advantages and disadvantages, effect of feedback on frequency response &
impedances; Oscillators: Barkhausen criterion for sustained oscillation, Nyquist criterion for stability
of amplifier, Types of Oscillators: Hartley and Colpitt oscillator; Wein bridge oscillator; RC phase
shift oscillator; crystal oscillator; Introduction to Power Electronic
Devices.
Network theorems and elements: Reciprocity, Tellegen’s and maximum power transfer theorems.
Networks with dependent sources. Mutual Inductance; Introduction of graph theory: basics of graph
theory, cut set matrix, tie set matrix, current and voltage equation; Transients analysis: Impulse, Step,
Ramp and sinusoidal response analysis of first order and second order circuits. Time domain &
transform domain (Laplace) analysis. Initial and final values of networks; Two port networks: Two
Port General Networks: Two port impedance, admittance, hybrid, ABCD parameters and their inter
relations. Equivalence of two ports. Interconnection of two port networks: filters, image impedance
symmetric T and pi networks; Network functions: Terminals and terminal pairs, Driving point
Impedance, admittance and transfer functions. Procedure for finding network functions for general
two terminal pair networks, Stability & causality, Hurwitz polynomial, positive real function;
Network synthesis: The four-reactance function forms, specification for reactance function. Foster
form of reactance networks. Cauer form of reactance networks Synthesis of R-L and R-C and L-C
networks in Foster and Cauer forms.
EC1332 [0 0 2 1]
EC1333 [0 0 2 1]
Experiments of this lab are implemented at Hardware as well as software level.
Study of Implementation techniques of combinational circuits;
Implementation of Arithmetic circuits using logic gates and MSI chips;
Building circuits using MSI chips and their applications;
Designing of sequential circuits;
Implementation of FSMs;
Design of Asynchronous sequential circuits;
Design of Combinational & Sequential Circuits using HDL
FOURTH SEMESTER
Engineering Mathematics- IV
MA1408 [3 0 0 3]
Statistics and Probability: Introduction to Probability, Baye’s theorem, Random variable, Measure
of central tendency and dispersion, Random Variables, Expectation, Moments and Moment generating
functions. Probability distributions: Binomial, Poisson, Normal, Introduction to Random
process.Numerical methods: Interpolation and extrapolation, Numerical differentiation &
integration. Solution of differential equation: Picard’s, Taylor series, Euler’s & Euler’s Modified
methods, Runge Kutta 4th order methods. Solution of system of linear algebraic equations: Gauss
Jacobi, Gauss Seidel, and relaxation methods.
EC1401 [3 1 0 4]
OPEN ELECTIVES
EC1491 [3 0 0 3]
Introduction: Units and systems, Dimensions and standards, Calibration methods, Static calibration,
Generalized Measurement System, Sensor, Basic requirements of a transducer, Classifications of
transducer. Error analysis, Statistical methods, Choice of transducer, factor influencing choice of
transducer; Characteristics of a Transducer: Static characteristics, Accuracy, Precision, Sensitivity,
Linearity, Hysteresis, Threshold, Resolution, Dead time, Dead zone, Scale range, Scale span -
Dynamic characteristics - Speed of response, Measuring lag, Fidelity, Dynamic error- mathematical
model of transducer - Zero, I, II order transducer, Response to step, ramp, impulse inputs;
Instruments: Ammeter, Voltmeter. Expression for torque of moving coil, moving iron, dynamometer,
induction and electrostatic instruments. Extension of range of instruments wattmeter, Torque
expression for dynamometer instruments. Reactive power measurement; Bridge Methods:
Measurement of inductance, capacitance and resistance using Bridge. Maxwell’s Anderson, Wein
bridge, Heaveside Cambell’s Desauty’s, Schering’s bridges, kelvin’s doublebridge, price guard wire
bridge loss of charge method, Megger, Wagners Earthing device; Transducers : Principle of
operation, construction, Characteristics and applications of potentiometer - loading effects, Strain
gauge - theory, temperature compensation, applications – RTD , Thermistors, Hotwire anemometer,
piezo resistive sensor; Inductive and capacitive transducer- Self-inductance, Mutual inductance
transducer , Induction potentiometer, LVDT, RVDT, Synchro’s, Capacitive transducer analog and
digital transducer, Thermoelectric transducer, Photovolatic cell, Hall effect Piezo electric,
Magnetostrictive.
