NEC Platforms 4M CHANGE APPLICATION FORM

TITLE/CONTENT DOC. NO. EVALUATION/VERIFICATION ITEM

ISSUED
□DESIGN VERIFICATION
DATE DATA
□QC FLOW CHART
APPROVED CHECKED PIC

NAME OF SUPPLIER □FIRST ARTICLE

INSPECTION
□COMPARISON WITH
BEFORE CHANGE
□PROCESS CAPABILITY
PART PAR □LOT CONTINGENT
FOR SUPPLIERS

NAM T DATA
E NO. □RELIABILITY TEST
Reason FOR CHANGE. TYPE OF CHANGE REPORT
□COPIES OF
CERTIFICATION
□OTHERS

PAST SHIPMENTS DETAILS

IMPLEMENTATION DATE (QTY SUPPLIER AND TOTAL
SHIPPED)
Copper Wire Bonding Che

REQUIRED DOCUMENT Primary

□QUALITY SYSTEM SURVEY □SPECIFICATION OF APPROVAL □COMPANY
PROFILE 　 □OTHERS　　
□Satisfaction
□QUALITY ASSURANCE SYSTEM □QC FLOW CHART □LOT DATA
□RELIABILITY TEST DATA
□COPIES OF CERTIFICAIONS □OTHER TECHNICAL DOC. □SAMPLES
□PERFORMANCE DATA Barrier Metal Check
DESIGN / PRDOUCTION
MATERIAL DEPARTMENT Secondar
ISSUEDENGINNERRING
ISSUED DATE
INTERNAL DOC.
DATE
INTERNAL DOC. □Satisfaction　　　□Dissa
FOR NEC Platforms USE

No. No.

CHECKE
APPROVED PREPARED APPROVED CHECKED PREPARED
Wire Bonding Confirmation
D
□APPROVED 　 □
EVALUATION
CONDIT
□RETURN FOR FURT
COMMENTS ANALYSIS/CONCLUSION ANALYSIS/CONCLUSION □RE
 FORMAT 1-E
N/VERIFICATION ITEM RESULT/OUTCOME
GN VERIFICATION ※PLEASE ATTACHED A SEPARATE
SHEET.
LOW CHART

ARTICLE
TION
PARISON WITH
EESS
CHANGE
CAPABILITY
CONTINGENT
BILITY TEST
T
ES OF
CATION
RS ＱＡ DATE
CHECKE PREPARE
APPROVED
D D

er Wire Bonding Check For Semiconductor

Device
Primary Judg
isfaction　　□Secondary Inquiry　　
□Return
er Metal Check □Yes　　　　　　□No
Secondary Judg

ction　　　□Dissatisfaction　　　□Return

□Satisfaction　　　□Dissatisfaction

PPROVED 　 □APPROVED
EVALUATION RESULT WITH
CONDITION　
TURN FOR FURTHER ACTION 　
IS/CONCLUSION □REJECT

SRQ-D-047-Y01-E Rev2 （2014.10.31）