Scanning

Acoustic
Microscopy
Training
This presentation and images are copyrighted by
Sonix, Inc. They may not be copied, reproduced,
modified, published, uploaded, posted, transmitted,
or distributed in any way, without prior written
permission from Sonix.

8700 Morrissette Drive

Springfield, VA 22152
tel: 703-
703-440-
440-0222
fax: 703-
703-440-
440-9512
e-mail: info@sonix.com
 This presentation serves as a brief
introduction into the theory and
operation of scanning acoustic
microscopes.

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2
 Ultrasound Inspection,
Using an Acoustic Microscope…
What does this
thing do?
• Ultrasound
•Non-Destructive Testing
•Example Images

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3
 Ultrasound
MEDICAL SONAR

University of California Medical Center

San Francisco, California

What
Whatare
areUltrasonic
UltrasonicWaves?
Waves?

Ultrasonic
Ultrasonicwaves
wavesrefer
referto
tosound
soundwaves
wavesabove
above20
20kHz
kHz
(not
(notaudible
audibleto
tothe
thehuman
humanear)ear)
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4
 Non-Destructive Testing

NDT utilizes various non-invasive

measurement techniques, such as
ultrasonics and radiography to
determine the integrity of a
component, structure, or material
without destroying the usefulness
of the item.

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 Where an Acoustic Microscope is utilized.

•Failure Analysis
•Failure Analysis
•Reliability
•Reliability
•Process Control
•Process Control
•Vendor Qualification
•Vendor Qualification
•Production
•Production
•Quality Control
•Quality Control
•Research
•Research
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 Common Applications

•Plasticencapsulated
•Plastic encapsulatedIC
ICpackages
packages
•FlipChips
•Flip Chips
•BondedWafers
•Bonded Wafers
•PrintedCircuit
•Printed CircuitBoards
Boards
•Capacitors
•Capacitors
•Ceramics
•Ceramics
•Metallic
•Metallic
•PowerDevices/Hybrids
•Power Devices/Hybrids
•MedicalDevices
•Medical Devices
•MaterialCharacterization
•Material Characterization

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 Examples
Lid seal voids Delamination

BGA die attach

Die Crack

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Examples

Die Top Mold compound voids Flip Chip Underfill

Delamination Voids

Die Tilt, B-Scan Die Pad delamination Die Attach Voids

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 Ultrasound Inspection

•Theory
•System Components
•Transducers

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 Ultrasonic Waves

Characteristics
Characteristicsof
ofUltrasonic
UltrasonicWaves
Waves

••Freely
Freelypropagate
propagatethrough
throughliquids
liquidsand
andsolids
solids

••Reflect
Reflectatatboundaries
boundariesofofinternal
internalflaws
flawsand
and
change
changeofofmaterial
material University of California Medical Center
San Francisco, California

••Capable
Capableofofbeing
beingfocused,
focused,straight
straight
transmission
transmission

••Suitable
Suitablefor
forReal-Time
Real-Timeprocessing
processing

••Harmless
Harmlessto
tothe
thehuman
humanbody
body

••Non-destructive
Non-destructiveto
tomaterial
material

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 Ultrasonic Inspection
Ultrasound
Ultrasound Inspection
InspectionModes
Modes
••AAtransducer
transducerproduces
producesaahigh
high
frequency sound wave which
frequency sound wave which •PulseEcho
•Pulse Echo
interacts
interactswith
withthe
thesample.
sample. •ThroughTransmission
•Through Transmission
••High
Highfrequency
frequencysound
soundwaves
waves
can
cannot
notpropagate
propagatethrough
throughair.
air.
Transducer
••Couplant-
Couplant-AAmaterial
materialused
usedto
to H2O
carry the high frequency sound
carry the high frequency sound
waves.
waves.
Coupling
•Waterisisthe
•Water themost
mostcommon
common
couplant for immersion
couplant for immersion
testing.
testing.
Receive

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 Scanner
The scanner consists of a three axis system, X, Y, and Z. The
motor controller directs the movement of these axes.

