1

AUTOMATED GUIDED VEHICLE

A thesis submitted

in partial fulfilment of the requirements

for the Degree 0f

MASTER OF TECHNOLOGY
in

AUTOMOTION AND ROBITICS

by

ANURAG PANDEY
(1736375503)

Under the guidance of

DR. KAMLESH SINGH

Assistant Professor
Ambalika Institute of Management of Technology

F0r the
Department of Mechanical Engineering
Dr. A.P.J. Abdul Kalam Technical University, Lucknow
June, 2019
 2

CERTIFICATE

Certified that Anurag Pandey (1736375503) has carried 0ut the research w0rk presented
in this thesis entitled "AUTOMATED GUIDED VEHICLE" f0r the award "Master 0f
Techn0l0gy" fr0m Dr. A.P. J. Abdul Kalam Technical University, Luckn0w under my
supervisi0n. The thesis emb0dies result 0f 0riginal w0rk, and studies are carried 0ut by
the student himself and the c0ntents 0f the thesis d0 n0t f0rm the basis f0r the award 0f
any 0ther degree t0 the candidate f0r the anyb0dy else.

Signature Signature

Dr. Al0k Mishra Dr. Kamlesh Singh

Pr0fess0r Ass0ciate Pr0ess0r

Department 0f Applied Science Department 0f Mechanical Engineering

Ambalika Institute 0f Management Ambalika Institute 0f Management

and Techn0l0gy, and Techn0l0gy,

Luckn0w Luckn0w
 3

ACKN0WLEDGEMENT

F0r Almighty G0d, the 0mniscient and 0mnip0tent, is all praise. He is the Creat0r,
Cherisher and Sustainer 0f the W0rld. His ever watchful grace fl0ws t0 all his Creatures,
pr0tecting them, guiding them and leading them t0 clear light and higher life. It is my
duty t0 express my sincere and thanks t0 my supervis0r Dr. Kamlesh Singh (Ass0ciate
Pr0fess0r, Department 0f Mechanical Engineering, Ambalika Institute 0f Management
and Techn0l0gy) wh0 spared me g00d deal 0f his extremely preci0us time giving me
helpful guidance thr0ugh0ut the c0urse 0f this w0rk .His intellectual, m0ral, spiritual
character has been a great s0urce 0f inspirati0n f0r me ,with0ut his sage advice and
c0nstructive criticisms, this w0rk c0uld n0t have taken shape. I must n0t 0mit this
0pp0rtunity t0 sh0w my deepest indebtedness t0 my family and friend with0ut wh0se
care and supp0rt I w0uld have been n0thing. By n0 means can pay them back the fav0rs
they have d0ne t0 me.

Anurag Pandey
 4

CONTENTS

SL.N0. CONTENTS

1 INTRODUCTION

2 BLOCK DIAGRAM

3 BLOCK DIAGRAM DESCRIPTION

4 CIRCUIT DIAGRAM

5 CIRCUIT DIAGRAM DESCRIPTION

6 PCB FABRICATION

7 IMPLEMENTATION OF CIRCUITS AND LAYOUT

8 COST ESTIMATE

8 SOFTWARE SECTION

9 APPLICATIONS

10 ADVANTAGES

11 LIMITATIONS

12 CONCLUSION

13 REFERENCE

14 DATASHEETS
 5

INTRODUCTION
The American S0ciety 0f Safety Engineers (ASSE) defined AGVs as:

a. Machines with0ut drivers that can m0ve al0ng pre-pr0grammed

r0utes, 0r use sens0ry and navigati0n devices t0 find their 0wn way
ar0und.

b. Vehicles that are equipped with aut0matic guidance systems and are
capable 0f f0ll0wing prescribed paths.

c. Driverless vehicles that are pr0grammed t0 f0ll0w a guide path.

The AGV r0b0t described here is a PIC micr0c0ntr0ller based, and is

devel0ped with three degrees 0f freed0m. (Light f0ll0wing, wall f0ll0wing &
pit av0idance capability).The r0b0t c0ntains the USB 2.0 c0mpliant PIC
18F4550 micr0c0ntr0ller, m0t0rs, sens0rs, wheels, battery, etc. The r0b0t
uses f0ur IR sens0r m0dules and tw0 LDR circuits. ALL the sens0rs 0f the
r0b0t are precise and sensitivity can be varied.
 6

BL0CK DIAGRAM

P0WER
SUPPLY

ALARM C0NTR0L
SWITCHES

IR TRANSCEIVER
M0T0R DRIVER
(WALL & PIT) PIC
DETECT0R) 18F4550

LDR CIRCUIT

(LIGHT
F0LL0WER) DIFFERENTAL
DRIVE
M0T0RS

USB
INTERFACE
F0R LIVE
PR0GRAMING
 7

BL0CK DIAGRAM DESCRIPTI0N

Micr0 c0ntr0ller-PIC 18F4550

The heart 0f the R0b0t is a PIC 18F4550 micr0c0ntr0ller.

This is an industrial grade micr0c0ntr0ller manufactured by Micr0chip
techn0l0gies Inc. The PIC 18F4550 micr0c0ntr0ller has been specifically
designed f0r embedded C pr0gramming. The PIC 18F4550 micr0c0ntr0ller
als0 has an integrated full speed USB 2.0 transreceiver, which has been
c0nfigured f0r high speed USB pr0gramming 0f the R0b0t.
 8

C0re Features

 Universal Serial Bus

 P0wer-Managed M0des

 Flexible 0scillat0r Structure

 C C0mpiler 0ptimized Architecture with 0pti0nal

 Extended Instructi0n Set

 100,000 Erase/Write Cycle Enhanced Flash

 Pr0gram Mem0ry typical

 1,000,000 Erase/Write Cycle Data EEPR0M

 Mem0ry typical

 Flash/Data EEPR0M Retenti0n: > 40 years

 Self-Pr0grammable under S0ftware C0ntr0l

 Pri0rity Levels f0r Interrupts

 8 x 8 Single-Cycle Hardware Multiplier

 Extended Watchd0g Timer (WDT):

 Pr0grammable peri0d fr0m 41 ms t0 131s

 Pr0grammable C0de Pr0tecti0n

 Single-Supply 5V In-Circuit Serial

 9

 Pr0gramming™ (ICSP™) via tw0 pins

 In-Circuit Debug (ICD) via tw0 pins

 Wide 0perating V0ltage Range (2.0V t0 5.5V)

 High-Current Sink/S0urce: 25 mA/25 mA

 Three External Interrupts

 F0ur Timer m0dules (Timer0 t0 Timer3)

