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1. Figure1 shows the phase diagram of the Pb-Sn system which shows a binary
eutectic with limited solid-solubility. Common solder alloys generally contain 40-
50wt.% Sn.
(a) What are the melting points of Pb and Sn according to the diagram?
(b) Consider a 50:50 (wt.%) alloy. For 200◦C determine:
i. The phases present
ii. The composition of these phases iii.
The relative amounts of phases (in wt.%)
(c) Repeat part (a) for 100◦C.
(d) Explain the microstructural changes that takes place in an alloy containing
10 wt.% Sn when cooled from 330◦C to 130◦C.
(e) Explain why solders near the 60wt.% Sn composition are used for heat
sensitive electronic components requiring minimum heat application.
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Tutorial 7 - Solutions
1. (a) What are the melting points of Pb and Sn according to the diagram?
Solution: Melting point of Pb: 327 ◦ C and Melting point of Sn: 232 ◦ C.
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iii. The relative amounts of phases (in wt.%)
Solution:
xL − x 54 − 50
wα = × 100% = × 100% = 11. 1( wt. %)
xL − xα 54 − 18
x − xα 50 − 18
wL = × 100% = × 100% = 88. 9( wt. %)
xL − xα 54 − 18
Solution: α and β
Solution:
xβ − x 99 − 50
wα = × 100% = × 100% = 52. 1( wt. %)
xβ − xα 99 − 5
x − xα 50 − 5
wβ = × 100% = × 100% = 47. 9( wt. %)
xβ − xα 99 − 5
(d) Explain the microstructural changes that takes place in an alloy containing 10
wt.% Sn when cooled from 330 ◦ C to 130 ◦ C.
Solution:
Between 275 ◦ C and ∼ 150 ◦ C the microstructure has only the α phase.
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Below ∼ 150 ◦ C, some of the α will transform to the β phase.
(e) Explain why solders near the 60wt.% Sn composition are used for heat sensitive
electronic components requiring minimum heat application.
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Figure 2: Iron-Iron carbide phase diagram.
0. 35 − 0. 022
wP = = 0. 44
0. 76 − 0. 022
0. 76 − 0. 35
wα 0 = = 0. 56
0. 76 − 0. 022
Solution: Ferrite exists as pro-eutectoid ferrite (α0) or as eutectoid ferrite (αe) in pearlite.
Total amount of ferrite (wα) therefore should be the some of above.
wα = wα0 + wαe
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wαe = wα − wα0 = 0.95 − 0.56 = 0.39
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