HG231ED HG430ED Service Manual

SERVICE MANUAL
Sec. 1: Main Section Sec. 2: Deck Mechanism Section

I Specifications I Standard Maintenance
I Preparation for Servicing I Alignment for Mechanism
I Adjustment Procedures I Disassembly/Assembly of Mechanism
I Schematic Diagrams I Alignment Procedures of Mechanism
I CBA’s I Deck Exploded Views
I Exploded views I Deck Parts List
I Parts List
VIDEO CASSETTE RECORDER
HG231ED
HG430ED
PAL
MAIN SECTION
HG231ED/HG430ED
Sec. 1: Main Section
I Specifications
I Preparation for Servicing
I Adjustment Procedures
I Schematic Diagrams
I CBA’s
I Exploded Views
I Parts List
TABLE OF CONTENTS
Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1-1
Important Safety Precautions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-2-1
Standard Notes for Servicing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-3-1
Preparation for Servicing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-4-1
Cabinet Disassembly Instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-5-1
Electrical Adjustment Instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-6-1
Block Diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-7-1
Function Indicator Symbols. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-7-7
Schematic Diagrams / CBA’s and Test Points. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-8-1
Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-9-1
Wiring Diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-10-1
IC Pin Function Descriptions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-11-1
Lead Identifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-12-1
Exploded Views. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-13-1
Mechanical Parts List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-14-1
Electrical Parts List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-15-1
SPECIFICATIONS
Description Unit Minimum Nominal Maximum Remark
1. Video
1-1. Video Output (PB) Vp-p 0.8 1.0 1.2 FL6A
1-2. Video Output (R/P) Vp-p 0.8 1.0 1.2
SP Mode,
1-3. Video S/N Y (R/P) dB 40 45
W/O Burst
1-4. Video Color S/N AM (R/P) dB 37 41 SP Mode
1-5. Video Color S/N PM (R/P) dB 30 36 SP Mode

1-6. Resolution (PB) Line 230 245 SP Mode
2. Servo
2-1. Jitter Low µsec 0.07 0.12 SP Mode
2-2. Wow & Flutter % 0.3 0.5 SP Mode
3. Normal Audio
3-1. Output (PB) dBV -9 -6 -3 SP Mode
3-2. Output (R/P) dBV -9 -6 -1.5 SP Mode
3-3. S/N (R/P) dB 36 41 SP Mode
3-4. Distortion (R/P) % 1.0 4.0 SP Mode
3-5. Freq. resp (R/P) at 200Hz dB -7 -4 SP Mode
(-20dB ref. 1kHz) at 6kHz dB -10 -4 SP Mode
4. Tuner
4-1. Video output Vp-p 0.8 1.0 1.2 E-E Mode
4-2. Video S/N dB 39 42 E-E Mode
4-3. Audio output dB -10 -6 -2 E-E Mode

4-4. Audio S/N dB 40 46 E-E Mode
5. Hi-Fi Audio [ HG430ED ]
5-1. Output dBV -12 -8 -4 SP Mode

5-2. Dynamic Range dB 70 85 SP Mode
5-3. Freq. resp (6dB B.W) Hz 20 ~ 20K SP Mode
Note: Nominal specs represent the design specs. All units should be able to approximate these – some will exceed
and some may drop slightly below these specs. Limit specs represent the absolute worst condition that still might
be considered acceptable; In no case should a unit fail to meet limit specs.
1-1-1 HG231SP
IMPORTANT SAFETY PRECAUTIONS
Product Safety Notice J. Be careful that foreign objects (screws, solder
droplets, etc.) do not remain inside the set.
Some electrical and mechanical parts have special
K. Crimp type wire connector
safety-related characteristics which are often not evi-
The power transformer uses crimp type connectors
dent from visual inspection, nor can the protection they
which connect the power cord and the primary side
give necessarily be obtained by replacing them with
of the transformer. When replacing the transformer,
components rated for higher voltage, wattage, etc.
follow these steps carefully and precisely to prevent
Parts that have special safety characteristics are iden-
shock hazards.
tified by a ! on schematics and in parts lists. Use of a
Replacement procedure
substitute replacement that does not have the same
safety characteristics as the recommended replace- 1)Remove the old connector by cutting the wires at a
ment part might create shock, fire, and/or other haz- point close to the connector.
ards. The Product’s Safety is under review Important: Do not re-use a connector. (Discard it.)
continuously and new instructions are issued when- 2)Strip about 15 mm of the insulation from the ends
ever appropriate. Prior to shipment from the factory, of the wires. If the wires are stranded, twist the
our products are carefully inspected to confirm with strands to avoid frayed conductors.
the recognized product safety and electrical codes of 3)Align the lengths of the wires to be connected.
the countries in which they are to be sold. However, in Insert the wires fully into the connector.
order to maintain such compliance, it is equally impor-
4)Use a crimping tool to crimp the metal sleeve at its
tant to implement the following precautions when a set
center. Be sure to crimp fully to the complete clo-
is being serviced.
sure of the tool.
Precautions during Servicing L. When connecting or disconnecting the internal
connectors, first, disconnect the AC plug from the
A. Parts identified by the ! symbol are critical for AC outlet.
safety. Replace only with part number specified.
B. In addition to safety, other parts and assemblies
are specified for conformance with regulations
applying to spurious radiation. These must also be
replaced only with specified replacements.
Examples: RF converters, RF cables, noise block-
ing capacitors, and noise blocking filters, etc.
C. Use specified internal wiring. Note especially:
1)Wires covered with PVC tubing
2)Double insulated wires
3)High voltage leads
D. Use specified insulating materials for hazardous
live parts. Note especially:
1)Insulation tape
2)PVC tubing
3)Spacers
4)Insulators for transistors
E. When replacing AC primary side components
(transformers, power cord, etc.), wrap ends of
wires securely about the terminals before solder-
ing.
F. Observe that the wires do not contact heat produc-
ing parts (heatsinks, oxide metal film resistors, fus-
ible resistors, etc.).
G. Check that replaced wires do not contact sharp
edges or pointed parts.
H. When a power cord has been replaced, check that
5 - 6 kg of force in any direction will not loosen it.
I. Also check areas surrounding repaired locations.
1-2-1 U29PSFP
Safety Check after Servicing
Examine the area surrounding the repaired location for Chassis or Secondary Conductor
damage or deterioration. Observe that screws, parts,
and wires have been returned to their original posi- Primary Circuit Terminals
tions. Afterwards, do the following tests and confirm
the specified values to verify compliance with safety d' d
standards.
1. Clearance Distance
When replacing primary circuit components, confirm
specified clearance distance (d) and (d’) between sol-
dered terminals, and between terminals and surround-
ing metallic parts. (See Fig. 1)
Table 1 : Ratings for selected area

AC Line Voltage Clearance Distance (d), (d’) Fig. 1
≥ 3mm(d)
220 to 240 V
≥ 6 mm(d’) Exposed Accessible Part
Note: This table is unofficial and for reference only.
Be sure to confirm the precise values.
2. Leakage Current Test
Confirm the specified (or lower) leakage current AC Voltmeter
between B (earth ground, power cord plug prongs) Z (High Impedance)
and externally exposed accessible parts (RF termi-
nals, antenna terminals, video and audio input and
output terminals, microphone jacks, earphone jacks,
etc.) is lower than or equal to the specified value in the
table below. One side of
B
Measuring Method (Power ON) : Power Cord Plug Prongs
Insert load Z between B (earth ground, power cord Fig. 2
plug prongs) and exposed accessible parts. Use an
AC voltmeter to measure across the terminals of load
Z. See Fig. 2 and the following table.
Table 2: Leakage current ratings for selected areas

One side of power cord plug
AC Line Voltage Load Z Leakage Current (i)
prongs (B) to:
2kΩ RES.
i≤0.7mA AC Peak RF or
Connected in
i≤2mA DC Antenna terminals
parallel
220 to 240 V
50kΩ RES.
i≤0.7mA AC Peak
Connected in A/V Input, Output
i≤2mA DC
parallel
Note: This table is unofficial and for reference only. Be sure to confirm the precise values.
1-2-2 U29PSFP
STANDARD NOTES FOR SERVICING
Circuit Board Indications Pb (Lead) Free Solder
a. The output pin of the 3 pin Regulator ICs is indi- When soldering, be sure to use the Pb free solder.
cated as shown.
Top View Bottom View

How to Remove / Install Flat Pack-IC
Input 1. Removal
Out In
With Hot-Air Flat Pack-IC Desoldering Machine:.
(1) Prepare the hot-air flat pack-IC desoldering
b. For other ICs, pin 1 and every fifth pin are indicated machine, then apply hot air to the Flat Pack-IC
as shown. (about 5 to 6 seconds). (Fig. S-1-1)
Pin 1
10
c. The 1st pin of every male connector is indicated as

shown.
Pin 1 Fig. S-1-1
(2) Remove the flat pack-IC with tweezers while apply-

ing the hot air.
Instructions for Connectors
(3) Bottom of the flat pack-IC is fixed with glue to the
1. When you connect or disconnect the FFC (Flexible CBA; when removing entire flat pack-IC, first apply
Foil Connector) cable, be sure to first disconnect soldering iron to center of the flat pack-IC and heat
the AC cord. up. Then remove (glue will be melted). (Fig. S-1-6)
2. FFC (Flexible Foil Connector) cable should be (4) Release the flat pack-IC from the CBA using twee-
inserted parallel into the connector, not at an angle. zers. (Fig. S-1-6)
Caution:
1. The Flat Pack-IC shape may differ by models. Use
an appropriate hot-air flat pack-IC desoldering
machine, whose shape matches that of the Flat
FFC Cable
Pack-IC.
2. Do not supply hot air to the chip parts around the
flat pack-IC for over 6 seconds because damage to
Connector the chip parts may occur. Put masking tape around
the flat pack-IC to protect other parts from damage.
CBA (Fig. S-1-2)
* Be careful to avoid a short circuit.
1-3-1 NOTE_1
3. The flat pack-IC on the CBA is affixed with glue, so (3) Bottom of the flat pack-IC is fixed with glue to the
be careful not to break or damage the foil of each CBA; when removing entire flat pack-IC, first apply
pin or the solder lands under the IC when removing soldering iron to center of the flat pack-IC and heat
it. up. Then remove (glue will be melted). (Fig. S-1-6)
(4) Release the flat pack-IC from the CBA using twee-
zers. (Fig. S-1-6)
Hot-air
Flat Pack-IC With Iron Wire:
Desoldering (1) Using desoldering braid, remove the solder from all
Machine pins of the flat pack-IC. When you use solder flux
CBA
which is applied to all pins of the flat pack-IC, you
can remove it easily. (Fig. S-1-3)
(2) Affix the wire to a workbench or solid mounting
point, as shown in Fig. S-1-5.
(3) While heating the pins using a fine tip soldering
Masking Flat Pack-IC
Tape iron or hot air blower, pull up the wire as the solder
melts so as to lift the IC leads from the CBA contact
Tweezers
pads as shown in Fig. S-1-5
Fig. S-1-2 (4) Bottom of the flat pack-IC is fixed with glue to the
CBA; when removing entire flat pack-IC, first apply
With Soldering Iron: soldering iron to center of the flat pack-IC and heat
(1) Using desoldering braid, remove the solder from all up. Then remove (glue will be melted). (Fig. S-1-6)
pins of the flat pack-IC. When you use solder flux (5) Release the flat pack-IC from the CBA using twee-
which is applied to all pins of the flat pack-IC, you zers. (Fig. S-1-6)
can remove it easily. (Fig. S-1-3)
Note:
When using a soldering iron, care must be taken
Flat Pack-IC Desoldering Braid
to ensure that the flat pack-IC is not being held by
glue. When the flat pack-IC is removed from the
CBA, handle it gently because it may be damaged
if force is applied.
Hot Air Blower

Soldering Iron
Fig. S-1-3
or
(2) Lift each lead of the flat pack-IC upward one by
one, using a sharp pin or wire to which solder will
not adhere (iron wire). When heating the pins, use Iron Wire
a fine tip soldering iron or a hot air desoldering
machine. (Fig. S-1-4)
Soldering Iron
To Solid
Mounting Point
Fig. S-1-5
Sharp
Pin
Fine Tip
Soldering Iron
Fig. S-1-4
1-3-2 NOTE_1
Instructions for Handling
Semi-conductors
Fine Tip Electrostatic breakdown of the semi-conductors may
CBA Soldering Iron occur due to a potential difference caused by electro-
static charge during unpacking or repair work.
1. Ground for Human Body
Be sure to wear a grounding band (1MΩ) that is prop-
erly grounded to remove any static electricity that may
be charged on the body.
Flat Pack-IC
Tweezers 2. Ground for Workbench
Be sure to place a conductive sheet or copper plate
Fig. S-1-6 with proper grounding (1MΩ) on the workbench or
other surface, where the semi-conductors are to be
placed. Because the static electricity charge on cloth-
2. Installation ing will not escape through the body grounding band,
(1) Using desoldering braid, remove the solder from be careful to avoid contacting semi-conductors with
the foil of each pin of the flat pack-IC on the CBA so your clothing.
you can install a replacement flat pack-IC more
easily.
<Incorrect>
(2) The “ I ” mark on the flat pack-IC indicates pin 1.
(See Fig. S-1-7.) Be sure this mark matches the 1
on the PCB when positioning for installation. Then
presolder the four corners of the flat pack-IC. (See
Fig. S-1-8.)
(3) Solder all pins of the flat pack-IC. Be sure that none
of the pins have solder bridges.
CBA
Example :
<Correct> Grounding Band
Pin 1 of the Flat Pack-IC

is indicated by a " " mark.
Fig. S-1-7
1MΩ
Presolder CBA
1MΩ
Conductive Sheet or
Copper Plate
Flat Pack-IC
CBA
Fig. S-1-8
1-3-3 NOTE_1
PREPARATION FOR SERVICING
How to Enter the Service Mode
About Optical Sensors

Caution:
An optical sensor system is used for the Tape Start
and End Sensors on this equipment. Carefully read
and follow the instructions below. Otherwise the unit
may operate erratically.
What to do for preparation
Insert a tape into the Deck Mechanism Assembly and
press the PLAY button. The tape will be loaded into
the Deck Mechanism Assembly. Make sure the power
is on, connect TP507 (S-INH) to GND. This will stop
the function of Tape Start Sensor, Tape End Sensor
and Reel Sensors. (If these TPs are connected before
plugging in the unit, the function of the sensors will
stay valid.) See Fig. 1.
Note: Because the Tape End Sensors are inactive, do

not run a tape all the way to the start or the end of the
tape to avoid tape damage.
Q505 Q504
TP507
S-INH
Fig. 1
1-4-1 HG240PFS
CABINET DISASSEMBLY INSTRUCTIONS
1. Disassembly Flowchart (1): Identification (location) No. of parts in the figures
(2): Name of the part
This flowchart indicates the disassembly steps to gain
(3): Figure Number for reference
access to item(s) to be serviced. When reassembling,
follow the steps in reverse order. Bend, route, and (4): Identification of parts to be removed, unhooked,
dress the cables as they were originally. unlocked, released, unplugged, unclamped, or
desoldered.
[1] Top Case P=Spring, L=Locking Tab, S=Screw,
CN=Connector
*=Unhook, Unlock, Release, Unplug, or Desolder
[2] Front Assembly
e.g. 2(S-2) = two Screws (S-2),
2(L-2) = two Locking Tabs (L-2)
[3] VCR Chassis Unit
(5): Refer to “Reference Notes.”
[4] Jack CBA Reference Notes
CAUTION: Locking Tabs (L-1) and (L-2) are fragile.
[5] Deck Assembly
Be careful not to break them.
1. Remove five Screws (S-2), two Screws (S-3):
[6] Main CBA HG231ED, three Screws (S-3): HG430ED, and
Screw (S-4). Then, slowly lift the VCR Chassis Unit
[7] Cylinder Shield (Deck Assembly, Jack CBA and Main CBA) up.
2. When reassembling, solder wire jumpers as shown
[8] Jack Board [ HG430ED ] in Fig. D5.
3. Before installing the Deck Assembly, be sure to
2. Disassembly Method place the pin of LD-SW on Main CBA as shown in
Fig. D6. Then, install the Deck Assembly while
REMOVAL aligning the hole of Cam Gear with the pin of LD-
ID/ SW, the shaft of Cam Gear with the hole of LD-SW
LOC PART REMOVE/*UNHOOK/ as shown in Fig. D6.
.No. Fig.
No. UNLOCK/RELEASE/ Note
UNPLUG/DESOLDER
[1] Top Case D1 7(S-1) -

(S-1)
Front
[2] D2 *3(L-1),*4(L-2) - (S-1)
Assembly
5(S-2), (S-4),
VCR Chassis D3-1
[3] 2(S-3) --- [ HG231ED ], 1
Unit D3-2
3(S-3) --- [ HG430ED ]
[4] Jack CBA D4 Desolder, (S-5) -
Deck D5 [1] Top Case

[5] 2(S-6), Desolder 2,3
Assembly D6
[6] Main CBA D5 *(L-3) --- [ HG430ED ] -

(S-1)
Cylinder
[7] D5 (S-7) -
Shield
Jack Board
[8] D5 ---------- -
[ HG430ED ]
↓ ↓ ↓ ↓ ↓
(1) (2) (3) (4) (5)
Fig. D1
1-5-1 HG231DC
(L-2)
[ HG430ED ]
(L-2)
(S-2)
(S-2) (S-3)
(S-3) (S-2)
(S-4)
[3]VCR
Chassis
Unit (S-3)
(S-2)
[2] Front
Assembly
(L-1)
Fig. D2
[ HG231ED ]
(S-2)
(S-2) (S-3)
(S-2)
(S-4)
[3] VCR
Chassis
Unit (S-3)
(S-2)
Fig. D3-2
[4] Jack CBA

(S-5)
Desolder
Fig. D4
Fig. D3-1
1-5-2 HG231DC
[7] Cylinder Shield
Pin
Cylinder Assembly
FE Head
(S-7)
SW507
ACE Head LD-SW
Assembly
[6] Main CBA
[ HG430ED ]
[8] Jack Board [5] Deck [5] Deck Assembly

Assembly
(L-3) Cam Gear
Hole
Shaft
Hole
[6] Main CBA LD-SW Pin

[6] Main CBA
(S-6)
Fig. D6
(S-6)
TOP VIEW From

From Capstan Motor
Cylinder From Assembly
From ACE Head
Assembly
FE Head Assembly Lead with
blue stripe
Printing
Lead with side
Lead with
blue stripe
white stripe
Desolder
from bottom
Lead connections of Deck Assembly and Main CBA
Fig. D5
1-5-3 HG231DC
ELECTRICAL ADJUSTMENT INSTRUCTIONS
General Note: "CBA" is an abbreviation for Head Switching Position Adjustment
"Circuit Board Assembly."
Purpose:
NOTE:
To determine the Head Switching position during
1.Electrical adjustments are required after replacing
playback.
circuit components and certain mechanical parts.
It is important to do these adjustments only after Symptom of Misadjustment:
all repairs and replacements have been com- May cause Head Switching noise or vertical jitter
pleted. Also, do not attempt these adjustments in the picture.
unless the proper equipment is available.
2.To perform these alignment / confirmation proce- Test point Adj.Point Mode Input
dures, make sure that the tracking control is set in
the center position: Press either "L5? " or "K" button J23(V-OUT) VR501
PLAY
on the remote control unit first, then the "PLAY" TP502(RF-SW) (Switching Point) -----
(SP)
button (Front Panel only). GND (MAIN CBA)
Test Equipment Required Measurement

Tape Spec.
Equipment
1.Oscilloscope: Dual-trace with 10:1 probe,
6.5H±1H
V-Range: 0.001~50V/Div., FL6A Oscilloscope
(412.7µs±63.5µs)
F-Range: DC~AC-20MHz
2.Alignment Tape (FL6A) Connections of Measurement Equipment
Oscilloscope
J23
Main CBA GND
TP502
CH1 CH2
Trig. (+)
Figure 1
EXT. Syncronize Trigger Point
CH1
1.0H 0.5H
CH2 6.5H+/-1H (412.7µs+/-63.5µs) V-Sync
Switching Pulse
Reference Notes:
Playback the Alignment tape and adjust VR501 so that
the V-sync front edge of the CH1 video output wave-
form is at the 6.5H±1H(412.7µs±63.5µs) delayed posi-
tion from the rising edge of the CH2 head switching
pulse waveform.
1-6-1 HG240EA
Comparison Chart of
Models & Marks
AL+5V IC501
Model Mark (SERVO/SYSTEM CONTROL)
MAIN CBA SW507
HG231ED A LD-SW RS501
HG430ED B D502 REMOTE TP507
SENSOR 14 REMOCON-IN
S-LED SENS-INH
KEY
KEY- 1 7
AL+5V 9 LD-SW SWITCH
95 CTL(+) KEY
Q504 94 CTL(-) KEY- 2 8
SWITCH
ST-S 10 ST-S
4 END-S
SENSOR CBA 80 T-REEL
79 S-REEL
TP506 Q503 PS503 Q501
END-S T-REEL S-REEL TIMER+5V RESET 34 RESET
Q505 TP501
END-S D561 STAND-BY +5V CTL
97 CTL AMP OUT
SENSOR CBA
D562 POWER Q562
TU701(TUNER UNIT)
3 SDA
D563 CAS 23 POWER-LED 12 SDA
(DECK ASSEMBLY) Q563
24 CAS-LED 5 SCL
25 TIMER-LED 11 SCL
CN504 D564 TIMER 26 REC-LED IC503 (MEMORY)
Q564
2 CTL(+)
CONTROL 5 SDA
1 CTL(-)
Servo/System Control Block Diagram
HEAD 6 SCL
1-7-1
D565 REC Q565
A
AC HEAD ASSEMBLY AUDIO-SW-1
AUDIO-SW-1 29
AUDIO-SW-2
AUDIO-SW-2 30
TO
AL+5V IIC-BUS SDA AUDIO BLOCK
VR501 IIC-BUS SCL
SW-POINT 2 PG-DELAY
A-MUTE-H
AL+5V 31 REC-SAF-SW A-MUTE-H 83
CYLINDER ASSEMBLY CAPSTAN MOTOR IIC-BUS SDA
CN502 IIC-BUS SCL
PG SW506 B
BLOCK DIAGRAMS
12 P-ON+15V P-ON+15V FROM/TO

