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From 19th to 22th June 2019, Nepcon Thailand 2019 will take place at Bangkok
International Trade and Exhibition Center in Bangkok, Thailand. Heilind Asia will
exhibit at Hall98 Booth 8C50 together with its suppliers TE Connectivity, Alpha Wire,
Molex, PEM, Amphenol and Bel; displaying the latest products and solutions.
sarah luo
Heilind Asia Pacific
PressReleasePing - June 12, 2019 -From 19th to 22th June
RM 1707-10,DELTA HOUSE,3 ON YIU ST
2019, Nepcon Thailand 2019 will take place at Bangkok
26119634
International Trade and Exhibition Center in Bangkok, Thailand.
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Heilind Asia will exhibit at Hall98 Booth 8C50 together with its
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suppliers TE Connectivity, Alpha Wire, Molex, PEM, Amphenol and
Bel; displaying the latest products and solutions.
As authorized distributor for more than 100 world leading manufacturers, Heilind Asia supports both original equipment
and contract manufacturers in all market segments of the electronics industry, stocking products from the industry’s
leading manufacturers in 25 component categories, with a particular focus on interconnect and electromechanical
products.
Founded in 1974, Heilind Electronics, Inc. (http://www.heilind.com) is one of the world's leading distributors of
connectors, relays, switches, thermal management & circuit protection products, terminal blocks, wire & cable, wiring
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accessories, insulation & identification, fastener/hardware and sensor products. Heilind has over 40 facilities in the
United States, Canada, Mexico, Brazil, Germany, Hong Kong, Singapore and Mainland China.
Heilind Asia Pacific (www.heilindasia.com) commenced operations in Dec 2012, and now has 22 locations throughout
Asia. Its industry leading service offering to customers in Asia Pacific is the result of a commitment to the belief of
“Distribution As It Should Be”. Learn more at www.heilindasia.com and on Facebook, WeChat, Weibo and Twitter.
Category: Technology
Region: Asia
Tags (meta-keywords): Heilind Asia, Hall98, Booth 8C50, NEPCON Thailand 2019
This press release is licensed under a Creative Commons Attribution 3.0 Unported License.
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