IC Brazil Program

Nilton Morimoto
IC‐Brazil Coordinator, PSI/USP
Eric Fabris
CT Technical Coordinator, EE/UFRGS
Oscar Salviani
CT2 Local Coordinator, CTI/MCTI
João Martino
CT3 Local Coordinator, PSI/USP

IC‐Brazil Program
 O começo de tudo

Discovery of Bipolar Transistor at Bell‐Labs,  Dec.1947, Bardeen e Brattain

IC‐Brazil Program
Inversor CMOS
High‐Performance Transistor Challenges

Electrode Gate
Resistance NMOS Transistor
Hot
Carrier
Stability

SD Series
Resistance
0.09 µm
Thin Oxide
Stability-
Electrical/Phys
Channel
ical
Profile , SCE,
Fluctuations,
Quantum
Effects
Capacitor tipo trincheira
Gates / Chip Vs. No. Levels Of Interconnect
100.00

SIA Roadmap 20 Million

Gates/Chip

10.00 7-Level
Metal
3-Level No. Levels Of
Metal Interconnect
1.00

Gates/Chip (Millions)
0.3 Million
Gates/Chip
0.10
1990 1992 1994 1996 1998 2000 2002 2004 2006 2008
Year Of First Introduction
Increasing Number Of Contacts
And Vias (Nodes) Per Chip

Increasing # Gates / Chip Drives

# Nodes / Chip up Dramatically
e.g.

0.25 µm Technology:
10 Million Logic Transistors / Chip
~ 50 Million Nodes / Chip
Increasing Number Of Contacts
And Vias (Nodes) Per Chip
Yield:
5% Loss:
5 Bad Nodes / (100 chips X 50Million Nodes)
1 Bad / 1 Billion Nodes!

Reliability:
10 FIT (0.1% Device Failures In 10 Years):
1 Failed Node / (1000 Chips X 50 Million Nodes)
1 Failure / 50 Billion Nodes!
 Driving Forces
• Technical

IC‐Brazil Program
Trends: “The Network” is driving technology

2000...
“The Network”
1990s
“The PC”

1980s
“Computer/Workstation”

1970s
Military/Aerospace
 Networking and Computing
Systems Group Enterprise
Computing
Personal Systems
Computing Division
Systems
Networking
Division
Systems Division

Access
C.O.
N IC

Router Backbone
Switch/Hub C.O.
10/100 Ethernet Telecom
Switch

ATM
Switch
Modems Access
Node
Communications
Transmission & Access Basestations
Systems Division
Wireless Infrastructure Systems
Division

Cellular Wireless local loop

 Trends: Networking Driven Products

Enterprise Routers
Switch/Hub
platforms
Central Office
Switching and
Transmission

ATM Switching
Analog Modems

SOHO Routers POTs line cards

Remote Access
Servers Access Mux
(DSLAM)
Cable Modems
Wireless
Infrastructure
ADSL Modems
Infrastructure
 ULSI Process Roadmap
Dual Inlaid
Copper with SiOF
Low K ILD 1000 MHz
0.10
1.2 volts

Dual Inlaid
Copper
Interconnect
Process Performance

600 MHz
0.13 TFSOI
1.5 volts

400 MHz
0.15
1.8 volts

350 MHz
0.18
1.8 volts
300 MHz
0.27
2.5 volts Buried Oxide
200 MHz
0.35
2.5 volts Silicon Substrate

120 MHz
0.50
3.3 volts Production Dates
1994 1995 1996 1997 1998 1999 2000 2001
 Driving Forces
• Market and economic

IC‐Brazil Program
 What is Driving Strong FDI inward? 
Market size and strong industrial base 
 A growing domestic electronics market
Brazilian Electronics Market  [B$]

A fast growing business‐oriented economy with a huge electronics market
Industrial Policy and Market Response Timeline
2. IC‐Brazil Program
1. Objectives 