Consumer Electronics
EC1492 [3 0 0 3]
Audio Systems: Microphones, Head Phones and Hearing Aids, Loud Speakers, Loud Speaker
Systems, Optical Recording and reproduction systems – CDs, DVDs, Blue ray technology, iPods,
MP4 players and accessories, Home Audio systems; Television: Elements of TV Communication
System, Scanning, Composite Video signal, Need for synchronizing and blanking pulses, Picture
Tubes, Construction and working of Camera Tubes, Block diagram of TV Receiver, LCD and Plasma
TV fundamentals, Block diagram and principles of working of cable TV and DTH;
Telecommunication Systems: Basics of Telephone system, Caller ID Telephone, Intercoms,
Cordless Telephones, Cellular mobile systems; Office electronics: Automatic Teller Machines,
Facsimile machines, Digital Diaries, Safety and security systems; Home electronics: Digital Camera
system, Microwave ovens, Washing Machines, Air Conditioners and Refrigerators.
Review of Vector Calculus: Cartesian coordinates, Circular, Cylindrical and Spherical co-ordinate.
Electrostatics: Coulomb's law and its applications; Electric field intensity and Electrostatic potential
due to point charges, Field due to continuous charge distribution. Electric flux and electric flux density,
Gauss's law, Gausses’s Law – Maxwell’s equation, Electric dipole and flux lines, energy density in
electrostatic fields., Electric field in material space: convection and conduction currents, conductors,
polarization in dielectrics, continuity equation and relaxation time; Electrostatic boundary condition:
dielectric-dielectric, dielectric-conductor. Poission’s and Laplace’s equations,; Magnetostatics:
Magnetic field intensity, Biot-Savart's law; magnetic flux and magnetic flux density; Ampere's law,
Maxwell’s equation, application of ampere’s law, magnetic flux density- Maxwell’s equation,
Maxwell’s equation for static fields, magnetic scalar and vector potential. magnetic boundary
conditions, magnetic energy; Electromagnetic Waves & Applications: Maxwell’s equation, Faraday’s
Law, transformer and motional electromotive forces, displacement current, Maxwell’s equation in
final form. Maxwell's equations in integral and point form for free space and material media,
Electromagnetic wave propagation: Wave propagation in lossy dielectrics, plane waves in lossless
dielectrics, plane wave in free space, plane waves in good conductors, power and the pointing vector,
reflection of a plain wave in a normal incidence. Introduction to Transmission Lines and waveguides.
Spectral analysis: Review of Fourier Transform. Introduction to Noise: Thermal Noise, Shot Noise,
Signal to Noise ratio, S/N of a tandem connection. Amplitude modulation: Generation &
Detection; Time and Frequency domain analysis of: single tone AM, Multi tone AM, DSBSC, SSB,
VSB. FDM. Angle modulation: Introduction to phase Modulation (PM) and frequency
modulation(FM), Generation & Detection; Time and frequency domain analysis of FM, Modulation
index for sinusoidal FM, Average power for sinusoidal FM, Single tone FM. Introduction to digital
signal detection: Model of Digital Communication System, Gram-schmitt orthogonalization
procedure, geometric interpretation of signals, response of bank of correlators to the noisy input,
detection of known signals in noise. Pulse modulation systems: Pulse amplitude modulation (PAM),
band width requirements and reconstruction methods, time division multiplexing (TDM), pulse
duration modulation (PDM). Base band digital data transmission: Base band digital communication
systems, multilevel coding using PAM, pulse shaping and band width consideration, inter symbol
interference (ISI), Nyquist condition for zero ISI, band-limited Nyquist pulses, the eye
diagram.Introduction to PCM, DPCM systems. Digital modulation techniques: Band pass (modulated)
digital data systems, binary digital modulation, ASK, PSK, DPSK, and FSK, M-ary data
communication systems, quadrature amplitude modulation (QAM).
