ay invent Technical Reference Guide HP Compaq de71xx and dx61xx Series Business Desktop Computers Document Part Number: 361834-002 Janvary 2005 ‘This document provides information on the design, architecture, function, and capabilities of the HP Compaq de71xx and dx61xx Series Business Desktop Computers. This information may be used by engineers, technicians, administrators, or anyone needing detailed information on the products covered.{© Copyright 2005 Hewlett-Packard Development Company, LP ‘The information contained herein is subject to change Without notice. Microsoft, MS-DOS, Windows, and Windows NT are radematcs of Microsoft Corporation in the U.S. and other Ihtel, Pentium, Intel Inside, and Celeron are trademarks of Inte] Corporation in the U.S. and other countries. [Adabe, Acrobat, and Acrobat Reader are trademarks or registered trademarks of Adobe Systems Incorporated, “The only warranties for HP prodicts and services are set forth inthe express warranty statements accompanying. such products and services. Nothing herein should be construed as consututing an additional warranty. HP shall not be lable for technical or edilorial erors or omissions contained herein, “This document contains proprietary information that is protected by copyright. No part ofthis document may be photocopied. reproduced, or anslted to another language without the prior witten consent of Hewlet-Packard Company. WARNING: Text set harm or loss of life this manner indicates that failure to follow directions could result in bodily CAUTION: Tex set off in this manner indicates that failure fo follow directions could resulin damage to ‘equipment or loss of information Technical Reference Guide HP Compaq de7 Ixcx and dx6 xox Series Business Desktop Computers Second Edition (January 2005) First Edition (April 2004) Document Part Number: 361834-0021 Introduction 1.1 About this Guide 1.1.1 Online Viewing 1.1.2 Hardcopy 1.2 Additional Information Sources 1.3 Model Numbering Convention 14 Serial Number 1.5 Notational Conventions... 15.1 Values 1.5.2 Ranges 1.5.3 Register Notation and Usage 1.5.4 Bit Notation and Byte Values. 1.6 Common Acronyms and Abbreviations 2 System Overview 2.1 Introduction 2.2 Features And Options 2.2.1 Standard Features 2.2.2 Options 2.3 Mechanical Design 2.3.1 Cabinet Layouts 2.3.2. Chassis Layouts 2.3.3 Board Layouts 2.4 System Architecture 2.4.1 Intel Pentium 4 Processor. 2.42 Chipset 2.4.3 Support Components 2.4.4 System Memory 2.4.5 Mass Storage 2.46 Serial and Parallel Interfaces 2.4.7 Universal Serial Bus Interface 2.4.8 Network Interface Controller 2.4.9 Graphics Subsystem. 2.4.10Audio Subsystem 2.5 Specifications. 3 Processor/Memory Subsystem 3.1 Introduction 3.2 Pentium 4 Processor 3.2.1 Processor Overview Contents 1 1 1 1 1 1 1 1 1 1 1 1 hob bb dbo Technical Reference Guide 561834002Contents 3.2.2 Processor Upgrading 3.3 Memory Subsystem 3.4 Subsystem Configuration System Support 4.1 Introduction 4.2 PCI Bus Overview. 4.2.1 PCI Bus Transactions : 4.2.2 PCI Bus Master Arbitration .... 4.2.3 Option ROM Mapping 4.2.4 PCI Interrupts 4.2.5 PCI Power Management Support 4.2.6 PCI Sub-Busses 4.2.7 PCI Connector 4.3 AGP Bus Overview 4.3.1 Bus Transactions 4.3.2 AGP Connector 4.4 System Resources 4.4.1 Interrupts 4.4.2 Direct Memory Access. 4.5 System Clock Distribution. 4.6 Real-Time Clock and Configuration Memory. 4.6.1 Clearing CMOS 4.6.2 CMOS Archive and Restore 4.6.3 Standard CMOS Locations 4.7 System Management 4.7.1 Security Functions 4.7.2 Power Management 4.73 System Status 4.14 Thermal Sensing and Cooling 48 Register Map and Miscellaneous Functions 4.8.1 System /O Map 4.8.2 LPC47B397 UO Controller Functions Input/Output Interfaces 5.1 Introduction $.2 Enhanced IDE/SATA Interfaces 5.2.1 EIDE Interfaces 5.3 Diskette Drive Interface. 53.1 Diskette Drive Programming 5.3.2 Diskette Drive Connector 54 Serial Interface 5.4.1 Serial Connector 5.4.2 Serial Interface Programming 5.5 Parallel Interface 5.5.1 Standard Parallel Port Mode. 5.5.2 Enhanced Parallel Port Mode 5.5.3 Extended Capabilities Port Mode. 561834-002 Technical Reference GuideContents 5.5.4 Parallel Interface Programming 1s 5.5.5 Parallel Interface Connector. . : - : 17 5.6 Keyboard/Pointing Device Interface........... <8 5.6.1 Keyboard Interface Operation 118 5.6.2 Pointing Device Interface Operating : 1-20 5.6.3 Keyboard/Pointing Device Interface Programming : fees 120 5.6.4 Keyboard/Pointing Device Interface Connector 124 5.7 Universal Serial Bus Interface 1-25 5.7.1 USB Data Formats : : voeeeeeees 1-26 5.7.2. USB Programming 1-27 5.7.3 USB Connector. 