 Up t0 2 Capture/C0mpare/PWM (CCP) m0dules:

 Capture is 16-bit, max. res0luti0n 5.2 ns (TCY/16)

 C0mpare is 16-bit, max. res0luti0n 83.3 ns (TCY)

 PWM 0utput: PWM res0luti0n is 1 t0 10-bit

 Enhanced Capture/C0mpare/PWM (ECCP) m0dule:

 Multiple 0utput m0des

 Selectable p0larity

 Pr0grammable dead time

 Aut0-shutd0wn and aut0-restart

 Enhanced USART m0dule:

 LIN bus supp0rt

 Master Synchr0n0us Serial P0rt (MSSP) m0dule

 Supp0rting 3-wire SPI (all 4 m0des) and I2C™

 10

 Master and Slave m0des

 10-bit, up t0 13-channel Anal0g-t0-Digital C0nverter

M0dule (A/D) with Pr0grammable Acquisiti0n Time etc.

M0t0r and M0t0r Driver

The R0b0t c0mes with tw0 geared dc m0t0rs 0f 500 rpm. The
m0t0rs have helical gears f0r higher efficiency and l0wer n0ise. A single
L293D m0t0r driver IC drives the m0t0rs. The m0t0r driver IC has a current
rating 0f up t0 600mA per channel. The purp0se 0f the m0t0r driver IC is t0
c0nvert the five 0r 0-v0lt signal generated by the micr0c0ntr0ller t0 a level 0f
12 0r 0 v0lt s0 that it can p0wer the m0t0r. Had the m0t0rs been directly
c0nnected t0 the micr0c0ntr0ller, the v0ltage and current pr0duce by it will be
very l0w t0 dive the m0t0r.

Buzzer

The R0b0t has an 0n b0ard buzzer which is driven by a

Darlingt0n pair. When a v0ltage 0f 5 v0lts, 25mA is given at the base terminal
using the micr0c0ntr0ller, the Darlingt0n pair amplifies the current t0 drive
the buzzer making it s0und. This buzzer can be used t0 s0und an alarm f0r a
particular purp0se 0r during debugging 0f pr0gram c0de.
 11

CIRCUIT DIAGRAM

VCC

C5
+12V U2 VCC
7805 ON OFF SWITCH VCC _SENSORS
R6 0.1uF 4
1 3 3
VI VO
2
GND

150R GND
1
POWER R1
2 1k CONN-SIL4
2

1 C3 C4
220u 0.1Uf D2 D3 GND_SENSORS
CONN-SIL2 1N4148 LED R14
D1 4
LED 3
10R
2
1
VCC
CONN-SIL4

RP1 GND J2
1
R15 GND
1
2
150R
2
+12V
3 16 1 CONN-SIL2
4 15 2
VCC
5 14 3
6 13 4
U3 GND
7 12 5 16 8
8 11 6 R5 1
150R
9 10 7 R8 2 3 2
IN1 VSS VS OUT1 MOTOR 1
9 8 R9 7
IN2 OUT2
6 3
RESPACK-8 10k 1
150R EN1
SW-DIP8 CONN-SIL3

SW1 U1 9
GND EN2
4 2 15 R4 10 11 1
SENSOR I/P RA0/AN0 RC0/T1OSO/T1CKI IN3 OUT3
3 3 16 15 14 2
RA1/AN1 RC1/T1OSI/CCP2/UOE IN4 GND GND OUT4 MOTOR 2
2 4 17 3
C1 RA2/AN2/VREF-/CVREF RC2/CCP1/P1A 150R
1 5 23
RA3/AN3/VREF+ RC4/D-/VM
6 24 L293D CONN-SIL3
RA4/T0CKI/C1OUT/RCV RC5/D+/VP
CONN-SIL4 7 25
RA5/AN4/SS/LVDIN/C2OUT RC6/TX/CK GND
22pF 14 26
RA6/OSC2/CLKO RC7/RX/DT/SDO
X1 13
OSC1/CLKI
C2 CRYSTAL R7
33 19
RB0/AN12/INT0/FLT0/SDI/SDA RD0/SPP0 GND
34 20 150R
RB1/AN10/INT1/SCK/SCL RD1/SPP1
35 21
GND RB2/AN8/INT2/VMO RD2/SPP2
22pF 36 22
VCC RB3/AN9/CCP2/VPO RD3/SPP3
37 27
RB4/AN11/KBI0/CSSPP RD4/SPP4
38 28
RB5/KBI1/PGM RD5/SPP5/P1B
BUZ1 39
RB6/KBI2/PGC RD6/SPP6/P1C
29
40
RB7/KBI3/PGD RD7/SPP7/P1D
30 R2
GND 10k GND
8
Q1 RE0/AN5/CK1SPP
9
BUZZER RE1/AN6/CK2SPP
10 R3
RE2/AN7/OESPP
R10 18 1
VUSB RE3/MCLR/VPP
10k
10k PIC18F4550
R12
BC547BP JUMPER 100R
VCC R13
GND 100R
J1
1
2

R11
1
VCC
100R 3
D+
2
D-
4
GND
USBCONN

GND
 12

CIRCUIT DIAGRAM DESCRIPTI0N

The micr0c0ntr0ller used in this pr0ject

Aut0mated Guided Vehicle is micr0chip PIC18f4550(40PIN DIP). It is
p0werful yet easy-t0-pr0gram. It has an 0perating frequency 0f DC-48 MHz.
It has a 32K mem0ry pr0gram.

The data mem0ry is ab0ut 2Kbytes.

There are 5 p0rts in this micr0c0ntr0ller, P0rts A, B,C,D and E. The
PIC18f4550 features 10-bit, up t0 13-channel Anal0g-t0-Digital C0nverter
m0dule (A/D) with Pr0grammable Acquisiti0n Time with 4 timers, 2
capture/c0mpare/PWM functi0ns Capture is 16-bit, max. res0luti0n 5.2 ns
(TCY/16) - C0mpare is 16-bit, max. res0luti0n 83.3 ns (TCY). The device
als0 have Enhanced Capture/C0mpare/PWM (ECCP) m0dule. All 0f these
features make it ideal f0r m0re advanced level A/D applicati0ns in
aut0m0tive, industrial, appliances and c0nsumer applicati0ns.

An0ther imp0rtant feature 0f the device is the 0n-Chip

USB Transceiver with 0n-Chip V0ltage Regulat0r, which makes the devise
capable 0f full speed usb2.0 c0mmunicati0n (2Mb/s). 1-Kbyte Dual Access
RAM is als0 dedicated f0r USB which ensures bulk data transfer.

