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Lh1525at Solid State Relej
Lh1525at Solid State Relej
www.vishay.com
Vishay Semiconductors
1 Form A Solid-State Relay (Normally Open)
FEATURES
• Low operating current
• High speed operation
A 1 6 S1 • Isolation test voltage 5300 VRMS
• Current limit protection
C 2 5 DC • DC only option
• Clean bounce free switching
3 4 S2
• Low power consumption
• Surface mountable
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
APPLICATIONS
DESCRIPTION • General telecom switching
The LH1525 relay are SPST normally open switches • Battery powered switch applications
(1 Form A) that can replace electromechanical relays in • Industrial controls
many applications. The relay requires a minimal amount of • Programmable controllers
LED drive current to operate, making it ideal for battery
powered and power consumption sensitive applications. • Instrumentation
The relay is constructed using a GaAIAs LED for actuation
control and MOSFETs for the switching output. The relay
employs current-limiting circuitry and can be configured for
AGENCY APPROVALS
AC/DC or DC-only operation. • UL1577, file no. E52744
ORDERING INFORMATION
DIP-6 SMD-6
L H 1 5 2 5 # # # T R
PACKAGE UL
SMD-6, tube LH1525AAB
SMD-6, tape and reel LH1525AABTR
DIP-6, tube LH1525AT
PIN CONFIGURATION
AC/DC configuration DC only configuration
A A
Load (±) Load (+)
1 6 1 6
C C
Do not connect Load (-)
2 5 2 5
Load (±)
3 4 3 4
Input A
VL
1 6
C
2 5
90 %
Output
3 4
Output 10 %
ton toff
800 250
PSO - Output Safety Power (mW)
150
400
100
200
50
0 0
-50 -25 0 25 50 75 100 125 150 175 -50 -25 0 25 50 75 100 125 150 175
Fig. 3 - Safety Power Dissipation vs. Ambient Temperature Fig. 4 - Safety Input Current vs. Ambient Temperature
140
60
T = 85 °C
100
40
80 T = 25 °C
30
60
20 T = -40 °C
40
20 10
IF > 5 mA
0 0
-40 -20 0 20 40 60 80 100
0 0.5 1.0 1.5 2.0
Tamb - Ambient Temperature (°C)
VF - Forward Voltage (V)
Fig. 5 - Maximum Load Current vs. Ambient Temperature Fig. 7 - Forward Current vs. Forward Voltage
1.7 2.5
IL = 100 mA
1.6
Normalized Forward Current
VF - Forward Voltage (V)
2.0
for Switch Turn-On
1.5
IF = 10 mA 1.5
1.4
1.3 1.0
1.2 IF = 2 mA
IF = 5 mA 0.5
1.1
Normalized to Tamb = 25 °C
1.0 0
-40 -20 0 20 40 60 80 100 -40 -20 0 20 40 60 80 100
Fig. 6 - Forward Voltage vs. Ambient Temperature Fig. 8 - Normalized Forward Current for Switch Turn-On vs.
Ambient Temperature
2.0 2.0
IL = 50 mA
IF = 5.0 mA
Normalized On-Resistance
IL = 50 mA
1.5 1.5
1.0 1.0
T = 25 °C
0.5 0.5
T = -40 °C
Normalized to Tamb = 25 °C
0 0
-40 -20 0 20 40 60 80 100 0 10 20 30 40 50
Fig. 9 - Normalized On-Resistance vs. Ambient Temperature Fig. 12 - Turn-On Time vs. Forward Current
60 2.0
IF = 0 mA 1.8
1.6 IF = 5 mA
1.4
40
1.2
30 1.0
0.8
20 0.6
0.4
10
0.2 Normalized to Tamb = 25 °C
0 0
0 10 20 30 40 50 60 -40 -20 0 20 40 60 80 100
Fig. 10 - Switch Capacitance vs. Applied Voltage Fig. 13 - Normalized Turn-On Time vs. Ambient Temperature
100 0.20
IL = 50 mA
Off-State Leakage Current (nA)
IF = 0 mA
T = 85 °C
0.16 T = 85 °C
10
Turn-Off Time (ms)
T = 25 °C 0.12
1 T = 25 °C
0.08
0.01 0
0 100 200 300 0 10 20 30 40 50
Fig. 11 - Off-State Leakage Current vs. Load Voltage Fig. 14 - Turn-Off Time vs. Forward Current
2.0
1.8
Normalized Turn-Off Time
1.6 IF = 5.0 mA
1.4
1.2
1.0
0.8
0.6
0.4
0.2 Normalized to Tamb = 25 °C
0
-40 -20 0 20 40 60 80 100
0.25 ± 0.10
1.00 ± 0.10
0.25 ± 0.20
Leads coplanarity
2.54 nom. 0.60 min. 8.00 min. 0.1 max.
2 x 2.54 = 5.08
6 5 4
Recommended footprint
5.08
1.50
2.54
3.55 ± 0.25
6.09 ± 0.25
0.70 ± 0.20
3.04 ± 0.25
1.00 ± 0.10
0.50 ± 0.10
2.54 nom. 3° to 9
° 10
0.25 ± 0.
2 x 2.54 = 5.08
6 5 4
1 2 3
PACKAGE MARKING
LH1525
V YWW 68
Fig. 17 - LH1525
Note
• Tape and reel suffix (TR) is not part of the package marking
7.5 ± 0.1
16.0 ± 0.3
7.77 ± 0.1 7.77 ± 0.1 CL
TUBE PACKING
TYPE UNITS/TUBE TUBES/BOX UNITS/BOX
SMD-6 50 40 2000
DIP-6 50 40 2000
SOLDER PROFILES
Axis Title Axis Title
300 10000 300 10000
5s
Lead temperature Max. 260 °C
250 250 255 °C
235 °C to 245 °C
240 °C
260 °C Second Full line: typical
wave 217 °C
First wave Dotted lines:
Temperature (°C)
Temperature (°C)
2nd line
2nd line
2nd line
ca. 2 K/s
1st line
1st line
ca. 200 K/s
150 150
100 °C to
130 °C Max. 120 s Max. 100 s
100 100 100 100
Max. ramp down 6 °C/s
2 K/s ca. 5 K/s
50 50 Max. ramp up 3 °C/s
Forced cooling
0 10 0 10
0 50 100 150 200 250 0 50 100 150 200 250 300
948626 Time (s) 19841 Time (s)
Fig. 19 - Wave Soldering Double Wave Profile Fig. 20 - Lead (Pb)-free Reflow Solder Profile
According to J-STD-020 for DIP Devices According to J-STD-020 for SMD Devices
SMD
DIP
i179041-2
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