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18
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IPC PCB DESIGNER CERTIFICATION (CID)
IPC’s Interconnect Designer Certification
IPC-2221B / IPC-2222A / IPC-DRM-18H
COURSE DESCRIPTION COURSE OUTLINE
The IPC Certified Interconnect Designer Program is the industry’s DAY 1
premier professional development course directly focused on PCB 1. DESIGN CONSIDERATIONS
design philosophy and requirements. • 1.1 Considerations for Design
• 1.2 Placement and Routing Techniques
This 3-day, lectured course (2-days lecture, 1-day testing and • 1.3 Electrical Characteristics
review), goes beyond the fundamentals of component placement • 1.4 Copper Clad Laminates
and track routing to encompass a complete understanding of all • 1.5 Holes in Printed Boards
the elements that go into the development of a printed circuit • 1.6 Drilling and Hole Locations
board–from design considerations, layout principles, component • 1.7 Features Formed in Copper
and assembly issues, to the overall physical demands and require- 2. THERMAL, RELIABILTTY, AND TESTING ISSUES
ments that need to be met to create a producible, quality product. • 2.1 Thermal Management of Boards
• 2.2 Thermal Management of Assemblies
Taught by recognized industry professionals, this program enhances • 2.3 Reliability
your experience by exposing you to instructors that have a broad • 2.4 Testing
expertise and appreciation for the process. 3. PHYSICAL BOARD PRINCIPLES
Class materials are sent out upon enrollment. Participants are • 3.1 Printed Board and Assembly Viewing Principles
• 3.2 Introduction to Datum Dimensioning
expected to be familiar with course materials prior to class.
• 3.3 Grid Systems
Although not required, enrollment as a member in the IPC • 3.4 Tooling Holes and Fiducials
Designer Council is encouraged and the best part is, it’s FREE. • 3.5 Board and Assembly Panelization
• 3.6 Panel Separation Methods
WHO SHOULD ATTEND 4. COMPONENT TYPES
This course is designed for anyone involved in the development, • 4.1 Components - Overview
design and fabrication–at any level from sales, management, • 4.2 Edge Board Connectors
• 4.3 Stiffeners
procurement, or quality–in printed circuit board production.
• 4.4 Bus Bars
WHAT STUDENTS RECEIVE DAY 2
4. COMPONENT TYPES (continued)
Everyone who attends will receive three key IPC standards and the
• 4.5 Sockets
Designer Certification Study Guide that describes their application:
• 4.6 Jumpers and Terminals
■ IPC-2221 Generic Standard On Printed Board Design • 4.7 MELFs
■ IPC-2222 Sectional Standard on Rigid Organic • 4.8 Eyelets
Printed Boards 5. COMPONENT AND ASSEMBLY ISSUES
• 5.1 Designing for Assembly
■ IPC-DRM-18H Component Identification Training
• 5.2 Mounting Through Hole Components
& Reference Guide
• 5.3 Mounting Surface Mount Components
■ Designer Certification Study Guide
• 5.4 Component Modifications
Everyone who successfully completes the program will receive: • 5.5 Component Insertion and Attachment Techniques
■ IPC Designer CID Certification (Upon exam passing) • 5.6 Solder Processes
• 5.7 Clinched Leads
■ Publication of your certification as an
6. BOARD SURFACE TREATMENTS
IPC Certified Designer • 6.1 Solder Mask
■ Registered certification with the IPC for • 6.2 Conformal Coatings
future validation • 6.3 Protective Coatings/Surface Finishes
• 6.4 Legend
PREREQUISITES 7. DOCUMENTATION AND DIMENSIONING
An understanding of the English language, both oral and written is • 7.1 Documentation and Classifications
• 7.2 Basic Drawing Format
all that is required to benefit from this IPC Designer Certification
8. SCHEMATIC AND TOLERANCING REQUIREMENTS
Program. ESL Students are encouraged to inquire.
9. FABRICATION AND TOLERANCING REQUIREMENTS
CLASS SIZE • 9.1 Board Fabrication Documentation
• 9.2 Dimensioning and Tolerancing
Maximum number of students is limited to ten (10) in order to 10. ASSEMBLY DOCUMENTATION AND BOMS
provide greater instructor interaction. Call early to reserve your space.
DAY 3
CERTIFICATION TESTING
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