Z
F
A
o
x
c
i
u
s
s

ep is
Ax
Y-
St
X-Axis
ScanCopyright Sonix, Inc
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 Transducers

High Frequency Low Frequency

Short Focus Long Focus

1.1. Higher 1.1. Lower

Lowerresolution
Higherresolution
resolution resolution
2.2. Shorter 2.2. Longer
Longerfocal
focallengths
Shorterfocal
focallengths
lengths lengths
3.3. Less 3.3. Greater
Greaterpenetration
Lesspenetration
penetration penetration
(Thinner (Thicker
(Thickerpackages)
(Thinnerpackages)
packages) packages)

General
Generalrules:
rules:
• •Ultra
UltraHigh
HighFrequency
Frequency(200+
(200+MHz)
MHz)for
forflip
flipchips
chipsand
andwafers.
wafers.
• •High
High Frequency (50-75 MHz) for thin plastic packages.(110MHz-UHF)
Frequency (50-75 MHz) for thin plastic packages. (110MHz-UHF)for
for
flip chips.
flip chips.
• •Low
LowFrequency
Frequency(15
(15MHz)
MHz)for
forthicker
thickerplastic
plasticpackages.
packages.
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 Transducer Beam Profile
Depth of Field

The purple region

is referred to as the
focal area or depth
of field of the
transducer beam.

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 Typical Transducer Selection
Sample Application Transducer

T/X Receiver 10 MHz w/0.75” focus

PLCC, QFP, PQFP 15 MHz w/0.5” focus
Power Pak 15 MHz w/0.5” focus
BGA Top 50-75 MHz w/12mm focus
Capacitors 75 MHz w/12mm focus
TSOP 75 MHz w/12mm focus
Flip Chip Underfill 110 MHz w/8mm focus
Flip Chip Interconnect UHF w/ 5.9 mm focus
Bonded Wafer 110 MHz w/8mm focus
Bonded Wafer UHF w/ 5.9 mm focus
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 ABC’s Of Acoustics

•Acoustic Reflections
•Acoustic Waveforms
•Image Display

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 Acoustic Properties
Material Density LongitudinalWave Acoustic Impedance
3 2 6
(g/cm ) Velocity (m/s) (kg/m s) (x10 )

0
Water (20 C) 1.00 1483 1.48
0
Alcohol (20 C) 0.79 1168 0.92
0
Air (20 C) 0.00 344 0.00
Silicon 2.33 8600 20.04
Gold 19.3 3240 62.53
Copper 8.90 4700 41.83
Aluminum 2.70 6260 16.90
Epoxy Resin 1.20 2600 3.12
Resin (for IC pkg) 1.72 3930 6.76
Glass (Quartz) 2.70 5570 15.04
Alumina (AL2O3) 3.80 10410 39.56

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 Sound Reflection

•Acoustic Material Properties

•density (ρ
ρ)
•velocity of sound in material (c)
•acoustic impedance (Z= ρc)

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 Sound Reflection

Whenever a sudden change in

acoustic impedance is encountered,
like at a material boundary, a portion
of sound is reflected and the
remainder propagates through the
boundary.

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Reflection vs. Transmission
Incident Energy

Water Z1 Reflected Energy

Z=
Z= ρC
ρC Plastic Z2 Transmitted Energy

Z1 = ρ C where: Z2 = ρ C where:
ρ=1.00 gram/cm3 ρ =2.00 gram/cm3
C= 1.5 x 106 C= 2.00 x 106
Z1 = 1.5 x 106 Z2 = 4.00 x 106

2 (Z 1 )
T =
(Z + Z ) R =
(Z 2 − Z 1 )
2 1
(Z 2 + Z 1 )
2 (1 . 5 ) 45% of the
T = ( 4 .0 − 1 .5 )
( 4 .0 + 1 .5 ) sound entering R =
( 4 .0 + 1 .5 )

( 3 .0 ) the boundary is
T = ( 2 .5 )
( 5 .5 ) reflected. R =
( 5 .5 )

T = . 55
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Reflected Sound Information

Measuring the reflected

ultrasound can provide:

• Amplitude Information
• Polarity Information
• Time Information

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 ABC’s of Acoustics
A-Scan- The raw ultrasonic data. It is the received RF signal
from a single point (x,y).