SENSOR Hi-Fi-H-SW
11 AL+12V(2) AL+12V REC-SAFETY Hi-Fi-H-SW 19 Hi-Fi AUDIO
A-MODE BLOCK
10 GND A-MODE 32
LINE-MUTE
9 D-PFG 90 D-PFG LINE-MUTE 28
DRUM
M 8 D-CONT 77 D-CONT
MOTOR IIC-BUS SDA
7 LM-FWD/REV 81 LM-FWD/REV IIC-BUS SDA 72
IIC-BUS SCL
6 GND IIC-BUS SCL 71
D-REC-H
5 C-CONT 76 C-CONT D-REC-H 33
CAPSTAN RF-SW
M 4 C-F/R 78 C-F/R RF-SW 18
MOTOR C-ROTA
3 C-FG 87 C-FG C-ROTA 15 FROM/TO
D-V-SYNC
LOADING M 2 P-ON+5V P-ON+5V D-V-SYNC 13 VIDEO BLOCK
MOTOR 1 AL+12V/+20.5V AL+12V/+20.5V B
H-A-SW
H-A-SW 16
H-A-COMP
H-A-COMP 17
FROM/TO C-POW-SW
66 C-POW-SW
POWER P-ON-H V-ENV
SUPPLY 67 P-ON-H V-ENV 6
P-DOWN-L C-SYNC
BLOCK 86 P-DOWN-L C-SYNC 58
HG231BLS
Comparison Chart of
REC-VIDEO SIGNAL PB-VIDEO SIGNAL MODE: SP/REC Models & Marks
Model Mark
HG231ED A
MAIN CBA
FROM IIC-BUS SDA HG430ED B
IC501 (OSD) SERVO/SYSTEM
CONTROL BLOCK IIC-BUS SCL
OSD
52 CHARACTER 50
MIX
IC301
Q351 BUFFER (Y/C SIGNAL PROCESS) 65 43 46 68 69 78 79
Video Block Diagram
(DECK ASSEMBLY)
SERIAL
Y. DELAY DECORDER
CYLINDER ASSEMBLY
CN253
R P 96 V(R)-1 1 VIDEO (R)-1
LUMINANCE SP SP 95 V-COM 2 HEAD
TU701(TUNER UNIT) SIGNAL HEAD
EP AMP 93 V(L)-2 3 VIDEO (L)-1
PROCESS
VIDEO IN 6 94 V(L)-2 4 HEAD
TUNER V-COM 5
VIDEO OUT 24 48 BYPASS AGC VIDEO (L)-2
IN1 V(R)-2 6 HEAD
50
IN2
52 VIDEO (R)-2
FRT HEAD
JK756 54 90
FRONT B
V-IN 56 IN2 CHARA. EP 89
FRT INS. Y HEAD
AMP 88
1-7-2
CCD 1H DELAY WF1
B PB/EE + REC FM 87
AGC TP502
MUTE 1/2 C
RF-SW
TUNER
IN1 CHROMINANCE D-REC-H
SIGNAL D-REC-H 80
PB/EE RF-SW
PROCESS
MUTE R PR P C-ROTA
C-ROTA/RF-SW 70
D-V-SYNC
D-V-SYNC 62 FROM/TO SERVO/SYSTEM
JACK CBA FBC Y/C
WF3 CONTROL BLOCK
MIX B H-A-SW
J23 H-A-SW 71
V-OUT H-A-COMP
R P H-A-COMP 83
JK101 Q101 CN101 CN151 V-ENV
V-ENV 84
V-OUT1 19 BUFFER 1 V-OUT1 1 61 C-SYNC
AGC VXO C-SYNC 67
V-IN1 20 3 V-IN1 3 63
JK102 Q102 CN102 CN152 58 59 28 29 25 21

V-OUT2 19 BUFFER 1 V-OUT2 1
V-IN2 20 3 V-IN2 3
X301 TP301
4.433619MHz
C-PB
WF2
HG231BLV
Comparison Chart of
Models & Marks
Model Mark
HG231ED A
HG430ED B
PB-AUDIO SIGNAL REC-AUDIO SIGNAL Mode : SP/REC
JACK CBA TU701(TUNER UNIT) MAIN CBA

AUDIO 2
JK101 TU-AUDIO 21
A-IN1 2 CN101 CN151
A-IN1 6 7 A-IN1(L) 7
A-OUT1 1 5 A-OUT1(R) 5
A-OUT1 3
JK102 IC151 (SWITCHING)

PB/EE
A-IN2 2 CN102 CN152 1
Q151 PB/EE
A-IN2 6 8 A-IN2(L) 8 5
BUFFER 3 PB/EE
A-OUT2 1 6 A-OUT2(R) 6 2
IN2
A-OUT2 3 4
TUNER
12
Audio Block Diagram ( A )
Q152 PB/EE
14
BUFFER 13 IN1
15
IN1
11
AUDIO-SW-1
SW 10 TO SERVO/SYSTEM
CTL AUDIO-SW-2 CONTROL BLOCK
9
IC301 (AUDIO SIGNAL PROCESS)

TUNER
13
IN1
15
1-7-3
IN2
17 ALC
12
DET
INV
PB-ON
R LINE
5 EQ ALC MUTE 11
8 9 ATT AMP
6 AMP
P
(DECK ASSEMBLY) SP/LP-ON
+5V 7
ACE HEAD ASSEMBLY
Q401 REC-ON
CN287 CN504
AUDIO A-PB/REC 3 3 A-PB/REC
HEAD Q402
A-COM 4 4 A-COM
BIAS
AUDIO AE-H 6 6 AE-H OSC
ERASE AE-H/FE-H 5 5 AE-H/FE-H 1 AUTO REC
HEAD 3 100
2 BIAS AMP
Q406
SERIAL
AUDIO HD-SW DECODER
CONTROL
FE HEAD Q403
(SWITCHING) 16 68 69 71
CN501
FULL 2 FE-H +5V A-MUTE-H
ERASE Q405 IIC-BUS SDA TO SERVO/SYSTEM
1 FE-H-GND
HEAD (PB=ON) IIC-BUS SCL CONTROL BLOCK
HG231BLA
Comparison Chart of
Models & Marks
Model Mark
HG231ED A
HG430ED B
PB-AUDIO SIGNAL REC-AUDIO SIGNAL Mode : SP/REC
MAIN CBA
N-A-PB
TO Hi-Fi N-A-REC
AUDIO BLOCK
Audio Block Diagram ( B )
IC301
(AUDIO SIGNAL PROCESS) 13 15 17
IN1
TUNER IN2
ALC
12
DET
1-7-4
INV
PB-ON
R LINE
5 EQ ALC MUTE 11
8 9 ATT AMP
6 AMP
P
(DECK ASSEMBLY) SP/LP-ON
+5V 7
ACE HEAD ASSEMBLY
Q401 REC-ON
CN504
AUDIO 3 A-PB/REC
HEAD Q402
4 A-COM
BIAS
AUDIO 6 AE-H OSC
ERASE 5 AE-H/FE-H 1 AUTO REC
HEAD 3 100
2 BIAS AMP
Q406
SERIAL
AUDIO HD-SW DECODER
CONTROL
FE HEAD 16 68 69 71
Q403
CN501
FULL 2 FE-H +5V
ERASE Q405
1 FE-H-GND
HEAD (PB=ON) A-MUTE-H
IIC-BUS SDA TO SERVO/SYSTEM
IIC-BUS SCL CONTROL BLOCK
HG430BLA
Comparison Chart of
Models & Marks
Model Mark
HG231ED A PB-AUDIO SIGNAL REC-AUDIO SIGNAL Mode : SP/REC
HG430ED B CN509 JK751

MAIN CBA 2 A-OUT1(L) A-OUT
1 A-OUT1(R) (L)
JACK CBA
JK101 A-OUT
CN101 CN151 (R)
A-IN1(R) 2 9 A-IN1(R) 9
A-IN1(L) 6 7 A-IN1(L) 7
A-OUT1(R) 1 5 A-OUT1(R) 5 SUB JACK CBA
A-OUT1(L) 3 11 A-OUT1(L) 11
JK102 CN102 CN152

A-IN2(R) 2 9 A-IN2(R) 9 AFV CBA TU701
A-IN2(L) 6 8 A-IN2(L) 8 (TUNER UNIT)
CN701 CN1 CN1 CN701
A-OUT2(R) 1 6 A-OUT2(R) 6 4 TU-AUDIO(R) 4 2 SIF 2 22 SIF OUT
IF SIGNAL
A-OUT2(L) 3 11 A-OUT2(L) 11 5 TU-AUDIO(L) 5 PROCESS
IC451 (Hi-Fi AUDIO SIGNAL PROCESS)

Hi-Fi Audio Block Diagram ( B )
MUTE-ON
67 73
65 74
SW OUTPUT
VCO MUTE 72 2 AUDIO IN
SELECT
SW
76
77
1-7-5
ALC ALC ALC MUTE-ON
75
62 70 SW R-CH IIC-BUS SDA

COMP BPF 37
NOISE LOGIC IIC-BUS SCL
61 71 R-CH 38
Q451
PNR P A-MODE
NOISE ENV
21 FROM/TO
DET DET LINE-MUTE
R MUTE 53 SERVO/SYSTEM
52 47
CONTROL BLOCK
56 R-CH LIM DEV VCO
48
54 INSEL
JK758
A-IN(R) 50 Hi-Fi-H-SW
HOLD 39
60 PULSE
FRONT LPF
2
JK757 MIX V/I
6
A-IN(L)
10 L-CH
14 LPF
8 INSEL
(DECK ASSEMBLY)
4 15
LIM DEV VCO
R CYLINDER
L-CH DO ASSEMBLY
PNR P DET
ALC CN253
+ R 24 Hi-Fi-A(R) 7 Hi-Fi
SW L-CH AUDIO
N-A-REC COMP LIM 26 Hi-Fi-COM 8 (R) HEAD
78 NOISE BPF
TO AUDIO BLOCK N-A-PB L 27 Hi-Fi-A(L) 9
80
Hi-Fi
AUDIO
34 33 (L) HEAD
HG430BLH
Comparison Chart of
Models & Marks NOTE : CAUTION CAUTION !
Model Mark The voltage for parts in hot circuit is measured using FOR CONTINUED PROTECTION AGAINST FIRE HAZARD, Fixed voltage (or Auto voltage selectable ) power supply circuit is used in this unit.
hot GND as a common terminal. REPLACE ONLY WITH THE SAME TYPE T1.6AL/250V FUSE. If Main Fuse (F001) is blown, check to see that all components in the power supply
HG231ED A circuit are not defective before you connect the AC plug to the AC power supply.
HG430ED B Otherwise it may cause some components in the power supply circuit to fail.
MAIN CBA
HOT CIRCUIT. BE CAREFUL.
A
F001 L003 D001 - D004 T001
T1.6A L 250V Q051 P-ON+15V
LINE BRIDGE
AC001 RECTIFIER 2 12 P-ON+44V
FILTER
P-ON-H
AL+12V/+20.5V
Q052 Q053
AL+9V
13
AL+12V
Q057 C-POW-SW
AL+5V
Power Supply Block Diagram
4 14 TIMER+5V
P-ON+5V
Q058
P-DOWN-L
Q055
AL-5V
Q001 15
Q054
16 Q059
1-7-6
Q002
A
11
Q056
7 17
6 18
Q004
SHUNT
IC001 REGULATOR
ERROR
VOLTAGE DET
Q003
4 1
3 2
HOT
COLD
HG231BLP
FUNCTION INDICATOR SYMBOLS
Note:
The following symbols will appear on the indicator panel to indicate the current mode or operation of the VCR.
On-screen modes will also be momentarily displayed on the tv screen when you press the operation buttons.
Display panel
STANDBY FUNCTION TIMER REC

TAPE IN
" H "= LED Light on, " L "= LED Light off
MODE INDICATOR ACTIVE

STANDBY Power on = " H "
Power off = " L "
FUNCTION VCR mode = " H "
TV mode = " L "
TAPE IN Cassette in = " H "
Cassette out = " L "
TIMER Timer stand by = " H "
One touch recording = " H "
Timer recording = " H "
General mode = " L "
REC REC mode = " H "
REC pause Blinks at 0.8Hz interval
General mode = " L "
When reel and capstan mechanism is not “A R” is displayed on a TV screen. (Refer to Fig. 1.)
functioning correctly
When tape loading mechanism is not func- “A T” is displayed on a TV screen. (Refer to Fig. 2.)
tioning correctly
When cassette loading mechanism is not “A C” is displayed on a TV screen. (Refer to Fig. 3.)
functioning correctly
When the drum is not working properly “A D” is displayed on a TV screen. (Refer to Fig. 4.)
P-ON Power safety detection “A P” is displayed on a TV screen. (Refer to Fig. 5.)
1-7-7 HG231FIS
TV screen
Note:
OSD for mechanical error will be displayed for 5 sec. after the mechanical error occurs.
When reel and capstan mechanism is not functioning When the drum is not working properly
correctly
A R A D
Fig. 1 Fig. 4
When tape loading mechanism is not functioning cor- P-ON Power safety detection
rectly
A T A P
Fig. 2 Fig. 5
When cassette loading mechanism is not functioning

correctly
A C
Fig. 3
1-7-8 HG231FIS
SCHEMATIC DIAGRAMS / CBA’S AND TEST POINTS
Standard Notes Notes:
WARNING 1. Do not use the part number shown on these draw-
ings for ordering. The correct part number is shown
Many electrical and mechanical parts in this chassis in the parts list, and may be slightly different or
have special characteristics. These characteristics amended since these drawings were prepared.
often pass unnoticed and the protection afforded by
2. All resistance values are indicated in ohms
them cannot necessarily be obtained by using replace-
ment components rated for higher voltage, wattage, (K=103, M=106).
etc. Replacement parts that have these special safety 3. Resistor wattages are 1/4W or 1/6W unless other-
characteristics are identified in this manual and its wise specified.
supplements; electrical components having such fea- 4. All capacitance values are indicated in µF
tures are identified by the mark " ! " in the schematic
(P=10-6 µF).
diagram and the parts list. Before replacing any of
these components, read the parts list in this manual 5. All voltages are DC voltages unless otherwise
carefully. The use of substitute replacement parts that specified.
do not have the same safety characteristics as speci- 6. Electrical parts such as capacitors, connectors,
fied in the parts list may create shock, fire, or other diodes, IC’s, transistors, resistors, switches, and
hazards. fuses are identified by four digits. The first two dig-
its are not shown for each component. In each
block of the diagram, there is a note such as shown
Capacitor Temperature Markings
below to indicate these abbreviated two digits.
Capacity Standard Temperature
Mark
change rate temperature range
(B) ±10% 20°C -25~+85°C

(F) +30 - 80% 20°C -25~+85°C
(SR) ±15% 20°C -25~+85°C

(Z) +30 - 80% 20°C -10~+70°C
Capacitors and transistors are represented by the following symbols.
CBA Symbols Schematic Diagram Symbols
(Top View) (Bottom View) Digital Transistor

+
Electrolytic Capacitor
(Bottom View)
Transistor or Digital Transistor
E C B
(Top View) (Top View)
NPN Transistor PNP Transistor
ECB ECB
(Top View) (Top View)
NPN Digital Transistor PNP Digital

Transistor
ECB ECB
1-8-1 SCPA1
LIST OF CAUTION, NOTES, AND SYMBOLS USED IN THE SCHEMATIC DIAGRAMS ON THE FOLLOWING
PAGES:
1. CAUTION:
FOR CONTINUED PROTECTION AGAINST FIRE HAZARD, REPLACE ONLY WITH THE SAME TYPE FUSE.
2. CAUTION:
Fixed Voltage (or Auto voltage selectable) power supply circuit is used in this unit.
If Main Fuse (F001) is blown, first check to see that all components in the power supply circuit are not defective
before you connect the AC plug to the AC power supply. Otherwise it may cause some components in the power
supply circuit to fail.
3. Note:
(1) Do not use the part number shown on the drawings for ordering. The correct part number is shown in the parts
list, and may be slightly different or amended since the drawings were prepared.
(2) To maintain original function and reliability of repaired units, use only original replacement parts which are
listed with their part numbers in the parts list section of the service manual.
4. Mode: SP/REC
5. Voltage indications for PLAY and REC modes on the schematics are as shown below:
1 2 3 PLAY mode
Unit: Volts
5.0 REC mode
5.0
(2.5)
The same voltage for
both PLAY & REC modes Indicates that the voltage
is not consistent here.
6. How to read converged lines
1-D3
3 1-B1
Distinction Area AREA D3
Line Number
(1 to 3 digits) 2 AREA B1
Examples:
1. "1-D3" means that line number "1" goes to area "D3". 1 1-D3
2. "1-B1" means that line number "1" goes to area "B1".
A B C D
7. Test Point Information
: Indicates a test point with a jumper wire across a hole in the PCB.
: Used to indicate a test point with a component lead on foil side.
: Used to indicate a test point with no test pin.
: Used to indicate a test point with a test pin.
1-8-2 SCRK05
Main 1/6 Schematic Diagram
Comparison Chart of
Models and Marks
MODEL MARK
HG231ED A
HG430ED B
1-8-3 1-8-4 HG231SCM1

Main 2/6 & Sensor Schematic Diagrams Comparison Chart of
Models and Marks
MODEL MARK
HG231ED A
HG430ED B
1-8-5 1-8-6 HG231SCM2

Main 3/6 Schematic Diagram Comparison Chart of
Models and Marks
MODEL MARK
HG231ED A
HG430ED B
1-8-7 1-8-8 HG231SCM3

Main 4/6 & Jack Schematic Diagrams Comparison Chart of
Models and Marks
MODEL MARK
HG231ED A
HG430ED B
1-8-9 1-8-10 HG231SCM4

Main 5/6 Schematic Diagram Comparison Chart of
Models and Marks
MODEL MARK
CAUTION ! NOTE : CAUTION ! HG231ED A
For continued protection against fire hazard, The voltage for parts in hot circuit is measured using Fixed voltage ( or Auto voltage selectable ) power supply circuit is used in this unit. HG430ED B
replace only with the same type fuse. hot GND as a common terminal. If Main Fuse (F001) is blown, check to see that all components in the power supply
circuit are not defective before you connect the AC plug to the AC power supply.
Otherwise it may cause some components in the power supply circuit to fail.
1-8-11 1-8-12 HG231SCM5

Main 6/6 Schematic Diagram ( B ) Comparison Chart of
Models and Marks
MODEL MARK
HG231ED A
HG430ED B
1-8-13 1-8-14 HG430SCM6

AFV Schematic Diagram ( B ) Comparison Chart of
Models and Marks
MODEL MARK
HG231ED A
HG430ED B
1-8-15 1-8-16 HG430SCAFV

Main CBA Top View
CAUTION ! CAUTION ! BECAUSE A HOT CHASSIS GROUND IS PRESENT IN THE POWER

For continued protection against fire hazard, Fixed voltage ( or Auto voltage selectable ) power supply circuit is used in this unit. SUPPLY CIRCUIT , AN ISOLATION TRANSFORMER MUST BE USED.
replace only with the same type fuse. If Main Fuse (F001) is blown, check to see that all components in the power supply ALSO , IN ORDER TO HAVE THE ABILITY TO INCREASE THE INPUT
circuit are not defective before you connect the AC plug to the AC power supply. SLOWLY , WHEN TROUBLESHOOTING THIS TYPE POWER SUPPLY
Otherwise it may cause some components in the power supply circuit to fail. CIRCUIT , A VARIABLE ISOLATION TRANSFORMER IS REQUIRED.
NOTE :
The voltage for parts in hot circuit is measured
using hot GND as a common terminal.
Sensor CBA Top View
BHF300F01011A
BHF300F01011B
WF3
J23
V-OUT
TP507
WF1 S-INH
TP502
RF-SW TP501
CTL
VR501 WF2
SW-P TP301
C-PB
1-8-17 1-8-18 BHG470F01014A

Main CBA Bottom View
CAUTION ! BECAUSE A HOT CHASSIS GROUND IS PRESENT IN THE POWER

For continued protection against fire hazard, CAUTION ! SUPPLY CIRCUIT , AN ISOLATION TRANSFORMER MUST BE USED.
replace only with the same type fuse. Fixed voltage ( or Auto voltage selectable ) power supply circuit is used in this unit. ALSO , IN ORDER TO HAVE THE ABILITY TO INCREASE THE INPUT
If Main Fuse (F001) is blown, check to see that all components in the power supply SLOWLY , WHEN TROUBLESHOOTING THIS TYPE POWER SUPPLY
circuit are not defective before you connect the AC plug to the AC power supply. CIRCUIT , A VARIABLE ISOLATION TRANSFORMER IS REQUIRED.
NOTE : Otherwise it may cause some components in the power supply circuit to fail.
The voltage for parts in hot circuit is measured
using hot GND as a common terminal.
1-8-19 1-8-20 BHG470F01014A

