Professional Documents
Culture Documents
Microfabrication Technology
FARIZA MOHAMAD
JEL
1.1 Cleanroom System and
Operation
Introduction
DEFINITION CLEANROOM:
It is an environment which
used in manufacturing or
scientific research
It is has a low level of
environmental pollutants such
as dust and chemical vapors
It has controlled level of
contamination that has
specified by the number of
particles per meter-cubed and
by maximum particles size.
Introduction
Introduction
Caused by movement
Source and control of
contamination
Cleanliness Class
Definition of Airborne per Fed.
Particulate Std. Class
Cleanliness 209E per
Fed. Std. 209E
Classification of Cleanroom Standard
Cleanroom class
ISO class 5
and below
Cleanroom Design and Components
Design
Non-Unidirectional Airflow
Original HEPA filter was designed in the 1940 to prevent the spread of
airborne radioactive contaminants. It is generic term for highly efficient
filters.
Theoretically can remove at least 99.97% of pollutants or particles such as
dust, pollen, mold, bacteria and airborne particles with a size of 0.3ưm /
larger at 85 liters per minute (LPM)
Composed of a mat of randomly arranged fibers. The pollutants and
particles are mainly trapped to a fiber when they force to pass the filter.
ULPA filter (Ultra Low Particulate Air)
Theoretically, can remove at least 99.999% of pollutant or particles such
as dust, pollen, mold, bacteria and airborne particles with a size of 0.12ưm /
larger at 85 liters per minute (LPM)
Fibers of Filter
Particles on Fibers
Negative pressure fume hood
Cleanroom
*if applicable
Wearing a suit
Electrostatic Discharge (ESD)
Electrostatic Discharge, or ESD, is a single-event,
rapid transfer of electrostatic charge between two objects,
usually resulting when two objects at different potentials
come into direct contact with each other. ESD can also
occur when a high electrostatic field develops between two
objects in close proximity. ESD is one of the major causes
of device failures in the semiconductor industry.
TOXIC
A substances that is capable of
causing injury or damage to a REACTIVE
living organism Reactive substances that will
vigorously polymerize, decompose
or become self-reactive due to
shock, pressure or temperature
FLAMMABLE
A substances that will ignite
easily and burn rapidly
CORROSIVE
Substances that cause visible
destruction or irreversible
alteration to materials and tissues
by chemical reaction on contact
VIDEO TOUR ON CLEANROOM
SAFETY PRACTICE
Etiquettes – Materials
Don’t(s)
Do(s)
•Carry non-cleanroom items
•Papers kept in a plastic sleeve
•Carry cleanroom items out of the
•Clean everything you carry into the
cleanroom
cleanroom
•Use pencils or erasers
•Use ball-point pen on cleanroom
•Cut the cleanroom wipers
paper
Etiquettes – Behaviour
Do(s) Don’t(s)
•Wear mask and gloves all the time •Scratch bare skin or comb hair
•Use cleanroom standard •Run, jump or hop
stationeries •Smoke, chew gum or eat
•Walk in steady and slow motion •Sneeze, do not enter cleanroom if you
unless in emergency have a flu/cold
Etiquettes – Wafer handling
Tools
Vacuum Handler
Wafer Transfer
Tweezers
Cassette
Box
Etiquettes – Wafer handling
Hydrofluoric Acid
Rinse for 5 mins and massage calcium glutamate
Burns
Minor burns should be treated with cold water. More
extensive burns should be covered with a clean
cloth until professional help arrives.
First aid
Poisoning
Determine the cause of poisoning and call for
professional help.
Dizziness
Remove them to fresh air and have them sit down.
If fainting occurs, get medical attention.
1.2 Transistor Fabrication
Processes
What is IC fabrication?
Semiconductor processing facility which turns
wafers into Integrated Circuits (ICs). A typical
wafer fabrication employs a series of complex steps
to define conductors, transistors, resistors, and
other electronic components on the
semiconductor wafer. The steps are built in the
cleanroom includes Oxidation, Photolithography,
Etching and Metallization process.
The Evolution of IC
1. Lithography
2. Schematic design
3. Layout design
4. Mask design
5. Mask fabrication
6. Wafer treatment
7. Structures forming
8. Mounting and control
9. Hermetic encapsulation
10.Electric measurements on the wafer
11.Testing
12.Final processes
13.Oxidation
14.Diffusion and Ion implantation
(12, 13 and 14 steps are repeated periodically)
Key working materials (1/2)
n-type semiconductor (n or n+)
Majority carrier: electrons
Typical impurity: Ph (Column V)
p-type semiconductor (p or p+)
Majority carrier: holes
Typical impurity: Boron (Column III)
Insulator - Silicon Dioxide (SiO2)
Used to insulate transistor gates (thin oxide)
Used to insulate layers of wires (field oxide)
Can be grown on Silicon or Chemically Deposited
Key working materials (2/2)
Polysilicon - polycrystalline silicon
Key material for transistor gates
Also used for short wires
Added by chemical deposition
Metal - Aluminum (…and more recently Copper)
Used for wires
Multiple layers common
Added by vapor deposition or “sputtering”
NMOS Process Recipe (1/2)
NMOS Process Recipe (2/2)
PMOS Masking (1/5)
PMOS Masking (2/5)
PMOS Masking (4/5)
CMOS Inverter (1/21)
CMOS Inverter (2/21)
CMOS Inverter (3/21)
CMOS Inverter (4/21)
CMOS Inverter (5/21)
CMOS Inverter (6/21)
CMOS Inverter (7/21)
CMOS Inverter (8/21)
CMOS Inverter (9/21)
CMOS Inverter (10/21)
CMOS Inverter (11/21)
CMOS Inverter (12/21)
CMOS Inverter (13/21)
CMOS Inverter (14/21)
CMOS Inverter (15/21)
CMOS Inverter (16/21)
CMOS Inverter (17/21)
CMOS Inverter (18/21)
CMOS Inverter (19/21)
CMOS Inverter (20/21)
CMOS Inverter (21/21)
END OF CHAPTER 1