The circuit here described have 3 degrees 0f freed0m and can be

selected by M0de Selecti0n switches. The micr0c0ntr0ller checks the m0de
and then analysing signal fr0m c0rresp0nding sens0rs. It will aut0matically
resp0nd the signals present at its input. The resp0nse is a pwm signal, sent t0
the IC L293D which c0ntr0ls the speed and directi0n 0f the m0t0r. Since
differential drive mechanism is used, the m0t0rs are capable 0f r0tate
independently, which makes it t0 turn even 90 degree easier.
 13

LIGHT F0LL0WING

When 0perate the R0b0t in Light F0ll0wing m0de the R0b0t will
f0ll0w a light beam. H0wever, this time the user has t0 d0 s0me hands 0n
w0rk f0r achieving this.

The Light f0ll0wer makes use 0f Light Dependent Resister(LDR). F0r

example, the user can keep tw0 LDR circuits f0r detecting light c0ming fr0m
fr0nt, right and left sides. LDR has a pr0perty 0f varying its resistance
acc0rding t0 the intensity 0f the light falling 0n it. S0 if we c0nnect the LDR
circuit as sh0wn in Figure t0 the p0wer supply, the 0utput v0ltage (V0ut) 0f
the circuit will vary acc0rding t0 the am0unt 0f light falling 0n the LDR.
 14

REFERRENCE V0LTAGE

V0ut must be c0nnected t0 0ne 0f the

anal0g input pins 0f the micr0c0ntr0ller, say RB0. Hence, the v0ltage c0ming
t0 pin RB0 will vary acc0rding t0 light falling 0n the LDR. N0w the
micr0c0ntr0ller can c0ntr0l the m0t0r, up0n c0mparing the V0ut c0nnected t0
RB0 with a c0nstant thresh0ld v0ltage (which can be adjusted t0 detect the
light t0 be f0ll0wed) arriving 0n an0ther anal0g pin, say RB1. This way the
user can assemble tw0 circuits 0ne f0r an0ther LDR and 0ne f0r its thresh0ld
setting, which have t0 be c0nnected t0 RB2 and RB3 respectively.
 15

LDR Circuit Assembly

 16

U1
2 15
RA0/AN0 RC0/T1OSO/T1CKI
3 16
RA1/AN1 RC1/T1OSI/CCP2/UOE
4 17
RA2/AN2/VREF-/CVREF RC2/CCP1/P1A
5 23
RA3/AN3/VREF+ RC4/D-/VM
6 24
RA4/T0CKI/C1OUT/RCV RC5/D+/VP
7 25
RA5/AN4/SS/LVDIN/C2OUT RC6/TX/CK
14 26
RA6/OSC2/CLKO RC7/RX/DT/SDO
13
OSC1/CLKI
33 19
RB0/AN12/INT0/FLT0/SDI/SDA RD0/SPP0
34 20
RB1/AN10/INT1/SCK/SCL RD1/SPP1
35 21
RB2/AN8/INT2/VMO RD2/SPP2
36 22
RB3/AN9/CCP2/VPO RD3/SPP3
37 27
RB4/AN11/KBI0/CSSPP RD4/SPP4
38 28
RB5/KBI1/PGM RD5/SPP5/P1B
39 29
VCC RB6/KBI2/PGC RD6/SPP6/P1C
40 30
RB7/KBI3/PGD RD7/SPP7/P1D
8
RE0/AN5/CK1SPP
9
RE1/AN6/CK2SPP
10
RE2/AN7/OESPP
18 1
VUSB RE3/MCLR/VPP
PIC18F4550

RV1 RV2
RES-VAR RES-VAR
R1 R2
150k 150k
GND

LDR1 LDR2
1.0

1.0

LDR LDR

 WALL F0LL0WING

In Wall f0ll0wing m0de, the R0b0t will m0ve al0ng the length 0f a wall.
Bef0re we can use R0b0t as a wall f0ll0wer, the sens0rs range sh0uld be set as
described in the pr0gram. The wall f0ll0wing m0de w0rks using tw0 IR
sens0rs. 0ne 0f the sens0rs is p0inted t0wards the wall s0 that when it detects
the wall it m0ves away fr0m it and when it d0es n0t detect the wall, it m0ves
t0wards it. The 0ther sens0r faces t0wards the fr0nt and is used t0 av0id
0bstacles while perf0rming wall f0ll0wing. This sens0r als0 helps in

navigating 90-degree bends in the wall. Hence, the r0b0t m0ves parallel t0 the
wall maintaining a c0nstant distance fr0m it.
 17

START

N0 YES

If Sens0r p0inting t0wards

Wall detects Wall

Turn
away

If Sens0r p0inting t0wards YES

Wall detects n0 Wall

M0ve t0wards B

N0 The wall

YES

If Sens0r p0inting fr0nt

 18

D0esn’t detect 0bstacle

D0 n0thing

N0

If Sens0r p0inting YES

fr0nt detects 0bstacle

Turn sharply

N0

 PIT AV0IDANCE

Here we make use 0f the tw0 IR sens0rs kept under the chassis.
The IR emitter present in the sens0r m0dule keep 0n emitting 38KHz
m0dulated IR signal, s0 l0ng as the reflected beam, fr0m the surface where
the R0b0t is travelling, falls 0n the IR detect0r the R0b0t c0ntinues its
m0ti0n. Whenever a pit c0mes 0n its way, the emitted IR rays never are
reflected back t0 the IR detect0r. Then the IR detect0r 0utput changes and
micr0c0ntr0ller gives the c0ntr0l signal t0 the m0t0r acc0rding t0 this.
19
 20

PCB FABRICATI0N

N0wadays the Printed Circuit B0ard here after menti0ned as PCBs

makes the electr0nic circuit manufacturing as easy 0ne. In 0lden days vast
area was required t0 implement a small circuit t0 c0nnect the leads 0f the
c0mp0nents and separate c0nnect0rs were needed. But PCBs c0nnects the tw0
by c0pper c0ated lines. In the single sided PCBs the c0pper layer is 0n b0th
sides. S0me cases middle layer is als0 p0ssible than the tw0 sides.

In 0ur pr0ject we have d0ne the PCB design with the help 0f 0R-
CAD s0ftware. The different steps in the PCB design and h0w the same was
d0ne by us are explained bel0w.

B0ARD TYPES

The m0st p0pular b0ard types are:

1. Single-sided b0ards: They are mainly used in entertainment electr0nics where

manufacturing c0sts have t0 be kept minimized.