OPEN ELECTIVES
Reference Books:
1. W. D. Cooper and A. D. Helstrick “Modern Electronics Instrumentation & Measurement
Techniques”, 4th edition, Pearson, 1990.
2. J. J. Carr. “Elements of Electronics Instrumentation and Measurement” 3rd edition, Pearson,
2003.
3. M. M. S Anand, “Electronics Instruments and Instrumentation Technology”,1st edition, PHI,
2009.
4. E.O. Deoblin, “Measurement systems” McGraw Hill, 4th edition, 1990.
5. S. Wolf & R.F.M Smith, “Student reference manual for Electronic and Instrumentation
measurement” PHI Publication, 2nd edition, 2004.
Industrial design: Product planning, Creativity, Aesthetics, Ergonomics, control panel organization,
Product detailing, Product finishes. Thermal management: Introduction to thermal sources, heat
calculations, heat transfer methods, heat sink selection, cooling methods in electronic systems.
Packaging Techniques: Introduction to Electronic Packaging, Microelectronics and Packaging
Technologies, Introduction to Silicon Integrated Circuit Chips, Semiconductor Devices, Area Array
Technologies: Ball Grid Arrays, Flip Chip, Chip-Scale Packaging, First Level Packages-IC packaging.
Second Level Packages: Printed Circuit Boards and Other Substrates; Third Level Packages:
Connectors, Cables, Modules, Cages and Cabinets, Reliability Prediction and Measurement. Noise
and EMI: Introduction to Noise and EMI, Interfacing of analog and digital systems. PCB design and
layout; System assembly considerations, Sources of EMI, Shielding of signal lines, Ground loops,
Introduction to functional aspects of SMPS and other power electronic equipment.
Reference Books:
Reference Books:
1. R.C. Gonzalez, R.E. Woods, “Digital Image Processing”, 3rd Edition, Pearson, 2008.
2. S. Jayaraman, S. Esakkirajan and T. Veerakumar, “Digital Image Processing”, TMH, 2010.
3. S. Sridhar, “Digital Image Processing”, Oxford University Press, 2013.
4. A.K. Jain, “Fundamentals of Digital Image Processing”, PHI, New Delhi, 2002.
Communication Lab-I
EC1534 [0 0 2 1]
Experiments of this lab are to implement in hardware, which includes:
Analog communication: Modulation schemes, Transmission and Reception
Transmission Lines & its parameters
Sampling Techniques and Time division multiplexing
Digital communication: Modulation schemes, Transmission and Reception
Advanced Modulation Formats.
Data transmission using Line coding techniques.
SIXTH SEMESTER
Antennas
EC1605 [3 1 0 4]
Introduction: Radiation Mechanism, current distribution, Antenna parameters; Vector potentials:
Electric and magnetic vector potentials, solutions for wave equations, far-field radiation, Duality
theorem, Reciprocity theorem; Linear wire Antennas: Infinitesimal, small and finite dipole Antennas,
Region separation, Half wave length dipole; Loop Antennas: Small circular loop Antenna, circular
loop with constant current, Ferrite loop; Antenna Arrays and other types of antennas: Two element
array, N-element array – uniform, broadside, ordinary end-fire, Non-uniform Amplitude Arrays,
planar and circular arrays; Qualitative study of Folded dipole, long wire, V, Rhombic, Helical, Yagi-
Uda, log-periodic, Aperture antennas, and horn Antennas, Babinet’s principle, Huygens‘s principle,
Rectangular and Circular Microstrip Patch antenna, Quality Factor, Bandwidth, Efficiency; Antenna
Measurements: Radiation Pattern measurement, Distance requirement for uniform phase, uniform
field amplitude requirement, Introduction to phase measurement; Gain Measurement: Comparison
method, Near field method, Introduction to current distribution measurement, Measurement of
antenna efficiency, measurement of Noise figure and noise temperature of an antenna polarization
measurement; Propagation of EM waves: Ground wave Propagation, Space Wave Propagation,
Troposphere and ionosphere propagation and its effect on Radio Waves.