Jack CBA Top View
Jack CBA Bottom View
1-8-21 1-8-22 BHG470F01014C

AFV CBA Top View ( B ) AFV CBA Bottom View ( B )
Comparison Chart of
Models and Marks
MODEL MARK
HG231ED A
HG430ED B
BHC400F01093
Sub Jack CBA Top View ( B ) Sub Jack CBA Bottom View ( B )
BHG470F01014B
1-8-23 1-8-24
WAVEFORMS
WF2 UPPER (TP301 of Main CBA)

WF1 LOWER (TP502 of Main CBA)
C-PB 10mV x 10
RF-SW 0.5V x 10
5ms
WF3 UPPER (J23 of Main CBA)

WF1 LOWER (TP502 of Main CBA)
V-OUT 0.1V x 10
RF-SW 0.5V x 10
50µs
WF3 (J23 of Main CBA)
V-OUT E-E
10µs 50mV x 10
1-9-1 U29WFPAL
AC CORD
Comparison Chart of
Models & Marks ANT-IN ANT-OUT
Model Mark
HG231ED A B
HG430ED B SENSOR CBA
(BHF300F01011) CN701 CN1
1 NU 1
2 SIF 2
SENSOR CBA 3 GND 3
4 TU-AUDIO(R) 4 AFV CBA
(BHF300F01011)
5 TU-AUDIO(L) 5 (BHC400F01093)
(DECK ASSEMBLY)
6 P-ON+5V 6
7 P-ON+5V 7
AC HEAD ASSEMBLY CN287 CN504 8 IIC-BUS SCL 8
CTL(-) 1 1 CTL(-) 9 IIC-BUS SDA 9
CONTROL HEAD
CTL(+) 2 2 CTL(+)
A-PB/REC 3 3 A-PB/REC
AUDIO HEAD
A-COM 4 4 A-COM
AUDIO AE-H/FE-H 5 5 AE-H/FE-H
ERASE HEAD AE-H 6 6 AE-H CN151 JW001 CN101
1 V-OUT1 1
2 GND 2
FE HEAD CN501 3 V-IN1 3 JK101,102
FULL 2 FE-H 4 AL+12V(1) 4
ERASE HEAD 1 FE-H GND 5 A-OUT1(R) 5 1
2
6 JK1-8P-OUT 6 3
7 A-IN1(L) 7 4
CAPSTAN MOTOR CN502 5
8 NU 8
LOADING M 1 AL+12V/+20.5V 6
9 A-IN1(R) 9 7
MOTOR 2 P-ON+5V MAIN CBA
10 GND 10 8
3 C-FG (BHG470F01014A) 9
11 A-OUT1(L) 11
M 4 C-F/R B JACK CBA 10
1-10-1
CYLINDER ASSEMBLY 11
5 C-CONT (BHG470F01014C)
CN152 JW002 CN102 12
PG CAPSTAN 6 GND 13
SENSOR 7 LM-FWD/REV 1 V-OUT2 1 14
MOTOR
8 D-CONT 2 GND 2 15
3 V-IN2 3 16
9 D-PFG 17
DRUM 10 GND 4 NU 4 18
MOTOR
M 11 AL+12V(2) 5 GND 5 19
6 A-OUT2(R) 6 20
12 P-ON+15V 21
7 SC2-IN 7
WIRING DIAGRAM
8 A-IN2(L) 8
VIDEO
(R)1 9 A-IN2(R) 9
HEAD 10 GND 10
11 A-OUT2(L) 11
VIDEO B
(L)1
HEAD
CN253
VIDEO 1 V(R)-1
(L)2
HEAD 2 V-COM
3 V(L)-1 B
VIDEO 4 V(L)-2 B
(R)2
HEAD 5 V-COM
JW003 CN509
6 V(R)-2 AUDIO
A-OUT1(R) 1 OUT(R)
Hi-Fi AUDIO 7 Hi-Fi-A(R) SUB JACK CBA
A-OUT1(L) 2
(R) HEAD 8 Hi-Fi-COM (BHG470F01014B)
GND 3
9 Hi-Fi-A(L) AUDIO
OUT(L)
Hi-Fi AUDIO
(L) HEAD
HG231WI
IC PIN FUNCTION DESCRIPTIONS
Comparison Chart of Models and Marks Pin IN/ Signal Active
Mark Function
No. OUT Name Level
Model Mark
A - N.U. Not Used -
HG231ED A
17 H-A- Head Amp
HG430ED B B IN Comparator H/L
COMP Signal
IC501( SERVO / SYSTEM CONTROL IC ) 18 OUT RF-SW Video Head H/L

Switching Pulse
“H” ≥ 4.5V, “L” ≤ 1.0V A - N.U. Not Used -
Pin IN/ Signal Active
Mark Function 19 Hi-Fi Audio
No. OUT Name Level B OUT Hi-Fi-H- Head Switching H/L
SW
Input Signal Pulse
1 IN SC2-IN from Pin 8 of A/D
SCART2 20 - N.U. Not Used -
Video Head 21 - N.U. Not Used -

2 IN PG- Switching Pulse A/D 22 - N.U. Not Used -
DELAY Signal Adjusted
Voltage 23 OUT POWER- “POWER” LED
H
LED Signal Output
P-ON Power
3 IN POW-SAF Detection Input A/D “CASSETTE”
Signal 24 OUT CAS-LED LED Signal H
Output
Tape End
4 IN END-S Position Detect A/D 25 TIMER- “TIMER” LED
Signal OUT H
LED Signal Output
Automatic Recording LED
5 IN AFC Frequency A/D 26 OUT REC-LED H
Control Signal
Control Signal
27 - N.U. Not Used -
Video Envelope
6 IN V-ENV Comparator A/D A - N.U. Not Used -
Signal 28
B OUT LINE- Audio Mute H
Key Scan Input MUTE Control Signal
7 IN KEY-1 A/D
Signal 1
A OUT AUDIO- Audio IN/OUT H/L
Key Scan Input 29 SW-1 Control Signal
8 IN KEY-2 A/D
Signal 2
B - N.U. Not Used -
Deck Mode
9 IN LD-SW Position A/D A OUT AUDIO- Audio IN/OUT H/L
Detector Signal 30 SW-2 Control Signal
Tape Start B - N.U. Not Used -
10 IN ST-S Position A/D
Detector Signal Recording
Safety SW
11 - N.U. Not Used - 31 IN REC- Detect (With H
SAF-SW Record tab="L"/
12 - N.U. Not Used - With out Record
tab="H")
13 OUT D-V- Dummy V-sync H/Hi-z
SYNC Output A - N.U. Not Used -
14 IN REMOCO Remote Control L 32 Hi-Fi Tape
N-IN Sensor B IN A-MODE Detection L
Color Phase Signal
Rotary
15 OUT C-ROTA
Changeover
H/L 33 OUT D-REC-H Delayed Record H
Signal
SIgnal
System Reset
A - N.U. Not Used - 34 IN RESET Signal L
Video Head (Reset=”L”)
16
B OUT H-A-SW Amp Switching H/L 35 IN Xcin Sub Clock -
Pulse
36 OUT Xcout Sub Clock -
37 - Vcc Vcc -
1-11-1 HG231PIN
Pin IN/ Signal Active Pin IN/ Signal Active
Mark Function Mark Function
No. OUT Name Level No. OUT Name Level
Main Clock I2C BUS
38 IN Xin Input
- 71 OUT IIC-BUS H/L
SCL Control Clock
Main Clock
39 OUT Xout
Input
- 72
IN/ IIC-BUS I2C BUS H/L
OUT SDA Control Data
40 - Vss Vss(GND) -
43 IN Clock Select -
CLKSEL Capstan Motor
(GND) 76 OUT C-CONT PWM
Control Signal
44 IN Clock Input for -
OSCin letter size Drum Motor
77 OUT D-CONT PWM
Control Signal
45 OUT OSCout Clock Output for -
letter size Capstan Motor
FWD/REV
46 - N.U. Not Used - 78 OUT C-F/R Control Signal H/L
(FWD=”L”/
47 - LP LP - REV=”H”)
48 IN FSC-IN 4.43MHz Clock - Supply Reel
[4.43MHz] Input 79 IN S-REEL PULSE
Rotation Signal
49 - OSDVss OSDVss - Take Up Reel
80 IN T-REEL PULSE
OSD Video Rotation Signal
50 IN OSD-V-IN Signal Input -
H/L/
81 OUT LM-FWD/ Loading Motor
51 - N.U. Not Used - REV Control Signal Hi-z
52 OUT OSD-V- OSD Video -
OUT Signal Output Audio Mute
83 OUT A-MUTE H
53 - OSDVcc OSDVcc - Control Signal
LPF Connected 84 - N.U. Not Used -

54 - HLF Terminal - 85 - N.U. Not Used -
(Slicer)
Power Voltage
55 - N.U. Not Used - 86 IN P-DOWN- Down Detector L
L
56 - N.U. Not Used - Signal
57 - N.U. Not Used - Capstan Motor

87 IN C-FG Rotation PULSE
Composite Detection Pulse
58 IN C-SYNC Synchronized PULSE
Pulse 88 - N.U. Not Used -
SCART 1 8Pin 89 - N.U. Not Used -

59 OUT 8POUT-1 Output Control H/L Drum Motor
Signal 90 IN D-PFG Pulse PULSE
60 - N.U. Not Used - Generator
61 - N.U. Not Used - 91 - AMPVRE V-Ref for CTL -

F OUT AMP
62 OUT SD-H SD-H -
92 - AMPVRE V-Ref for CTL -
63 - N.U. Not Used - F in AMP
64 - N.U. Not Used - 93 - P80/C P80/C Terminal -
65 - N.U. Not Used - IN/ Playback/
94 CTL (-) Record Control H/L
Capstan Power OUT Signal (-)
66 OUT C-POW- Switching H/L
SW Playback/
Signal IN/
95 CTL (+) Record Control H/L
Power On OUT Signal (+)
67 IN P-ON-H H
Signal at High
CTL AMP
68 - N.U. Not Used - 96 - AMPC Connected -
69 - N.U. Not Used - Terminal
1-11-2 HG231PIN
Pin IN/ Signal Active
Mark Function
No. OUT Name Level
To Monitor for
97 - CTLAMP CTL AMP PULSE
out
Output
98 - AMPVcc AMPVcc -
A/D Converter
99 - Power Input/ -
AVcc Standard
Voltage Input
IF AGC
100 IN AGC Comparator A/D
Signal
Notes:
Abbreviation for Active Level:
PWM -----Pulse Wide Modulation
A/D--------Analog - Digital Converter
1-11-3 HG231PIN
LEAD IDENTIFICATIONS
2SC2785(F,H,J) 2SA1015-GR(TPE2) BU4052BCF-E2
BA1F4M-T 2SA1020(Y) CD4052BCSJX
BN1F4M-T 2SC1815-BL(TPE2) TC4052BF(EL)
BN1L4M-T 2SC1815-GR(TPE2) 16 9
KRA103M 2SC1815-Y(TPE2)
KRA104M 2SC2120-Y(TPE2)
KRC103M 2SC3266-Y(TPE2)
KTA1266(GR) KTA1267(GR,Y)
KTA1281(Y) KTC3203(Y)
KTC3199(BL,GR,Y)
KTC3205(Y)
1 8
E C B E C B MID-32A22F
2SK3566 PT204-6B-12
EL817A
BR24L02F-WE2 EL817B
CAT24WC02JI EL817C
LTV-817B-F
LTV-817C-F
PS2561A-1(Q,W)
8 5
A C
1 4
C
K E E
G D S LA72648M-MPB-E
FA1F4M-T1B QSZAB0RMB192
KRC103S RTK 80 51
RN1511(TE85R) KTA1504GR-RTK
FMG4A T148 KTA1504Y-RTK 81 50
KTC3875Y-RTK
C1 C2
C
B1 E B2
100 31
B E
1 30
LA71750EM-MPB-E MSP3407G-QG-B8
MSP3407G-QG-B8-V3
60 41
33 23
61 40
34 22
Note:
A: Anode
K: Cathode
E: Emitter
C: Collector
80 B: Base
21 44 12 R: Reference
S: Source
1 G: Gate
20
1 11 D: Drain
1-12-1 HG231LE
EXPLODED VIEWS
Front Panel
A1X
1-13-1 HG231FEX
Cabinet
2L011
2B18
2L011
2L011 See Electrical Parts List

for parts with this mark.
Some Ref. Numbers are
A2 not in sequence.
2L011
2B9
2B9
A5
JACK CBA
2L012 2L011
2L022
2L042
2L021
2L021
A4 2L021 2L021 2L051
2L022 2B5
2L041 [ HG430ED ]
[ HG430ED ] 2L041
2L021
SUB JACK CBA

SENSOR CBA
2L031
AFV CBA
2B7
2L041
2L099 1B1
[ HG430ED ] 2B46 A10
2B8
MAIN CBA
A3
A7
1-13-2 HG231CEX
Packing
X1 X20 X3 X2
Some Ref. Numbers are not in sequence.
S2
X4
S3
S2
Unit
A14
S1
1-13-3 HG231PEX
MECHANICAL PARTS LIST
PRODUCT SAFETY NOTE: Products marked with a ! Ref. No. Mark Description Part No.
have special characteristics important to safety. Before S3 UNIT, BAG V4010PA 0VM406453B
replacing any of these components, read carefully the ACCESSORIES
product safety notice in this service manual. Don't X1 REMOTE CONTROL UNIT 364/CZF29UU NA690ED
degrade the safety of the product through improper ser- X2 DRY BATTERY R6P/2S or XB0M451T0001
vicing. DRY BATTERY ES-GR6M-C XB0M571GLP01
X3 RF CORD PAL 1.2M or WPZ0122LG001
NOTE: RF CABLE CC1001020012010 WPZ0122LW001

X4 ACCESSORY BAG K8092BA 0VM404632
Parts that are not assigned part numbers (---------) are
X20! A OWNER'S MANUAL(GERMAN) HG231ED 0VMN04101
not available.
X20! B OWNERS MANUAL HG430ED 1VMN20013
Comparison Chart of Models and Marks

Model Mark
HG231ED A
HG430ED B
Ref. No. Mark Description Part No.

A1X A FRONT ASSEMBLY HE231ED 0VM204402
A1X B FRONT ASSEMBLY HE432ED 0VM204455
A2 CASE, TOP(ANTHRACITE) HE240ED 0VM101267
A3 A CHASSIS HE470ED 0VM000174A
A3 B CHASSIS(U27F-GMBH) HE240ED 0VM000177
A4 B JACK BOARD(U27 FTZ) HE480ED
(See Electrical Parts List)
A5 JACK BOARD(2-21P) HE470ED
A7 PANEL, BOTTOM HE470ED 0VM203862
A10! A LABEL, RATING HG231ED ------------
A10! B LABEL,RATING HG430ED ------------
A14 LABEL, SERIAL NO. HE240ED ------------
A14 A LABEL, BAR CODE HG231ED ------------
A14 B LABEL,BAR CODE HG430ED ------------
1B1 A DECK ASSEMBLY CZD013/VM23A0 N23A0FL
1B1 B DECK ASSEMBLY CZD013/VM23ED N23E0FL
2B5 SHEILD, CYLINDER HG470ED 0VM306638
2B7 SHIELD ASSEMBLY HG470ED
2B8 BUSH, LED(F) H3700UD
2B9 CUSHION HC460ED 0VM413251
2B18 FIBER, TOP CASE HC460ED 0VM412906
2B46 ROHM HOLDER H7770JD
2L011 SCREW, P-TIGHT 3X10 BIND HEAD+ GBCP3100
2L012 SCREW, P-TIGHT 3X10 BIND HEAD+ GBCP3100
2L021 SCREW, P-TIGHT M3X10 WASHER GCMP3100
HEAD+
2L022 SCREW, P-TIGHT M3X10 WASHER
HEAD+
2L031 SCREW, S-TIGHT M3X6 BIND HEAD+ GBMS3060
2L041 P-TIGHT SCREW 3X8 BIND + GBMP3080
2L042 P-TIGHT SCREW 3X8 BIND + GBMP3080
2L051 SCREW, S-TIGHT M3X5 BIND HEAD+ GBMS3050
2L099 SCREW, P-TIGHT M3X8 BIND HEAD+ GBCP3080
PACKING
S1 A GIFT BOX CARTON HG231ED 0VM306884
S1 B GIFT BOX,CARTON HG430ED 1VM320025
S2 STYROFOAM HG470ED 0VM204516
20040325 1-14-1 HG231CA

ELECTRICAL PARTS LIST
PRODUCT SAFETY NOTE: Products marked with a ! Ref. No. Mark Description Part No.
have special characteristics important to safety. Before C017 ELECTROLYTIC CAP. 470µF/16V M or CE1CMASDL471
replacing any of these components, read carefully the ELECTROLYTIC CAP. 470µF/16V M CE1CMASTL471
product safety notice in this service manual. Don't C018 ELECTROLYTIC CAP. 100µF/16V M or CE1CMASDL101
degrade the safety of the product through improper ser- ELECTROLYTIC CAP. 100µF/16V M CE1CMASTL101
vicing. C020 ELECTROLYTIC CAP. 1000µF/16V M CE1CMZPTL102
C021 ELECTROLYTIC CAP. 470µF/10V M or CE1AMASDL471
ELECTROLYTIC CAP. 470µF/10V M CE1AMASTL471
NOTES:
C022 A ELECTROLYTIC CAP. 22µF/16V M H7 CE1CMAVSL220
1. Parts that are not assigned part numbers (---------)
C025 CHIP CERAMIC CAP.(1608) B K 0.01µF/50V CHD1JK30B103
are not available. C026 ELECTROLYTIC CAP. 47µF/16V M H7 CE1CMAVSL470
2. Tolerance of Capacitors and Resistors are noted C053 ELECTROLYTIC CAP. 220µF/6.3V M H7 CE0KMASSL221
with the following symbols. C056 CHIP CERAMIC CAP.(1608) B K 0.047µF/ CHD1JK30B473
50V or
C.....±0.25% D.....±0.5% F.....±1% CHIP CERAMIC CAP.(1608) B K 0.047µF/ CHD1EK30B473
25V
G.....±2% J......±5% K.....±10%
C057 CHIP CERAMIC CAP.(1608) CH J 470pF/50V CHD1JJ3CH471
M.....±20% N.....±30% Z.....+80/-20% or
CHIP CERAMIC CAP. CG J 470pF/50V CHD1JJ3CG471
C060 B ELECTROLYTIC CAP. 10µF/16V M H7 CE1CMAVSL100
Comparison Chart of Models and Marks C061 B CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V CHD1JZ30F104
or
Model Mark B CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V CHD1EZ30F104
or
HG231ED A
B CHIP CERAMIC CAP. FZ Z 0.1µF/50V CHD1JZ3FZ104
HG430ED B
C151 A CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V CHD1JZ30F104
or
A CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V CHD1EZ30F104
MCV CBA or
A CHIP CERAMIC CAP. FZ Z 0.1µF/50V CHD1JZ3FZ104
Ref. No. Mark Description Part No. C152 A CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V CHD1JZ30F104
A MCV CBA 0VSA15006 or
B MCV CBA 0VSA15267 A CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V CHD1EZ30F104
Consists of the following or
MAIN CBA (MCV-A) ------------ A CHIP CERAMIC CAP. FZ Z 0.1µF/50V CHD1JZ3FZ104
B SUB JACK CBA (MCV-B) ------------
JACK CBA (MCV-C) ------------ C154 A CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V CHD1JZ30F104
SENSOR CBA 0VSA14893 or
or
MAIN CBA A CHIP CERAMIC CAP. FZ Z 0.1µF/50V CHD1JZ3FZ104
Ref. No. Mark Description Part No. C155 A ELECTROLYTIC CAP. 10µF/16V M H7 CE1CMAVSL100
MAIN CBA (MCV-A) ----------- C156 A ELECTROLYTIC CAP. 10µF/16V M H7 CE1CMAVSL100
Consists of the following C157 ELECTROLYTIC CAP. 1µF/50V M H7 CE1JMAVSL1R0
CAPACITORS C158 CHIP CERAMIC CAP. B K 1000pF/50V CHD1JK30B102
C002! METALLIZED FILM CAP. 0.068µF/275V K or CT2E683HJE06 C159 A CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V CHD1JZ30F104
or
! METALLIZED FILM CAP. 0.068µF/250V K CT2E683DC011
C003! A SAFTY CAP. 2200pF/250V or CCN2EMA0E222 or
! A SAFETY CAP. 2200pF/250V CA2E222MR049 A CHIP CERAMIC CAP. FZ Z 0.1µF/50V CHD1JZ3FZ104
C003! B SAFTY CAP. 2200pF/250V CCN2EMA0E222 C251 ELECTROLYTIC CAP. 10µF/16V M H7 CE1CMAVSL100
C004 ELECTROLYTIC CAP. 33µF/400V M(L.Z) CA2H330NC010 C252 CHIP CERAMIC CAP. B K 1000pF/50V CHD1JK30B102
C005 CERAMIC CAP. B K 0.01µF/500V CCD2JKP0B103 C253 ELECTROLYTIC CAP. 1µF/50V M H7 CE1JMAVSL1R0
C006 CERAMIC CAP. SL K 56pF/1KV or CCD3AKPSL560 C254 CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V CHD1JZ30F104
or
CERAMIC CAP. SL J 56pF/1KV CCD3AJPSL560
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V CHD1EZ30F104
C007 CERAMIC CAP.(AX) B K 1000pF/50V CCA1JKT0B102 or
C008 CERAMIC CAP.(AX) X K 5600pF/16V CCA1CKT0X562 CHIP CERAMIC CAP. FZ Z 0.1µF/50V CHD1JZ3FZ104
C010 FILM CAP.(P) 0.022µF/50V J or CMA1JJS00223 C302 CHIP CERAMIC CAP.(1608) B K 0.022µF/ CHD1JK30B223
FILM CAP.(P) 0.022µF/50V J CA1J223MS029 50V or
C011 ELECTROLYTIC CAP. 10µF/16V M H7 CE1CMAVSL100 CHIP CERAMIC CAP.(1608) B K 0.022µF/ CHD1EK30B223
25V
C012 ELECTROLYTIC CAP. 10µF/50V M H7 CE1JMAVSL100
C303 ELECTROLYTIC CAP. 1µF/50V M H7 CE1JMAVSL1R0
C014 ELECTROLYTIC CAP. 470µF/35V M or CE1GMASDL471
ELECTROLYTIC CAP. 470µF/35V M CE1GMASTL471
C305 CHIP CERAMIC CAP. F Z 0.22µF/16V or CHD1CZ30F224
C015 ELECTROLYTIC CAP. 47µF/25V M H7 CE1EMAVSL470
CHIP CERAMIC CAP. FZ Z 0.22µF/25V CHD1EZ3FZ224
20040325 1-15-1 HG231EL