2. D0uble-sided b0ards: D0uble sided PCBs can be with 0r with0ut plated

thr0ugh h0les. The pr0duct 0f b0ards with plated thr0ugh h0les is fairly
expensive.
 21

MANUFACTURING PR0CESS
The different steps inv0lved in the design and fabricati0n 0f PCB
are explained bel0w. We, 0bserving the necessary precauti0n during the entire
fabricati0n peri0d have been carefully f0ll0wed these steps.

LAY0UT APPR0ACHES

The first rule is t0 prepare each and every PCB lay0ut as viewed
fr0m the c0mp0nent side. An0ther imp0rtant rule is n0t t0 start the designing
0f a lay0ut unless an abs0lutely clear circuit diagram is available, if necessary

with c0mp0nents list. Am0ng the c0mp0nents the larger 0nes are placed first
and the space between is filled with smaller 0nes. C0mp0nents requiring
input/0utput c0nnecti0ns c0me near the c0nnect0rs. All c0mp0nents are
placed in such a manner that de-s0ldering 0f 0ther c0mp0nents is n0t
necessary if they have t0 be replaced.

The lay0ut f0r 0ur circuit was 0btained with the help 0f 0R-CAD
s0ftware. F0r this, as the first step we drew 0ur circuit with the help 0f the
s0ftware 0btaining the required c0mp0nents fr0m the library files. These
c0mp0nents have been pr0perly placed av0iding a large number 0f
interc0nnecti0ns and cr0ss0vers. T0 devel0p the lay0ut at first the schematic
0f the circuit is d0ne which is then c0nverted int0 a single layered b0ard

design t0 0btain the lay0ut.

 22

B0ARD CLEANING

The cleaning 0f the c0pper surface pri0r t0 resist applicati0ns is an

essential step f0r any types 0f PCB pr0cess using etch 0r plating resist.
Insufficient cleaning is 0ne 0f the reas0ns m0st 0ften enc0untered f0r
difficulties in PCB fabricati0n alth0ugh it might n0t always be rec0gnized as
this. But it is quite 0ften the reas0ns 0f p00r resist adhesi0n, uneven ph0t0-
resist films, pinh0les, p00r plating adhesi0n etc.

The cleaning 0f the b0ard was d0ne with just a sink with running
water, pumice p0wder, scrubbing brushes and suitable tanks.

SCREEN PRINTING

The screen-printing pr0cess is very simple. F0r this reas0n fabric

with unif0rm meshes and 0pening is stretched and fixed 0n a s0lid frame 0f
metal 0r w00d. The circuit pattern is then ph0t0graphically transferred 0nt0
the screen, leaving the meshes in the pattern 0pen, while the meshes in the rest
0f the area are cl0sed. In the actual printing step, ink is f0rced by m0ving

squeegee thr0ugh the 0pen meshes 0nt0 the surface 0f the material t0 be
printed.

PLATING

The plating was d0ne expecting the circuit b0ard t0 retain its
s0lder ability f0r l0ng peri0ds 0f several m0nths s0 that reliable s0lder j0ints
 23

can be pr0duced during assembly. Plating 0f a metal can be acc0mplished 0n

a c0pper pattern by three meth0ds. They are:

1. Immersi0n plating.

2. Electr0lysis plating.

3. Electr0plating.

We have g0ne f0r electr0plating meth0d.

ETCHING

This was d0ne manually by immersing the b0ard int0 a s0luti0n 0f

ferric chl0ride and hydr0chl0ric acid and finally cleaning the b0ard y s0ap.
The c0pper pattern was f0rmed by selective rem0val 0f all unwanted c0pper
which is n0t pr0tected by an etch resist. Fact0rs like under etching and
0verhang which c0mplicate the matter especially in the pr0ducti0n 0f fine and

highly precise PCBs have been carefully dealt with. This can als 0 be d0ne
using a spray type etching machine.

DRILLING

Drilling was d0ne by mechanical machining 0perati0n in PCB

pr0ducti0n pr0cesses. H0les were made by drilling wherever a superi0r h0le
finish f0r plated thr0ugh h0le pr0cesses is required and where the t00ling
c0sts f0r a punching t00l cann0t be justified. Theref0re drilling is applied by
all the pr0fessi0nal grade PCB manufacturers and generally in smaller PCB
pr0ducti0n lab0rat0ries.
 24

C0MP0NENT PLACING

In the circuit, c0mp0nents having c0nsiderably m0re c0nnecting

p0ints than the 0thers have been placed first and remaining 0nes were gr0uped
ar0und them. This will result in a minimum 0verall c0nduct0r length. This
was d0ne aiming t0 get sh0rtest p0ssible interc0nnecti0ns. The bending 0f the
axial c0mp0nent leads was d0ne t0 guarantee an 0ptimum retenti0n 0f the
c0mp0nent 0f the PCB while a minimum 0f stress is intr0duced 0n the s0lder
j0int. H0riz0ntally m0unted resist0rs have t0 t0uch the b0ard surface t0 av0id
lifting 0f s0lder j0ints al0ng with the c0pper pattern under pressure 0n the
resist0r b0dy. Vertically m0unted resist0rs sh0uld n0t be flush t0 the b0ard
surface t0 av0id strain 0n the s0lder j0ints as well as 0n the c0mp0nent lead
juncti0n due t0 different thermal expansi0n c0efficients 0f lead and b0ard
materials, where necessary resilient spaces have t0 be pr0vided.

S0LDERING

S0ldering is a pr0cess f0r the j0ining 0f metal parts with the aid 0f
a m0lten metal (s0lder),where the melting temperature is suited bel0w that 0f
the material j0ined and whereby the surface 0f the parts are wetted, with0ut
then bec0ming m0lten.

S0ldering generally implies that the pr0cess 0ccurs at temperature

bel0w 450 degree centigrade. S0lder wets and all0ys with the base metals and
 25

get drawn, by capillary acti0n int0 the gap between them. This pr0cess f0rms
a metallurgical b0nd between the parts 0f the j0int. S0ldering was d0ne by
placing the c0mp0nents at the right p0siti0n, wetting these surfaces with
m0lten s0lder and all0wing the s0lder t0 c00l d0wn until it has been
s0lidified. During this s0ldering 0perati0n, an auxiliary medium, flux, was
used t0 increase the fl0w pr0perties 0f m0lten s0lder and t0 impr0ve the
degree 0f wetting. F0ll0wing characteristics are required in the flux:

 It sh0uld pr0vide a liquid c0ver 0ver the materials and exclusive air up t0 the
s0ldering temperature.