Text books/ Reference books:
1. C. A. Balanis, Antenna Theory, 3rd Ed., John Wiley & Sons, New Delhi, 2010.
2. J. Kraus, Antenna and wave Propagation, 4th Ed, Tata McGraw – Hill, New Delhi, 2010.
3. K. D. Prasad, Antenna and Wave Propagation, 3rd Ed., Satya Prakashan, New Delhi,
2009.
4. F. E. Termen, Radio Engineering, Tata McGraw – Hill, New Delhi, 1995.
Introduction: VLSI technology trends, performance measures and Moore‗s law; MOS devices and
circuits: MOS transistors, Study of depletion and enhancement mode operations, Threshold Voltage.
Second order effects in MOSFETs; Fabrication of ICs: Lithographic process of MOS and CMOS
fabrication. N-well, P-well and twin tub processes, Latch-up in CMOS, SOI process, VLSI Yield and
economics; MOS Circuit design & layouts: Implementation of Boolean functions and combinational
circuits using switch logic & gate logic, Pass transistors and transmission gates, Pseudo NMOS
inverter, Dynamic and clocked CMOS inverters, Clocking strategies; Basic
circuit concepts and performance estimation: Sheet resistance, Standard unit of capacitance,
Estimation of delay in NMOS and CMOS inverters; Sub system design: Design strategies, Design
issues and structured approach. Design examples such as Adders, ALUs and Shifters, Design of
sequential circuits; Memory Arrays: SRAM, DRAM; Current trends: BiCMOS and GaAs devices and
circuits, Low power VLSI circuit techniques
Review of signals and systems: Time and frequency analysis of signals and systems.Transform
Analysis of LTI Systems: The frequency Response of LTI systems, Inverse system, All- Pass system,
Minimum Phase system, Linear systems with Generalized Linear Phase. Frequency domain sampling
and reconstruction of discrete time signals: Discrete-Time Processing of continuous- Time Signals,
Continuous- Time Processing of Discrete-Time Signals, Changing the Sampling Rate Using Discrete-
Time Processing. Discrete Fourier transform: Introduction, properties of the DFT, use of DFT in linear
filtering, filtering of long data sequences, DFT as linear transformation; Computation of DFT,
Decimation-in- Time and Decimation–in–frequency Algorithms. Implementation of discrete time
systems: Structures for FIR systems – Direct form, cascade form, Frequency sampling and lattice
structures. Structures for IIR systems – Direct form, cascade and parallel form. Design of IIR filters
and digital FIR filters: Classical design by impulse invariance, bilinear transformation and matched Z
transform, characteristics and design of commonly used filters – butter worth. Power spectrum
estimation: Estimation of power spectra from Finite duration of observation of signals. Non-
parametric methods of PSD estimation: Periodogram, Bartlett, Welch, Blackman and Tukey methods
(qualitative analysis).
