cuáles son las implicaciones de las restricciones del uso de plomo en soldadura?

reports of tin whiskers have been reported from tin-lead coatings.Whiskers evolve from tin
surfaces as a stress-relief mechanism between tin crystals. Most stress in tin deposits arises
from the growth of copper-tin intermetallics at the interface with underlying copper.With a
much slower rate of nickel-tin intermetallic formation, tin whiskers form at a much lower rate
than tin coatings on nickel underplate.
Several tin-whisker mitigation techniques have been proposed:
● Inclusion of lead, silver, and other metals in the tin deposit

● Use of a nickel tin coating as a barrier between copper and tin

● Annealing of tin as a stress relief

● Conformal coating as a barrier to whisker growth

In practice, the only effective whisker mitigation strategies involve nickel barriers and contamination
of the tin deposit with a sufficient amount of metal, such as 2 percent Pb.