128 5.7.4 USB Cable Data 1-29 5.8 Audio Subsystem cee 1229 5.8.1 Functional Analysis 1-30 5.8.2 AC9T Audio Controller 1-31 5.8.3 AC97 Link Bus 5.8.4 Audio Codec 5.8.5 Audio Programming 5.8.6 Audio Specifications 5.9 Network Interface Controller. 5.9.1 Wake-On-LAN Support 137 5.9.2 Alert Standard Format Support 1.37 5.9.3 Power Management Support 1.37 5.9.4 NIC Programming : 1-38 5.9.5 NIC Connector 1-38 5.9.6 NIC Specifications 1.39 6 Integrated Graphics Subsystem 6.1 Introduction 1 6.2 Functional Description . 1 6.2.1 Video Memory Allocation Reporting : 1 63 Display Modes eZ 64 Programming 1 6.5 Upgrading 845G-Based Graphics .. 1 6.6 VGA Monitor Connector: I 7 Power and Signal Distribution 7.1 Introduction L 7.2 Power Supply Assembly/Control 1 7.2.1 Power Supply Assembly 1 7.2.2 Power Conttol. ...... 00... wee 4 7.2.3 Power Management L 7.3 Power Distribution, 1 7.3.1 3.3/5/12 VDC Distribution. . 1 7.32 Low Voltage Production/Distribution - 7.4 Signal Distribution Technical Reference Guide 361834002 vContents 8 BIOS ROM 8.1 Introduction 8.2 ROM Flashing 8.2.1 Upgrading. 8.2.2 Changeable Splash Screen 8.3 Boot Functions. oe 8.3.1 Boot Device Order 8.3.2 Network Boot (F12) Support 8.3.3 Memory Detection and Configuration 8.3.4 Boot Error Codes . 4 Setup Utility. 5 Client Management Functions 8.5.1 System ID and ROM Type. 8.5.2 EDID Retrieve 8.5.3 Temperature Status. 8.5.4 Drive Fault Prediction 8.6 PnP Support 8.6.1 SMBIOS 8.7 Power Management Functions 8.7.1 Independent PM Support 8.8 USB Legacy Support A Error Messages and Codes B ASCII Character Set © Keyboard Index w 361834-002 Technical Reference Guide1 11 1.1.2 1.2 Introduction About this Guide ‘This guide provides technical information about HP Compaq dx71xx and de61xx series personal ‘computers that feature the Intel Pentium 4 processor and the Intel 915G chipset. This document describes in detail the system's design and operation for programmers, engineers, technicians, and system administrators, as well as end-users wanting detailed information, ‘The chapters of this guide primarily describe the hardware and firmware elements and primarily = bits 7,6, 5, and 4. Example B: IRQ37, 9 = IRQ signals 3 through 7, and IRQ signal 9 1.5.3 Register Notation and Usage ‘This guide uses standard Intel naming conventions in discussing the mictoprocessor's (CPU) internal registers, Registers that are accessed through programmable I/O using an indexing scheme are indicated using the following format: — Index port Data port In the example above, register 03C3.17h is accessed by writing the index port value 17h to the index address (03C4h), followed by a write to ora read from port 03CSh, 1.5.4 Bit Notation and Byte Values Bit designations are labeled between brackets (1¢., “bit <0 >"), Binary values are shown with the ‘most significant bit (MSb) on the far left, least significant bit (LSb) at the far right. Byte values in hexadecimal are also shown with the MSB on the left, LSB on the right. Technical Reference Guide 361834002 73Introduction 1.6 Common Acronyms and Abbreviations Table 1-1 lists the acronyms and abbreviations u; ed in this guide. Table 1-1 ‘Acronyms and Abbreviations ‘Acronym or Abbreviation Des a compere AC allernating current ACPI ‘Advanced Configuration and Power Inierface AND enalogio-digital ‘ADC Analog-o-digital convertor ‘ADD or ADD2 ‘Advanced digital display (card) AGP Accelerated grophics port APL cepplication programming interface ARC ‘Advanced Programmable Inierup! Controller APM ‘edvanced power management AOL Ales OnLAN™ ASIC epplicaionspecii inlegrated circu ASF Alen Standard Format a 1. attention (modem commands) 2. 286-based PC architecture ATA AT attachment (IDE protocol) AIAPL ‘ATA w/packe inerlace extensions av eudio-video inerleaved AGA ‘Advanced VGA AWG ‘American Wire Gauge (specification) BAT Basic assurance lest Beco binarycoded decimal Bios basic inpu'/ouiput system bis second/new revision BNC Bayonet NeilkConcelman (connector type) bps or b/s bits per second BsP Bootstrap processor BIO Buil fo order CAS column address strobe © compact disk ‘DROM compact disk readonly memory cps compact disk system CGA color graphics adapter 14 367834002 Technical Reference GuideIntroduction Table 1-1 Acronyms and Abbreviations ‘Acronym or Abbreviation oh Channel, chapter em centimeter MC cache/memery controller ‘MOS complimentary metaloxide semiconductor (configuration memory) Calle controler Cai conta codec 1. coder/decoder 2. compressor/decompressor cra Compaq cru central processing unit RIMM Continuity (blank) RIMM CRT caihode ray tube cM 1. Compag system