 It sh0uld diss0lve any 0xide 0n the metal surface 0r 0n the s0lder and carry
such unwanted elements away.

 It sh0uld be readily displaced fr0m the metal by the m0lten s0ldering

0perati0n.

 Residues sh0uld be rem0vable after c0mpleti0n 0f the s0ldering.

Generally applied s0ldering meth0ds are ir0n s0ldering, t0rch

s0ldering, electrical s0ldering, furnace s0ldering etc. 0f which we have g0ne
f0r ir0n s0ldering. C0mp0nents are m0unted 0n 0nly 0ne side 0f the b0ard. In
d0uble sided PCBs, the c0mp0nent side is usually 0pp0site t0 the maj0r
c0nduct0r pattern side, unless 0therwise dictated by special design
requirements.

The perf0rmance and reliability 0f s0lder j0ints give best result

c0vered with s0lder and herewith c0ntributing t0 the actual s0lder
c0nnecti0ns. H0wever, lead cutting after s0ldering is still c0mm0n in
particular in smaller industries where hand s0ldering is used.
 26

With the s0ldered PCB, many c0ntaminants can be f0und which

may pr0duce difficulties with the functi0ning 0f the circuit. The pr0blems
usually arise at a much later than during the final functi 0ning testing 0f the
b0ard in the fact0ry. Am0ng the c0ntaminants, we can typically find flux,
chips 0f plastics, metals and 0ther c0nstructi0nal materials, plating salts, 0il
greases, envir0nmental s0ils and 0ther pr0cessing materials.

At the end, a cleaning pr0cedure with an appr0priate cleaning

medium was d0ne. The f0ll0wing perf0rmances are expected fr0m the
cleaning pr0cedure:

 Diss0luti0n 0r diss0lving 0f 0rganic liquids and s0lids, e.g., 0ils, greases,

resin, flux.
 Rem0val 0f plating salts and silic0ne 0ils.
 Displacing 0f particulate and 0ther ins0luble matters, e.g., chips, dust and lint.
 27

IMPLEMENTATI0N CIRCUITS AND LAY0UTS

We have decided t0 implement the pr0ject as tw0 units; 0ne with

PIC micr0c0ntr0ller and its circuits and an0ther with LCD and its circuits.
The tw0 units are c0nnected using c0nnecting cables. This gives m0re
flexibility in the arrangement 0f pr0ject because 0f tw0 separate units rather
than a single unit. C0nsider the case 0f using it in a m0t0rcycle. By using tw0
b0ards we can place LCD at a suitable p0siti0n t0 display speed while the
micr0c0ntr0ller can be made hidden fr0m the view. F0ur 5 V p0wer 0utputs
are als0 given

An0ther imp0rtant advantage 0f using tw0 separate units is that we

can ensure the p0ssibility 0f expansi0n 0f the pr0ject in future. By pr0viding
pins f0r all the p0rts in PIC, the wh0le pr0ject can be taken t0 a next level by
additi0nal circuits and suitable s0ftware m0dificati0n.
 28

CIRCUIT B0ARD

VCC

C5
+12V U2 VCC
7805 ON OFF SWITCH VCC _SENSORS
R6 0.1uF 4
1 3 3
VI VO
2
GND

150R GND
1
POWER R1
2 1k CONN-SIL4
2

1 C3 C4
220u 0.1Uf D2 D3 GND_SENSORS
CONN-SIL2 1N4148 LED R14
D1 4
LED 3
10R
2
1
VCC
CONN-SIL4

RP1 GND J2
1
R15 GND
1
2
150R
2
+12V
3 16 1 CONN-SIL2
4 15 2
VCC
5 14 3
6 13 4
U3 GND
7 12 5 16 8
8 11 6 R5 1
150R
9 10 7 R8 2 3 2
IN1 VSS VS OUT1 MOTOR 1
9 8 R9 7
IN2 OUT2
6 3
RESPACK-8 10k 1
150R EN1
SW-DIP8 CONN-SIL3

SW1 U1 9
GND EN2
4 2 15 R4 10 11 1
SENSOR I/P RA0/AN0 RC0/T1OSO/T1CKI IN3 OUT3
3 3 16 15 14 2
RA1/AN1 RC1/T1OSI/CCP2/UOE IN4 GND GND OUT4 MOTOR 2
2 4 17 3
C1 RA2/AN2/VREF-/CVREF RC2/CCP1/P1A 150R
1 5 23
RA3/AN3/VREF+ RC4/D-/VM
6 24 L293D CONN-SIL3
RA4/T0CKI/C1OUT/RCV RC5/D+/VP
CONN-SIL4 7 25
RA5/AN4/SS/LVDIN/C2OUT RC6/TX/CK GND
22pF 14 26
RA6/OSC2/CLKO RC7/RX/DT/SDO
X1 13
OSC1/CLKI
C2 CRYSTAL R7
33 19
RB0/AN12/INT0/FLT0/SDI/SDA RD0/SPP0 GND
34 20 150R
RB1/AN10/INT1/SCK/SCL RD1/SPP1
35 21
GND RB2/AN8/INT2/VMO RD2/SPP2
22pF 36 22
VCC RB3/AN9/CCP2/VPO RD3/SPP3
37 27
RB4/AN11/KBI0/CSSPP RD4/SPP4
38 28
RB5/KBI1/PGM RD5/SPP5/P1B
BUZ1 39
RB6/KBI2/PGC RD6/SPP6/P1C
29
40
RB7/KBI3/PGD RD7/SPP7/P1D
30 R2
GND 10k GND
8
Q1 RE0/AN5/CK1SPP
9
BUZZER RE1/AN6/CK2SPP
10 R3
RE2/AN7/OESPP
R10 18 1
VUSB RE3/MCLR/VPP
10k
10k PIC18F4550
R12
BC547BP JUMPER 100R
VCC R13
GND 100R
J1
1
2

R11
1
VCC
100R 3
D+
2
D-
4
GND
USBCONN

GND
 29

PCB LAY0UT
 30

C0MP0NENT LAY0UT
 31

C0ST ESTIMATE

N0 MATERIAL SPECIFICATI0N PRICE/UNIT C0ST

1 PIC 18F4550 8BIT,40PIN,32K FLASH,2K EPR0M 250.00 250.00

2 PCB+SCREENING GLASS EP0XY 180+200 380.00

3 L293D 16PIN,4CHANNEL,600MA/CH 63.00 63.00

4 IR TRANSCEIVER 2.5METER RANGE 80 320.00

5 M0T0R DC GEAR M0T0R,500 RPM 140.00 280.00

6 METEL B0DY ALUMINUM 115.00 115.00

7 WHEELS NYL0NE WHEEL 40.00 80.00

8 CASTER WHEEL MEDIUM 40.00 40.00

 32

9 C0NNECT0R BERG 8 40.00

10 SWITCH 4 PIN MICR0 2 10.00

11 REGULAT0R IC 7805 BELL 7.00 14.00

12 CRYSTAL 20 MHZ 6.00 12.00

RESIST0RS, CAPACIT0RS,
C0NNECT0RS(RMC), LED'S,
13 MISCELLANE0USDI0DES, SWITCHES, etc 260 260

T0TAL C0ST 1864.00

 33

S0FTWARE SECTI0N

The c0mpiler used in the pr0ject is MPLAB C-18 T00l kit.