B-Scan- A line of A-scans. (Vertical cross-section)

C-Scan-Data from a specified depth over the

entire scan area. (Horizontal cross-section.
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 A-SCAN
Transducer
Initial Pulse

Front surface

Interface of Sample
interest

Back surface

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 Ultrasonic Waveforms
The Black signal is commonly
referred to as the initial pulse or the
main bang. This signal occurs at 1
Zero microseconds.

The Red signal is commonly referred

to as the front surface. This
represents the first interface the sound 2
encounters.

The Green signal would be considered 1 2

the area of interest. A data gate would
be positioned over this signal or group
of signals for evaluation.

The Blue signal is commonly referred to

as a back wall echo or back surface.
Just as the name implies it is the back
or bottom of the sample.
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 A-SCAN
100%
+ Phase

Amplitude %FSH 0%

_ Phase
-100%

Time / Depth

A-Scans provide the following information:

1. Amplitude / % of full screen height (FSH)
2. Phase / positive or negative peak
3. Time / Depth

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 C-SCAN
IP
Front surface Back surface

Area of interest
The red box (data gate) indicates
the depth of information.

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 B-Scan
Front surface

Signal from
indication

Back surface

The blue line (B-scan gate) represents the depth

of information recorded.

Back surface
Front surface Signal from
indication
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 Inspection Modes

•Pulse Echo
•Through Transmission

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 Inspection Modes
Pulse-Echo Through Transmission

Transmit
Transmit
&
Receive

Receive

Pulse-Echo
Pulse-Echo- -One
OneTransducer
Transducer
Through
ThroughTransmission
Transmission- -Two TwoTransducers
Transducers
• • Ultrasound reflected from the sample is
Ultrasound reflected from the sample is used. used.
• • Ultrasound
Ultrasound transmitted throughthe
transmitted through the
• • Can determine which interface is delaminated.
Can determine which interface is delaminated. sample is used.
sample is used.
• • Requires
Requiresscanning
scanningfrom
fromboth
bothsides
sidestotoinspect
inspect • • One
OneScan
Scanreveals
revealsdelamination
delaminationatatall
all
all interfaces.
all interfaces. interfaces.
interfaces.
• • Provides
Providesimages
imageswith
withhigh
highdegree
degreeofofspatial
spatial • • No
Noway
waytotodetermine
determinewhich
whichinterface
interfaceisis
detail.
detail. delaminated.
delaminated.
• • Peak Amplitude, Time of Flight (TOF)
Peak Amplitude, Time of Flight (TOF) and and
• • Less
Lessspatial
spatialresolution
resolutionthan
thanpulse-echo.
pulse-echo.
Phase Inversion measurement
Phase Inversion measurement • • Commonly
Commonly used to verify pulse-echo
used to verify pulse-echo
Copyright Sonix, Inc
results.
30 results.
 Inspection Modes
Pulse-Echo Front Surface

Back surface

1 2

Transmit 1
&
Receive

Front Surface Air Gap

Air Gap
2

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 Inspection Modes
Through Transmission 1

1 2 3 Transmit

3
Receive

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 Focusing Sound

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 Too Close
Focusing the Transducer
1

Too Far

Focused 3
Too Close
Focused
2
2 1

Too Far

Focusing an ultrasonic transducer is similar to focusing an

optical microscope.
When optimum focus is reached the signal will reach a
maximum peak. (See the A-scans images to the left)
Copyright Sonix, Inc
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 De-focused-- too close

28% 1. Note the

Water path time in
microseconds
of the signal
at the different
focus
locations.
Correct focus
(Red arrow)

85%
2. Also note
the amplitude
of the signal.
(white box)
When the
De-focused-- too far signal is not
in focus the
33% amplitude is
lower
compared to
that of correct
focus.