management 2. Compag server management DAC digitalo-analog converter be direct current DCH OS compatibility hole ppc Display Data Channel DDR Double data rate (memory) DIMM dual inline memory module DIN Deuiche IndusiNorm (connector type) DP dual inline package DMA direct memory access DMI Deskop management interface opi dots per inch DRAM dynamic random access memory DRG’ deta request Dv Digital video interface dword Double word (22 bis) DD DO ‘extended data out (RAM type) EEPROM electrically eraseable PROM EGA enhanced graphics adapier EIA Elecronic Indusity Association ESA, extended ISA EP enhanced parallel port EIDE enhanced IDE Technical Reference Guide 367884002 13Introduction Table 1-1 Acronyms and Abbreviations ‘Acronym or Abbreviation FSCO Extended System Configuration Date (formal BY Environmental Variable (data) ECA Exchangeable Card Architecure FO First in/frst out mL flag (regisler) -M frequency modulation PM fast page mode (RAM type) FU Floating point unit (numeric or math coprocessor) Fes Frames per second # Foot/feet eB aigabye GMCH Graphics/memory controller hub ‘GND ground ‘GAO general purpose 1/0 ‘GPOC general purpose openollecior GART Graphics address remapping table Gul rophie user interface b hexadecimal hw hardware hex hexadecimal He Hertz (eyelespersecond) ico 170 controller hub IDE infegrated drive element TEBE Insitute of Elecical and Elecronic Engineers F inferupt flag ve interface Isc inegrated graphics controler in inch INT interrupt vo inpu/oviput PL inal program loader OA Infrared Data Association IRQ inerrupt request ISA industy standard erchivecure 1S 367834002 Technical Reference GuideIntroduction Table 1-1 ‘Acronyms and Abbreviations ‘Aerenym or Abbreviation KB/KE Tilobits/kilobyies (x 1024 bits/x 1024 byies) Kb/s Kilebis per second kg Kilogrom riz kilohertz iv Kilovolh lb pound IAN local area neiwork ‘co liguid crystal display ED lightemiting diode wee Low pin count isi Tange scale integration Isb/ise least significant bit/least significant byte LUN logical unit (SCSI) m Meter MCH Memery controller hub MX rmutimedia extensions MPEG Molion Picture Experts Group me milisecond MSb/MSB most significant bit/most significant byte mux rmuliplex MA motion video acceleration mw motion video window ° variable porameter/valve NC network inlerface card/contoller NiMH nickel metal hydride NMI rnonmaskable inferupt NRZI Nonsetutrto-zere inverted ns nanosecond NI nested task flag NISC National Television Standards Commitice NVRAM nonvolatile random access memory Os operating system PAL 1. programmable array logic 2. phase alternating line PATA Parallel ATA, Technical Reference Guide 367834002 7Introduction Table 1-1 Acronyms and Abbreviations ‘Acronym or Abbreviation PC Fersonel compuler PCA Printed cireuil assembly PC peripheral component interconnet Pole PCI Express PCM puke code modulation PCMCIA Personal Compuler Memory Card International Association PEG PCI express graphics PFC ower factor conection PIN personal idenification number FIO Programmed /O PN Fert number Post poweron self test PROM programmable read-only memory PR pointer RAM random access memory RAS row address strobe RORAM (Direct) Rambus DRAM RGB red/green/blve (monitor input) RH Relative humidity RMS, roo! mean square ROM read-only memory RPM revolutions per minote RIC real lime clock RW Read/Write SATA Serial ATA scsi small computer system interface SDR Singles data rate (memory) SDRAM ‘Synchronous Dynamic RAM spvo Seril digital video output SEC Single Edge-Connecior SECAM sequential colour avec memaire (sequential color wth memory) SF sign flag SGRAM ‘Synchronous Graphics RAM 1S 367834002 Technical Reference GuideIntroduction Table 1-1 Acronyms and Abbreviations ‘Acronym or Abbreviation SIMD Single insvucion muliple date IMM single inline memory module SMART Self Monitor Analysis Report Technology SM system management inferupt SMM syslem management mode SMRAM system management RAM SPD serial presence detect SPDIF Sony/ Philips Digital Interface (IEC:958 specification) SPN ‘Spare part number SPP standard parallel port SRAM static RAM SSE ‘Streaming SIMD extensions STN super Iwis! pneumatic SVGA super VGA sw software TAD telephone answering device TAFl Temperature-sensing And Fan contol Inlegrated circuit Ter tape correr package 1 trop flag TT thin-film transisior TA Telecommunications Information Administration TE twisted pair ethemet Tri track per inch TH Transislocransistor logic W Felevision ™ transmit UART \niversal asynchronous receiver/ransmilier UDMA Ura DMA URL Uniform resource locator sins microsecond use Universal Serial