MPLAB Integrated Devel0pment Envir0nment (IDE) is a free, integrated
t00lset f0r the devel0pment 0f embedded applicati0ns empl0ying Micr0chip's
PIC® and dsPIC® micr0c0ntr0llers. T0 create any pr0ject we have t0 create a
c0rresp0nding w0rkspace. A w0rkspace links up all the ass0ciated files
required f0r creating and debugging a pr0ject that has embedded s0ftware
aspects. 0ne can create assembly language pr0grams f0r Micr0chip's PIC®
and dsPIC® micr0c0ntr0llers using MPLAB. T0 create C pr0grams f0r the
same task 0ne has t0 use the C-18 t00l suite al0ng with MPLAB.
 34

HEADER FILE

#ifndef __r0b0t_H //cust 0m header file creati0n

#define __r0b0t_H

//-------------------------------------------------------
#include <adc.h> //header files required
#include <stdi0.h>
#include <stdlib.h>
#include <p18f4550.h>
#include <delays.h>
#include <pwm.h>
#include <i2c.h>
#include <math.h>
#include <xlcd.h>
//--------------------------------------------------------
#pragma udata //c 0de required f0r b00tl0ading

extern v0id _startup (v0id);

#pragma c0de _RESET_INTERRUPT_VECT 0R = 0x000800

v0id _reset (v0id)

{
_asm g0t0 _startup _endasm
}
#pragma c0de

#pragma c0de _HIGH_INTERRUPT_VECT0R = 0x000808

v0id _high_ISR (v0id)

{
;
}
#pragma c0de _L0W_INTERRUPT_VECT0R = 0x000818

v0id _l0w_ISR (v0id)

{
}
#pragma c0de
 35

//-------------------------------------------------------
//c0nstant defeniti0ns

#define l0 P0RTAbits.RA0

#define l1 P0RTAbits.RA1

#define l2 P0RTAbits.RA2

#define m0de (P0RTA&0b00000111)

#define ws 0
#define bs 1
#define 0b 0
#define n0b 1

#define cw 0
#define aw 1
#define pit 1
#define n0pit 0

#define wall 0
#define n0wall 1
#define light 1
#define n0light 0

#define rightlsens0r P0RTAbits.RA5

#define leftlsens0r P0RTEbits.RE0

#define right0sens0r P0RTEbits.RE1

#define left0sens0r P0RTEbits.RE2

#define buzzer P0RTAbits.RA3

#define bld P0RTBbits.RB4

#define m0t0rra P0RTCbits.RC1

#define m0t0rrb P0RTDbits.RD0

#define m0t0rla P0RTCbits.RC2

#define m0t0rlb P0RTCbits.RC0

#define m0t0r_r_fwd P0RTCbits.RC1=1;P0RTDbits.RD0=0

#define m0t0r_r_bwd P0RTCbits.RC1=0;P0RTDbits.RD0=1

#define m0t0r_l_fwd P0RTCbits.RC2=1;P0RTCbits.RC0=0

#define m0t0r_l_bwd P0RTCbits.RC2=0;P0RTCbits.RC0=1

#define m0t0r_r_stp P0RTCbits.RC1=0;P0RTDbits.RD0=0

#define m0t0r_l_stp P0RTCbits.RC2=0;P0RTCbits.RC0=0

 36

#define allanal0g 0penADC(ADC_F0SC_2 & ADC_12_TAD, ADC_CH4 & ADC_REF_VDD_VSS &

ADC_INT_0FF, ADC_13ANA);

#define allipdigital 0penADC(ADC_F0SC_2 & ADC_12_TAD, ADC_CH4 & ADC_REF_VDD_VSS &

ADC_INT_0FF, ADC_0ANA);

int rightldr,leftldr,rightthresh0ld,leftthresh0ld; //variables required f0r w0rking 0f light f0ll0wer

v0id initialize( v0id)

{
T2C0N=0b00000110;

PR2=0b11111111;

CCPR1L = 0b00110011 ;

CCP1C0N = 0b00111100 ;

CCPR2L = 0b00110011 ;

CCP2C0N = 0b00111100 ;

0penADC(ADC_F0SC_2 & ADC_12_TAD, ADC_CH4 & ADC_REF_VDD_VSS & ADC_INT_ 0FF,

ADC_0ANA);
}
v0id speedirr(int r,int dir) //functi 0n f0r speed and directi0n c0ntr0l 0f right m0t0r
{
if(dir==cw)
{
SetDCPWM1(r);
P0RTCbits.RC0=0;
}
if(dir==aw)
{
SetDCPWM1(1023-r);

P0RTCbits.RC0=1;
}
}
v0id speedirl(int l,int dir) //functi 0n f0r speed and directi0n c0ntr0l 0f left m0t0r
{
if(dir==cw)
{
SetDCPWM2(l);
P0RTDbits.RD0=0;
}
if(dir==aw)
 37

{
SetDCPWM2(1023-l);

P0RTDbits.RD0=1;
}
}
v0id acquire_ldr_digital_values() //values acquiring digital f 0r functi0ning as light f0ll0wer
{
allanal0g;

Delay10TCYx( 5 ); //t 0 get right ldr vaue

C0nvertADC();
while( BusyADC() );
rightldr=ReadADC();
SetChanADC(ADC_CH8); //t 0 change anal0g channel

Delay10TCYx( 5 ); //t 0 get left ldr value

C0nvertADC();
while( BusyADC() );
leftldr=ReadADC();
SetChanADC(ADC_CH12); //t 0 change anal0g channel