Ref. No. Mark Description Part No. Ref. No. Mark Description Part No.
C307 CHIP CERAMIC CAP.(1608) B K 0.047µF/ CHD1JK30B473 CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V CHD1EZ30F104
50V or or
CHIP CERAMIC CAP.(1608) B K 0.047µF/ CHD1EK30B473 CHIP CERAMIC CAP. FZ Z 0.1µF/50V CHD1JZ3FZ104
25V
C333 ELECTROLYTIC CAP. 0.47µF/50V M H7 CE1JMAVSLR47
C308 CHIP CERAMIC CAP.(1608) B K 0.022µF/ CHD1JK30B223
50V or C334 ELECTROLYTIC CAP. 4.7µF/25V M NP H7 CP1EMAVSB4R7
CHIP CERAMIC CAP.(1608) B K 0.022µF/ CHD1EK30B223 C335 ELECTROLYTIC CAP. 10µF/16V M H7 CE1CMAVSL100
25V C336 CHIP CERAMIC CAP.(1608) CH J 1000pF/ CHD1JJ3CH102
C309 CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V CHD1JZ30F104 50V or
or CHIP CERAMIC CAP. CH J 1000pF/25V or CHD1EJ3CH102
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V CHD1EZ30F104 CHIP CERAMIC CAP. CG J 1000pF/50V CHD1JJ3CG102
or
C337 CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V CHD1JZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50V CHD1JZ3FZ104 or
C310 CHIP CERAMIC CAP.(1608) B K 0.047µF/ CHD1JK30B473 CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V CHD1EZ30F104
50V or or
CHIP CERAMIC CAP.(1608) B K 0.047µF/ CHD1EK30B473 CHIP CERAMIC CAP. FZ Z 0.1µF/50V CHD1JZ3FZ104
25V
C338 ELECTROLYTIC CAP. 100µF/6.3V H7 CE0KMAVSL101
C312 CHIP CERAMIC CAP. B K 8200pF/50V CHD1JK30B822
or C340 CHIP CERAMIC CAP. CH J 120pF/50V or CHD1JJ3CH121
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V CHD1EZ30F104 CHIP CERAMIC CAP. CG J 120pF/50V CHD1JJ3CG121
or C341 CHIP CERAMIC CAP. CH J 220pF/50V or CHD1JJ3CH221
CHIP CERAMIC CAP. FZ Z 0.1µF/50V CHD1JZ3FZ104 CHIP CERAMIC CAP. CG J 220pF/50V CHD1JJ3CG221
C314 CHIP CERAMIC CAP.(1608) B K 0.01µF/50V CHD1JK30B103 C342 ELECTROLYTIC CAP. 1µF/50V M H7 CE1JMAVSL1R0
C315 CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V CHD1JZ30F104 C343 CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V CHD1JZ30F104
or or
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V CHD1EZ30F104 CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V CHD1EZ30F104
or or
CHIP CERAMIC CAP. FZ Z 0.1µF/50V CHD1JZ3FZ104 CHIP CERAMIC CAP. FZ Z 0.1µF/50V CHD1JZ3FZ104
C316 CHIP CERAMIC CAP.(1608) B K 0.01µF/50V CHD1JK30B103 C345 CHIP CERAMIC CAP. CH J 68pF/50V or CHD1JJ3CH680
C317 ELECTROLYTIC CAP. 47µF/6.3V M H7 CE0KMAVSL470 CHIP CERAMIC CAP. CG J 68pF/50V CHD1JJ3CG680
C318 ELECTROLYTIC CAP. 1µF/50V M H7 CE1JMAVSL1R0 C346 CHIP CERAMIC CAP. CH J 68pF/50V or CHD1JJ3CH680
C319 ELECTROLYTIC CAP. 1µF/50V M H7 CE1JMAVSL1R0 CHIP CERAMIC CAP. CG J 68pF/50V CHD1JJ3CG680
C320 CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V CHD1JZ30F104 C347 CHIP CERAMIC CAP. CH D 10pF/50V or CHD1JD3CH100
or
CHIP CERAMIC CAP. CG D 10pF/50V CHD1JD3CG100
or C351 ELECTROLYTIC CAP. 220µF/6.3V M H7 CE0KMAVSL221
CHIP CERAMIC CAP. FZ Z 0.1µF/50V CHD1JZ3FZ104 C352 ELECTROLYTIC CAP. 100µF/16V M H7 CE1CMAVSL101
C321 CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V CHD1JZ30F104 C401 ELECTROLYTIC CAP. 47µF/6.3V M H7 CE0KMAVSL470
or C402 ELECTROLYTIC CAP. 220µF/6.3V M H7 CE0KMASSL221
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V CHD1EZ30F104 C403 CERAMIC CAP. B K 470pF/100V CCD2AKS0B471
or
C404 FILM CAP.(P) 0.018µF/100V J or CMA2AJP00183
CHIP CERAMIC CAP. FZ Z 0.1µF/50V CHD1JZ3FZ104
FILM CAP.(P) 0.018µF/50V J CMA1JJP00183
C322 ELECTROLYTIC CAP. 10µF/16V M H7 CE1CMAVSL100
or C412 CHIP CERAMIC CAP. B K 1800pF/50V CHD1JK30B182
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V CHD1EZ30F104 C414 CHIP CERAMIC CAP.(1608) B K 0.01µF/50V CHD1JK30B103
or
C324 CHIP CERAMIC CAP. CH J 68pF/50V or CHD1JJ3CH680 or
CHIP CERAMIC CAP. CG J 68pF/50V CHD1JJ3CG680 CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V CHD1EZ30F104
or
or CHIP CERAMIC CAP. FZ Z 0.1µF/50V CHD1JZ3FZ104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V CHD1EZ30F104 C417 CHIP CERAMIC CAP.(1608) B K 0.022µF/ CHD1JK30B223
or 50V or
CHIP CERAMIC CAP. FZ Z 0.1µF/50V CHD1JZ3FZ104 CHIP CERAMIC CAP.(1608) B K 0.022µF/ CHD1EK30B223
25V
C326 CHIP CERAMIC CAP. CH J 68pF/50V or CHD1JJ3CH680
CHIP CERAMIC CAP. CG J 68pF/50V CHD1JJ3CG680 or
C327 ELECTROLYTIC CAP. 0.47µF/50V M H7 CE1JMAVSLR47 CHIP CERAMIC CAP. CG J 33pF/50V CHD1JJ3CG330
C328 B CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V CHD1JZ30F104 C419 CHIP CERAMIC CAP.(1608) B K 4700pF/50V CHD1JK30B472
or
C421 ELECTROLYTIC CAP. 33µF/6.3V M H7 CE0KMAVSL330
B CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V CHD1EZ30F104
or C422 ELECTROLYTIC CAP. 4.7µF/25V M H7 CE1EMAVSL4R7
B CHIP CERAMIC CAP. FZ Z 0.1µF/50V CHD1JZ3FZ104 C423 A CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V CHD1JZ30F104
or
C329 B CHIP CERAMIC CAP. CH J 68pF/50V or CHD1JJ3CH680
B CHIP CERAMIC CAP. CG J 68pF/50V CHD1JJ3CG680 or
C330 CERAMIC CAP.(AX) F Z 0.1µF/50V CCA1JZTFZ104 A CHIP CERAMIC CAP. FZ Z 0.1µF/50V CHD1JZ3FZ104
C332 CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V CHD1JZ30F104 C424 ELECTROLYTIC CAP. 22µF/6.3V M H7 CE0KMAVSL220
or
20040325 1-15-2 HG231EL

C425 CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V CHD1JZ30F104 C474 B ELECTROLYTIC CAP. 22µF/6.3V M H7 CE0KMAVSL220
or
C475 B CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V CHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V CHD1EZ30F104 or
or
CHIP CERAMIC CAP. FZ Z 0.1µF/50V CHD1JZ3FZ104 or
C426 A CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V CHD1JZ30F104 B CHIP CERAMIC CAP. FZ Z 0.1µF/50V CHD1JZ3FZ104
or
A CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V CHD1EZ30F104 or
or
A CHIP CERAMIC CAP. FZ Z 0.1µF/50V CHD1JZ3FZ104 or
C427 A CHIP CERAMIC CAP. CH J 220pF/50V or CHD1JJ3CH221 B CHIP CERAMIC CAP. FZ Z 0.1µF/50V CHD1JZ3FZ104
A CHIP CERAMIC CAP. CG J 220pF/50V CHD1JJ3CG221 C477 B ELECTROLYTIC CAP. 10µF/16V M H7 CE1CMAVSL100
C428 A CHIP CERAMIC CAP. CH J 68pF/50V or CHD1JJ3CH680 C478 B ELECTROLYTIC CAP. 4.7µF/25V M H7 CE1EMAVSL4R7
A CHIP CERAMIC CAP. CG J 68pF/50V CHD1JJ3CG680 C479 B ELECTROLYTIC CAP. 4.7µF/25V M H7 CE1EMAVSL4R7
C428 B CHIP CERAMIC CAP. CH J 220pF/50V or CHD1JJ3CH221 C480 B CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V CHD1JZ30F104
or
B CHIP CERAMIC CAP. CG J 220pF/50V CHD1JJ3CG221
C429 A CHIP CERAMIC CAP. CH J 68pF/50V or CHD1JJ3CH680 or
A CHIP CERAMIC CAP. CG J 68pF/50V CHD1JJ3CG680 B CHIP CERAMIC CAP. FZ Z 0.1µF/50V CHD1JZ3FZ104
C430 ELECTROLYTIC CAP. 47µF/6.3V M H7 CE0KMAVSL470 C481 B ELECTROLYTIC CAP. 4.7µF/25V M H7 CE1EMAVSL4R7
C451 B ELECTROLYTIC CAP. 47µF/16V M H7 CE1CMAVSL470 C482 B ELECTROLYTIC CAP. 4.7µF/25V M H7 CE1EMAVSL4R7
C452 B CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V CHD1JZ30F104 C483 B ELECTROLYTIC CAP. 4.7µF/25V M H7 CE1EMAVSL4R7
or
or C485 B CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V CHD1JZ30F104
or
C453 B ELECTROLYTIC CAP. 10µF/16V M H7 CE1CMAVSL100 or
C454 B ELECTROLYTIC CAP. 22µF/10V M H7 CE1AMAVSL220 B CHIP CERAMIC CAP. FZ Z 0.1µF/50V CHD1JZ3FZ104
C455 B CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V CHD1JZ30F104 C486 B CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V CHD1JZ30F104
or or
B CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V CHD1EZ30F104 B CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V CHD1EZ30F104
or or
B CHIP CERAMIC CAP. FZ Z 0.1µF/50V CHD1JZ3FZ104 B CHIP CERAMIC CAP. FZ Z 0.1µF/50V CHD1JZ3FZ104
C456 B CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V CHD1JZ30F104 C489 B CHIP CERAMIC CAP. B K 2200pF/50V CHD1JK30B222
or
C501 ELECTROLYTIC CAP. 220µF/6.3V M H7 CE0KMAVSL221
or C502 CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V CHD1JZ30F104
or
C458 B ELECTROLYTIC CAP. 4.7µF/25V M H7 CE1EMAVSL4R7 CHIP CERAMIC CAP. FZ Z 0.1µF/50V CHD1JZ3FZ104
C459 B CHIP CERAMIC CAP.(1608) B K 0.01µF/50V CHD1JK30B103 C506 B CERAMIC CAP.(AX) B K 100pF/50V CCA1JKT0B101
C460 B CHIP CERAMIC CAP.(1608) B K 4700pF/50V CHD1JK30B472 C508 ELECTROLYTIC CAP. 1µF/50V M H7 CE1JMAVSL1R0
C461 B ELECTROLYTIC CAP. 22µF/10V M H7 CE1AMAVSL220 C510 ELECTROLYTIC CAP. 22µF/10V M H7 CE1AMAVSL220
C462 B CHIP CERAMIC CAP.(1608) B K 0.01µF/50V CHD1JK30B103 C511 ELECTROLYTIC CAP. 100µF/6.3V H7 CE0KMAVSL101
C463 B CHIP CERAMIC CAP.(1608) B K 0.01µF/50V CHD1JK30B103 C512 CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V CHD1JZ30F104
C465 B CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V CHD1JZ30F104 CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V CHD1EZ30F104
or or
B CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V CHD1EZ30F104 CHIP CERAMIC CAP. FZ Z 0.1µF/50V CHD1JZ3FZ104
or C513 CHIP CERAMIC CAP.(1608) CH J 22pF/50V CHD1JJ3CH220
B CHIP CERAMIC CAP. FZ Z 0.1µF/50V CHD1JZ3FZ104 or
C466 B ELECTROLYTIC CAP. 220µF/6.3V M H7 CE0KMAVSL221 CHIP CERAMIC CAP. CG J 22pF/50V CHD1JJ3CG220
C467 B ELECTROLYTIC CAP. 22µF/10V M H7 CE1AMAVSL220 C514 CHIP CERAMIC CAP.(1608) CH J 22pF/50V CHD1JJ3CH220
or
C468 B CHIP CERAMIC CAP.(1608) B K 4700pF/50V CHD1JK30B472
C469 B CHIP CERAMIC CAP.(1608) B K 0.01µF/50V CHD1JK30B103
C470 B ELECTROLYTIC CAP. 4.7µF/25V M H7 CE1EMAVSL4R7
or CHIP CERAMIC CAP. CG J 18pF/50V CHD1JJ3CG180
B CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V CHD1EZ30F104 C517 CHIP CERAMIC CAP.(1608) B K 4700pF/50V CHD1JK30B472
or C518 CHIP CERAMIC CAP.(1608) B K 0.047µF/ CHD1JK30B473
B CHIP CERAMIC CAP. FZ Z 0.1µF/50V CHD1JZ3FZ104 50V or
C473 B CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V CHD1JZ30F104 CHIP CERAMIC CAP.(1608) B K 0.047µF/ CHD1EK30B473
or 25V
B CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V CHD1EZ30F104 C519 CHIP CERAMIC CAP.(1608) B K 0.01µF/50V CHD1JK30B103
or C520 CHIP CERAMIC CAP.(1608) CH J 100pF/50V CHD1JJ3CH101
B CHIP CERAMIC CAP. FZ Z 0.1µF/50V CHD1JZ3FZ104 or
20040325 1-15-3 HG231EL

C521 CHIP CERAMIC CAP. CH J 560pF/50V or CHD1JJ3CH561 C853 CHIP CERAMIC CAP.(1608) B K 4700pF/50V CHD1JK30B472
CHIP CERAMIC CAP. CG J 560pF/50V CHD1JJ3CG561 C854 CHIP CERAMIC CAP.(1608) B K 0.01µF/50V CHD1JK30B103
C522 ELECTROLYTIC CAP. 22µF/6.3V M H7 CE0KMASSL220 C855 CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V CHD1JZ30F104
or
C524 CHIP CERAMIC CAP. CH J 330pF/50V or CHD1JJ3CH331 or
CHIP CERAMIC CAP. CG J 330pF/50V CHD1JJ3CG331 CHIP CERAMIC CAP. FZ Z 0.1µF/50V CHD1JZ3FZ104
C526 CHIP CERAMIC CAP.(1608) B K 4700pF/50V CHD1JK30B472 C856 CHIP CERAMIC CAP. CH J 180pF/50V or CHD1JJ3CH181
C527 ELECTROLYTIC CAP. 22µF/6.3V M H7 CE0KMASSL220 CHIP CERAMIC CAP. CG J 180pF/50V CHD1JJ3CG181
C528 CHIP CERAMIC CAP.(1608) B K 0.01µF/50V CHD1JK30B103 C859 ELECTROLYTIC CAP. 47µF/6.3V M H7 CE0KMAVSL470
C530 CERAMIC CAP.(AX) F Z 0.022µF/25V CCA1EZTFZ223 C862 CHIP CERAMIC CAP.(1608) B K 0.01µF/50V CHD1JK30B103
C531 CERAMIC CAP.(AX) Y M 0.01µF/16V CCA1CMT0Y103
CONNECTOR
C532 ELECTROLYTIC CAP. 22µF/6.3V M H7 CE0KMASSL220
CN701 B AFV PCB ASSEMBLY CPU2900/G470 HG470AFV
or DIODES
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V CHD1EZ30F104 D001 RECTIFIER DIODE 1N4005 or NDQZ001N4005
or RECTIFIER DIODE 1N4005 NDWZ001N4005
CHIP CERAMIC CAP. FZ Z 0.1µF/50V CHD1JZ3FZ104 D002 RECTIFIER DIODE 1N4005 or NDQZ001N4005
C535 CHIP CERAMIC CAP.(1608) B K 0.01µF/50V CHD1JK30B103 RECTIFIER DIODE 1N4005 NDWZ001N4005
C538 CHIP CERAMIC CAP.(1608) B K 0.022µF/ CHD1JK30B223 D003 RECTIFIER DIODE 1N4005 or NDQZ001N4005
50V or
RECTIFIER DIODE 1N4005 NDWZ001N4005
CHIP CERAMIC CAP.(1608) B K 0.022µF/ CHD1EK30B223
25V D004 RECTIFIER DIODE 1N4005 or NDQZ001N4005
C563 CHIP CERAMIC CAP. F Z 1µF/10V or CHD1AZB0F105 RECTIFIER DIODE 1N4005 NDWZ001N4005
CHIP CERAMIC CAP. F Z 1µF/10V CHD1AZ30F105 D005 RECTIFIER DIODE BA159 NDQZ000BA159
C564 CHIP CERAMIC CAP.(1608) CH J 100pF/50V CHD1JJ3CH101 D006 SWITCHING DIODE 1N4148M or NDTZ01N4148M
or SWITCHING DIODE 1SS133(T-77) QDTZ001SS133
CHIP CERAMIC CAP. CG J 100pF/50V CHD1JJ3CG101 D007 SWITCHING DIODE 1N4148M or NDTZ01N4148M
C567 CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V CHD1JZ30F104 SWITCHING DIODE 1SS133(T-77) QDTZ001SS133
or
D008 SWITCHING DIODE 1N4148M or NDTZ01N4148M
CHIP CERAMIC CAP. FZ Z 0.1µF/50V CHD1JZ3FZ104 D009 SWITCHING DIODE 1N4148M or NDTZ01N4148M
C701 CHIP CERAMIC CAP.(1608) B K 0.047µF/ CHD1JK30B473 SWITCHING DIODE 1SS133(T-77) QDTZ001SS133
50V or
D011 RECTIFIER DIODE BA158 NDQZ000BA158
CHIP CERAMIC CAP.(1608) B K 0.047µF/ CHD1EK30B473
25V D012 RECTIFIER DIODE FR202-B/P NDQZ000FR202
C702 CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V CHD1JZ30F104 D013 RECTIFIER DIODE FR202-B/P NDQZ000FR202
or D014 A SCHOTTKY BARRIER DIODE SB140 or NDQZ000SB140
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V CHD1EZ30F104 A SCHOTTKY BARRIER DIODE ERB81-004 AERB81004***
or
D014 B SCHOTTKY BARRIER DIODE SB340 NDQZ000SB340
D015 ZENER DIODE DZ-18BSBT265 or NDTB00DZ18BS
C704 CHIP CERAMIC CAP.(1608) B K 0.01µF/50V CHD1JK30B103
ZENER DIODE MTZJT-7718B QDTB00MTZJ18
or D016 A RECTIFIER DIODE BA158 NDQZ000BA158
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V CHD1EZ30F104 D018 SWITCHING DIODE 1N4148M or NDTZ01N4148M
CHIP CERAMIC CAP. FZ Z 0.1µF/50V CHD1JZ3FZ104 D019 ZENER DIODE DZ-6.8BSBT265 or NDTB0DZ6R8BS
C708 CHIP CERAMIC CAP.(1608) B K 0.01µF/50V CHD1JK30B103 ZENER DIODE MTZJT-776.8B QDTB0MTZJ6R8
C709 A ELECTROLYTIC CAP. 1µF/50V M H7 CE1JMAVSL1R0 D021 SWITCHING DIODE 1N4148M or NDTZ01N4148M
C710 A CHIP CERAMIC CAP. B K 1000pF/50V CHD1JK30B102 SWITCHING DIODE 1SS133(T-77) QDTZ001SS133
C715 A CHIP CERAMIC CAP.(1608) B K 0.01µF/50V CHD1JK30B103 D023 A ZENER DIODE DZ-5.1BSBT265 or NDTB0DZ5R1BS
C716 B CHIP CERAMIC CAP. F Z 0.22µF/16V or CHD1CZ30F224 A ZENER DIODE MTZJT-775.1B QDTB0MTZJ5R1
B CHIP CERAMIC CAP. FZ Z 0.22µF/25V CHD1EZ3FZ224 D051 RECTIFIER DIODE 1N4005 or NDQZ001N4005
C717 B CHIP CERAMIC CAP. F Z 0.22µF/16V or CHD1CZ30F224 RECTIFIER DIODE 1N4005 NDWZ001N4005
B CHIP CERAMIC CAP. FZ Z 0.22µF/25V CHD1EZ3FZ224 D052 RECTIFIER DIODE 1N4005 or NDQZ001N4005
C756 B CHIP CERAMIC CAP.(1608) CH J 470pF/50V CHD1JJ3CH471 RECTIFIER DIODE 1N4005 NDWZ001N4005
or
D053 RECTIFIER DIODE 1N4005 or NDQZ001N4005
RECTIFIER DIODE 1N4005 NDWZ001N4005
C757 B CHIP CERAMIC CAP.(1608) CH J 470pF/50V CHD1JJ3CH471
or D055 PCB JUMPER D0.6-P10.0 JW10.0T
B CHIP CERAMIC CAP. CG J 470pF/50V CHD1JJ3CG471 D056 ZENER DIODE DZ-5.6BSCT265 or NDTC0DZ5R6BS
C851 CHIP CERAMIC CAP.(1608) CH J 22pF/50V CHD1JJ3CH220 ZENER DIODE MTZJT-775.6C QDTC0MTZJ5R6
or D057 A CARBON RES. 1/4W J 3.3k Ω RCX4JATZ0332
CHIP CERAMIC CAP. CG J 22pF/50V CHD1JJ3CG220 D057 B ZENER DIODE DZ-10BSBT265 or NDTB00DZ10BS
C852 CHIP CERAMIC CAP.(1608) CH J 22pF/50V CHD1JJ3CH220 B ZENER DIODE MTZJT-7710B QDTB00MTZJ10
or
D058 ZENER DIODE DZ-18BSBT265 or NDTB00DZ18BS
20040325 1-15-4 HG231EL