Bus uw vnshielded twisted pair v volt VAC Volts alternating curent Technical Reference Guide 361834002 9Introduction Tabh Acronyms and Abbreviations ‘Acronym or Abbreviation Des Voc Voli direct corent VESA Video Electronic Standards Associalion VGA video graphics adapter Vist very large scale integration VRAM Video RAM w watt wot Wake-OntAN ‘WRAM Windows RAM iF 2000 flag a 2210 insertion force (sockel) 770 367834002 Technical Reference Guide2 2.1 Introduction ‘The HP Compag de71xx and dx61xx Series Business Desktop Computers (Figure 2-1) deliver an outstanding combination of manageability, serviceability, and compatibility for enterprise System Overview environments, Based on the Intel Pentium 4 processor with the Intel 915G Chipset, these systems ‘emphasize performance along with industry compatibility. These models feature architectures incorporating the PCI bus. All models are easily upgradeable and expandable to keep pace with the needs of the office enterprise. S= HP Compaq de7100 USOT Figure 2-1 HP Compag dx6txx ST ‘This chapter includes the following topics: Features (2.2), page 2-2 Mechanical design (2.3), page 2-4 System architecture (2.4), page 2-22 Specifications (2.5), page 2-29 ec: HP Compaq de7100 SFF HP Compaq dx6txx MT HP Compaq de7100 CMT HP Compaq dxé Ixx and de7 Ix Series Business Desktop Computers Technical Reference Guide 361834-002 2System Overview 2.2 Features And Options ‘This section describes the standard features. 2.2.1 Standard Features ‘The following standard features are included on all series inless otherwise indicated: Intel Pentium 4 processor in LGAT75 (Socket T) package Integrated graphics controller C2700 and PC3200 DIMMS support on dx6100 and de7100 models PC2-4300 DIMM support on dx6120 models IDE controller providing serial and parallel ATA support Hard drive fault prediction Eight USB 2.0 ports ‘Audio processor with one headphone output, one microphone input, and one line input Network interface controller providing 10/100/1000Base T support Plug 'n Play compatible (with ESCD support) Intelligent Manageability support Energy Star compliant Security features including: Flash ROM Boot Block Diskette drive disable, boot disable, write protect Power-on password Administrator password cocec Serial/parallel port disable M_PS/2 enhanced keyboard PS/2 scroll mouse 2 367834002 Technical Reference GuideSystem Overview ‘Table 2-1 shows the differences in features between the different PC series based on form factor: Table 2-1 Difference Matrix by Form Factor sor oF 7 mr nr Sere ai00 ‘7100-6100 76120 Gx6100/eu6120——_ Noes See MI and CMI rear chassis fr enernlly accesible VO connect EI Rerahd stipe elds, Figure 2-18. MI / CMT System Board and CMI PCI Expansion Board Technical Reference Guide '361834-002 BaiSystem Overview 2.4 System Architecture ‘The systems covered in this guide feature an architecture based on the Intel Pentium 4 processor and the Intel 915G chipset (Figure 2-11). These systems allow processor upgrading with the Intel Pentium 4 family and offer flexibility in expansion capabilities, All systems covered in this guide include the following key components: Intel Pentium 4 with Hyper-Threading technology, 32-KB L1 cache and 1-MB L2 cache. Intel 915G/GV chipset - Includes $2915G or 82915GV GMCH north bridge and 82801 ICH6 south bridge including an integrated graphics controller, dual-channel DDR | or DDR2 SDRAM controller, serial and parallel ATA controllers, USB 2.0 controller, and PCI controller supporting PCT 2.3 devices SMC 47B397 super /O controller supporting PS/2 keyboard and mouse peripherals M1 AD1981B audio controller supporting line in, speaker out, and headphone out Broadcom BCMS7S1 10/10/1000 network interface controller ‘The 915G/GV chipset provides a major portion of system functionality. Designed to compliment the latest Intel Pentium 4 processors, the chipset serves the processor through a 800-MB Front-Side Bus (FSB). Communication between the GMCH and ICH6 components occurs through the Direct Media Interface (DMD. The SFE, ST, MT, and CMT form factors use the integrated graphics controller of the 82915G that may be upgraded through a PCI Express x16 graphics slot. All systems include a PCI 2.3 slot, and feature as standard a serial ATA (SATA) hard drive with support for legacy parallel ATA 100 devices including a MultiBay device. Table 2-2 lists the differences between models. Table 2-2. Architectural Differences By Form Factor Medel usDT SPF ST MT ‘CMT Chipset o15GV 156 9156. 