2. Organization 

3. Training Centers

4. Design Houses

5. Examples of IC

IC‐Brazil Program
 2.1 Brazil‐IC Program Start 

• July 2005

• Launched by CATI/SEPIN/MCT

• Initiative of Academy, Government and Industry

IC‐Brazil Program
 2.1 IC‐Brazil ‐ Vision & Objectives
• To promote the development of an ecosystem in 
microelectronics in Brazil and the insertion of Brazil in the 
semiconductor market
– Promote local IC companies
– Attraction of international companies
– Promote electronics innovation: RFID, DTV, instrumentation, 
automation, …
• Synergy with other governmental incentives:
• Informatics law
• PADIS – program for semiconductors and displays
• PDP
• Subvention programs by FINEP and BNDES
• …

IC‐Brazil Program
 2.1 Focus on IC Design
• Demand for new ICs:
– Growing markets
– New applications
– Growing opportunity for Fabless (since 2006: > 20%)
• Fertile field for innovation
• Some Technical Challenges:
– Growing complexity & functionality 
– Power consuption and heat removal
– SoC and SIP
– Growing parameter variability – redundancy and 
route auto‐correction
IC‐Brazil Program
IC Brazil Organization Chart

IC‐Brazil Program
 2.3 Training Centers
• Objectives:
• Increase specialized human resources in IC design

• Attract talent people for R&D on commercial 
applications

• Create, in short time, a critical mass of IC 
designers to promote semiconductor activities in 
Brazil
IC‐Brazil Program
 2.3 Training Centers
• CT1 – UFRGS, Porto Alegre – start: April 2008
• CT2 – CTI, Campinas – start: August 2008
• CT3 – USP, São Paulo – Start: August 2014
• Structure: Phases I, II e III
– Phase I: theory and EDA tools – 5 months
– Phase II: IC design project – 7 months
– Phase III: internship at DH´s or companies – 12 months

IC‐Brazil Program
2.4 Design Houses

• Total = 19

• +

Perseptia
STI Semiconductors

IC‐Brazil Program
General Tendencies and Challenges
• New products and applications
• Cloud computing
• Convergences of functions: notebook or
smartphone?
• Mobility and easy to use
• Universal access, connectivity, interoperability
• Wireless sensor network
• Ambient energy harvesting
• Ecological correctness
IC‐Brazil Program
 Some specific opportunity fields
• RFID: cattle, vehicles, food, goods, documents,
health items (blood, drugs, vaccines), etc.
• Brazilian Digital TV
• Low cost education tools, Tablet, …
• Wireless sensor networks: agriculture, environment,
energy, health, etc
• Energy: smart grid, deep water oil exploration,
ethanol production chain
• Embedded electronics: agriculture implements, cars,
avionics
IC‐Brazil Program
 Ecological challenges – Green ICT
• Norms:
– RoHS  ‐ Restriction of Hazard 
toxidade
Substance

– WEEE – Waste of ElectroElectronic 
Equipment reciclagem

• Ecodesign Concepts and Life Cycle 
Analysis energia

IC‐Brazil Program
 Energy
• Increasing energy consumption by ICT (10% of 
electrical energy)
• Demand for carbon free energy (green)
• Alternative energies:
– Eolic
– Photovoltaic – CAGR > 40 %
– Other forms of energy harvesting
• Reduce/optimize energy consumption:
– Smart grid 
– Light and displays by LED and OLED
– Ecodesign of products (includes energy efficiency)

IC‐Brazil Program
 Photovoltaic Energy
• Installed per year: 2009 = 7,3GW, 2010 =  17,5GW 

(ITAIPU=14GW)

• Headed by Germany: 2009 = 3,8 GW, 2010 = 7,3 GW

• PV energy cost: 2009 = $2.15 Wp; 2010 = $1.75 Wp

• c‐Si will continue to dominate the next ~ 10 years  (in 

2020: consumption of 51.000t polysilicon, with 3g/W)
IC‐Brazil Program
 Thank You
Obrigado
morimoto@LSI.USP.BR
www.ci‐brasil.gov.br

ACKNOWLEDGMENTS 

IC‐Brazil Program