DEPARTMENT ELECTIVES
Material properties: Physical properties, Crystal structure, Miller indices, Packing Density, Defects,
Dislocation; Crystal growth & Silicon Oxidation: Silicon Crystal Growth - Czochralski and Float Zone
Technique, Distribution of dopants, Segregation/Distribution coefficient; Silicon oxidation: Thermal
Oxidation process- Kinetics of oxide Growth; Photolithography: Photo resists, Lift Off technique,
Optical Lithography, masks, photo resists, Pattern transfer, Resolution enhancement techniques, Next
generation lithography- electron beam lithography; Diffusion & Ion implantation: Basic diffusion
process, Fick‘s law, Pre-deposition and drive-in diffusion, Diffusion profile for various dopants,
Lateral Diffusion; Range of Implanted Ions, straggle, ion stopping, ion Channeling, Annealing, Rapid
Thermal Annealing; Etching: Wet chemical etching of Silicon, Silicon dioxide, Silicon Nitride and
Aluminum. Dry etching, Plasma fundamentals and etch mechanism; Epitaxy: Epitaxial growth
technique, Molecular beam epitaxy; Metallization: evaporation and sputtering, Realizing resistor;
Single and double damascene process.
Mobile Communication
EC1657 [3 0 0 3]
An overview of C++ programming language: basic terms and operations, Data structures: definition
of basic terms (data types, abstract data types and data structure). Importance of data structures in
computer programming, Types of data structure: linear and non-linear data structure; Array:
declaration, classification, application of arrays, List: operations, list implementation (array list, linked
list), singly, doubly linked list, sorted list, Stack: operation, static and dynamic stacks, application of
stacks, Queues: operations of queues, storing queues in static or dynamic data structures, Trees: binary
search trees, trees transversal (inorder, postorder, and preorder), Common operations on a tree,
application of trees in computer programming, Hashing and hash table, garbage collection, storage
management, Analysis of algorithm, synergy between data structures and algorithm, Factors to be
considered in the choice of data structures and algorithms, Practical implementation of linear data
structures in C++.
Computer Networks and Internet: Introduction to Internet; Protocol; Network Edge: End System,
Clients, Servers; Connection-oriented and Connectionless Services; Network Core: Circuit Switching,
Packet Switching; Packet switched networks: Datagram and virtual-circuit networks, types of delay;
Protocol layers and service models. Application Layer: Principles of Network Applications; The
Web and HTTP (HyperText Transfer Protocol): Overview, Non-persistent and Persistent connections,
HTTP message format, User-Server Interaction: Cookies, HTTP content, Web caching, The
conditional GET. FTP (File Transfer Protocol): Introduction; FTP Commands and replies .
Electronics Mail in Internet: SMTP (Simple Mail Transfer Protocol), Comparison with HTTP, Mail
Access Protocols: POP3, IMAP. Domain Name Service (DNS): Services provided, Working, DNS
Caching, DNS records and messages. Transport Layer: Connectionless Transport: UDP (User
Datagram Protocol): Segment Structure, Checksum; Connection-oriented Transport: TCP
(Transmission Control Protocol): Connection, Segment Structure, RTT (Round Trip Time) estimation,
and Connection management, Delay modeling. Network Layer: Intra-Autonomous System
(Intra-AS) Routing in the Internet: RIP (Routing Information Protocol), OSPF (Open Shortest Path
First). Network Security: Introduction, Cryptography: principles, Cryptography model, Brute-force
attack, Authentication Protocols: ap1.0, ap2.0, ap3.0, ap4.0 and ap5.0; Integrity: Digital Signatures,
Message Digests, Hash Function Algorithm; Key Distribution and Certification; Access Control:
Firewall: Packet Filtering, Application Gateway. Vulnerability, Threats, Attacks and
Countermeasures: Virus, Worms, Trojan Horses, Mapping, Packet Sniffing, Spoofing, Denial-of-
Service and Distributed Denial-of-Service Attacks, Hijacking; Hacking: types of Hackers. Network
Management: Introduction, Infrastructure required, Structure of Management Framework.
Text Book:
1. S. Furber “ARM System-on- Chip Architecture”, Second Edition, Pearson Education, 2000.
2. J.R. Gibson “ARM Assembly Language-an Introduction” Dept. of Electrical Engineering and
Electronics, The University of Liverpool, 2007.