9156 9156 ‘Memory sockets 3 4 4 4 4 DDR? models? Ne Yes Yes Yes Yes Graphics upgrade PCI23card —-PCIEor == PCIE or-—=SPCIE or ~—PCIE or only PCI23 card PCI23 card PCI23 card C123 card PCI Express x16 No Yer (1 Yer (1 Yer Yer graphics slot? PCI Express x1 slot? Ne Yer [1] Yer [1] Yes Yes Serial / parallel ports Optional [2] Standard [3] Standard [3] Standard [3] Standard [3] ‘SATA interfaces T 2 2 4 4 Note: 1) So ch accesible C123 Sigh sei tld 2] Reque adoper, [3] 2nd srl por equi edaper 22 367834002 Technical Reference GuideSystem Overview Pentium 4 Processor STSGIGV Chipset 1 Rap | 1 enter BO8 1 | rraphic [ch A DDRIDDRA| Ment Catt. | 915 121] ‘SDRAM ' comcn| SORA) \ [cre DDRODRA] POI Express PCI Exp. jeep) cr 2 DOR! x16 sit PEGI] PEG UF TI omn H ! ! ' ' ! ! ' ! SATA 1 Fsara | MT ose Let Hard Drive =) or Tee Keb] use Pons 1-8 eT T MuNBay Device +} es | azeot 1 [[Seriai vF (1 [Parallel VF [1] pene ve | che ! uF] -Pes7e287 LPowr VO Cntir. Scoystem, PACE uF | [fap ouse [iste uF ' POI Cntr ' t : | re | A) Keyboard 9 Floppy ROEEECIO} Mouse we Express x1 slot Power Supply, NC | [PCT Express 0 sot) Note: [1] SFF, ST, MT, and CMT form factors only. [2] 82915GV for USDT form factor 829156 for SFF. ST. MT, and CMT form factors Figure 2-19 System Architecture, Block diagram Technical Reference Guide 361834002 228System Overview 2.4.1 Intel Pentium 4 Processor ‘The models covered in this guide feature the Intel Pentium 4 processor with Hyper-Threading technology. This processor is backward-compatible with software written for the Pentium II, Pentium Il, Pentium MMX, Pentium Pro, Pentium, and x86 microprocessors. The processor architecture includes a floating-point unit, 32-KB first and 1-MB secondary caches, and ‘enhanced performance for multimedia applications through the use of multimedia extension (MMX) instructions. Also included are streaming SIMD extensions (SSE and SSE2) for enhancing 3D graphics and speech processing performance. The Pentium 4 processor features Net-Burst Architecture that uses hyper-pipelined technology and a rapid-execution engine that runs at twice the processor's core speed ‘These systems employ a zero-insertion-force (ZIF) Socket-T designed for mounting an LGA775 processor package (Figure 2-20) Figure 220. Processor Socket and Processor Package To remove the processor: 1, Remove the processore heat sink/fan assembly (not shown). 2, Release the locking lever (®) by first pushing down, then out and up. 3. Pull up the securing frame (@) 4, Grasp the processor (®) by the edges and lift straight up from the socket. &y The processor heatsink/fan assembly mounting differs between form factors. Always use the same assembly or one of the same type when replacing the processor. Refer to the applicable Service Reference Guide for detailed removal and replacement procedures of the heatsink/fan assembly and the processor. 224 367834002 Technical Reference GuideSystem Overview 2.4.2 Chipset ‘The chipset consists of a Graphics Memory Controller Hub (GMCH), an enhanced /O controller hub (ICH), and a firmware hub (FWH). Table 2-3 compares the functions provided by the chipsets. Components 82915G/GV GMCH 8280188 ICH 82802 FWH [1] Table 2-3 Chipset Components Funetion Intel Graphics Medic Accelerator 900 (integrated graphics controller) PC Express x16 graphics interface (915G only) SDRAM controller supporling unbuffered, non-ECC PC2700/PC3200 DDR or PC2:3200/2C2-4300 DDR? DIMMs (depending on model} 533, or 800-MHe FSB PCI 23 bus VF PCI Express x1 LPC bus I/F SMBus I/F IDE I/F with SATA and PATA support AC '97 controler RIC/CMOS. IRQ controller Fower management logic USB 1.1/2.0 conteller supporting eight (8) ports loaded with HP/Compag BIOS NOTE: [1]. Or equivalent component Technical Reference Guide 361834002 25System Overview 2.4.3 Support Components InpuVoutput functions not provided by the chipset are handled by other support components. ‘Some of these components also provide “housekeeping” and various other functions as well. Table 2-4 shows the functions provided by the support components, Table 2-4 Support Component Functions FCAT8S97 YO Conrlr CMSTS1 Eh! Cones ‘ADI98IB Audio Codec 2.4.4 System Memory Xeyboard and pointing doves /F Dakar Serel VF (COMIand COM, Perl! (PT, B72, oF PTS) ber RG) sorakzer ower bor and on pael IED loge G0 pore Pecettr evermore monioing Fan conel and wonton 2ower sippy vellage monloreg Sie ard lowe Pin Coon 120} bs VE 10/100/1000 Fat here network nelace eon: ‘aie ir Dagleltoaralg coneer pedlogiodigial coerer ‘aalog VO ‘chord audio support ‘These systems implement a dual-channel Double Data Rate (DDR) memory architecture. All ‘4x6100 and dc7100 models support PC2700 (3 MH) and PC3200 (400-MHz) DIMMs. Only ‘4x6120 models support DDR2, PC2-4300 (533-MHz) DIMMs. @ DDR and DDR2 DIMMs are NOT interchangeable. Memory type is defined by the system board. ‘The USDT system provides three DIMM sockets supporting up to 3 GB of memory while all other form factors provide four DIMM sockets and support a total of four gigabytes of memory. The maximum memory amounts stated above ate with 1-GB memory modules using 1-Gb technology DIMMs. 