ZENER DIODE MTZJT-7718B QDTB00MTZJ18 L703 PCB JUMPER D0.6-P5.0 JW5.0T
D153 ZENER DIODE DZ-11BSAT265 or NDTA00DZ11BS L704 INDUCTOR 15µH-K-26T LLAXKATTU150
ZENER DIODE MTZJT-7711A QDTA00MTZJ11 L851 INDUCTOR 1.8µH-K-26T LLAXKATTU1R8
D154 B ZENER DIODE DZ-11BSAT265 or NDTA00DZ11BS RANSISTORS
B ZENER DIODE MTZJT-7711A QDTA00MTZJ11 Q001! FET 2SK3566 QFWZ02SK3566
D155 ZENER DIODE DZ-11BSAT265 or NDTA00DZ11BS Q002 TRANSISTOR KTC3199(BL) or NQS50KTC3199
ZENER DIODE MTZJT-7711A QDTA00MTZJ11 TRANSISTOR 2SC1815-BL(TPE2) QQS202SC1815
D156 B ZENER DIODE DZ-11BSAT265 or NDTA00DZ11BS Q003 TRANSISTOR KTC3199(BL) or NQS50KTC3199
B ZENER DIODE MTZJT-7711A QDTA00MTZJ11 TRANSISTOR 2SC1815-BL(TPE2) QQS202SC1815
D301 SWITCHING DIODE 1N4148M or NDTZ01N4148M Q004 TRANSISTOR KTA1267(GR) or NQS10KTA1267
SWITCHING DIODE 1SS133(T-77) QDTZ001SS133 TRANSISTOR KTA1267(Y) NQQY0KTA1267
D501 SWITCHING DIODE 1N4148M or NDTZ01N4148M Q051 RES. BUILT-IN TRANSISTOR KRA104M or NQSZ0KRA104M
SWITCHING DIODE 1SS133(T-77) QDTZ001SS133 RES. BUILT-IN TRANSISTOR BN1L4M-T QQSZ00BN1L4M
D502 LED MIE-534A2 or NPZZM1E534A2 Q052 RES. BUILT-IN TRANSISTOR KRC103M or NQSZ0KRC103M
LED SIR-563ST3F P or QPQPS1R563ST RES. BUILT-IN TRANSISTOR BA1F4M-T QQSZ00BA1F4M
LED SIR-563ST3F Q QPQQS1R563ST Q053 B TRANSISTOR KTC3199(Y) or NQSY0KTC3199
D553 SWITCHING DIODE 1N4148M or NDTZ01N4148M B TRANSISTOR KTC3199(GR) or NQS10KTC3199
SWITCHING DIODE 1SS133(T-77) QDTZ001SS133 B TRANSISTOR 2SC2785(J) or QQSJ02SC2785
D561 LED(RED) 204HD/E NPQZ00204HDE B TRANSISTOR 2SC2785(H) or QQSH02SC2785
D562 LED(RED) 204HD/E NPQZ00204HDE B TRANSISTOR 2SC2785(F) or QQSF02SC2785
D563 LED(GREEN) 204-10GD/S957 NPQZ10GDS957 B TRANSISTOR 2SC1815-Y(TPE2) or QQSY02SC1815
D564 LED(RED) 204HD/E NPQZ00204HDE B TRANSISTOR 2SC1815-GR(TPE2) QQS102SC1815
D565 LED(RED) 204HD/E NPQZ00204HDE Q054 A TRANSISTOR KTC3203(Y) or NQSY0KTC3203
D701 ZENER DIODE DZ-33BSDT265 or NDTD00DZ33BS A TRANSISTOR 2SC2120-Y(TPE2) QQSY02SC2120
ZENER DIODE MTZJT-7733D QDTD00MTZJ33 Q054 B TRANSISTOR KTC3205(Y) or NQSY0KTC3205
ICS B TRANSISTOR 2SC3266-Y(TPE2) QQSY02SC3266
IC001! PHOTOCOUPLER EL817A or NPEA000EL817 Q055 TRANSISTOR KTA1266(GR) or NQS40KTA1266
! PHOTOCOUPLER EL817B or NPEB000EL817 TRANSISTOR 2SA1015-GR(TPE2) QQS102SA1015
! PHOTOCOUPLER EL817C or NPEC000EL817 Q056 RES. BUILT-IN TRANSISTOR KRA103M or NQSZ0KRA103M
! PHOTOCOUPLER LTV-817B-F or NPEB0LTV817F RES. BUILT-IN TRANSISTOR BN1F4M-T QQSZ00BN1F4M
! PHOTOCOUPLER LTV-817C-F or NPEC0LTV817F Q057 TRANSISTOR KTA1281(Y) or NQSY0KTA1281
! PHOTOCOUPLER PS2561A-1(Q) or QPEQPS2561A1 TRANSISTOR 2SA1020(Y) QQSY02SA1020
! PHOTOCOUPLER PS2561A-1(W) QPEWPS2561A1 Q058 RES. BUILT-IN TRANSISTOR KRC103M or NQSZ0KRC103M
IC151 A IC:SWITCHING CD4052BCSJX or NSZBA0TF3079 RES. BUILT-IN TRANSISTOR BA1F4M-T QQSZ00BA1F4M
A IC:SWITCHING BU4052BCF-E2 or QSZBA0TRM024 Q059 RES. BUILT-IN TRANSISTOR KRC103M or NQSZ0KRC103M
A IC:SWITCHING TC4052BF(EL) QSZBA0TTS096 RES. BUILT-IN TRANSISTOR BA1F4M-T QQSZ00BA1F4M
IC301 IC:Y/C/A LA71750EM-MPB-E QSZBA0RSY020 Q151 A CHIP TRANSISTOR KTC3875Y-RTK NQ1Y0KTC3875
IC451 B IC:HIFI LA72648M-MPB-E QSZBA0RSY033 Q152 A CHIP TRANSISTOR KTC3875Y-RTK NQ1Y0KTC3875
IC501 SYSCON IC M3776AMCA-AB5GP QSZAB0RMB192 Q351 CHIP TRANSISTOR KTA1504GR-RTK or NQ140KTA1504
IC503 IC:EEPROM CAT24WC02JI or NSZBA0SBG001 CHIP TRANSISTOR KTA1504Y-RTK NQ1Y0KTA1504
IC BR24L02F-WE2 QSZBA0TRM068 Q352 TRANSISTOR KTC3199(Y) or NQSY0KTC3199
COILS TRANSISTOR KTC3199(GR) or NQS10KTC3199
L001 BEAD CORE B16 RH 3.5X10X1.3 XL03010XM001 TRANSISTOR 2SC2785(J) or QQSJ02SC2785
L002 BEAD CORE B16 RH 3.5X10X1.3 XL03010XM001 TRANSISTOR 2SC2785(H) or QQSH02SC2785
L003! LINE FILTER 56MH TLF14CB5630R2 or LLBG00ZTU022 TRANSISTOR 2SC2785(F) or QQSF02SC2785
! LINE FILTER 50MH LF-4D-E503 LLBG00ZKQ009 TRANSISTOR 2SC1815-Y(TPE2) or QQSY02SC1815
L009 CHOKE COIL 47µH-K or LLBD00PKV007 TRANSISTOR 2SC1815-GR(TPE2) QQS102SC1815
CHOKE COIL 47µH-K or LLBD00PKV005 Q401 TRANSISTOR KTA1266(GR) or NQS40KTA1266
CHOKE COIL 47µH-K LLBD00PKT001 TRANSISTOR 2SA1015-GR(TPE2) QQS102SA1015
L010 CHOKE COIL 47µH-K or LLBD00PKV007 Q402 TRANSISTOR KTC3203(Y) or NQSY0KTC3203
CHOKE COIL 47µH-K or LLBD00PKV005 TRANSISTOR 2SC2120-Y(TPE2) QQSY02SC2120
CHOKE COIL 47µH-K LLBD00PKT001 Q403 RES. BUILT-IN TRANSISTOR KRA103M or NQSZ0KRA103M
L012 INDUCTOR 100µH-J-5FT LLARJCSTU101 RES. BUILT-IN TRANSISTOR BN1F4M-T QQSZ00BN1F4M
L251 INDUCTOR 5.6µH-K-26T LLAXKATTU5R6 Q405 CHIP TRANSISTOR FMG4A T148 or QQ2Z000FMG4A
L301 INDUCTOR(100µH K) LAP02TA101K LLAXKATTU101 CHIP TRANSISTOR RN1511(TE85R) QQ2Z00RN1511
L403 INDUCTOR 47µH-K-5FT LLARKBSTU470 Q406 CHIP TRANSISTOR KTC3875Y-RTK NQ1Y0KTC3875
L451 B INDUCTOR 47µH-K-5FT LLARKBSTU470 Q451 B CHIP TRANSISTOR KRC103S RTK or NQ1Z0KRC103S
L452 B INDUCTOR 27µH-K-5FT LLARKBSTU270 B CHIP TRANSISTOR FA1F4M-T1B QQ8Z00FA1F4M
L501 INDUCTOR(100µH K) LAP02TA101K LLAXKATTU101 Q501 TRANSISTOR KTC3199(BL) or NQS50KTC3199
L701 PCB JUMPER D0.6-P5.0 JW5.0T TRANSISTOR 2SC1815-BL(TPE2) QQS202SC1815
Q503 PHOTO TRANSISTOR PT204-6B-12 or NPWZT2046B12
20040325 1-15-5 HG231EL

PHOTO TRANSISTOR MID-32A22F NPWZ1D32A22F R023 CHIP RES.(1608) 1/10W F 2.2k Ω or RRXAFR5H0222
Q551 TRANSISTOR KTC3199(BL) or NQS50KTC3199 CHIP RES.(1608) 1/10W F 2.2k Ω RRXAFR5Z0222
TRANSISTOR 2SC1815-BL(TPE2) QQS202SC1815 R024 CHIP RES.(1608) 1/10W J 33k Ω RRXAJR5Z0333
Q552 RES. BUILT-IN TRANSISTOR KRC103M or NQSZ0KRC103M R025 CHIP RES.(1608) 1/10W F 3.3k Ω or RRXAFR5H0332
RES. BUILT-IN TRANSISTOR BA1F4M-T QQSZ00BA1F4M CHIP RES. 1/10W F 3.3k Ω RRXAFR5Z0332
Q562 TRANSISTOR KTC3199(Y) or NQSY0KTC3199 R026 CHIP RES.(1608) 1/10W J 22k Ω RRXAJR5Z0223
TRANSISTOR KTC3199(GR) or NQS10KTC3199 R027 CARBON RES. 1/6W J 1k Ω or RCX6JATZ0102
TRANSISTOR 2SC2785(J) or QQSJ02SC2785 CARBON RES. 1/4W J 1k Ω RCX4JATZ0102
TRANSISTOR 2SC2785(H) or QQSH02SC2785 R028 CARBON RES. 1/4W J 1M Ω RCX4JATZ0105
TRANSISTOR 2SC2785(F) or QQSF02SC2785 R029 A CARBON RES. 1/4W J 180 Ω RCX4JATZ0181
TRANSISTOR 2SC1815-Y(TPE2) or QQSY02SC1815 R030 CHIP RES.(1608) 1/10W F 2.2k Ω or RRXAFR5H0222
TRANSISTOR 2SC1815-GR(TPE2) QQS102SC1815 CHIP RES.(1608) 1/10W F 2.2k Ω RRXAFR5Z0222
Q563 TRANSISTOR KTC3199(Y) or NQSY0KTC3199 R031 CHIP RES.(1608) 1/10W J 56k Ω RRXAJR5Z0563
TRANSISTOR KTC3199(GR) or NQS10KTC3199 R032 CHIP RES.(1608) 1/10W J 1.8k Ω RRXAJR5Z0182
TRANSISTOR 2SC2785(J) or QQSJ02SC2785 R053 PCB JUMPER D0.6-P5.0 JW5.0T
TRANSISTOR 2SC2785(H) or QQSH02SC2785 R054 CHIP RES.(1608) 1/10W J 180 Ω RRXAJR5Z0181
TRANSISTOR 2SC2785(F) or QQSF02SC2785 R058 CARBON RES. 1/6W J 820 Ω or RCX6JATZ0821
TRANSISTOR 2SC1815-Y(TPE2) or QQSY02SC1815 CARBON RES. 1/4W J 820 Ω RCX4JATZ0821
TRANSISTOR 2SC1815-GR(TPE2) QQS102SC1815 R059 A CARBON RES. 1/4W J 270 Ω RCX4JATZ0271
Q564 TRANSISTOR KTC3199(Y) or NQSY0KTC3199 R060 CARBON RES. 1/6W J 2.7k Ω or RCX6JATZ0272
TRANSISTOR KTC3199(GR) or NQS10KTC3199 CARBON RES. 1/4W J 2.7k Ω RCX4JATZ0272
TRANSISTOR 2SC2785(J) or QQSJ02SC2785 R061 CHIP RES.(1608) 1/10W J 22k Ω RRXAJR5Z0223
TRANSISTOR 2SC2785(H) or QQSH02SC2785 R062 A CARBON RES. 1/4W J 3.3k Ω RCX4JATZ0332
TRANSISTOR 2SC2785(F) or QQSF02SC2785 R062 B CARBON RES. 1/6W J 10k Ω or RCX6JATZ0103
TRANSISTOR 2SC1815-Y(TPE2) or QQSY02SC1815 B CARBON RES. 1/4W J 10k Ω RCX4JATZ0103
TRANSISTOR 2SC1815-GR(TPE2) QQS102SC1815 R063 CARBON RES. 1/4W J 1.2k Ω RCX4JATZ0122
Q565 TRANSISTOR KTC3199(Y) or NQSY0KTC3199 R064 CARBON RES. 1/4W J 1.2k Ω RCX4JATZ0122
TRANSISTOR KTC3199(GR) or NQS10KTC3199 R065 CARBON RES. 1/4W J 1.2k Ω RCX4JATZ0122
TRANSISTOR 2SC2785(J) or QQSJ02SC2785 R066 CHIP RES.(1608) 1/10W J 47k Ω RRXAJR5Z0473
TRANSISTOR 2SC2785(H) or QQSH02SC2785 R067 CARBON RES. 1/4W J 680 Ω RCX4JATZ0681
TRANSISTOR 2SC2785(F) or QQSF02SC2785 R068 CARBON RES. 1/4W J 680 Ω RCX4JATZ0681
TRANSISTOR 2SC1815-Y(TPE2) or QQSY02SC1815 R071 CARBON RES. 1/6W J 3.9k Ω or RCX6JATZ0392
TRANSISTOR 2SC1815-GR(TPE2) QQS102SC1815 CARBON RES. 1/4W J 3.9k Ω RCX4JATZ0392
RESISTORS R073 CARBON RES. 1/6W J 1 Ω or RCX6JATZ01R0
R002 METAL OXIDE FILM RES. 1W J 150k Ω or RN01154ZU001 CARBON RES. 1/4W J 1 Ω RCX4JATZ01R0
METAL OXIDE FILM RES. 1W J 150k Ω RN01154KE009 R151 A CHIP RES.(1608) 1/10W J 2.7k Ω RRXAJR5Z0272
R003 CARBON RES. 1/4W J 1M Ω RCX4JATZ0105 R152 A CHIP RES.(1608) 1/10W J 390k Ω RRXAJR5Z0394
R004 CARBON RES. 1/4W J 1M Ω RCX4JATZ0105 R153 A CHIP RES.(1608) 1/10W J 2.2k Ω RRXAJR5Z0222
R005 CARBON RES. 1/6W G 680 Ω or RCX6GATZ0681 R154 A CHIP RES.(1608) 1/10W J 390k Ω RRXAJR5Z0394
CARBON RES. 1/4W G 680 Ω RCX4GATZ0681 R155 A CHIP RES.(1608) 1/10W J 22k Ω RRXAJR5Z0223
R006 METAL OXIDE FILM RES. 1W J 1.8 Ω or RN011R8ZU001 R251 A CHIP RES.(1608) 1/10W J 1.8k Ω RRXAJR5Z0182
METAL OXIDE FILM RES. 1W J 1.8 Ω RN011R8KE009 R251 B CHIP RES.(1608) 1/10W J 2.2k Ω RRXAJR5Z0222
R007 CARBON RES. 1/6W J 22k Ω or RCX6JATZ0223 R252 CHIP RES.(1608) 1/10W J 39k Ω RRXAJR5Z0393
CARBON RES. 1/4W J 22k Ω RCX4JATZ0223 R301 CHIP RES.(1608) 1/10W J 1.2k Ω RRXAJR5Z0122
R008 CARBON RES. 1/6W J 100k Ω or RCX6JATZ0104 R302 CHIP RES.(1608) 1/10W J 8.2k Ω RRXAJR5Z0822
R009 CARBON RES. 1/6W G 3.3k Ω or RCX6GATZ0332 R307 CHIP RES.(1608) 1/10W J 4.7k Ω RRXAJR5Z0472
CARBON RES. 1/4W G 3.3k Ω RCX4GATZ0332 R308 CHIP RES.(1608) 1/10W J 6.8k Ω RRXAJR5Z0682
R011 CARBON RES. 1/4W J 390k Ω RCX4JATZ0394 R309 CHIP RES.(1608) 1/10W J 100 Ω RRXAJR5Z0101
R012 CARBON RES. 1/4W J 390k Ω RCX4JATZ0394 R310 CHIP RES.(1608) 1/10W J 10k Ω RRXAJR5Z0103
R013 CARBON RES. 1/6W J 470k Ω or RCX6JATZ0474 R311 CHIP RES.(1608) 1/10W J 18k Ω RRXAJR5Z0183
CARBON RES. 1/4W J 470k Ω RCX4JATZ0474 R312 CHIP RES.(1608) 1/10W J 10k Ω RRXAJR5Z0103
R014 CARBON RES. 1/6W J 100k Ω or RCX6JATZ0104 R313 B CHIP RES.(1608) 1/10W J 18k Ω RRXAJR5Z0183
CARBON RES. 1/4W J 100k Ω RCX4JATZ0104 R314 A CHIP RES.(1608) 1/10W J 18k Ω RRXAJR5Z0183
R015 CHIP RES.(1608) 1/10W J 10k Ω RRXAJR5Z0103 R315 CHIP RES.(1608) 1/10W J 2.2k Ω RRXAJR5Z0222
R016 CARBON RES. 1/6W J 100k Ω or RCX6JATZ0104 R316 CHIP RES.(1608) 1/10W J 6.8k Ω RRXAJR5Z0682
R018 CHIP RES.(1608) 1/10W J 22k Ω RRXAJR5Z0223 R319 CHIP RES.(1608) 1/10W J 10k Ω RRXAJR5Z0103
R022 CHIP RES.(1608) 1/10W J 4.7k Ω RRXAJR5Z0472 R321 CARBON RES. 1/6W J 33 Ω or RCX6JATZ0330
20040325 1-15-6 HG231EL