3. A. N.Sloss, Dominic Symes, Chris Wright, “ARM System Developer's Guide” Elsevier, 2004.
Reference Books:
1. B.P. Singh & Renu Singh “Advanced Microprocessors & Microcontrollers”, New Age
International, 2005.
VLSI Testing & Verification
EC1661 [3 0 0 3]
Physical Faults and their modeling: Stuck at Faults, Bridging Faults; Fault collapsing; Fault
Simulation: Deductive, Parallel and Concurrent Fault Simulation. Critical Path Tracing. ATPG for
Combinational Circuits: D-Algorithm, Boolean Differences, PODEM Random, Deterministic and
Weighted Random Test Pattern Generation; Aliasing and its effect on Fault Coverage. ATPG for
Sequential Circuits: Time Frame Expansion; Controllability and Observability Scan Design,
Boundary Scan for Board Level Testing; Memory Testing: Permanent, Intermittent and Pattern
Sensitive Faults, Marching Tests; Delay Faults. PLA Testing: Cross Point Fault Model and Test
Generation. Compression Techniques: General Aspects of Compression Techniques; Ones-Count,
Transition Count and Parity Check Compression; Syndrome Testing; Signature Analysis; Built-In-
Self-Test (BIST) Concept: Test-Pattern generation for BIST; Specific BIST Architecture – CSBL,
LOCST, CBIST, RTD, BILBO; Introduction to Built-In-Self-Repair (BISR) Approaches. System
Level Diagnosis & Repair: Introduction; Concept of Redundancy, Spatial Redundancy, Time
Redundancy, Error Correction Codes. Verification: Design verification techniques based on
simulation, analytical and formal approaches; Functional Verification, Timing Verification, Formal
Verification, Basics of Equivalence Checking and model checking, Hardware Emulation.
Introduction: Digital System implementation using MSI/LSI circuits like PLDs, PLAs and PALs. Full-
custom, semi-custom, standard cell based, Programmable ASICs – CPLDs, MPGAs and FPGAs,
FPGA Design flow. Sequential Logic Design: Introduction, Basic Bi-stable Memory Devices,
additional bi-stable devices, reduced characteristics and excitation table for bi-stable devices.
Synchronous Sequential Logic Circuit Design: Introduction, Moore, Mealy and Mixed type
Synchronous State Machines. Synchronous sequential design of Moore, Melay Machines.
Algorithmic State Machine: An Algorithm with inputs, digital solution, Implementation of traffic
light controller, ASM charts, Design Procedure for ASMs. Digital System Design: Top down and
Bottom up approach, Data Path, Control Path, Controller behavior and Design, Timing of sequential
circuits, Pipelining, Resource sharing, FSM issues: State diagram optimization, State Assignment,
Asynchronous Inputs, Output Races, Fault Tolerance. Data path and Control design using
VHDL/Verilog HDL and it’s mapping on FPGA.
1. Behrouz A. Forouzan ,“Data Communications and Networking”, 4th Edition, Tata McGraw-
Hill. 2007.
2. Andrew S. Tanenbaum , Computer Networks, 4th Edition. Prentice Hall of India, 2003.
3. William Stallings, Data & Computer communication, 8th Edition. Pearson, 2007.
OPEN ELECTIVES
Scenario of Renewable Energy (RE) Sources: Needs of renewable energy, advantages and limitations
of RE, present energy scenario of conventional and RE sources. Solar Energy: Energy available from
the sun, spectral distribution, solar radiation outside the earth’s atmosphere and at the earth’s surface,
solar radiation geometry, Instruments for solar radiation measurements, types of solar collectors, solar
energy thermal storage, heating and cooling of buildings, solar cell modules and arrays, solar cell
types, material, applications, advantages and disadvantages. Wind Energy: Energy available from
wind, basics of wind energy conversion system, windmill rotors, horizontal and vertical axes rotors,
drag, lift, torque and power coefficients, tip speed ratio, wind turbine performance curves, wind energy
potential and site selection, basics of wind farm. Bio Energy:
Types of biogas plants, biogas generation, factors affecting biogas generation, advantages and
disadvantages, biomass energy, energy plantation, gasification, types and applications of gasifiers.
