Professional Documents
Culture Documents
TN12 PDF
TN12 PDF
IGT 0.2 to 15 mA A
A
K A
DESCRIPTION G
K A
Available either in sensitive (TS12) or standard G
(TN12 / TYN) gate triggering levels, the 12A SCR DPAK D2PAK
series is suitable to fit all modes of control, found (TN12-B / TS12-B) (TN12-G)
in applications such as overvoltage crowbar A
A
protection, motor control circuits in power tools
and kitchen aids, inrush current limiting circuits,
capacitive discharge ignition and voltage
regulation circuits...
K K
A A
G G
Available in through-hole or surface-mount
IPAK TO-220AB
packages, they provide an optimized performance
(TN12-H / TS12-H) (TYNx12RG)
in a limited space area.
■ SENSITIVE
Symbol Test Conditions TS1220 Unit
IGT MAX. 200 µA
VD = 12 V RL = 140 Ω
VGT MAX. 0.8 V
VGD VD = VDRM RL = 3.3 kΩ RGK = 1 kΩ Tj = 125°C MIN. 0.1 V
VRG IRG = 10 µA MIN. 8 V
IH IT = 50 mA RGK = 1 kΩ MAX. 5 mA
IL IG = 1 mA RGK = 1 kΩ MAX. 6 mA
dV/dt VD = 65 % VDRM RGK = 220 Ω Tj = 125°C MIN. 5 V/µs
VTM ITM = 24 A tp = 380 µs Tj = 25°C MAX. 1.6 V
Vt0 Threshold voltage Tj = 125°C MAX. 0.85 V
Rd Dynamic resistance Tj = 125°C MAX. 30 mΩ
IDRM Tj = 25°C 5 µA
VDRM = VRRM RGK = 220 Ω MAX.
IRRM Tj = 125°C 2 mA
2/11
TN12, TS12 and TYNx12 Series
■ STANDARD
TN1215 TYN
Symbol Test Conditions Unit
B/H G x12T x12
MIN. 2 0.5 2
IGT mA
VD = 12 V RL = 33 Ω MAX. 15 5 15
VGT MAX. 1.3 V
VGD VD = VDRM RL = 3.3 kΩ Tj = 125°C MIN. 0.2 V
IH IT = 500 mA Gate open MAX. 40 30 15 30 mA
IL IG = 1.2 IGT MAX. 80 60 30 60 mA
dV/dt VD = 67 % VDRM Gate open Tj =125°C MIN. 200 40 200 V/µs
VTM ITM = 24 A tp = 380 µs Tj = 25°C MAX. 1.6 V
Vt0 Threshold voltage Tj = 125°C MAX. 0.85 V
Rd Dynamic resistance Tj = 125°C MAX. 30 mΩ
IDRM Tj = 25°C 5 µA
VDRM = VRRM MAX.
IRRM Tj = 125°C 2 mA
S = 1 cm² D2PAK 45
Rth(j-a) Junction to ambient (DC) °C/W
IPAK 100
TO-220AB 60
S = Copper surface under tab.
Figure 1: Maximum average power dissipation Figure 2: Average and D.C. on-state current
versus average on-state current versus case temperature
P(W) IT(AV)(A)
12 14
D.C.
11 α = 180°
10 12
9
10
8
α = 180°
7 8
6
5 6
4
4
3 360°
2 2
1 IT(AV)(A) Tcase(°C)
α
0 0
0 1 2 3 4 5 6 7 8 9 0 25 50 75 100 125
3/11
TN12, TS12 and TYNx12 Series
Figure 3: Average and D.C. on-state current Figure 4: Relative variation of thermal
versus ambient temperature (device mounted impedance junction to case versus pulse
on FR4 with recommended pad layout) (DPAK) duration
IT(AV)(A) K=[Zth(j-c)/Rth(j-c)]
3.0 1.0
2.5
D.C.
2.0 D2PAK
0.5
1.5
α = 180°
DPAK
1.0
0.2
0.5
Tamb(°C) tp(s)
0.0 0.1
0 25 50 75 100 125 1E-3 1E-2 1E-1 1E+0
D2PAK
1.2
0.10 TO-220AB / IPAK
1.0
IH & IL
0.8 RGK = 1kΩ
0.6
0.4
0.2
tp(s) Tj(°C)
0.01 0.0
1E-2 1E-1 1E+0 1E+1 1E+2 5E+2 -40 -20 0 20 40 60 80 100 120 140
Figure 7: Relative variation of gate trigger Figure 8: Relative variation of holding current
current and holding current versus junction versus gate-cathode resistance (typical
temperature for TN8 & TYN08 series values) for TS8 series
IH[RGK] / IH[RGK=1kΩ]
IGT,IH,IL[Tj] / IGT,IH,IL[Tj=25°C] 5.0
2.4 Tj = 25°C
2.2 4.5
2.0 4.0
1.8 IGT
3.5
1.6
1.4 3.0
1.2 2.5
1.0
2.0
0.8 IH & IL
0.6 1.5
0.4 1.0
0.2 Tj(°C) 0.5
0.0 RGK(kΩ)
-40 -20 0 20 40 60 80 100 120 140 0.0
1E-2 1E-1 1E+0 1E+1
4/11
TN12, TS12 and TYNx12 Series
Figure 9: Relative variation of dV/dt immunity Figure 10: Relative variation of dV/dt immunity
versus gate-cathode resistance (typical versus gate-cathode capacitance (typical
values) for TS8 series values) for TS8 series
3.0
2.5
1.0 2.0
1.5
1.0
0.5
RGK(kΩ) CGK(nF)
0.1 0.0
0 200 400 600 800 1000 1200 0 25 50 75 100 125 150
Figure 11: Surge peak on-state current versus Figure 12: Non-repetitive surge peak on-state
number of cycles current for a sinusoidal pulse with width
tp < 10 ms, and corresponding values of I²t
Figure 13: On-state characteristics (maximum Figure 14: Thermal resistance junction to
values) ambient versus copper surface under tab
(epoxy printed circuit board FR4, copper
thickness: 35µm) (DPAK and D2PAK)
ITM(A) Rth(j-a)(°C/W)
200 100
Tj max.:
100 Vt0=0.85V
Rd=30mΩ
80
60
Tj=max
DPAK
10
Tj=25°C 40
D2PAK
20
VTM(V) S(cm²)
1 0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 0 2 4 6 8 10 12 14 16 18 20
5/11
TN12, TS12 and TYNx12 Series
TS 12 20 - 600 B (-TR)
TYN 6 12 T RG
6/11
TN12, TS12 and TYNx12 Series
DIMENSIONS
REF. Millimeters Inches
Min. Max Min. Max.