CARBON RES. 1/4W J 33 Ω RCX4JATZ0330 R464 B CHIP RES.(1608) 1/10W J 39k Ω RRXAJR5Z0393
R322 B CHIP RES.(1608) 1/10W J 75 Ω RRXAJR5Z0750 R465 B CHIP RES.(1608) 1/10W J 8.2k Ω RRXAJR5Z0822
R323 CARBON RES. 1/6W J 33 Ω or RCX6JATZ0330 R466 B CHIP RES.(1608) 1/10W J 5.6k Ω RRXAJR5Z0562
CARBON RES. 1/4W J 33 Ω RCX4JATZ0330 R467 B CHIP RES.(1608) 1/10W 0 Ω RRXAZR5Z0000
R324 CHIP RES.(1608) 1/10W J 47k Ω RRXAJR5Z0473 R468 B CHIP RES.(1608) 1/10W J 5.6k Ω RRXAJR5Z0562
R325 CHIP RES.(1608) 1/10W J 33 Ω RRXAJR5Z0330 R469 B CHIP RES.(1608) 1/10W J 5.6k Ω RRXAJR5Z0562
R326 CHIP RES.(1608) 1/10W 0 Ω RRXAZR5Z0000 R470 B CHIP RES.(1608) 1/10W J 39k Ω RRXAJR5Z0393
R330 CHIP RES.(1608) 1/10W J 5.6M Ω RRXAJR5Z0565 R471 B CHIP RES.(1608) 1/10W J 39k Ω RRXAJR5Z0393
R331 CHIP RES.(1608) 1/10W J 10k Ω RRXAJR5Z0103 R472 B CHIP RES.(1608) 1/10W J 150 Ω RRXAJR5Z0151
R332 CHIP RES.(1608) 1/10W 0 Ω RRXAZR5Z0000 R473 B CHIP RES.(1608) 1/10W J 150 Ω RRXAJR5Z0151
R333 B CHIP RES.(1608) 1/10W 0 Ω RRXAZR5Z0000 R474 B CHIP RES.(1608) 1/10W J 39k Ω RRXAJR5Z0393
R334 CHIP RES.(1608) 1/10W 0 Ω RRXAZR5Z0000 R475 B CHIP RES.(1608) 1/10W J 10k Ω RRXAJR5Z0103
R351 CHIP RES.(1608) 1/10W J 180 Ω RRXAJR5Z0181 R476 B CHIP RES.(1608) 1/10W J 33 Ω RRXAJR5Z0330
R352 CHIP RES.(1608) 1/10W J 150 Ω RRXAJR5Z0151 R477 B CHIP RES.(1608) 1/10W J 33 Ω RRXAJR5Z0330
R355 CARBON RES. 1/4W J 680 Ω RCX4JATZ0681 R478 B CHIP RES.(1608) 1/10W J 22k Ω RRXAJR5Z0223
R357 CHIP RES.(1608) 1/10W J 220 Ω RRXAJR5Z0221 R479 B CHIP RES.(1608) 1/10W J 6.8k Ω RRXAJR5Z0682
R358 CHIP RES.(1608) 1/10W J 1.5k Ω RRXAJR5Z0152 R480 B CHIP RES.(1608) 1/10W J 100 Ω RRXAJR5Z0101
R360 CHIP RES.(1608) 1/10W J 1.8k Ω RRXAJR5Z0182 R481 B CHIP RES.(1608) 1/10W J 100 Ω RRXAJR5Z0101
R401 CHIP RES.(1608) 1/10W J 5.6k Ω RRXAJR5Z0562 R502 CHIP RES.(1608) 1/10W J 1k Ω RRXAJR5Z0102
R404 CARBON RES. 1/6W J 100 Ω or RCX6JATZ0101 R505 CHIP RES.(1608) 1/10W J 10k Ω RRXAJR5Z0103
CARBON RES. 1/4W J 100 Ω RCX4JATZ0101 R506 CHIP RES.(1608) 1/10W J 10k Ω RRXAJR5Z0103
R407 CARBON RES. 1/4W J 820 Ω RCX4JATZ0821 R509 CHIP RES.(1608) 1/10W J 4.7k Ω RRXAJR5Z0472
R412 CHIP RES.(1608) 1/10W J 27k Ω RRXAJR5Z0273 R514 CHIP RES.(1608) 1/10W J 820 Ω RRXAJR5Z0821
R414 CHIP RES.(1608) 1/10W J 120 Ω RRXAJR5Z0121 R517 CHIP RES.(1608) 1/10W J 560 Ω RRXAJR5Z0561
R415 CHIP RES.(1608) 1/10W J 12k Ω RRXAJR5Z0123 R518 CHIP RES.(1608) 1/10W J 470 Ω RRXAJR5Z0471
R417 CHIP RES.(1608) 1/10W J 560 Ω RRXAJR5Z0561 R521 CHIP RES.(1608) 1/10W J 220k Ω RRXAJR5Z0224
R418 CHIP RES.(1608) 1/10W 0 Ω RRXAZR5Z0000 R522 CHIP RES.(1608) 1/10W J 39k Ω RRXAJR5Z0393
R423 A CHIP RES.(1608) 1/10W J 22k Ω RRXAJR5Z0223 R525 CHIP RES.(1608) 1/10W J 1.5k Ω RRXAJR5Z0152
R424 A CHIP RES.(1608) 1/10W J 3.9k Ω RRXAJR5Z0392 R526 CHIP RES.(1608) 1/10W J 1.8k Ω RRXAJR5Z0182
R425 A CHIP RES.(1608) 1/10W J 68k Ω RRXAJR5Z0683 R527 CHIP RES.(1608) 1/10W J 680 Ω RRXAJR5Z0681
R425 B CHIP RES.(1608) 1/10W J 5.6k Ω RRXAJR5Z0562 R528 CHIP RES.(1608) 1/10W J 18k Ω RRXAJR5Z0183
R426 A CHIP RES.(1608) 1/10W J 12k Ω RRXAJR5Z0123 R529 CARBON RES. 1/4W J 270 Ω RCX4JATZ0271
R426 B CHIP RES.(1608) 1/10W J 4.7k Ω RRXAJR5Z0472 R530 CHIP RES.(1608) 1/10W J 180 Ω RRXAJR5Z0181
R427 A CHIP RES.(1608) 1/10W J 68k Ω RRXAJR5Z0683 R531 CHIP RES.(1608) 1/10W J 68k Ω RRXAJR5Z0683
R428 A CHIP RES.(1608) 1/10W J 12k Ω RRXAJR5Z0123 R533 CHIP RES.(1608) 1/10W J 33k Ω RRXAJR5Z0333
R429 CHIP RES.(1608) 1/10W J 2.2k Ω RRXAJR5Z0222 R534 CARBON RES. 1/6W G 3.6k Ω or RCX6GATZ0362
R430 B CHIP RES.(1608) 1/10W 0 Ω RRXAZR5Z0000 CARBON RES. 1/4W G 3.6k Ω RCX4GATZ0362
R431 B CHIP RES.(1608) 1/10W 0 Ω RRXAZR5Z0000 R535 CARBON RES. 1/6W G 10k Ω or RCX6GATZ0103
R451 B CHIP RES.(1608) 1/10W J 8.2k Ω RRXAJR5Z0822 CARBON RES. 1/4W G 10k Ω RCX4GATZ0103
R452 B CHIP RES.(1608) 1/10W J 39k Ω RRXAJR5Z0393 R536 CARBON RES. 1/6W G 470 Ω or RCX6GATZ0471
R453 B CHIP RES.(1608) 1/10W J 5.6k Ω RRXAJR5Z0562 CARBON RES. 1/4W G 470 Ω RCX4GATZ0471
R454 B CHIP RES.(1608) 1/10W J 39k Ω RRXAJR5Z0393 R537 CARBON RES. 1/6W G 22k Ω or RCX6GATZ0223
R455 B CHIP RES.(1608) 1/10W J 5.6k Ω RRXAJR5Z0562 CARBON RES. 1/4W G 22k Ω RCX4GATZ0223
R456 B CHIP RES.(1608) 1/10W J 39k Ω RRXAJR5Z0393 R538 CARBON RES. 1/6W G 1.5k Ω or RCX6GATZ0152
R457 B CHIP RES.(1608) 1/10W J 5.6k Ω RRXAJR5Z0562 CARBON RES. 1/4W G 1.5k Ω RCX4GATZ0152
R458 B CHIP RES.(1608) 1/10W 0 Ω RRXAZR5Z0000 R539 CARBON RES. 1/6W G 4.7k Ω or RCX6GATZ0472
R459 B CHIP RES.(1608) 1/10W J 39k Ω RRXAJR5Z0393 CARBON RES. 1/4W G 4.7k Ω RCX4GATZ0472
R460 B CHIP RES.(1608) 1/10W J 470 Ω RRXAJR5Z0471 R540 CHIP RES.(1608) 1/10W J 390k Ω RRXAJR5Z0394
R461 B CHIP RES.(1608) 1/10W J 10k Ω RRXAJR5Z0103 R541 CHIP RES.(1608) 1/10W J 390k Ω RRXAJR5Z0394
R462 B CHIP RES.(1608) 1/10W J 2.7k Ω RRXAJR5Z0272 R542 CHIP RES.(1608) 1/10W J 1.8k Ω RRXAJR5Z0182
R463 B CHIP RES.(1608) 1/10W J 8.2k Ω RRXAJR5Z0822 R543 CHIP RES.(1608) 1/10W J 1k Ω RRXAJR5Z0102
20040325 1-15-7 HG231EL

R544 CHIP RES.(1608) 1/10W J 2.7k Ω RRXAJR5Z0272 TACT SWITCH TC-1104(H=9.5) SST0101DNG01
R545 CHIP RES.(1608) 1/10W J 2.2k Ω RRXAJR5Z0222 SW506 LEAF SWITCH MXS01830MVP0 SSC0101MCE03
R546 CHIP RES.(1608) 1/10W J 12k Ω RRXAJR5Z0123 SW507 ROTARY MODE SWITCH SSS-53MD SSR0106KB003
R547 CHIP RES.(1608) 1/10W J 1.8k Ω RRXAJR5Z0182 SW509 TACT SWITCH KSM0614B or SST0101HH013
R548 CHIP RES.(1608) 1/10W J 1k Ω RRXAJR5Z0102 TACT SWITCH SKQSAF001A or SST0101AL041
R549 CHIP RES.(1608) 1/10W J 1.2k Ω RRXAJR5Z0122 TACT SWITCH TC-1104(H=9.5) SST0101DNG01
R551 CHIP RES.(1608) 1/10W J 100 Ω RRXAJR5Z0101 SW510 TACT SWITCH KSM0614B or SST0101HH013
R553 CARBON RES. 1/4W J 820 Ω RCX4JATZ0821 TACT SWITCH TC-1104(H=9.5) SST0101DNG01
R556 CHIP RES.(1608) 1/10W J 10k Ω RRXAJR5Z0103 SW511 TACT SWITCH KSM0614B or SST0101HH013
R561 CARBON RES. 1/6W J 330 Ω or RCX6JATZ0331 TACT SWITCH TC-1104(H=9.5) SST0101DNG01
CARBON RES. 1/4W J 330 Ω RCX4JATZ0331 SW512 TACT SWITCH KSM0614B or SST0101HH013
R562 CARBON RES. 1/6W J 330 Ω or RCX6JATZ0331 TACT SWITCH SKQSAF001A or SST0101AL041
CARBON RES. 1/4W J 330 Ω RCX4JATZ0331 TACT SWITCH TC-1104(H=9.5) SST0101DNG01
R563 CARBON RES. 1/4W J 270 Ω RCX4JATZ0271 MISCELLANEOUS
R564 CARBON RES. 1/6W J 330 Ω or RCX6JATZ0331 RS501 REMOTE RECEIVER MIM-93M9DKF or USESJRSUNT03
CARBON RES. 1/4W J 330 Ω RCX4JATZ0331 REMOTE RECEIVER PIC-37042LQ USESJRSKK038
R565 CARBON RES. 1/6W J 330 Ω or RCX6JATZ0331 2B7 SHIELD ASSEMBLY HG470ED 0VM416072
CARBON RES. 1/4W J 330 Ω RCX4JATZ0331 2B8 BUSH, LED(F) H3700UD 0VM409508
R567 CHIP RES.(1608) 1/10W J 3.9k Ω RRXAJR5Z0392 2B46 ROHM HOLDER H7770JD 0VM304573
R568 CHIP RES.(1608) 1/10W J 3.9k Ω RRXAJR5Z0392 A4 B JACK BOARD(U27 FTZ) HE480ED 0VM203840
R569 CHIP RES.(1608) 1/10W J 3.9k Ω RRXAJR5Z0392 AC001! AC CORD PE8B2CG1H0A-057 WAE0172LW003
R570 CHIP RES.(1608) 1/10W J 3.9k Ω RRXAJR5Z0392 F001! FUSE T1.6AL/250V or PAGC20BW3162
R601 B CHIP RES.(1608) 1/10W J 10k Ω RRXAJR5Z0103 ! FUSE 50T016H 1.6A/250V PAGH20BHV162
R602 A CHIP RES.(1608) 1/10W J 10k Ω RRXAJR5Z0103 FH001 FUSE HOLDER MSF-015 or XH01Z00LY001
R603 A CHIP RES.(1608) 1/10W J 10k Ω RRXAJR5Z0103 FUSE HOLDER DFH-001 XH01Z00RP001
R604 B CHIP RES.(1608) 1/10W J 10k Ω RRXAJR5Z0103 FH002 FUSE HOLDER MSF-015 or XH01Z00LY001
R606 CHIP RES.(1608) 1/10W J 10k Ω RRXAJR5Z0103 FUSE HOLDER DFH-001 XH01Z00RP001
R611 CHIP RES.(1608) 1/10W J 10k Ω RRXAJR5Z0103 J902 BEAD CORE B16 RH 3.5X10X1.3 XL03010XM001
R613 CHIP RES.(1608) 1/10W J 10k Ω RRXAJR5Z0103 JK756 B RCA JACK(YELLOW) MSP-281V4-B JXRL010LY003
R701 CARBON RES. 1/6W J 1.8k Ω or RCX6JATZ0182 JK757 B RCA JACK(WHITE) MSP-281V1-B JXRL010LY005
CARBON RES. 1/4W J 1.8k Ω RCX4JATZ0182 JK758 B RCA JACK(RED) MSP-281V3-A JYRL010LY002
R702 CARBON RES. 1/6W J 1k Ω or RCX6JATZ0102 JW001 A FLAT CABLE, 7P AWG26#2651/P2.0/150 WX3807S6FF15
CARBON RES. 1/4W J 1k Ω RCX4JATZ0102 JW001 B FLAT CABLE, 11P AWG26#2651/P1.25/150 WX1HC460-002
R703 CARBON RES. 1/6W J 1k Ω or RCX6JATZ0102 JW002 A FLAT CABLE, 8P AWG26#2651/P1.25/150 WX1HC267-001
CARBON RES. 1/4W J 1k Ω RCX4JATZ0102 JW002 B FLAT CABLE, 11P AWG26#2651/P1.25/150 WX1HC460-002
R706 CHIP RES.(1608) 1/10W J 1k Ω RRXAJR5Z0102 PS503 PHOTO INTERRUPTER RPI-302C70 QPWZP1302C70
R707 B CHIP RES.(1608) 1/10W 0 Ω RRXAZR5Z0000 T001! SWITCHING TRANSFORMER 04702 or LTT00EPKT116
R756 B CHIP RES.(1608) 1/10W 0 Ω RRXAZR5Z0000 ! SWITCHING TRANSFORMER BCK-25- LTT00EPXB007
R757 B CHIP RES.(1608) 1/10W J 75 Ω RRXAJR5Z0750 344D
R758 B CHIP RES.(1608) 1/10W J 4.7k Ω RRXAJR5Z0472 TP301 PCB JUMPER D0.6-P10.0 JW10.0T
R759 B CHIP RES.(1608) 1/10W J 4.7k Ω RRXAJR5Z0472 TP501 PCB JUMPER D0.6-P6.0 JW6.0T
R851 CHIP RES.(1608) 1/10W J 1.5k Ω RRXAJR5Z0152 TP502 PCB JUMPER D0.6-P5.0 JW5.0T
R852 CHIP RES.(1608) 1/10W J 1k Ω RRXAJR5Z0102 TP506 PCB JUMPER D0.6-P5.0 JW5.0T
R853 CHIP RES.(1608) 1/10W J 1k Ω RRXAJR5Z0102 TP507 PCB JUMPER D0.6-P6.0 JW6.0T
TU701 A TUNER UNIT TMDG1-661A UTUNPLBAL014
SWITCHES
TU701 B TUNER UNIT TMDG2-661A UTUNPLBAL015
SW501 TACT SWITCH KSM0614B or SST0101HH013
VR501 CARBON P.O.T. 100k Ω B VRCB104HH014
TACT SWITCH SKQSAF001A or SST0101AL041
X301 X'TAL 4.433619MHz or FXC445LLN001
TACT SWITCH TC-1104(H=9.5) SST0101DNG01
X'TAL 4.433619MHz 1811388
X501 X'TAL 12.000MHz FXD126LDS001
X502 X'TAL 32.768kHz(20PPM) or FXC323LQUA01
X'TAL 32.768kHz(20PPM) FXC323LDS002
20040325 1-15-8 HG231EL

SUB JACK CBA Ref. No. Mark Description Part No.
Ref. No. Mark Description Part No. RESISTORS

R101 A CARBON RES. 1/4W J 1k Ω RCX4JATZ0102
B SUB JACK CBA (MCV-B) -----------
R101 B CARBON RES. 1/4W J 820 Ω RCX4JATZ0821
Consists of the following
CAPACITORS
C751 B CHIP CERAMIC CAP. B K 2200pF/50V CHD1JK30B222
R104 B CARBON RES. 1/6W J 4.7k Ω or RCX6JATZ0472
B CARBON RES. 1/4W J 4.7k Ω RCX4JATZ0472
RESISTORS
R105 A CARBON RES. 1/6W J 4.7k Ω or RCX6JATZ0472
R751 B CHIP RES.(1608) 1/10W J 820 Ω RRXAJR5Z0821
A CARBON RES. 1/4W J 4.7k Ω RCX4JATZ0472
R752 B CHIP RES.(1608) 1/10W J 820 Ω RRXAJR5Z0821
R106 CARBON RES. 1/6W J 4.7k Ω or RCX6JATZ0472
MISCELLANEOUS
CARBON RES. 1/4W J 4.7k Ω RCX4JATZ0472
JK751 B RCA JACK MSP-282V-12 PBSN JXRL030LY011
R108 CARBON RES. 1/4W J 68 Ω RCX4JATZ0680
JW003 B FLAT CABLE, 3P AWG26#2651/P2.0/200 WX1HE480-001
R109 CHIP RES.(1608) 1/10W J 75 Ω RRXAJR5Z0750
JACK CBA R110 B CARBON RES. 1/4W J 820 Ω RCX4JATZ0821
JACK CBA (MCV-C) -----------
R113 B CARBON RES. 1/6W J 4.7k Ω or RCX6JATZ0472
Consists of the following
B CARBON RES. 1/4W J 4.7k Ω RCX4JATZ0472
CAPACITORS
R114 A CARBON RES. 1/6W J 4.7k Ω or RCX6JATZ0472
A CARBON RES. 1/4W J 4.7k Ω RCX4JATZ0472
R115 CARBON RES. 1/6W J 4.7k Ω or RCX6JATZ0472
C103 B CHIP CERAMIC CAP.(1608) CH J 470pF/50V CHD1JJ3CH471
or CARBON RES. 1/4W J 4.7k Ω RCX4JATZ0472
B CHIP CERAMIC CAP. CG J 470pF/50V CHD1JJ3CG471 R116 CARBON RES. 1/6W J 15k Ω or RCX6JATZ0153
C104 CHIP CERAMIC CAP.(1608) CH J 470pF/50V CHD1JJ3CH471 CARBON RES. 1/4W J 15k Ω RCX4JATZ0153
or R117 CHIP RES.(1608) 1/10W J 10k Ω RRXAJR5Z0103
CHIP CERAMIC CAP. CG J 470pF/50V CHD1JJ3CG471 R118 CARBON RES. 1/4W J 68 Ω RCX4JATZ0680
C105 CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V or CHD1JZ30F104 R119 CHIP RES.(1608) 1/10W J 75 Ω RRXAJR5Z0750
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V or CHD1EZ30F104 R120 CARBON RES. 1/6W J 680 Ω or RCX6JATZ0681
CHIP CERAMIC CAP. FZ Z 0.1µF/50V CHD1JZ3FZ104 CARBON RES. 1/4W J 680 Ω RCX4JATZ0681
C107 ELECTROLYTIC CAP. 1µF/50V M H7 CE1JMAVSL1R0 R123 CHIP RES.(1608) 1/10W J 220 Ω RRXAJR5Z0221
C108 CHIP CERAMIC CAP. B K 1000pF/50V CHD1JK30B102 R125 CARBON RES. 1/6W J 680 Ω or RCX6JATZ0681
C109 CHIP CERAMIC CAP. B K 2200pF/50V CHD1JK30B222 CARBON RES. 1/4W J 680 Ω RCX4JATZ0681
C110 B CHIP CERAMIC CAP. B K 2200pF/50V CHD1JK30B222 R126 CHIP RES.(1608) 1/10W J 220 Ω RRXAJR5Z0221
C111 B CHIP CERAMIC CAP.(1608) CH J 470pF/50V CHD1JJ3CH471 R127 CHIP RES.(1608) 1/10W 0 Ω RRXAZR5Z0000
or
MISCELLANEOUS
2L022 SCREW, P-TIGHT M3X10 WASHER HEAD+ GCMP3100
or A5 JACK BOARD(2-21P) HE470ED 0VM203835
CHIP CERAMIC CAP. CG J 470pF/50V CHD1JJ3CG471 JK101 RGB CONNECTOR MRC-021V-01 JXGL210LY002
C113 CHIP CERAMIC CAP. B K 2200pF/50V CHD1JK30B222 JK102 RGB CONNECTOR MRC-021V-01 JXGL210LY002
C116 ELECTROLYTIC CAP. 470µF/6.3V M CE0KMASTL471 SENSOR CBA
C117 ELECTROLYTIC CAP. 470µF/6.3V M CE0KMASTL471
DIODES Ref. No. Mark Description Part No.
D101 ZENER DIODE DZ-11BSAT265 or NDTA00DZ11BS SENSOR CBA 0VSA14893