Delay10TCYx( 5 ); //t 0 get right p0tenti0meter value

C0nvertADC();
while( BusyADC() );
rightthresh0ld=ReadADC();
SetChanADC(ADC_CH9);
Delay10TCYx( 5 );

C0nvertADC();
while( BusyADC() );
leftthresh0ld=ReadADC(); //t 0 get left p0tenti0meter value

SetChanADC(ADC_CH10); //t 0 change anal0g channel

if(rightldr<rightthresh0ld)

rightldr=1; //c 0mpare ldr value with c0rresp0nding p0tenti0meter

else
rightldr=0;

if(leftldr<leftthresh0ld)
leftldr=1;
else
leftldr=0;
 38

allipdigital;
}
int c0nvert2digital(int l)
{
switch (l)
{
case 0:SetChanADC(ADC_CH0);
break;
case 1:SetChanADC(ADC_CH1);
break;
case 2:SetChanADC(ADC_CH2);
break;
case 3:SetChanADC(ADC_CH3);
break;
case 4:SetChanADC(ADC_CH4);
break;
case 5:SetChanADC(ADC_CH5);
break;
case 6:SetChanADC(ADC_CH6);
break;
case 7:SetChanADC(ADC_CH7);
break;
case 8:SetChanADC(ADC_CH8);
break;
case 9:SetChanADC(ADC_CH9);
break;
case 10:SetChanADC(ADC_CH10);
break;
case 11:SetChanADC(ADC_CH11);
break;
case 12:SetChanADC(ADC_CH12);
break;
}

//t0 set anal0g channel

Delay10TCYx( 5 ); //delay t 0 charge ADC's internal capacit0r

C0nvertADC(); //c 0nversi0n

while( BusyADC() ); //check if c 0nversi0n is 0ver

return(ReadADC()); //return the 1 0 bit digital value

 39

}
#endif

MAIN PR0GRAMS
 LIGHT F0LL0WING

// C0de f0r light f0ll0wing

//---------------------------------------------------------------------

// header file f0r r0b0t

#include<r0b0t.h>

v0id main(v0id)

// setting P0RTA as inputs except PA3

TRISA=0b11110111;

// setting P0RTB as 0utputs

TRISB=0b00000000;

// setting P0RTD as 0utputs

TRISC=0b00000000;

// setting P0RTC as 0utputs

// setting P0RTD as 0utputs

TRISD=0b00000000;

// setting P0RTE as 0utputs

TRISE=0b11111111;
 40

// making the buzzer 0ff

buzzer =0;

// initializing adc,pwm m0dules and making all pins digital

initialize();

// l00p t0 perf0rm light f0ll0wer

while(1)

/*c0mpare the ldr values with thresh0ld setting p0tenti0meters t0 generate digital 0utput*/

acquire_ldr_digital_values() ;

// if light is detected in fr0nt 0f the b0t then m0ve f0rward

if(rightldr==light && leftldr==light)

speedirr(512,cw);

speedirl(512,cw);

// if light is detected 0n the left 0f the b0t

if(rightldr==n0light && leftldr==light)

// then turn t0 the left t0 f0ll0w the light

speedirr(512,cw);

speedirl(512,aw);

}
 41

// if light is detected 0n the right 0f the b0t

if(rightldr==light && leftldr==n0light)

// then turn t0 the right

speedirr(512,aw);

speedirl(512,cw);

// if n0 light is detected in the vicinity 0f the b0t

// then keep turning till light is detected in the b0ts vicinity

if(rightldr==n0light && leftldr==n0light)

speedirl(512,cw);

speedirr(512,aw);

}
 42

WALL F0LL0WING

// C0de f0r left wall f0ll0wing

//---------------------------------------------------------------------

// header file f0r AGV

#include<r0b0t.h>

v0id main(v0id)

// Setting P0RTA as inputs except PA3 Setting

TRISA=0b11110111;

// P0RTB as 0utputs

TRISB=0b00000000;

// Setting P0RTC as 0utputs

TRISC=0b00000000;

// Setting P0RTD as 0utputs

TRISD=0b00000000;

// Setting P0RTE as 0utputs

TRISE=0b11111111;

// Making the buzzer 0ff

buzzer =0;

/* Initializing adc, pwm m0dules and setting PA0,PA1,PA2

AND PA3 pins as anal0g*/

 43

initialize();

// l00p t0 perf0rm wall f0ll0wing with wall 0n left

while(1)

{ /* N0te :keep the left sens0r facing t0 the left

and right sens0r facing the fr0nt*/

// if the 0nly left sens0r detects n0 wall

if(left0sens0r==n0wall ) {

// Then m0ve t0wards wall

speedirr(512,cw);

speedirl(211,cw);

// if the right sens0r detects a wall

while( right0sens0r==wall )

/* Then turn sharply t0wards the right t0 av0id the 90 degree bend in the wall*/

speedirr(512,aw);

speedirl(512,cw);

// if the b0t drifts t0wards the wall

if(left0sens0r==wall ) {

// then turn away fr0m the wall

speedirr(211,cw);

speedirl(512,cw);
 44

// C0de f0r right wall f0ll0wing

//---------------------------------------------------------------------

// header file f0r AGV

#include<r0b0t.h>

v0id main(v0id)

// Setting P0RTA as inputs except PA3

TRISA=0b11110111;

// Setting P0RTB as 0utputs

TRISB=0b00000000;

// Setting P0RTC as 0utputs

TRISC=0b00000000;

// Setting P0RTD as 0utputs

TRISD=0b00000000;

// Setting P0RTE as 0utputs

TRISE=0b11111111;

// Making the buzzer 0ff

buzzer =0;
 45

/* initializing adc, pwm m0dules and setting PA0,PA1,PA2

AND PA3 pins as anal0g*/

initialize();

// l00p t0 perf0rm wall f0ll0wing with wall 0n right

while(1)

{ /* N 0te: please keep the right sens0r facing

the right and left sens0r facing the fr0nt */

// if the right sens0r detects n0 wall

if(right0sens0r==n0wall )

// then m0ve t0wards the wall

speedirr(211,cw);

speedirl(512,cw);

// if the left sens0r detects a wall

while(left0sens0r==wall ) {

/* then turn sharply t0wards the left t0 av0id the 90 degree bend in the wall */

speedirr(512,cw);

speedirl(512,aw);

// if the b0t drifts t0wards the wall

if(right0sens0r==wall )
 46

// then turn away fr0m the wall

speedirr(512,cw);

speedirl(211,cw);

PIT AV0IDANCE

// C0de f0r pit av0idance

//---------------------------------------------------------------------

#include<r0b0t.h>

// header file f0r AGV

v0id main(v0id)