226 367834002 Technical Reference GuideSystem Overview 2.4.5 Mass Storage All models support at least two mass storage devices, with one being externally accessible for removable media. These systems provide one, two, or four SATA interfaces and one PATA interface. These systems may be preconfigured or upgraded with a 40-, 80-, or 160-GB SATA, hard drive and one removable media drive such as a CD-ROM drive. Some systems also provide one MultiBay interface. 2.4.6 Serial and Parallel Interfaces All models except those that use the USDT form factor include a serial port and a parallel port, both of which are accessible at the rear of the chassis. The USDT form factor may be upgraded with an adapter to provide serial and parallel ports. The SFF, ST, MT, and CMT form factors may be upgraded with an optional second serial port ‘The serial interface is RS-232-C/16550-compatible and supports standard baud rates up to 115,200 as well as two high-speed baud rates of 230K and 460K. The parallel interface is, Enhanced Parallel Port (EPP1_.9) and Enhanced Capability Port (ECP) compatible, and supports bi-directional data transfers. 2.4.7 Universal Serial Bus Interface All models provide eight Universal Serial Bus (USB) ports, with two ports accessible at the front of the unit and six ports accessible on the rear panel. The USB interface provides hot plugging/unplugging functionality. ‘These systems support USB 1.1 and 2.0 functionality on all ports 2.4.8 Network Interface Controller lll models feature a Broadcom NetXtreme Gigabit Network Interface Controller (NIC) integrated on the system board. The controller provides automatic selection of 1OBASE-T, 100BASE-TX, or 1000BASE-T operation with a local area network and includes power-down, wake-up, and Alert-On-LAN (AOL), and Alert Standard Format (ASF) features. An RJ-45 connector with status LEDs is provided on the rear panel Technical Reference Guide 361834002 2System Overview 2.4.9 Graphics Subsystem ‘These systems use the 82915G or 8291SGV GMCH component that integrates an Intel graphics controller that can drive an external VGA monitor. The integrated graphics controller (GC) features a 333-MHz core processor and a 400-MHz RAMDAC. The controller implements Dynamic Video Memory Technology (DVMT 3.0) for video memory. Table 2-5 lists the key features of the integrated graphics subsystem, Table 2-5 Integrated Graphics Subsystem Statistics 829156 or GV GMCH Integrated Graphics Controller Recommended for: Hi 2D, Entry 3D Bus Type Int PCI Express Memory Amount 8 MB pre-llocated Memory Type DYMT 3.0 DAC Speed ‘400 MHz Maximum 2D Res 2048x1536 @ 85 He Software Compatibilty ‘Quick Draw, Direc 90, Dirwet Draw, Direct Show, Open GL.1.4, MPEG 1-2, Indeo ‘Oupus TRGB ‘The IGC of the 82915G used in the SFF, ST, MT, and CMT form factors supports upgrading through a PCI Express x16 graphics slot. The IGC of the 8291 SGV used in the USDT form factor does not support a PCI Express x16 graphic slot and may only be upgraded through the PCT 23 slot. 2.4.10 Audio Subsystem ‘These systems use the integrated AC97 audio controller of the chipset and the ADI 1981B audio codec. These systems include microphone and line inputs and headphone and line outputs and include a 3-watt output amplifier driving an internal speaker. All models feature front panel-accessible microphone in and headphone out audio jacks as standard, 228 367834002 Technical Reference GuideSystem Overview 2.5 Specifications This section includes the environmental, electrical, and physical specifications for the systems covered in this guide, Where provided, metric statistics are given in parenthesis. Specifications are subject to change without notice Table 2-6 Environmental Specifications (Factory Configuration) moter Operating ‘Ambient Air Temperature 50° to 95° F (10° to 36"C, max. -24" to 140" F (-80" to 60" C, max rate of change < 10°C/Hr) rate of change < 20°C/Hr) Shock (w/e damage) 5Gs[1] 206s [1] Vibration 0.000215 G'/Hz, 10-300 Hz 0.0005 G'/Hz, 10-500 Hz Humidity 10-90% Rh @ 28° C max. 5.95% Rh @ 38.7° C max. wet bulb temperature ‘wet bulb temperature Maximum Altitude 10,000 4 (2048 m) [2] 