E A
A 2.20 2.40 0.086 0.094
B2
C2 A1 0.90 1.10 0.035 0.043
L2 A2 0.03 0.23 0.001 0.009
B 0.64 0.90 0.025 0.035
D
B2 5.20 5.40 0.204 0.212
H R C 0.45 0.60 0.017 0.023
L4 C2 0.48 0.60 0.018 0.023
B
A1
R
D 6.00 6.20 0.236 0.244
G C E 6.40 6.60 0.251 0.259
G 4.40 4.60 0.173 0.181
A2
H 9.35 10.10 0.368 0.397
0.60 MIN. L2 0.80 typ. 0.031 typ.
L4 0.60 1.00 0.023 0.039
V2
V2 0° 8° 0° 8°
6.7 3 3 1.6
2.3
6.7
2.3
1.6
7/11
TN12, TS12 and TYNx12 Series
DIMENSIONS
REF. Millimeters Inches
A Min. Typ. Max. Min. Typ. Max.
E
C2 A 4.30 4.60 0.169 0.181
L2
A1 2.49 2.69 0.098 0.106
A2 0.03 0.23 0.001 0.009
D B 0.70 0.93 0.027 0.037
L B2 1.25 1.40 0.048 0.055
L3 C 0.45 0.60 0.017 0.024
A1
C2 1.21 1.36 0.047 0.054
B2
C R
D 8.95 9.35 0.352 0.368
B
E 10.00 10.28 0.393 0.405
G G 4.88 5.28 0.192 0.208
L 15.00 15.85 0.590 0.624
A2
2mm min. L2 1.27 1.40 0.050 0.055
FLAT ZONE
L3 1.40 1.75 0.055 0.069
R 0.40 0.016
V2
V2 0° 8° 0° 8°
16.90
10.30 5.08
1.30
3.70
8.90
8/11
TN12, TS12 and TYNx12 Series
DIMENSIONS
REF. Millimeters Inches
Min. Typ. Max. Min. Typ. Max.
A 2.20 2.40 0.086 0.094
A1 0.90 1.10 0.035 0.043
A
A3 0.70 1.30 0.027 0.051
E
C2 B 0.64 0.90 0.025 0.035
B2
L2 B2 5.20 5.40 0.204 0.212
B3 0.95 0.037
B5 0.30 0.035
D
C 0.45 0.60 0.017 0.023
C2 0.48 0.60 0.019 0.023
H
L1 B3 D 6 6.20 0.236 0.244
L
B A1 E 6.40 6.60 0.252 0.260
V1 e 2.28 0.090
G 4.40 4.60 0.173 0.181
H 16.10 0.634
e B5 C
L 9 9.40 0.354 0.370
G A3
L1 0.8 1.20 0.031 0.047
L2 0.80 1 0.031 0.039
V1 10° 10°
DIMENSIONS
REF. Millimeters Inches
B C Min. Typ. Max. Min. Typ. Max.
ØI b2 A 15.20 15.90 0.598 0.625
a1 3.75 0.147
L
F a2 13.00 14.00 0.511 0.551
B 10.00 10.40 0.393 0.409
A
b1 0.61 0.88 0.024 0.034
I4 b2 1.23 1.32 0.048 0.051
l3
C 4.40 4.60 0.173 0.181
a1 c2
c1 0.49 0.70 0.019 0.027
l2 c2 2.40 2.72 0.094 0.107
a2
e 2.40 2.70 0.094 0.106
F 6.20 6.60 0.244 0.259
M ØI 3.75 3.85 0.147 0.151
b1 c1
e
I4 15.80 16.40 16.80 0.622 0.646 0.661
L 2.65 2.95 0.104 0.116
l2 1.14 1.70 0.044 0.066
l3 1.14 1.70 0.044 0.066
M 2.60 0.102
9/11
TN12, TS12 and TYNx12 Series
In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These
packages have a Lead-free second level interconnect . The category of second level interconnect is
marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The
maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an
ST trademark. ECOPACK specifications are available at: www.st.com.
10/11
TN12, TS12 and TYNx12 Series
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences
of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted
by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject
to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not
authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
11/11