Two Phase Electronic Cooling with HFO 1234ze Nano-fluid for managing thermal issues in Highly Dense

Systems-on-Chip – a pilot study

Abstract

Nowadays electronics gadgets need to design for higher functionalities with lower in size, weight and power
consumption. Such demand leads to create dense populated systems. Even industrial electronic component /system
design also prefer same slim fashion. On other hand the overheating of electronic components reduces its
performance, life and by the way the reliability of such electronic product/system is greatly affected due to
overheating. So cooling is indispensible for electronic systems. The conventional cooling methods failed to offer
best performances. Hence this part of research proposed a effective two phase cooling technique with nano-fluid.
The objective research is to maintain the peak temperature at junction and hot spots to get the best performance of
electronic system. The HFO 1234ze nano-fluid employed with the flow rate of of 1100ml/min.The HotSpot
Simulator-6.0 software employed for establish, verification and validation of simulated model and trial runs to
answer many ‘what if’ questions. The performance of the proposed two phase nono-fluid cooling system for 3-D
Unit-under Test (UUT) was verified and validated with real system and simulated for experiments. The proposed
system found outperforms.