ZENER DIODE MTZJT-7711A QDTA00MTZJ11 Consists of the following
D102 ZENER DIODE DZ-11BSAT265 or NDTA00DZ11BS TRANSISTORS
ZENER DIODE MTZJT-7711A QDTA00MTZJ11 Q504 PHOTO TRANSISTOR PT204-6B-12 or NPWZT2046B12
D103 ZENER DIODE DZ-11BSAT265 or NDTA00DZ11BS PHOTO TRANSISTOR MID-32A22F NPWZ1D32A22F
ZENER DIODE MTZJT-7711A QDTA00MTZJ11 Q505 PHOTO TRANSISTOR PT204-6B-12 or NPWZT2046B12
D105 ZENER DIODE DZ-11BSAT265 or NDTA00DZ11BS PHOTO TRANSISTOR MID-32A22F NPWZ1D32A22F
ZENER DIODE MTZJT-7711A QDTA00MTZJ11
COILS AFV CBA
L101 BEAD CORE B16 RH 3.5X10X1.3 XL03010XM001
L102 BEAD CORE B16 RH 3.5X10X1.3 XL03010XM001 Ref. No. Mark Description Part No.
TRANSISTORS B AFV CBA 0VSA14857
Q101 TRANSISTOR KTA1266(GR) or NQS40KTA1266 Consists of the following
TRANSISTOR 2SA1015-GR(TPE2) QQS102SA1015 CAPACITORS
Q102 TRANSISTOR KTA1266(GR) or NQS40KTA1266 C1 B CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V or CHD1JZ30F104
TRANSISTOR 2SA1015-GR(TPE2) QQS102SA1015 B CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V or CHD1EZ30F104
20040325 1-15-9 HG231EL

C5 B CHIP CERAMIC CAP.(1608) CH J 22pF/50V or CHD1JJ3CH220
C7 B CHIP CERAMIC CAP. CH C 3pF/50V or CHD1JC3CH3R0
B CHIP CERAMIC CAP. CJ C 3pF/50V or CHD1JC3CJ3R0
B CHIP CERAMIC CAP. CH D 3pF/50V CHD1JD3CH3R0
C8 B CHIP CERAMIC CAP. CH C 3pF/50V or CHD1JC3CH3R0
B CHIP CERAMIC CAP. CJ C 3pF/50V or CHD1JC3CJ3R0
B CHIP CERAMIC CAP. CH D 3pF/50V CHD1JD3CH3R0
C12 B ELECTROLYTIC CAP. 10µF/16V M H7 CE1CMASSL100
C17 B CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V or CHD1JZ30F104
B CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V or CHD1EZ30F104
C20 B ELECTROLYTIC CAP. 3.3µF/50V M H7 CE1JMASSL3R3
C24 B ELECTROLYTIC CAP. 0.22µF/50V M H7 CE1JMASSLR22
CONNECTOR
CN1 B ANGLE PIN HEADER, 9P 6029B-1-09Z003-T 5700069
DIODES
D2 B SWITCHING DIODE 1N4148M or NDTZ01N4148M
B SWITCHING DIODE 1SS133(T-77) QDTZ001SS133
ICS
IC1 B IC:AUDIO PROCESSOR MSP3407G-QG-B8 NSZBA0SP3001
or
B IC:AUDIO PROCESSOR MSP3407G-QG-B8- NSZBA0SP3004
V3
COILS
L1 B INDUCTOR 10µH-K-26T LLAXKATTU100
L2 B PCB JUMPER D0.6-P5.0 JW5.0T
RESISTORS
R1 B CHIP RES.(1608) 1/10W J 1k Ω RRXAJR5Z0102
R4 B CHIP RES.(1608) 1/10W J 120k Ω RRXAJR5Z0124
R5 B CHIP RES.(1608) 1/10W 0 Ω RRXAZR5Z0000
MISCELLANEOUS
X1 B X'TAL 18.432MHz FXD186LLN001
20040325 1-15-10 HG231EL

DECK MECHANISM SECTION

HG231ED/HG430ED
Sec. 2: Deck Mechanism Section

I Standard Maintenance
I Mechanism Alignment Procedures
I Disassembly / Assembly of Mechanism
I Deck Exploded Views
I Deck Parts List
TABLE OF CONTENTS
Standard Maintenance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1-1
Service Fixture and Tools . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-2-1
Mechanical Alignment Procedures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-3-1
Disassembly / Assembly Procedures of Deck Mechanism . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-4-1
Alignment Procedures of Mechanism . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-5-1
Deck Exploded Views . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-6-1
Deck Parts List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-7-1
STANDARD MAINTENANCE
Service Schedule of Components
This maintenance chart shows you the standard of replacement and cleaning time for each part.
Because those may replace depending on environment and purpose for use, use the chart for reference.
H: Hours : Cleaning I: Replace
Deck Periodic Service Schedule
Ref.No. Part Name 1,000 H 2,000 H 3,000 H 4,000 H
B2 Cylinder Assembly I I
B3 Loading Motor Assembly I
B8 Pulley Assembly I I
B587 Tension Lever Assembly I I
B31 ACE Head Assembly I
B573, B574 Reel S, Reel T I
B37 Capstan Motor I I
B52 Cap Belt I I
*B73 FE Head I
*B86 F Brake Assembly (HI) I I
B133 Idler Assembly (HI) I I
B410 Pinch Arm Assembly I I
B414 M Brake (SP) Assembly (HI) I I
B416 M Brake (TU) Assembly (HI) I I
B525 LDG Belt I I
Notes:
1.Clean all parts for the tape transport (Upper Drum with Video Head / Pinch Roller / ACE Head / FE Head) using
90% lsopropyl Alcohol.
2.After cleaning the parts, do all DECK ADJUSTMENTS.
3.For the reference numbers listed above, refer to Deck Exploded Views.
* B73 ------ Recording model only
* B86 ------ Not used in 2 head model.
2-1-1 U29PHSMEN
Cleaning Cleaning of ACE Head
Clean the head with a cotton swab.
Cleaning of Video Head
Procedure
Clean the head with a head cleaning stick or chamois
1.Remove the top cabinet.
cloth.
2.Dip the cotton swab in 90% isopropyl alcohol and
Procedure
clean the ACE Head. Be careful not to damage the
1.Remove the top cabinet. upper drum and other tape running parts.
2.Put on a glove (thin type) to avoid touching the
Notes:
upper and lower drum with your bare hand.
1.Avoid cleaning the ACE Head vertically.
3.Put a few drops of 90% Isopropyl alcohol on the
2.Wait for the cleaned part to dry thoroughly before
head cleaning stick or on the chamois cloth and,
operating the unit or damage may occur.
by slightly pressing it against the head tip, turn the
upper drum to the right and to the left.
Notes:
1.The video head surface is made of very hard
material, but since it is very thin, avoid cleaning it
vertically.
2.Wait for the cleaned part to dry thoroughly before
operating the unit.
3.Do not reuse a stained head cleaning stick or a
stained chamois cloth. ACE Head
Do Not touch
with your bare
hand!
Upper
Cylinder
Do Not !
Video Head
Cleaning Stick
2-1-2 U29PHSMEN
SERVICE FIXTURE AND TOOLS
J-1-1, J-1-2 J-2
J-3 J-4
J-5
Ref. No. Name Part No. Adjustment

J-1-1 Alignment Tape FL6A Head Adjustment of ACE Head
J-1-2 Alignment Tape FL6N8 Azimuth and X Value Adjustment of ACE Head /
(2 Head model) Adjustment of Envelope Waveform
FL6NS8
(4 Head model)
J-2 Guide Roller Adj. Screwdriver Available Guide Roller
Locally
J-3 Mirror Available Tape Transportation Check
Locally
J-4 Azimuth Adj. Screwdriver + Available ACE Head Height
Locally
J-5 Flat Screwdriver - Available X Value
Locally
2-2-1 U29PFIX
MECHANICAL ALIGNMENT PROCEDURES
Explanation of alignment for the tape to correctly run B. Method to place the Cassette Holder in the tape-
starts on the next page. Refer to the information below loaded position without a cassette tape
on this page if a tape gets stuck, for example, in the 1. Disconnect the AC Plug.
mechanism due to some electrical trouble of the unit.
2. Remove the Top Case and Front Assembly.
Service Information 3. Turn the LDG Belt in the appropriate direction
shown in Fig. M1. Release the locking tabs shown
A. Method for Manual Tape Loading/Unloading
in Fig. M1 and continue turning the LDG Belt until
To load a cassette tape manually: the Cassette Holder comes to the tape-loaded
1. Disconnect the AC plug. position. Allow a minute or two to complete this
2. Remove the Top Case and Front Assembly. task.
3. Insert a cassette tape. Though the tape will not be
automatically loaded, make sure that the cassette Top View
tape is all the way in at the inlet of the Cassette Moving guide T preparation
Holder. To confirm this, lightly push the cassette (Eject Position) LOAD
tape further in and see if the tape comes back out, Moving guide S preparation UNLOAD
by a spring motion, just as much as you have (Eject Position) /EJECT
pushed in.
4. Turn the LDG Belt in the appropriate direction Side View
shown in Fig. M1 for a minute or two to complete
this task.
To unload a cassette tape manually:
1. Disconnect the AC plug.
2. Remove the Top Case and Front Assembly. LDG Belt
3. Make sure that the Moving guide preparations are

in the Eject Position.
4. Turn the LDG Belt in the appropriate direction
shown in Fig. M1 until the Moving guide prepara-
tions come to the Eject Position. Stop turning when Push the tape
the preparations begin clicking or can not be to load it.
moved further. However, the tape will be left wound
Push the locking tab gently to unlock
around the cylinder. when loading without a cassette.
5. Turn the LDG Belt in the appropriate direction con-
tinuously, and the cassette tape will be ejected. Fig. M1
Allow a minute or two to complete this task.
Bottom View
LDG Belt (B)
UNLOAD
/EJECT
Cam Gear
Fig. M2
2-3-1 HG240MA
1. Tape Interchangeability Alignment
Note:
To do these alignment procedures, make sure that the
Tracking Control Circuit is set to the preset position
every time a tape is loaded or unloaded. (Refer to
page 2-3-4, procedure 1-C, step 2.)
Equipment required:
Dual Trace Oscilloscope
VHS Alignment Tape (FL6N8 --- 2 head model,
FL6NS8 --- 4 head model)
Guide Roller Adj. Screwdriver
Flat Screwdriver (Purchase Locally)
Note: Before starting this Mechanical Alignment, do all
Electrical Adjustment procedures.
Flowchart of Alignment for tape traveling

Loading (Use a blank tape.)
No good
Adjust the height of the Guide Rollers

(Supply side and take-up side).
(Use a blank tape.) (Page 2-3-3) 1-A
Check to see that the tape is not creasing

and that there is no slack on the supply
and take-up side Guide Rollers.
(Use a blank tape.) 1-A
Adjust the X Value for maximum envelope.

(Page 2-3-3) (Use Alignment Tape.) 1-B Do the final tape-traveling test to see that
the tape runs normally in play mode with-
out creasing or slacking. 1-A
Adjust the envelope. (Page 2-3-4) 1-C OK
No good Check to see that the tape is not creasing

Check the envelope.
1-C and that there is no slack on the REV Post.
(Use a blank tape.) 1-E
OK
Adjust the Audio Section. OK
(Azimuth Alignment) (Page 2-3-4) 1-D
Completion
No good
Check the audio output. 1-D
OK
Check the following: No good
1. X Value (Page 2-3-3) Adjust the X value and envelope. 1-B, 1-C
2. Envelope (Page 2-3-4) 1-B, 1-C
OK
2-3-2 HG240MA
1-A. Preliminary/Final Checking and 4. If creasing or snaking is apparent, adjust the Tilt
Alignment of Tape Path Adj. Screw of the ACE Head. (Fig. M6)
Purpose:
To make sure that the tape path is well stabilized. Azimuth Adj. Screw
Symptom of Misalignment:
If the tape path is unstable, the tape will be damaged.
ACE Head
Note: Do not use an Alignment Tape for this proce-
dure. If the unit is not correctly aligned, the tape may Flat
be damaged. Screwdriver
1. Playback a blank cassette tape and check to see
that the tape runs without creasing at Guide Rollers
[2] and [3], and at points A and B on the lead sur- Tilt Adj. Screw
face. (Refer to Fig. M3 and M4.) Fig. M6
2. If creasing is apparent, align the height of the guide
rollers by turning the top of Guide Rollers [2] and 1-B. X Value Alignment
[3] with a Guide Roller Adj. Screwdriver. (Refer to
Fig. M3 and M5.) Purpose:
To obtain maximum PB FM envelope signal at the pre-
Guide Roller [2] Guide Roller [3] set position of the Tracking Control Circuit, align the
Horizontal Position of the ACE Head.
ACE Head If the Horizontal Position of the ACE Head is not prop-
erly aligned, maximum PB FM envelope cannot be
obtained at the preset position of the Tracking Control
Circuit.
B 1. Connect the oscilloscope to TP301 (C-PB) and

A
TP501 (CTL) on the Main CBA. Use TP502 (RF-
Take-up Guide Post [4] SW) as a trigger.
Fig. M3
2. Playback the Gray Scale of the Alignment Tape
(FL6N8 --- 2 head model, FL6NS8 --- 4 head
model) and confirm that the PB FM signal is
present.
3. Set the Tracking Control Circuit to the preset posi-
tion by pressing CH UP button on the remote con-
trol unit then “PLAY” button on the unit. (Refer to
note on bottom of page 2-3-4.)
4. Use the Flat Screwdriver so that the PB FM signal
at TP301 (C-PB) is maximum. (Fig. M6)
Lead Surface of Cylinder Tape Fig. M4
Correct Incorrect
Guide Roller
Tape
Take-up Guide
Post
Tape
Fig. M5
3. Check to see that the tape runs without creasing at

Take-up Guide Post [4] or without snaking between
Guide Roller [3] and ACE Head. (Fig. M3 and M5)
2-3-3 HG240MA
5. To shift the CTL waveform, press CH UP or CH 5. When Guide Rollers [2] and [3] (Refer to Fig. M3)
DOWN button on the remote control unit. Then are aligned properly, there is no envelope drop
make sure that the maximum output position of PB either at the beginning or end of track as shown in
FM envelope signal become within ±2ms from pre- Fig. M9.
set position.
Dropping envelope level at the beginning of track.
Good
FM envelope signal 2ms Center Position
Fig. M8
CTL signal
FM envelope output signal
is adjusted at maximum. Dropping envelope level at the end of track.
No Good
FM envelope output signal is low.

Fig. M7
Fig. M9
6. Set the Tracking Control Circuit to the preset posi-
tion by pressing CH UP button on the remote con-
trol unit. and then “PLAY” button. Envelope is adjusted properly. (No envelope drop)
1-C. Checking/Adjustment of Envelope
Waveform
Purpose:
To achieve a satisfactory picture, adjust the PB FM
envelope becomes as flat as possible.
If the envelope output is poor, noise will appear in the Fig. M10
picture. The tracking will then lose precision and the
playback picture will be distorted by any slight varia-
Note: Upon completion of the adjustment of Guide
tion of the Tracking Control Circuit.
Rollers [2] and [3] (Refer to Fig. M3), check the X
1. Connect the oscilloscope to TP301 (C-PB) on the Value by pushing the CH UP or DOWN buttons alter-
Main CBA. Use TP502 (RF-SW) as a trigger. nately, to check the symmetry of the envelope. Check
2. Playback the Gray Scale on the Alignment Tape the number of pushes to ensure preset position. The
(FL6N8 --- 2 head model, FL6NS8 --- 4 head number of pushes CH UP button to achieve 1/2 level of
model). Set the Tracking Control Circuit to the pre- envelope should match the number of pushes CH
set position by pressing CH UP button and then DOWN button from center. If required, redo the “X
“PLAY” button on the unit. Adjust the height of Value Alignment.”
Guide Rollers [2] and [3] (Fig. M3, Page 2-3-3)
watching the oscilloscope display so that the enve-
lope becomes as flat as possible. To do this adjust-
ment, turn the top of the Guide Roller with the
Guide Roller Adj. Screwdriver.
3. If the envelope is as shown in Fig. M7, adjust the
height of Guide Roller [2] (Refer to Fig. M3) so that
the waveform looks like the one shown in Fig. M9.
4. If the envelope is as shown in Fig. M8, adjust the
height of Guide Roller [3] (Refer to Fig. M3) so that
the waveform looks like the one shown in Fig. M9.
2-3-4 HG240MA
1-D. Azimuth Alignment of Audio/Con- 2. When the tape has been curled up or bent, turn the
trol/ Erase Head alignment screw to adjust the height of REV Post.
(Refer to Fig. M11 and M13.)
Purpose:
To correct the Azimuth alignment so that the Audio/
Control/Erase Head meets tape tracks properly.
If the position of the Audio/Control/Erase Head is not
properly aligned, the Audio S/N Ratio or Frequency REV Post [5]
Response will be poor.
1. Connect the oscilloscope to the audio output jack
on the rear side of the deck.
2. Playback the alignment tape (FL6N8 --- 2 head Take-up Guide Post [4]
model, FL6NS8 --- 4 head model) and confirm that Fig. M11
the audio signal output level is 8kHz.
3. Adjust Azimuth Adj. Screw so that the output level
on the AC Voltmeter or the waveform on the oscillo- Correct Incorrect
scope is at maximum. (Fig. M6) REV Post
Note: Upon completion of the adjustment of Azimuth Tape
Adj. Screw, check the X Value by pushing the CH UP
or DOWN buttons alternately, to check the symmetry
of the envelope. Check the number of pushes to
ensure preset position. The number of pushes CH UP Take-up Guide
button to achieve 1/2 level of envelope should match Post
Tape
the number of pushes CH DOWN button from center. If
required, redo the “X Value Alignment.”
1-E. Checking and Alignment of Tape
Path during reversing Fig. M12
Purpose:
To make sure that the tape path is well stabilized dur-
ing reversing.
If the tape path is unstable during reversing, the tape
will be damaged. Alignment
Screw
Note: Do not use an Alignment Tape for this proce-
dure. If the unit is not correctly aligned, the tape may
Tape Guide
be damaged. Assembly
1. Insert a black cassette tape into the tray and set
the unit to REV. Then confirm if the tape has been
curled up or bent at the Take-up Guide Post[4] or
Fig. M13
REV Post[5]. (Refer to Fig. M11 and M12.)
2-3-5 HG240MA
DISASSEMBLY/ASSEMBLY PROCEDURES
OF DECK MECHANISM
Before following the procedures described below, be sure to remove the deck assembly from the cabinet. (Refer to
CABINET DISASSEMBLY INSTRUCTIONS.)
All the following procedures, including those for adjustment and replacement of parts, should be done in Eject
mode; see the positions of [44] and [45] in Fig. DM1H on page 2-4-3. When reassembling, follow the steps in
reverse order.
REMOVAL INSTALLATION
STEP START-
REMOVE/*UNHOOK/
/LOC. ING PART ADJUSTMENT
No. No. Fig. No. UNLOCK/RELEASE/
CONDITION
UNPLUG/DESOLDER
[1] [1] Guide Holder A T DM3H 2(S-1)
Cassette Holder
[2] [1] T DM4H
Assembly
[3] [2] Slider (SP) T DM5H (S-1A), *(L-1)
[4] [2] Slider (TU) T DM5H *(L-2)
[5] [4] Lock Lever T DM5H *(L-3), *(P-1)
[6] [2] Cassette Plate T DM5H
[7] [7] Cylinder Assembly T DM1H, DM6H Desolder, 3(S-2)
Loading Motor Desolder, LDG Belt,
[8] [8] T DM1H, DM7H
Assembly 2(S-3)
[9] [9] ACE Head Assembly T DM1H, DM7H (S-4)
Tape Guide Arm
[10] [2] T DM1H, DM8H-1 *(P-2)
Assembly
[11] [10] C Door Opener T DM1H, DM8H-1 (S-4A), *(L-4)
DM1H, DM8H-1,
[12] [11] Pinch Arm (B) T *(P-3)
DM8H-2
Pinch Arm (A) DM1H, DM8H-1,
[13] [12] T
Assembly DM8H-2
[14] [14] FE Head T DM1H, DM9H (S-5)
[15] [15] Prism T DM1H, DM9H (S-6)
[16] [2] Slider Shaft T DM10H *(L-5)
[17] [16] C Drive Lever (SP) T DM10H
[18] [16] C Drive Lever (TU) T DM10H (S-7), *(P-4)
[19] [19] Capstan Motor B DM2H, DM11H 3(S-8), Cap Belt
[20] [20] Clutch Assembly (HI) B DM2H, DM12H (C-1)
[21] [20] Center Gear B DM12H
*[22] [22] F Brake Assembly (HI) B DM2H, DM12H *(L-6)
[23] [22] Worm Holder B DM2H, DM13H-1 (S-9), *(L-7), *(L-8)
[24] [22] Pulley Assembly (HI) B DM2H, DM13H-1
[25] [25] Mode Gear (LM) B DM2H, DM13H-1 (C-2)
DM2H, DM13H-1,
[26] [20],[25] Mode Lever (HI) B (C-3)
DM13H-2
[22],[23], DM2H, DM13H-1, (+)Refer to Alignment
[27] Cam Gear (A) (HI) B (C-4)
[26] DM13H-2 Sec.Page 2-5-1
[28] [26] TR Gear C B DM2H, DM13H-1 (C-5)
[29] [28] TR Gear Spring B DM13H-1
[30] [29] TR Gear A/B B DM13H-1
[31] [31] FF Arm (HI) B DM1H, DM14H
[32] [26] Idler Assembly (HI) B DM1H, DM14H *(L-9)
2-4-1 U29PHSDA
REMOVAL INSTALLATION
STEP START-
REMOVE/*UNHOOK/
/LOC. ING PART ADJUSTMENT
No. No. Fig. No. UNLOCK/RELEASE/
CONDITION
UNPLUG/DESOLDER
[33] [26] BT Arm B DM2H, DM14H *(P-5)
Loading Arm (SP) (+)Refer to Alignment
[34] [26] B DM2H, DM14H
Assembly Sec.Page 2-5-1
Loading Arm (TU) (+)Refer to Alignment
[35] [34] B DM2H, DM14H
Assembly Sec.Page 2-5-1
M Brake (TU) Assembly
[36] [16],[26] T DM1H, DM15H
(HI)
M Brake (SP) Assembly
[37] [2],[26] T DM1H, DM15H *(P-6)
(HI)
Tension Lever
[38] [37] T DM1H, DM15H
Assembly
[39] [38] T Lever Holder T DM15H *(L-10)
[40] [40] M Gear (HI) T DM1H, DM15H (C-6)
[41] [15],[40] Sensor Gear (HI) T DM1H, DM15H (C-7)
[42] [36],[40] Reel T T DM1H, DM15H
[43] [38] Reel S T DM1H, DM15H
Moving Guide S
[44] [34],[38] T DM1H, DM16H (S-11), Slide Plate
Preparation
Moving Guide T
[45] [35] T DM1H, DM16H
Preparation
[46] [19] TG Post Assembly T DM1H, DM16H *(L-11)
(+)Refer to Alignment
[47] [27] Rack Assembly R DM17H
Sec.Page 2-5-1
[48] [47] F Door Opener R DM17H
[49] [49] Cleaner Assembly T DM1H, DM6H
[50] [49] CL Post T DM6H *(L-12)
↓ ↓ ↓ ↓ ↓ ↓ ↓
(1) (2) (3) (4) (5) (6) (7)
(1): Follow steps in sequence. When reassembling, follow the steps in reverse order.
These numbers are also used as identification (location) No. of parts in the figures.
(2): Indicates the part to start disassembling with in order to disassemble the part in column (1).
(3): Name of the part
(4): Location of the part: T=Top B=Bottom R=Right L=Left
(5): Figure Number
(6): Identification of parts to be removed, unhooked, unlocked, released, unplugged, unclamped, or desoldered.
P=Spring, W=Washer, C=Cut Washer, S=Screw, *=Unhook, Unlock, Release, Unplug, or Desolder
e.g., 2(L-2) = two Locking Tabs (L-2).
(7): Adjustment Information for Installation
(+):Refer to Deck Exploded Views for lubrication.
.
* [ 22 ] F Brake Assembly (HI) is not used in 2 head model.
2-4-2 U29PHSDA
Top View
[44] [7] [45] [49] [9] [46] [8]
[14]
[13]
[11]
[15]
[38]
[10]
[37] [12]
[36]
[43] [32] [41] [31] [40] [42]
Fig. DM1H
Bottom View
[19]
[35]
[34]
[23] [25]
[24]
[26]
[27]
[22] [28] [20] [33]