20,000 f (9144 m) [2] NOTE (0) Peaking acceleration during an 17 mz halsine shock pub [2] Maximum rte of change 1500 /min Table 2-7 Electrical Specifications Parameter us. International input line Volage Nominal 100-240 VAC 100-240 VAC ‘Maximum 90-264 VAC 90-264 VAC Input Line Frequency Range: Nominal 50-60 Hz 50-60 He Maximum: 47-63 He 47-63 He Power Supply ‘Maximum Continuous Power: USOT 200 waits 200 wats ST or SFF 240 waite 240 wats Mr 300 watt [1] 300 watts [1] cur 340 watts 340 watts Maximum line Current Draw Usor 4A@IO0VAC ——_2A@ 200 VAC Sf or SPF SA@IO0VAC —-25.A@ 200 VAC Ma BA@IOOVAC —_4A@ 200 VAC cur GA@IOOVAC —-30A@ 200 VAC [1] Some MT SKU shpped with 240-wat power suppl. Technical Reference Guide 361834002 229System Overview Table 2-8 Physical Specifications sor ST SFF Mr MT [3] 295in-3.95in-3.95in 45in1765in (749 em) (10.03 em) (10.03 em) (36.8 em) (44.8 cm) Width 124in—13.3in 13.3 in 6.88 in 6.60in (315m) (83.78.em) (33.78 em) 75.em) (16.8 em) Depth 13.18 in 149in —149in 631 in 178in (33.48 em) (97.85em) (37.85 em) (41.1 em) (45.21 em) Weight [1] 13.2lb(2] 195lb 195 bb 238lb 325lb (60kg)(2] (@8kg) (8.8 bg) (10.8kg) (147 kg) loadbeering ebilly 100 lb 1001 100 b re 100 1b of chassis [4] (454g) (45.4 kg) (45.4 kg) (45.4 bg) NOTES: [1] System weight may vary depending on installed drives/peripherals [2] Without MuliBey device installed, [3] Minitower configuration, For desktop configuration, swap Height and Width dimensions. [4] Applicable To unit in desktop orientation only and assumes reasonable type of load such a monitor. 230 367834002 Technical Reference GuideSystem Overview te Diskette Drive Specifications Parameter ‘Measurement Media Type 3.5 in 1.44 MB/720 KB diskette Height 1/3 bay (1 in) Byles per Sector 512 Sectors per Track High Density 18 low Densiy 9 Tracks per Side. High Density 80 low Density 80 Read/Write Heads 2 ‘Average Access Time: TracktoTrack (high/low) 3 ms/6 ms ‘Average (high/low) 94 5/169 ms Setting Time 15 ms lotency Average 100 ms 3678840002 231 Technical Reference GuideSystem Overview Table 2-10 Optical Drive Specifications rameter ‘48x CD-ROM 48/24/28x CD-RW Drive interlace Type DE IDE Media Type (reeding) Mode 1,2, Mixed Mode, CDDA, Mode 1,2, Mixed Mode, CD.DA, Photo CD, Ci, CD-XA Photo CD, Cdi, CD-XA Media Type (writing) N/a CDR, CDRW. Transfer Rate (Reads) 4.8 Kb/s (max sustained) CDROM, 4.8 Kb/s; Transfer Rate (Wiites). CDROM/CDR, 1.56 Kb/s Ne CDR, 24 Kbps (sustained) CDRW, 1.5 Kbps (cusained); Capacity 650 MB @ 12 em Mode 1, 12 em 550 MB Mode 2, 12m 640 MB Bem 180 MB Center Hole Diameter 15 mm 15 mm Disc Diameter 8/12em 8/12 em Dize Thickness 1.2mm 1.2 mm Track Ph bum 1b um laser Beam Divergence ht 535415" Output Power 0.14 mW 53.6 0.14 mW Type GaAs GaAs Wave Length 790 +/-25 0m 790 +/-25 nm ‘Average Access Tine: Random <100 ms £120 me Full Soke <150 ms <200 ms ‘Audio Outpu Level 0.7 Vis 0.7 Vims Cache Buller 128 KB 128 KB 22 367884002 Technical Reference GuideSystem Overview Table 2-11 cifications rameter 40 GB 80 GB 160 6B Drive Size 35in 35in 35in Interface SATA SATA SATA Transfer Rate 150 MB/s 150 MB/s 150 MB/s Drive Protection System Yes Yes Yes Support? Typical Seek Time (w/setling) Single Track 12 ms 0.8 ms 0.8 ms Average 8.0 ms 9.0 ms 9 ms Full Stroke 18 ms V7 ms V7 ms Disk Format logical blocks) 78,165,360 156,301,488 320,173,056 Rotation Speed 5400/7200 5400/7200 7200 RPM Drive Fault Prediction SMART I SMART I SMART Il Technicel Reference Guide 3678840002 233System Overview 234 367834002 Technical Reference Guide3 Processor/Memory Subsystem 3.1 Introduction ‘This chapter describes the processor/memory subsystem. These systems feature the Intel Pentium 4 processor and the 915G chipset (Figure 3-1). The dx6100 and de7100 models support PC2700 or PC3200 DDR memory and come standard with PC3200 DIMMs installed. The 4x6120 models support PC2-4300 DDR2 DIMMs only. Pentium 4 Processor XMMt XMM2 [1] cha cha Fea UF bimMl DIMM GMCH Chtrl T_T che che DIMM in| XMS NE Note: [1] SFF, ST, MT, and CMT models only, Figure 3-1. Processor/Memory Subsystem Architecture This chapter includes the following topics: Pentium 4 processor (3.2), page 3-2 Memory subsystem (3.3), page 34 Technical Reference Guide 361834002 BiProcessor/Memery Subsyslem 3.2 3.2.1 Pentium 4 Processor These systems each feature an Intel Pentium 4 processor in a FC-LGA775 package mounted with a passive heat sink in a zero-insertion force socket. The mounting socket allows the processor to be easily changed for servicing and/or upgrading. Processor Overview ‘The Intel Pentium 4 processor represents the latest generation of