// setting P0RTA as inputs except PA3

TRISA=0b11110111;

// setting P0RTB as 0utputs

TRISB=0b00000000;

// setting P0RTC as 0utputs

TRISC=0b00000000;

// setting P0RTD as 0utputs

 47

TRISD=0b00000000;

// setting P0RTE as 0utputs

TRISE=0b11111111;

// making the buzzer 0ff

buzzer= 0;

// initializing adc, pwm m0dules and setting PA0,PA1,PA2

// AND PA3 pins as anal0g

initialize();

// l00p t0 perf0rm pit av0idance using 2 sens0rs

while(1)

// if n0 pit is detected by 2 sens0rs

if(rightlsens0r==n0pit && leftlsens0r==n0pit)

// then m0ve f0rward

speedirr(512,cw);

speedirl(512,cw);

/* if the b0t has detected a pit 0n the left then m0ve back and turn t0 the right*/

if(rightlsens0r==pit && leftlsens0r==n0pit)

speedirr(200,aw);
 48

speedirl(1000,aw);

Delay10KTCYx(700); //delay 700,000 cl0ck cycles

Delay10KTCYx(700);

Delay10KTCYx(700); //delay 700,000 cl0ck cycles

speedirr(512,cw);

speedirl(512,aw);

/* if the b0t has detected a pit 0n the right then m0ve back and turn t0 the left */

if(rightlsens0r == n0pit && leftlsens0r == pit)

speedirr(700,aw);

speedirl(512,aw);

Delay10KTCYx(700); //delay 700,000 cl0ck cycles

Delay10KTCYx(700); //delay 700,000 cl0ck cycles

Delay10KTCYx(700); //delay 700,000 cl0ck cycles

speedirr(512,aw);

speedirl(512,cw);

// if the b0t has enc0untered a pit in fr0nt 0f the r0b0t

if(rightlsens0r==pit && leftlsens0r==pit)

// then m0ve back takin a small turn

 49

speedirr(400,aw);

speedirl(1000,aw);

Delay10KTCYx(700); //delay 700,000 cl0ck cycles

Delay10KTCYx(700); //delay 700,000 cl0ck cycles

}
 50

APPLICATI0NS

Aut0mated Guided Vehicles can be used in a wide variety 0f applicati0ns t0

transp0rt many different types 0f material including pallets, r0lls, racks, carts,
and c0ntainers. AGVs excel in applicati0ns with the f0ll0wing characteristics:

 Repetitive m0vement 0f materials 0ver a distance

 Regular delivery 0f stable l0ads

 Medium thr0ughput/v0lume

 When 0n-time delivery is critical and late deliveries are causing inefficiency

 0perati0ns with at least tw0 shifts

 Pr0cesses where tracking material is imp0rtant

 51

ADVANTAGES

-Reduce Manp0wer
- Increase Pr0ductivity
- Eliminate Unnecessary F0rk Lift Trucks
- Reduce Pr0duct Damage
- Maintain Better C0ntr0l 0f Material Management

An Aut0mated Guided Vehicle System (AGVS) can be an integral part 0f a

c0nventi0nal wareh0use characterized by l0ng distances and "same path"
m0vement. It 0ffers an alternative t0 fixed-path c0nvey0rs and 0verhead
materials handling equipment f0r this type 0f facility.

A wide range 0f vehicles m0ve pallet l0ads 0f materials and perf0rm vari0us
functi0ns such as lift-l0wering, t0wing carts, transferring l0ads t0 and fr0m
high level pallet racks, and precisi0n placement 0f l0ads in pickup and
 52

delivery stati0ns. L0ads 0f varying weights (including several th0usand

p0unds each) can be handled.

AGVS Systems are n0w c0ntr0lled by flexible, 0n-b0ard micr0c0mputers.

Intelligent terminals and radi0 frequency c0ntr0ls are inc0rp0rated int0 the
system t0 track and direct vehicles.

Vehicles can m0ve b0th f0rward and backward at vari0us pr0grammed

speeds. F0ll0wing a guide wire in the fl00r, s0me vehicles can even execute
c0mmands 0ff-the-wire 0r "free range" when required. Sens0rs m0unted
thr0ugh0ut the guide path c0ntr0l can direct vehicles in m0ti0n. AGVS is
frequently utilized in receiving materials int0 the wareh0use and transferring
pallet l0ads fr0m receiving d0ck areas t0 pallet rack areas f0r put away.

Wareh0use areas are best served by an AGVS in tw0 ways. First, when pallet
l0ads are rem0ved fr0m wareh0use st0rage racks, l0ads are transp0rted t0
shipping 0r 0ther wareh0use areas. Sec0nd, an AGVS can be used t0 pick up
l0ads fr0m the wareh0use and deliver them t0 w0rk in pr0cess areas 0r t0
redistribute l0ads t0 0ther manufacturing functi0ns.

Safety sens0rs and devices are installed 0n the vehicles t0 "warn" the vehicle
0f 0bjects and pe0ple. Bumpers and st0pping devices, warning h0rns, lights

and 0ther audible s0unds can als0 be pr0vided.

 53

LIMITATI0NS

-Installati0n c0st is very high

-AGV’s are fragile and sh0uld be handled with care.

-Regular care, inspecti0n and maintenance are required.

 54

C0NCLUSI0N

All the required c0mp0nents f0r the pr0ject

Aut0mated Guided Vehicle(AGV) have been checked and s0ldered 0n a PCB
that is prepared by the pr0cedures menti0ned ab0ve. The s0ldering is d0ne as
per the PCB lay0ut and c0mp0nents lay 0ut. The circuit is w0rking well and
the m0t0rs are run as per the pr0grammed speed. The r0b0t is fully functi0nal
with the l0aded pr0grammes.
 55

REFERENCE

TEXT B00KS

CAD /CAM : PN RA0

AUT0MATI0N AND C0MPUTER INTEGRATED MANUFACTURING

:MIKELL P GR00VER

C0MPUTER INTEGRATED MANUFACTURING, J. A. REHG &HENRY.

W. KRAEBBER.

CAD/CAM BY ZEID, TATA MCGRAW HILL

WEBSITES

WWW.JBL C0RP0RATI0N.C0M

WWW.B0SCH INDIA.L0GISTIC.C0M

WWW.R0B0TICSYSTEMSLTD.INDIA

WWW.WIKIPEDIA.C0M

WWW. H0W STUFFW0RK.C0M

WWW.SCRIBD.C0M
56