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Contents
Indo-MIM Confidential
Copper MIM materials
Following Copper material offered by INDO-MIM
MIM Cu :
Chemical Composition:
Cu
100.0 Maximum
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MIM Cu
Material Properties:
TYPICAL VALUES
Tensile Properties
Density Thermal Ultimate Yield Strength Elongation
Conductivity Strength (0.2%) (in 25mm)
(at 25 °c)
g/cm3 W/(m-K) MPa MPa %
8.75 360 207 69 30
Magnification : 200X
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Other Copper alloy grades through MIM
Cu [ Ni Sn Fe Cr Mn Si O C Other
> -- -- -- -- -- -- -- -- -- --
Cu999
< Bal. -- -- 0.1 -- -- -- 0.05 -- --
> -- -- 7.0 -- -- -- -- -- -- --
CuSn8
< Bal. 9.0 -- -- -- -- -- -- 0.2
CuNi9Sn6
< Bal. 9.5 6.5 -- -- -- -- -- -- 0.3
CuNi15Sn8
< Bal. 15.5 8.5 -- -- -- -- -- -- 0.3
• Mainly the parts for thermal management application like Heat Sinks for
LED & High power chips, specifically for IGBT.
• Copper parts are therefore the markets Parts for Electro technology, E-
mobility, and renewable energy.
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Copper MIM Parts
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Copper MIM Parts
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Cold Plate MIM Part for IGBT Application
Cold Plates used in the IGBT system which helps the heat to dissipate have been
developed using MIM Technology in Copper material.
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Complexity Simplified
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