Intel's IA32-class of processors. Featuring Intel's NetBurst architecture and Hyper-Threading technology, the Pentium 4 processor is designed for intensive multimedia and internet applications of today and the future while maintaining compatibility with software written for earlier (Pentium III, Pentium II, Pentium, Celeron, and x86) microprocessors. Key features of the Pentium 4 processor include: Ml Hyper-Threading Technology—The main processing loop has twice the depth (20 stages) of earlier processors allowing for increased processing frequencies, Execution Trace Cache— A new feature supporting the branch prediction mechanism, the trace cache stores translated sequences of branching micro-operations ( ops) and is checked when suspected re-occurring branches are detected in the main processing loop. This feature allows instruction decoding to be removed from the main processing loop. Rapid Execution Engine—Arithmetic Logic Units (ALUs) run at twice (2x) processing frequency for higher throughput and reduced latency. Mm _-MB Advanced transfer L2 cache—Using 32-byte-wide interface at processing speed, the large L2 cache provides a substantial increase. Advanced dynamic execution—Using a larger (4K) branch target buffer and improved prediction algorithm, branch mis-predictions are reduced by an average of 33 % over the Pentium IIL Enhanced Floating Point Processor —With 128-bit integer processing and deeper pipelining the Pentium 4's FPU provides a 2x performance boost over the Pentium IIL Additional Streaming SIMD extensions (SSE2)—In addition to the SSE support provided by previous Pentium processors, the Pentium 4 processor includes an additional 144 MMX instructions, further enhancing: Streaming video/audio processing Q Photo/video editing Speech recognition 3D processing Encryption processing 1 Quad-pumped Front Side Bus (FSB)—The FSB uses a 200-MHz clock for qualifying the buses’ control signals. However, address information is transferred using a 2x strobe while data is transferred with a 4x strobe, providing a maximum data transfer rate that is four times that of earlier processors. cry 367834002 Technical Reference GuideProcessor/Memory Subsyslem Figure 3-2 illustrates the internal architecture of the Intel Pentium 4 processor. Penton Wr 74360 730 7330 74320 Pentium 4 Processor Branch 16K Execution |) 2e-pe Prediction || Trace Cache ||! integer Pu FPU 9. Out order oe Ea [ALU Spo0d (Cor spo Tare Spe UGH 320GH2 00GHE 200K 32) El FSB speed (max. data transter rte) Ta tathe Size 72.0he TM 3 Te Acre Ts SOG Te ao Te Figure 3:2. Pentium 4 Processor Internal Architecture ‘The Intel Pentium 4 increases processing speed by using higher clock speeds with hyper-pipelined technology, therefore handling significantly more instructions at a time. The Pentium 4 features a branch prediction mechanism improved with the addition of an execution trace cache and a refined prediction algorithm. The execution trace cache can store 12 kilobytes of micro-ops (decoded instructions dealing with branching sequences) that are checked when re-occurring branches are processed. Code that is not executed (bypassed) is no longer stored in the L1 cache as was the case in the Pentium IIL ‘The front side bus (FSB) of the Pentium 4 uses a 200-MHz, clock but provides bi- and quad-pumped transfers through the use of 2x- and 4x-MHz strobes. The Pentium 4 processor is compatible with software written for x86 processors, 3.2.2 Processor Upgrading All units use the LGA775 ZIF (Socket T) mounting socket. These systems require that the processor use an integrated heatsink/fan assembly. A replacement processor must use the same type heatsink/fan assembly as the original to ensure proper cooling. ‘The processor uses a PLGA775 package consisting of the processor die mounted “upside down” on aPC board, This arrangement allows the heat sink to come in direct contact with the processor die, The heat sink and attachment clip are specially designed provide maximum heat transfer from the processor component. CAUTION: Attachment ofthe heaisink fo the processor is critcal on these sysiems. Improper attachment of the healsink wil kly resub in a thermal condition. Although the system is designed to detect thermal conditions end automatically shu! down, such a condition could sil result in damage tothe processor ‘component. Refer to the applicable Service Reference Guide for processor insallation insrucions CAUTION: Insiling a processor thal isnot supported by the system board may cause damage tothe system board and/or the processor. Technical Reference Guide 361834002 33