Ocean Energy: OTEC principle, open, closed and hybrid cycle OTEC system, Energy from tides,
estimation of tidal power, tidal power plants, single and double basin plants, site requirements,
advantages and limitations. Geothermal energy: Introduction, vapour and liquid dominated systems,
binary cycle, hot dry rock resources, magma resources, advantages and disadvantages. Economic
Analysis: Initial and annual cost, basic definitions, present worth calculations, repayment of loan in
equal annual instalments, annual savings, cumulative saving and life cycle cost, economic analysis of
add on solar system, payback period, clean development mechanism.
Reference Books:
1. S. P. Sukhatme & J. K. Nayak “Solar Energy: Principles of Thermal Collection and Storage”
Tata McGraw-Hill Education, 3rd edition, 2008.
2. J. A. Duffie and W.A. Beckman “Solar Engineering of Thermal Processes” 4th edition John
Wiley, 2013.
3. S. N. Singh “Non-conventional energy resources”, Pearson India,2016.
4. F. Krieth , J. F. Kreider & D.Y. Goswami “Principles of Solar Energy” 3rd edition John
Wiley,1987.
EC1695 [3 0 0 3]
Basic Components of Audio and Video: Construction & Working of Microphone, types of
microphone, Construction & Working of Loud Speaker, Tweeter, Wooffer, Mid range, CCD Camera.
HI-FI and Stereophony : Meaning of Hi-Fi, Basic components, Fundamental of sound harmonics,
Loudness, Pitch, Timbre, Sensitivity, Stereophony recording, Broadcasting of stereophony and its
reproduction, Graphic equalizer, Basic idea about audio pre amplifier and power amplifiers. Scanning
and Composite Video Signal : Scanning Process, Flicker & Inter lace scanning, Contrast Ratio &
Aspect ratio and viewing distance, Composite Video signal dimensions, Horizontal and vertical sync
details, TV standards for 625 line system. Basics of T.V. Signal Transmission & Reception: Block
diagram of TV transmitter and TV Receiver. Colour T.V.: Introduction to Colour T.V. & colour T.V.
Essentials. Basic Concept of New Trends : Audio CD player, Audio conferencing, Digital versatile
disk (DVD), Home theatre system, LCD & LED TV, Plasma TV, Blue ray disc.
Reference Books:
1. A.K. Sawhney, “A Course in Electrical & Electronic Measurement & Instruments”, 2015.
2. B. Grob, C. E. Herndon, “Basic Television & Video System”, McGraw-Hill, 1999.
3. R. G. Gupta “Audio and Video Systems- Principles, Maintenance and Troubleshooting”
McGraw Hill Education Limited, 2010.
4. R.R. Gulati, “Monochrome & Colour TV System” New age International, 3rd edition, 2009.
5. R. R. Gulati, “Modern Television –Practice, Principles, Technology & Servicing”, New age
International, 3rd edition, 2007.
6. A.M. Dhake, “T.V. and Video Engineering”, McGraw Hill Education Ltd, 2nd edition, 2000.
Reference Books:
EC1634 [0 0 2 1]
Experiments of this lab are implemented using MATLAB software and Hardware on DSP Processor
Kit .
Time domain and Frequency domain Analysis of signals and systems.
Analysis in z-domain.
Filter Design.
Introduction to Code Composer Studio.
Filter Implementation using DSP Kits.
Project
EC1680 [0 0 2 1]
To design and present a project related to Electronics and Communication engineering with substantial
multidisciplinary component.