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 Focusing Sound
De-Focused - Too Close Focused on Die De-Focused - Too Far Away

Amplitude = 42% Time =10.5 us Amplitude = 82% Time = 14.5 us Amplitude = 55% Time = 18.5 us

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 Practical Application

•Digital Oscilloscope
•Front Surface Follower
•Data Gates

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 Digital Oscilloscope

Initial pulse 1st Echo

2nd Echo 3rd Echo

The 1st set of echoes is the Multiple Echoes

area of interest, gate placement
will be on this group. Copyright Sonix, Inc
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 Gates
Gates
Gatesare
areused
usedtotocollect
collectinformation
informationat
at
desired Gate Threshold
desiredinterfaces
interfaceswithin
withinthe
thesample.
sample.
1
•Thegate
•The gateisisplaced
placedover
overthe
thesignal
signalor
or
signals of interest.
signals of interest.

•Theabsolute
•The absolutevalue
valueof
ofthe
thehighest
highest
amplitude
amplitudesignal
signalwhich
whichbreaks
breaksthe
thegate
gate Highest Amplitude signal
threshold within the gated region is
threshold within the gated region is
recorded.
recorded. (Figure
(Figure1)
1)

•Ifno
•If nosignal
signalbreaks
breaksthe
thegate
gatethreshold
threshold
no
nodata
dataisisrecorded.
recorded. (Figure
(Figure2)2) 2
•Signalamplitude
•Signal amplitudecan
canbe
beincreased
increasedor
or
decreased by adjusting gain. No data recorded
decreased by adjusting gain.

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 Practical Application

•Image Data
•Peak Amplitude
•Time of Flight (TOF)
•Phase Inversion

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 Peak Amplitude

Peak amplitude imaging is used

when defects result in changes in
the amount or strength of
ultrasound reflected. It is the most
common type of imaging
technique.

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 Peak Amplitude
Peak Amplitude

100

78
75

X1
50

25

Signal height is measured in absolute

value for Peak Amplitude images.

Amplitude 78% Sonix, Inc

Copyright
42
 Time Of Flight

Time of Flight (TOF) imaging

works by measuring changes in
the time it take sound to reflect off
a particular interface. Most
commonly used to measure die
tilting.

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 Time Of Flight
1

X2

X1

Time of Flight images provide a

relative depth within a sample.
Structures which appear white or
light gray are closer to the surface
The peak signal for location 1 occurs at
of the sample.
14.2 microseconds (light gray) while the
Structures which appear darker peak signal for location 2 occurs at 14.6
shades of gray or black are deeper microseconds (dark gray).
within sample. Copyright Sonix, Inc
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 Peak Amplitude vs. TOF
Peak Amplitude Time of Flight

X2 X2

X1 X1

Amplitude =73% Time =14.2 microseconds Amplitude =67% Time =14.6 microseconds
Copyright Sonix, Inc
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 Phase Inversion

Phase Inversion imaging is used when

defects cause changes in polarity (phase)
of the signal. Most commonly used for top
and back side imaging of plastic
encapsulated devices.

Do not use phase inversion imaging for flip

chip, bonded wafer or die attach imaging.

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 Phase Inversion
Normal

Phase Inverted

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 Phase Gate
X

Sonix
Sonixuses
usesaa
proprietary
proprietaryalgorithm
algorithm
RED to
todetect
detectphase
phase
inversion.
inversion. This
This
method
method isis
X
independent
independentof ofsignal
signal
amplitude
amplitude as longas
as long as
the signal is not
the signal is not
saturated
saturated(100%
(100%
screen height).
screen height).
Yellow

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Image Comparison & Correlation

Through Transmission Peak Amplitude Image Phase Inversion Image

of Die Top of Die Top

Peak Amplitude Image

of Die Attach

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