Fig. DM2H
2-4-3 U29PHSDA
A
[3]
(S-1)
[4]
[1] (S-1)
(L-1)
(L-3)
[5]
B
(S-1A) (L-2)
[6]
(P-1)
Installation of [3] and [6]

First, insert [6] diagonally in [3] as shown below. Then,
install [6] in [3] while pushing (L-1) in a direction of
arrow. After installing [6] in [3], confirm that pin A of [3]
Fig. DM3H enters hole A of [6] properly.
[3]
Pin D 1
Hole A
Pin C (L-1) [6]
[2] 2 Pin A
View for A
A
1 Slide Installation of [4] and [6]

2 Pull up
Install [6] in [4] while pulling (L-2) in a direction of
arrow. After installing [6] in [4], confirm that pin B of [4]
enters hole B of [6] properly.
[4]
Pin A
Pin B
Slot A
Hole B
[6]
Pin B (L-2)
View for B
Fig. DM5H
Slots B
Slot A
First, while pushing the locking tab as
shown in the right, slide and pull up the right
side on [2] to release Pin A and Pin B from
the slots A.
Then, remove Pin C and Pin D on [2] from
the slots B as shown.
Locking tab View for A
Fig. DM4H
2-4-4 U29PHSDA
(S-4A) [11]
[7] (L-4)
[49]
(P-3)
[13]
[50]
Removal of [11] [12]
(L-12)
1) Remove screw (S-4A).
2) Unhook spring (P-2). [10]
3) Release (L-4) while
(P-2)
holding [12] with a
finger.
4) Loosen a finger
holding [12] and
remove [11].
(S-2)
Pin of [12]
A Pin of [10]
Groove of [27]
When reassembling [10] and

[12], confirm that pin of [10]
and pin of [12] are in the
[27] groove of [27] as shown.
Desolder Lead with
from bottom Red Stripe View for A Fig. DM8H-1
View for A Fig. DM6H
(S-4)
[9]
[8]
Desolder [8]
from bottom
(S-3)
Lead with White Stripe
LDG
View for A
Belt
Fig. DM7H
2-4-5 U29PHSDA
Installation of [13] and [12] (S-5)
[14]
(S-6)
[13] [15]
Hook spring (P-3) up to [12]
and [13], then install then to
(P-3)
the specified position so that
[12] will be floated slightly
while holding [12] and [13].
(Refer to Fig. A.)
[12]
Fig. A
Pin of [12]
Install pin of [12] in groove of [27].
(Refer to Fig. B.) [27]
Fig. DM9H
[17]
Groove of [27]
(L-5)
Fig. B (Top view)
Notch of
[13] [16]
Hold [12] and [13] till groove of chassis
pin of chassis looks and fit [13]
in notch of chassis. Then, turn turn [18]
a few [13] while holding [12].
(Refer to Fig. C.) (P-4)
Groove of [12]
pin of chassis
Fig. C
Install [11] and [10] while holding [12].

(Refer to Fig. DM8H-1.)
Fig. DM8H-2
(S-7)
Fig. DM10H
2-4-6 U29PHSDA
[22] turn (C-1)
(S-8)
[20]
(L-6)
[21]
[19]
Cap Belt
Pin on [22]
Installation position of Cap Belt
[20] Cap Belt
[27]
Position of pin on [22]

Fig. DM12H
[19]
View for A
Fig. DM11H
2-4-7 U29PHSDA
[26] Installation of [26]
(C-3)
Position of Mode Lever when installed
(S-9) Pin of [33] Pin of [37]
Pin of [36]
(L-8)
[23]
(L-7)
[24] Bottom View
(C-5)
(C-4) (C-2) [26]
[28]
[29] [25] [27]
[30]
Align [26] and [27] as shown.
[27] First groove on [27]
First tooth on [47]
[27]
When reassembling [27],
meet the first groove on
[27] to the first tooth on
[47] as shown.
Top View
[31] Fig. DM13H-2
Fig. DM13H-1
(P-5)
[31]
Refer to the Alignment
Section, Page 2-5-1.
[35]
[32]
(L-9) [34]
Fig. DM14H
2-4-8 U29PHSDA
[38]
[36]
[43]
(P-6) turn
[39]
(L-10)
turn [42]
turn
[48] [47]
Slide
[37] Fig. DM17H
(C-7)
[41]
(C-6)
[40]
Fig. DM15H
[45]
[44]
[46]
(L-11)
Slide Plate
(S-11)
Fig. DM16H
2-4-9 U29PHSDA
ALIGNMENT PROCEDURES OF MECHANISM
The following procedures describe how to align the Alignment 1
individual gears and levers that make up the tape load-
ing/unloading mechanism. Since information about the Loading Arm (SP) and (TU) Assembly
state of the mechanism is provided to the System Install Loading Arm (SP) and (TU) Assembly so that
Control Circuit only through the Mode Switch, it is their triangle marks point to each other as shown in
essential that the correct relationship between individ- Fig. AL2.
ual gears and levers be maintained.
All alignments are to be performed with the mech- Alignment 2
anism in Eject mode, in the sequence given. Each Mode Gear
procedure assumes that all previous procedures have
been completed. Keeping the two triangles pointing at each other, install
the Loading Arm (SP) Assembly so that the last tooth
of the gear meets the most inside teeth of the Mode
IMPORTANT:
Gear. See Fig. AL2.
If any one of these alignments is not performed prop-
erly, even if off by only one tooth, the unit will unload or
stop and it may result in damage to the mechanical or Triangle Marks
electrical parts. Loading Arm
(SP) Assembly
Alignment points in Eject Position
Last Tooth
Top View
Alignment 2
Loading Arm
(TU) Assembly
Most inside teeth
of Mode Gear
Alignment 3 Alignment 1 Mode Gear
Fig. AL2
Alignment 3
Cam Gear (A) (HI), Rack Assembly
Install the Rack Assembly so that the first tooth on the
Bottom View Alignment 1 gear of the Rack Assembly meets the first groove on
the Cam Gear (A) (HI) as shown in Fig. AL3.
Alignment 2 Top View Cam Gear (A)(HI)

Alignment 3
First tooth
Fig. AL1
First groove
Gear on Rack Assembly
on the Cam Gear (A)(HI)
Fig. AL3
2-5-1 U29PHSAPM
DECK EXPLODED VIEWS
Deck Mechanism View 1
Mark Description
Floil G-684G or Multemp MH-D (Blue grease)
SLIDUS OIL #150
B2
B35
L1467 B494
L1191
B9 B73 B10 B553
B411
B567
L1053
B410
B74
L1051
Chassis Assembly
Top View (Lubricating Point)
B5
L1322 B501
L1450
L1450
B12
B121 L1466
B11 B126
B571 B492 B8
B37 B86
[ HG430ED ]
Some Ref. Numbers are not in sequence. Chassis Assembly
Bottom View (Lubricating Point)
2-6-1 HG231DEX
Mark Description
Floil G-684G or Multemp MH-D
B587 (Blue grease)
B487 B521
B416 SLIDUS OIL #150
B591
SANKOUL FG84M (Yellow grease)
B590 B522
B148 L1406 B3
B508 B499 B573
B574
B592
B585 B518 B558
B564 B557
B31
B414
B572
B565
L1151 B525
B417
B568
B578
B133
B579 B551
B582
B580 A
B583 B491
B513 Bottom Side

B579 B581 B488 (Grease point)
B559
B507
View B516
for A
B52 Bottom Side (Grease point)
Some Ref. Numbers are not in sequence.
2-6-2 HG231DEX
Mark Description
Floil G-684G or Multemp MH-D (Blue grease)
L1321
SLIDUS OIL #150
B347
L1321
B355
B354
B483
L1341
B425
B482
B562
B300
B563
B313
B529
B360
B359
B361
B555
B303
Some Ref. Numbers are not in sequence. B514
2-6-3 HG231DEX
DECK PARTS LIST
Comparison Chart of Models and Marks Ref. No. Mark Description Part No.
B507 REEL WASHER MK9 5*2.1*0.5 0VM410058
Model Mark
B508 S BRAKE SPRING(HI) MK12 0VM414899
HG231ED A
B513 P.S.W F 6*2.55*0.5 0VM402629A
HG430ED B
B514 SCREW RACK MK10 0VM411535
B516 REEL WASHER MK9 5*2.1*0.5 0VM410058
B518 P.S.W CUT 1.6X4.0X0.5T 0VM408485A
B521 REV BRAKE SPG(HI) MK12 0VM414943
B2 A CYLINDER ASSEMBLY MK12.5 PAL 2HD N2328CYL
2SP B522 TG POST ASSEMBLY MK10 0VSA11012
B2 B CYLINDER ASSEMBLY MK12.5 PAL 6HD or N2367CYL B525 LDG BELT MK11 0VM412804
B CYLINDER ASSEMBLY MK12.5 PAL 6HD(V) N2369CYL B529 CLEANER ASSEMBLY MK10 0VSA11161
B3 LOADING MOTOR ASSEMBLY MK12.5 0VSA14636 B551 FF ARM(HI) MK12 0VM306183
B5 SLIDE PLATE MK12.5 0VM416429 B553 REV SPRING MK11 0VM412555
B8 PULLEY ASSEMBLY(HI) MK12 0VSA13501 B555 RACK ASSEMBLY MK12 0VSA13289
B9 MOVING GUIDE S P.P MK12.5 0VSA14717 B557 MOTER PULLEY U5 0VM403205
B10 MOVING GUIDE T P.P MK12.5 0VSA14639 B558 LOADING MOTOR M31E-1 R-14 7401 MMDZB12MM007
B11 LOADING ARM(TU) ASSEMBLY MK12 0VSA13300 B559 CLUTCH ASSEMBLY(HI) MK12 0VSA13450
B12 LOADING ARM(SP) ASSEMBLY MK12 0VSA13299 B562 C DRIVE LEVER(SP) MK12 0VM203772
B31 AC HEAD ASSEMBLY MK12.5 0VSA14841 B563 SLIDER SHAFT MK12 0VM305762
B35 TAPE GUIDE ARM ASSEMBLY MK12.5 0VSA15014 B564 M GEAR(HI) MK12 0VM305755
B37 CAPSTAN MOTOR 288/VCZC1301 N9681CML B565 SENSOR GEAR(HI) MK12 0VM305756
B52 CAP BELT MK10 0VM411138 B567 PINCH ARM(B) MK12 0VM305718
B73 FE HEAD(MK11) MH-131SF11 or DHVEC01Z0005 B568 BT ARM MK12 0VM305728
FE HEAD(MK12) VTR-1X2ERS11-155 or DHVEC01TE005 B571 P.S.W CUT 1.6X4.0X0.5T 0VM408485A
FE HEAD(MK12) HVFHP0047A DHVEC01AL007 B572 P.S.W CUT 1.6X4.0X0.5T 0VM408485A
B74 PRISM MK10 0VM202870 B573 REEL S MK11 0VM203436
B86 B F BRAKE ASSEMBLY(HI) MK12 0VSA13447 B574 REEL T MK10 0VM202872C
B121 WORM MK12 0VM414091 B578 TR GEAR A MK10 0VM304440
B126 PULLEY MK12 0VM414330B B579 TR GEAR B MK12 0VM305900
B133 IDLER ASSEMBLY(HI) MK12.5 0VSA14849 B580 TR GEAR C MK12 0VM305743A
B148 TG CAP MK6 0VM407664C B581 CENTER GEAR MK11 0VM305081
B300 C DRIVE LEVER(TU) MK12 0VM203773 B582 TR GEAR SPRING MK10 0VM411187C
B303 F DOOR OPENER MK12 0VM203751C B583 CAM WASHER MK12 0VM414741
B313 C DRIVE SPRING MK12 0VM414145 B585 PSW(317505) MK11 0VM413663
B347 GUIDE HOLDER A MK10 0VM304920 B587 TENSION LEVER ASSEMBLY MK12 0VSA13279
B354 SLIDER(TU) MK12 0VM101172F B590 BRAKE ARM(TU) MK12 0VM203752E
B355 SLIDER(SP) MK12 0VM101182H B591 BAND BRAKE(TU) MK12 0VM305724C
B359 CLEANER LEVER MK10 0VM304413 B592 TG POST MK10 0VM411108E
B360 CLEANER ROLLER MK9 0VM410032C L1051 SCREW, B-TIGHT M2.6X6 PAN HEAD+ GPMB9060
B361 CL POST MK10 0VM411114 L1053 SCREW, S-TIGHT M2.6X8 WASHER HEAD+ GCMS9080
B410 PINCH ARM(A) ASSEMBLY(6) MK12.5 or 0VSA14935 L1151 SCREW, SEMS M2.6X4 PAN HEAD+ CPM39040
PINCH ARM(A) ASSEMBLY(5) MK12 0VSA13788 L1191 SCREW, S-TIGHT M2.6X8 WASHER HEAD+ GCMS9080
B411 PINCH SPRING MK12 0VM414644 L1321 SCREW, S-TIGHT M3X6 BIND HEAD+ GBMS3060
B414 M BRAKE(SP) ASSEMBLY(HI) MK12 0VSA13655 L1322 SCREW, B-TIGHT M2.3X4 BIND HEAD+ GBMBY040
B416 M BRAKE(TU) ASSEMBLY(HI) MK12 0VSA13449 L1341 SCREW, P-TIGHT M2X6 PAN HEAD+ GPMP2060
B417 TENSION SPG(3002645) MK12.5 0VM414221G L1406 AC HEAD SCREW MK9 0VM410964
B425 LOCK LEVER SPRING MK10 0VM411110 L1450 SCREW, SEMS M2.6X5 PAN HEAD+ CPM39050
B482 CASSETTE PLATE MK12 0VM203749 L1466 SCREW, S-TIGHT M2.6X6 BIND HEAD+ GBMS9060
B483 LOCK LEVER MK12 0VM414095 L1467 SCREW M2.6X5 WASHER HEAD+ SCM39050
B487 BAND BRAKE(SP) MK12 0VM305723
B488 MODE LEVER(HI) MK12 or 0VM101175J
MODE LEVER(HI) MK12.5 0VM101352
B491 CAM GEAR(A)(HI) MK12 0VM101176
B492 MODE GEAR(LM) MK12 0VM204236
B494 C DOOR OPENER MK12 0VM305719
B499 T LEVER HOLDER MK12 0VM305729
B501 WORM HOLDER MK12 or 0VM203767
WORM HOLDER(R) MK12 0VM204324
20040325 2-7-1 HG231DPL

HG231ED/HG430ED
HG231ED/HG430ED
2004-04-15

HG231ED HG430ED Service Manual

Uploaded by

Document Information

Original Title

Copyright

Available Formats

Share this document

Share or Embed Document

Sharing Options

Did you find this document useful?

Is this content inappropriate?

Copyright:

Available Formats

HG231ED HG430ED Service Manual

Uploaded by

Copyright:

Available Formats

SERVICE MANUAL

Sec. 1: Main Section Sec. 2: Deck Mechanism Section

VIDEO CASSETTE RECORDER

VIDEO CASSETTE RECORDER

1-1. Video Output (PB) Vp-p 0.8 1.0 1.2 FL6A

1-2. Video Output (R/P) Vp-p 0.8 1.0 1.2

1-4. Video Color S/N AM (R/P) dB 37 41 SP Mode

1-5. Video Color S/N PM (R/P) dB 30 36 SP Mode

2-1. Jitter Low µsec 0.07 0.12 SP Mode

2-2. Wow & Flutter % 0.3 0.5 SP Mode

3-1. Output (PB) dBV -9 -6 -3 SP Mode

3-2. Output (R/P) dBV -9 -6 -1.5 SP Mode

3-3. S/N (R/P) dB 36 41 SP Mode

3-4. Distortion (R/P) % 1.0 4.0 SP Mode

3-5. Freq. resp (R/P) at 200Hz dB -7 -4 SP Mode

(-20dB ref. 1kHz) at 6kHz dB -10 -4 SP Mode

4-1. Video output Vp-p 0.8 1.0 1.2 E-E Mode

4-2. Video S/N dB 39 42 E-E Mode

4-3. Audio output dB -10 -6 -2 E-E Mode

5. Hi-Fi Audio [ HG430ED ]

5-1. Output dBV -12 -8 -4 SP Mode

5-3. Freq. resp (6dB B.W) Hz 20 ~ 20K SP Mode

Table 1 : Ratings for selected area

Table 2: Leakage current ratings for selected areas

Top View Bottom View

c. The 1st pin of every male connector is indicated as

Pin 1 Fig. S-1-1

(2) Remove the flat pack-IC with tweezers while apply-

* Be careful to avoid a short circuit.

Hot Air Blower

<Correct> Grounding Band

Pin 1 of the Flat Pack-IC

About Optical Sensors

Note: Because the Tape End Sensors are inactive, do

[1] Top Case D1 7(S-1) -

[4] Jack CBA D4 Desolder, (S-5) -

Deck D5 [1] Top Case

[6] Main CBA D5 *(L-3) --- [ HG430ED ] -

[4] Jack CBA

[6] Main CBA

[8] Jack Board [5] Deck [5] Deck Assembly

[6] Main CBA LD-SW Pin

TOP VIEW From

Lead connections of Deck Assembly and Main CBA

Test Equipment Required Measurement

EXT. Syncronize Trigger Point

12 P-ON+15V P-ON+15V FROM/TO

JK102 Q102 CN102 CN152 58 59 28 29 25 21

JACK CBA TU701(TUNER UNIT) MAIN CBA

JK102 IC151 (SWITCHING)

IC301 (AUDIO SIGNAL PROCESS)

(DECK ASSEMBLY) SP/LP-ON

(DECK ASSEMBLY) SP/LP-ON

HG430ED B CN509 JK751

JK102 CN102 CN152

IC451 (Hi-Fi AUDIO SIGNAL PROCESS)

62 70 SW R-CH IIC-BUS SDA

HOT CIRCUIT. BE CAREFUL.

STANDBY FUNCTION TIMER REC

MODE INDICATOR ACTIVE

When cassette loading mechanism is not functioning

(B) ±10% 20°C -25~+85°C

(SR) ±15% 20°C -25~+85°C