DGS Dicing-Grinding Service

DISCO HI-TEC EUROPE GmbH

High Quality

• Thickness measurement (Laser/Capacitive)

• Die strength measurement
• Automatic Optical Inspection
• Inspection microscope
• Automatic tracking system via internet platform for customers
• High process traceability

Bringing science
to comfortable living
through advanced
Kiru, Kezuru, Migaku
technologies.

ISO Certification Contact Dicing | Kiru

Grinding | Kezuru
DISCO HI-TEC EUROPE GmbH
Liebigstraße 8
Polishing | Migaku
85551 Kirchheim b. München
Germany
Special Solutions
Phone: +49 (0)89 90903 - 0
Fax: +49 (0)89 90903 -199
E-mail: dgs@discoeurope.com
Web: www.dicing-grinding.com
DIN EN ISO 9001 DIN EN ISO 14001 OHSAS 18001
Dicing | Kiru Polishing | Migaku The New Cleanroom Open since Summer 2013

• Single cut
• Step cup
• Dry polishing Floor size: 400 m2
• Bevel cut
• Stress relief process for higher Number of Machines: 30+
• Grooving
die strength and reduction in Now added: CAMTEK Automatic Inspection Tool
• Chopper cut die warpage Condor 200 Series
• Circle cut
• Edge trimming

Grinding | Kezuru Special Solutions for high-end applications:

• Dicing Before Grinding (DBG)
• Standard grinding
• Plasma etching for high
• Ultra-Thin grinding
die strength
• Bonded Wafer grinding
• TAIKO for power devices <100 µm
• Partial Wafer grinding
• Surface planarization
• Individual Die grinding
• Stealth Laser for various materials
• Edge trimming
• Ultrasonic dicing
• Poligrind / Ultrapoligrind
• IR/White light

All DGS applications are offered for various materials up to 300 mm in combination with
Wafer lamination | Wafer mounting | UV irradiation of tapes | Inspection (chipping inspection, die strength testing, etc.) | Vacuum sealed packaging under N2